LED 캡슐화 시장(2026-2030년)

The global LED encapsulation market is forecasted to grow by USD 573.9 mn during 2025-2030, accelerating at a CAGR of 4.7% during the forecast period. The report on the global LED encapsulation market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by miniaturization of advanced display backlighting, regulatory push for eco-friendly packaging, integration of smart connected lighting.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's global LED encapsulation market is segmented as below:

By Type

• Epoxy
• Silicone
• Polyurethane

By Type Of Packaging

• Chip-on-board
• Surface-mount device
• Chip-scale package
• Micro-LED modules

By Technology

• Heat cure thermoset
• UV or LED light cure
• Dual cure systems
• Room temperature vulcanization (RTV)

Geography

• APAC
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • The Netherlands
• South America
  • Brazil
  • Argentina
  • Chile
• Middle East and Africa
  • UAE
  • South Africa
  • Turkey
• Rest of World (ROW)

This study identifies the transition toward chip scale as one of the prime reasons driving the global led encapsulation market growth during the next few years. Also, integration of quantum dot enhancements and expansion of medical phototherapy devices will lead to sizable demand in the market.

The report on the global led encapsulation market covers the following areas:

• Global led encapsulation market sizing
• Global led encapsulation market forecast
• Global led encapsulation market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global led encapsulation market vendors that include 3M Co., Dow Chemical Co., DuPont de Nemours Inc., Elkem ASA, Epic Corp., H.B. Fuller Co., Henkel AG and Co. KGaA, Huntsman International LLC, Laird Performance Materials, Lumileds Holding BV, Momentive Materials Inc., Nagase and Co. Ltd., Nichia Corp., Nitto Denko Corp., Panasonic Holdings Corp., Samsung Electronics Co. Ltd., Shin Etsu Chemical Co. Ltd., SolEpoxy Inc., Stanley Electric Co. Ltd., Toyoda Gosei Co. Ltd., Wacker Chemie AG. Also, the global led encapsulation market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview
  • Executive Summary - Chart on Market Overview
  • Executive Summary - Data Table on Market Overview
  • Executive Summary - Chart on Global Market Characteristics
  • Executive Summary - Chart on Market by Geography
  • Executive Summary - Chart on Market Segmentation by Type
  • Executive Summary - Chart on Market Segmentation by Type of Packaging
  • Executive Summary - Chart on Market Segmentation by Technology
  • Executive Summary - Chart on Incremental Growth
  • Executive Summary - Data Table on Incremental Growth
  • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

• 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
• 2.2 Criticality of inputs and Factors of differentiation
• 2.3 Factors of disruption
• 2.4 Impact of drivers and challenges

3 Market Landscape

• 3.1 Market ecosystem
• 3.2 Market characteristics
• 3.3 Value chain analysis

4 Market Sizing

• 4.1 Market definition
• 4.2 Market segment analysis
  • Market segments
• 4.3 Market size 2025
• 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

• 5.1 Global LED Encapsulation Market 2020 - 2024
  • Historic Market Size - Data Table on Global LED Encapsulation Market 2020 - 2024 ($ million)
• 5.2 Type segment analysis 2020 - 2024
  • Historic Market Size - Type Segment 2020 - 2024 ($ million)
• 5.3 Type of Packaging segment analysis 2020 - 2024
  • Historic Market Size - Type of Packaging Segment 2020 - 2024 ($ million)
• 5.4 Technology segment analysis 2020 - 2024
  • Historic Market Size - Technology Segment 2020 - 2024 ($ million)
• 5.5 Geography segment analysis 2020 - 2024
  • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
• 5.6 Country segment analysis 2020 - 2024
  • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

• 6.1 Impact of AI on Global LED Encapsulation Market
• 6.2 Impact of geopolitical conflicts on Global LED Encapsulation Market

7 Five Forces Analysis

• 7.1 Five forces summary
  • Five forces analysis - Comparison between 2025 and 2030
• 7.2 Bargaining power of buyers
  • Bargaining power of buyers - Impact of key factors 2025 and 2030
• 7.3 Bargaining power of suppliers
  • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
• 7.4 Threat of new entrants
  • Threat of new entrants - Impact of key factors in 2025 and 2030
• 7.5 Threat of substitutes
  • Threat of substitutes - Impact of key factors in 2025 and 2030
• 7.6 Threat of rivalry
  • Threat of rivalry - Impact of key factors in 2025 and 2030
• 7.7 Market condition

8 Market Segmentation by Type

• 8.1 Market segments
• 8.2 Comparison by Type
• 8.3 Epoxy - Market size and forecast 2025-2030
• 8.4 Silicone - Market size and forecast 2025-2030
• 8.5 Polyurethane - Market size and forecast 2025-2030
• 8.6 Market opportunity by Type
  • Market opportunity by Type ($ million)

9 Market Segmentation by Type of Packaging

• 9.1 Market segments
• 9.2 Comparison by Type of Packaging
• 9.3 Chip-on-board - Market size and forecast 2025-2030
• 9.4 Surface-mount device - Market size and forecast 2025-2030
• 9.5 Chip-scale package - Market size and forecast 2025-2030
• 9.6 Micro-LED modules - Market size and forecast 2025-2030
• 9.7 Market opportunity by Type of Packaging
  • Market opportunity by Type of Packaging ($ million)

10 Market Segmentation by Technology

• 10.1 Market segments
• 10.2 Comparison by Technology
• 10.3 Heat cure thermoset - Market size and forecast 2025-2030
• 10.4 UV or LED light cure - Market size and forecast 2025-2030
• 10.5 Dual cure systems - Market size and forecast 2025-2030
• 10.6 Room temperature vulcanization (RTV) - Market size and forecast 2025-2030
• 10.7 Market opportunity by Technology
  • Market opportunity by Technology ($ million)

11 Customer Landscape

• 11.1 Customer landscape overview
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

• 12.1 Geographic segmentation
• 12.2 Geographic comparison
• 12.3 APAC - Market size and forecast 2025-2030
  • 12.3.1 China - Market size and forecast 2025-2030
  • 12.3.2 Japan - Market size and forecast 2025-2030
  • 12.3.3 India - Market size and forecast 2025-2030
  • 12.3.4 South Korea - Market size and forecast 2025-2030
  • 12.3.5 Australia - Market size and forecast 2025-2030
  • 12.3.6 Indonesia - Market size and forecast 2025-2030
• 12.4 North America - Market size and forecast 2025-2030
  • 12.4.1 US - Market size and forecast 2025-2030
  • 12.4.2 Canada - Market size and forecast 2025-2030
  • 12.4.3 Mexico - Market size and forecast 2025-2030
• 12.5 Europe - Market size and forecast 2025-2030
  • 12.5.1 Germany - Market size and forecast 2025-2030
  • 12.5.2 UK - Market size and forecast 2025-2030
  • 12.5.3 France - Market size and forecast 2025-2030
  • 12.5.4 Italy - Market size and forecast 2025-2030
  • 12.5.5 Spain - Market size and forecast 2025-2030
  • 12.5.6 The Netherlands - Market size and forecast 2025-2030
• 12.6 South America - Market size and forecast 2025-2030
  • 12.6.1 Brazil - Market size and forecast 2025-2030
  • 12.6.2 Argentina - Market size and forecast 2025-2030
  • 12.6.3 Chile - Market size and forecast 2025-2030
• 12.7 Middle East and Africa - Market size and forecast 2025-2030
  • 12.7.1 Saudi Arabia - Market size and forecast 2025-2030
  • 12.7.2 UAE - Market size and forecast 2025-2030
  • 12.7.3 South Africa - Market size and forecast 2025-2030
  • 12.7.4 Turkey - Market size and forecast 2025-2030
  • 12.7.5 Israel - Market size and forecast 2025-2030
• 12.8 Market opportunity by geography
  • Market opportunity by geography ($ million)
  • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

• 13.1 Market drivers
  • Miniaturization of advanced display backlighting
  • Regulatory push for eco-friendly packaging
  • Integration of smart connected lighting
• 13.2 Market challenges
  • Volatile silicone and epoxy feedstock pricing
  • Increasing OLED penetration in premium displays
  • Reliability concerns amid rising blue-light
• 13.3 Impact of drivers and challenges
  • Impact of drivers and challenges in 2025 and 2030
• 13.4 Market opportunities
  • Transition toward chip scale
  • Integration of quantum dot enhancements
  • Expansion of medical phototherapy devices

14 Competitive Landscape

• 14.1 Overview
• 14.2 Competitive Landscape
  • Overview on criticality of inputs and factors of differentiation
• 14.3 Landscape disruption
  • Overview on factors of disruption
• 14.4 Industry risks
  • Impact of key risks on business

15 Competitive Analysis

• 15.1 Companies profiled
  • Companies covered
• 15.2 Company ranking index
  • Company ranking index
• 15.3 Market positioning of companies
  • Matrix on companies position and classification
• 15.4 3M Co.
  • 3M Co. - Overview
  • 3M Co. - Business segments
  • 3M Co. - Key news
  • 3M Co. - Key offerings
  • 3M Co. - Segment focus
  • SWOT
• 15.5 Dow Chemical Co.
  • Dow Chemical Co. - Overview
  • Dow Chemical Co. - Business segments
  • Dow Chemical Co. - Key news
  • Dow Chemical Co. - Key offerings
  • Dow Chemical Co. - Segment focus
  • SWOT
• 15.6 DuPont de Nemours Inc.
  • DuPont de Nemours Inc. - Overview
  • DuPont de Nemours Inc. - Business segments
  • DuPont de Nemours Inc. - Key news
  • DuPont de Nemours Inc. - Key offerings
  • DuPont de Nemours Inc. - Segment focus
  • SWOT
• 15.7 Elkem ASA
  • Elkem ASA - Overview
  • Elkem ASA - Business segments
  • Elkem ASA - Key offerings
  • Elkem ASA - Segment focus
  • SWOT
• 15.8 H.B. Fuller Co.
  • H.B. Fuller Co. - Overview
  • H.B. Fuller Co. - Business segments
  • H.B. Fuller Co. - Key offerings
  • H.B. Fuller Co. - Segment focus
  • SWOT
• 15.9 Henkel AG and Co. KGaA
  • Henkel AG and Co. KGaA - Overview
  • Henkel AG and Co. KGaA - Business segments
  • Henkel AG and Co. KGaA - Key offerings
  • Henkel AG and Co. KGaA - Segment focus
  • SWOT
• 15.10 Huntsman International LLC
  • Huntsman International LLC - Overview
  • Huntsman International LLC - Business segments
  • Huntsman International LLC - Key news
  • Huntsman International LLC - Key offerings
  • Huntsman International LLC - Segment focus
  • SWOT
• 15.11 Nagase and Co. Ltd.
  • Nagase and Co. Ltd. - Overview
  • Nagase and Co. Ltd. - Business segments
  • Nagase and Co. Ltd. - Key offerings
  • Nagase and Co. Ltd. - Segment focus
  • SWOT
• 15.12 Nitto Denko Corp.
  • Nitto Denko Corp. - Overview
  • Nitto Denko Corp. - Business segments
  • Nitto Denko Corp. - Key offerings
  • Nitto Denko Corp. - Segment focus
  • SWOT
• 15.13 Panasonic Holdings Corp.
  • Panasonic Holdings Corp. - Overview
  • Panasonic Holdings Corp. - Business segments
  • Panasonic Holdings Corp. - Key news
  • Panasonic Holdings Corp. - Key offerings
  • Panasonic Holdings Corp. - Segment focus
  • SWOT
• 15.14 Samsung Electronics Co. Ltd.
  • Samsung Electronics Co. Ltd. - Overview
  • Samsung Electronics Co. Ltd. - Business segments
  • Samsung Electronics Co. Ltd. - Key news
  • Samsung Electronics Co. Ltd. - Key offerings
  • Samsung Electronics Co. Ltd. - Segment focus
  • SWOT
• 15.15 Shin Etsu Chemical Co. Ltd.
  • Shin Etsu Chemical Co. Ltd. - Overview
  • Shin Etsu Chemical Co. Ltd. - Business segments
  • Shin Etsu Chemical Co. Ltd. - Key offerings
  • Shin Etsu Chemical Co. Ltd. - Segment focus
  • SWOT
• 15.16 Stanley Electric Co. Ltd.
  • Stanley Electric Co. Ltd. - Overview
  • Stanley Electric Co. Ltd. - Business segments
  • Stanley Electric Co. Ltd. - Key offerings
  • Stanley Electric Co. Ltd. - Segment focus
  • SWOT
• 15.17 Toyoda Gosei Co. Ltd.
  • Toyoda Gosei Co. Ltd. - Overview
  • Toyoda Gosei Co. Ltd. - Business segments
  • Toyoda Gosei Co. Ltd. - Key offerings
  • Toyoda Gosei Co. Ltd. - Segment focus
  • SWOT
• 15.18 Wacker Chemie AG
  • Wacker Chemie AG - Overview
  • Wacker Chemie AG - Business segments
  • Wacker Chemie AG - Key offerings
  • Wacker Chemie AG - Segment focus
  • SWOT

16 Appendix

• 16.1 Scope of the report
  • Market definition
  • Objectives
  • Notes and caveats
• 16.2 Inclusions and exclusions checklist
  • Inclusions checklist
  • Exclusions checklist
• 16.3 Currency conversion rates for US$
  • Currency conversion rates for US$
• 16.4 Research methodology
  • Research methodology
• 16.5 Data procurement
  • Information sources
• 16.6 Data validation
  • Data validation
• 16.7 Validation techniques employed for market sizing
  • Validation techniques employed for market sizing
• 16.8 Data synthesis
  • Data synthesis
• 16.9 360 degree market analysis
  • 360 degree market analysis
• 16.10 List of abbreviations
  • List of abbreviations