LED 캡슐화 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, lED encapsulation market size in 2026 is estimated at USD 3.79 billion, growing from 2025 value of USD 3.55 billion with 2031 projections showing USD 5.22 billion, growing at 6.65% CAGR over 2026-2031.

This report is Segmented by Encapsulant Material (Epoxy, Silicone, Polyurethane, Acrylic and Other Encapsulant Material), LED Package Type (Chip-On-Board (COB), Surface-Mount Device (SMD), Chip-Scale Package (CSP), Mini/Micro-LED Modules, End-Use Application (Automotive, Consumer Electronics, Industrial/Outdoor/Horticulture), and More), and Geography. Market Forecasts are Provided in Terms of Value (USD).

Global LED Encapsulation Market Trends and Insights

Rising Penetration of High-Power LEDs Across General Illumination

Commercial luminaires replacing metal-halide fixtures now exceed 150 lumens per watt, which requires encapsulant formulations to retain optical clarity for over 50,000 hours at die temperatures exceeding 120 °C. DesignLights Consortium rules require lumen maintenance above 90% at 36,000 hours, effectively sidelining epoxy systems prone to yellowing. Dow's primerless DOWSIL EI-2888 meets UL 94 and cures at room temperature, helping fixture makers hit tight assembly takt times. Energy codes in the United States and Europe that reward high-efficacy, tunable-white installations continue to drive silicone volume. Phosphor-converted white LEDs also need matrices that do not leach sulfur, maintaining chromatic stability demanded in circadian lighting programs.

Accelerating Adoption of Automotive LED Lighting Systems

Adaptive driving-beam and matrix headlamps have become standard on many mid-tier models in Europe and Asia, exemplified by ams OSRAM's 25,600-pixel EVIYOS 2.0 module deployed in VW and Opel platforms. Nichia's µPLS integrates 16,384 micro-LEDs onto ASIC drivers chosen by Forvia Hella, requiring encapsulants with thermal conductivity above 1.0 W/m*K to manage cycles from -40 °C to +125 °C. Seoul Semiconductor's WICOP no-wire LEDs increase system efficacy to 240 lm/W, reducing taillight assemblies and encapsulant volume per lumen. Regulatory requirements under UN R-123 for glare-free beams and SAE J2650 photometry reinforce uptake, sustaining the LED encapsulation market through 2030.

Volatile Silicone and Epoxy Feedstock Pricing

Shin-Etsu raised silicone prices by at least 10% from July 2024 and Hexion lifted epoxy resin prices by USD 0.10 per lb from January 2024, compressing margins for mid-tier encapsulant producers. Dow's Performance Materials and Coatings segment saw 2023 net sales slide 21% to USD 8.497 billion, reflecting oversupply and soft demand. Formulators are blending lower-cost polyurethane or acrylic chemistries in non-critical applications and negotiating pass-through clauses with LED packagers to cushion volatility.

Other drivers and restraints analyzed in the detailed report include:

1. Surge in UV-C and UV-B LED Modules Requiring High-Clarity Encapsulants
2. Growth of Horticultural and Agri-Tech Lighting with 90 °C Continuous Junction Temps
3. Stringent VOC and Micro-Siloxane Outgassing Regulations in EU and California

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Silicone encapsulants held a 55.30% market share in the LED encapsulation market in 2025 and are forecast to register a 7.52% CAGR, outperforming epoxy and polyurethane due to their endurance above 180 °C and UV transmittance surpassing 90% over 50,000 hours. Shin-Etsu has earmarked JPY 180 billion (USD 1.24 billion) for domestic and Thai silicone expansions, focusing on LED packaging and environmentally friendly grades. Epoxy retains a foothold in low-power signage but continues to cede ground where blue-rich spectra accelerate photo-oxidation. Polyurethane grows in cost-sensitive strips yet is constrained by moisture sensitivity. Acrylics occupy a niche in flexible-strip uses thanks to their fast UV cure.

Dow's 2025 launch of DOWSIL EG-4175 gel underscores a shift toward ultra-high-temperature silicones with self-healing and primerless adhesion, reducing assembly steps and ensuring dielectric reliability at 180 °C. Elkem's Shanghai line adds 1,500 t/y of thermal-conductive silicone to capture electronics and battery modules that increasingly overlap with high-power LEDs

Chip-on-Board dominated with 38.10% of LED encapsulation market size in 2025, prized in high-lumen luminaires for cost-per-watt efficiency. Yet, Chip-Scale Packages are surging at a 7.05% CAGR, as Samsung shipped 1.5 billion CSP units in Q3 2024, meeting demand for smartphones and ambient lighting. CSP removes lead frames and wire bonds, lowering package height to under 0.5 mm and slimming bezel designs. Mini- and micro-LED penetration in adaptive headlamps and tablet backlights is also lifting encapsulant requirements for low CTE and minimal outgassing to protect quantum-dot color converters.

Seoul Semiconductor's WICOP architecture boosts efficacy and slices encapsulant volume per lumen. ams OSRAM's pixel-dense EVIYOS 2.0 and Nichia's µPLS need encapsulants aligned with GaN silicon CTE to avert delamination across -40 °C to +125 °C cycles.

Complete Report Scope:

• By Encapsulant Material
  • Epoxy
  • Silicone
  • Polyurethane
  • Acrylic and Other Encapsulant Material
• By LED Package Type
  • Chip-on-Board (COB)
  • Surface-Mount Device (SMD)
  • Chip-Scale Package (CSP)
  • Mini/Micro-LED Modules
• By End-Use Application
  • Automotive Lighting
  • Consumer Electronics and Displays
  • Architectural and Commercial Lighting
  • Industrial and Outdoor / Horticulture
• By Curing Technology
  • Heat-Cure Thermoset
  • UV / LED Light-Cure
  • Dual-Cure Systems
  • Room-Temperature Vulcanization (RTV)
• By Geography
  • North America
    • United States
    • Canada
  • South America
    • Brazil
    • Mexico
    • Argentina
    • Rest of South America
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • Middle East and Africa
    • Middle East
      • United Arab Emirates
      • Saudi Arabia
      • Rest of Middle East
    • Africa
      • South Africa
      • Nigeria
      • Rest of Africa

Geography Analysis

North America accounted for 38.30% of LED encapsulation market revenue in 2025, buoyed by the CHIPS and Science Act's USD 231 billion stimulus that pulls supply chains back onshore. Prospective 60% tariffs on Chinese imports are prompting LED packagers to establish capacity in Mexico and Canada under USMCA terms. Automotive LED demand accelerates as U.S. OEMs embed adaptive beams into mainstream models, while near-shored encapsulant manufacturing mitigates freight and tariff costs.

Asia-Pacific is projected to post a 7.16% CAGR, retaining its manufacturing stronghold. China accounts for 70% of global LED chip output, while Indonesia and Vietnam benefit from supply-chain diversification. Additionally, India's PLI incentives are spurring domestic component lines. Japan and South Korea are at the forefront of R&D advances, as reflected in Wacker Chemie's specialty silicone investments.

Europe enforces strict energy-efficiency and recyclability mandates under Ecodesign 2019/2020, steering demand toward primerless, low-VOC silicones. Germany champions high-pixelated headlamps, while Central and Eastern Europe scale horticultural fixtures requiring high-temp encapsulants. South America's market remains smaller but growing, led by Brazilian retrofits and Mexican automotive lines. Middle East and Africa adopt high-efficacy luminaires within smart-city and off-grid solar programs, creating niches for encapsulants that handle desert temperatures and high UV.

1. Dow Inc.
2. DuPont de Nemours, Inc.
3. Wacker Chemie AG
4. Shin-Etsu Chemical Co., Ltd.
5. Momentive Performance Materials Inc.
6. Henkel AG and Co. KGaA
7. H.B. Fuller Company
8. Panasonic Holdings Corporation
9. Elkem ASA
10. Nagase and Co., Ltd.
11. NuSil Technology LLC
12. Epic Resins
13. Intertronics Ltd.
14. Momentive Performance Materials Inc.
15. Citizen Electronics Co., Ltd.
16. OSRAM Licht AG
17. Nichia Corporation
18. Seoul Semiconductor Co., Ltd.
19. Cree LED (SG Hldg.)
20. Everlight Electronics Co., Ltd.
21. Sumitomo Bakelite Co., Ltd.
22. 3M Company

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising Penetration Of High-Power LEDs Across General Illumination
  • 4.2.2 Accelerating Adoption Of Automotive LED Lighting Systems
  • 4.2.3 Expansion Of Consumer Electronics Back-Lighting Demand
  • 4.2.4 Surge In UV-C/UV-B LED Modules Requiring High-Clarity Encapsulants
  • 4.2.5 Near-Shoring Of Encapsulant Supply Chains Due To 2025 Tariff Regimes
  • 4.2.6 Growth Of Horticultural And Agri-Tech Lighting With 90 °C Continuous Junction Temps
• 4.3 Market Restraints
  • 4.3.1 Volatile Silicone And Epoxy Feed-Stock Pricing
  • 4.3.2 Increasing OLED Penetration In Premium Displays
  • 4.3.3 Reliability Concerns Amid Rising Blue-Light Output Densities
  • 4.3.4 Stringent VOC And Micro-Siloxane Out-Gassing Regulations In EU And California
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Threat of New Entrants
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Bargaining Power of Suppliers
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Encapsulant Material
  • 5.1.1 Epoxy
  • 5.1.2 Silicone
  • 5.1.3 Polyurethane
  • 5.1.4 Acrylic and Other Encapsulant Material
• 5.2 By LED Package Type
  • 5.2.1 Chip-on-Board (COB)
  • 5.2.2 Surface-Mount Device (SMD)
  • 5.2.3 Chip-Scale Package (CSP)
  • 5.2.4 Mini/Micro-LED Modules
• 5.3 By End-Use Application
  • 5.3.1 Automotive Lighting
  • 5.3.2 Consumer Electronics and Displays
  • 5.3.3 Architectural and Commercial Lighting
  • 5.3.4 Industrial and Outdoor / Horticulture
• 5.4 By Curing Technology
  • 5.4.1 Heat-Cure Thermoset
  • 5.4.2 UV / LED Light-Cure
  • 5.4.3 Dual-Cure Systems
  • 5.4.4 Room-Temperature Vulcanization (RTV)
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Mexico
    • 5.5.2.3 Argentina
    • 5.5.2.4 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Rest of Europe
  • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 Rest of Asia-Pacific
  • 5.5.5 Middle East and Africa
    • 5.5.5.1 Middle East
      • 5.5.5.1.1 United Arab Emirates
      • 5.5.5.1.2 Saudi Arabia
      • 5.5.5.1.3 Rest of Middle East
    • 5.5.5.2 Africa
      • 5.5.5.2.1 South Africa
      • 5.5.5.2.2 Nigeria
      • 5.5.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration Analysis
• 6.2 Strategic Moves and Investments
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Dow Inc.
  • 6.4.2 DuPont de Nemours, Inc.
  • 6.4.3 Wacker Chemie AG
  • 6.4.4 Shin-Etsu Chemical Co., Ltd.
  • 6.4.5 Momentive Performance Materials Inc.
  • 6.4.6 Henkel AG and Co. KGaA
  • 6.4.7 H.B. Fuller Company
  • 6.4.8 Panasonic Holdings Corporation
  • 6.4.9 Elkem ASA
  • 6.4.10 Nagase and Co., Ltd.
  • 6.4.11 NuSil Technology LLC
  • 6.4.12 Epic Resins
  • 6.4.13 Intertronics Ltd.
  • 6.4.14 Momentive Performance Materials Inc.
  • 6.4.15 Citizen Electronics Co., Ltd.
  • 6.4.16 OSRAM Licht AG
  • 6.4.17 Nichia Corporation
  • 6.4.18 Seoul Semiconductor Co., Ltd.
  • 6.4.19 Cree LED (SG Hldg.)
  • 6.4.20 Everlight Electronics Co., Ltd.
  • 6.4.21 Sumitomo Bakelite Co., Ltd.
  • 6.4.22 3M Company

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment