BLE 모듈 시장(2026-2030년)

The global BLE module market is forecasted to grow by USD 56564.4 mn during 2025-2030, accelerating at a CAGR of 18.6% during the forecast period. The report on the global BLE module market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by escalating integration of iot ecosystems across diverse industries, rising demand for energy efficient and battery operated communication solutions, continuous technological advancements in core specification standards.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's global BLE module market is segmented as below:

By Application

• Industrial automation
• Automotive tracking
• Asset tracking and proximity marketing
• Consumer electronics
• Others

By Type

• Single mode
• Dual mode
• Others

By Device

• Computing devices
• Smart wearables
• Smart home appliances
• Others

Geography

• APAC
  • China
  • Japan
  • South Korea
  • India
  • Indonesia
  • Australia
• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Italy
  • The Netherlands
  • Spain
• Middle East and Africa
  • UAE
  • South Africa
  • Turkey
• South America
  • Brazil
  • Argentina
  • Chile
• Rest of World (ROW)

This study identifies the integration of ai and ml at edge as one of the prime reasons driving the global ble module market growth during the next few years. Also, progressive miniaturization and system-in-package advancements and expansion of mesh networking and advanced interoperability protocols will lead to sizable demand in the market.

The report on the global ble module market covers the following areas:

• Global ble module market sizing
• Global ble module market forecast
• Global ble module market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global ble module market vendors that include Alps Alpine Co. Ltd., BDE Technology, Espressif Systems Shanghai, Ezurio, FANSTEL Corp., Infineon Technologies AG, InsightSIP, LM Technologies Ltd, Microchip Technology Inc., Murata Manufacturing Co. Ltd., NXP Semiconductors NV, Panasonic Holdings Corp., Raytac Corp, Renesas Electronics Corp., Shenzhen Holyiot Technology Co., Shenzhen Minew Tech Co. Ltd., Silicon Laboratories Inc., STMicroelectronics NV, TAIYO YUDEN Co. Ltd., Telit Cinterion, Texas Instruments Inc., u blox AG. Also, the global ble module market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview
  • Executive Summary - Chart on Market Overview
  • Executive Summary - Data Table on Market Overview
  • Executive Summary - Chart on Global Market Characteristics
  • Executive Summary - Chart on Market by Geography
  • Executive Summary - Chart on Market Segmentation by Application
  • Executive Summary - Chart on Market Segmentation by Type
  • Executive Summary - Chart on Market Segmentation by Device
  • Executive Summary - Chart on Incremental Growth
  • Executive Summary - Data Table on Incremental Growth
  • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

• 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
• 2.2 Criticality of inputs and Factors of differentiation
• 2.3 Factors of disruption
• 2.4 Impact of drivers and challenges

3 Market Landscape

• 3.1 Market ecosystem
• 3.2 Market characteristics
• 3.3 Value chain analysis

4 Market Sizing

• 4.1 Market definition
• 4.2 Market segment analysis
  • Market segments
• 4.3 Market size 2025
• 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

• 5.1 Global BLE Module Market 2020 - 2024
  • Historic Market Size - Data Table on Global BLE Module Market 2020 - 2024 ($ million)
• 5.2 Application segment analysis 2020 - 2024
  • Historic Market Size - Application Segment 2020 - 2024 ($ million)
• 5.3 Type segment analysis 2020 - 2024
  • Historic Market Size - Type Segment 2020 - 2024 ($ million)
• 5.4 Device segment analysis 2020 - 2024
  • Historic Market Size - Device Segment 2020 - 2024 ($ million)
• 5.5 Geography segment analysis 2020 - 2024
  • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
• 5.6 Country segment analysis 2020 - 2024
  • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

• 6.1 Impact of AI on global BLE module market
• 6.2 Impact of geopolitical conflicts on global BLE module market

7 Five Forces Analysis

• 7.1 Five forces summary
  • Five forces analysis - Comparison between 2025 and 2030
• 7.2 Bargaining power of buyers
  • Bargaining power of buyers - Impact of key factors 2025 and 2030
• 7.3 Bargaining power of suppliers
  • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
• 7.4 Threat of new entrants
  • Threat of new entrants - Impact of key factors in 2025 and 2030
• 7.5 Threat of substitutes
  • Threat of substitutes - Impact of key factors in 2025 and 2030
• 7.6 Threat of rivalry
  • Threat of rivalry - Impact of key factors in 2025 and 2030
• 7.7 Market condition

8 Market Segmentation by Application

• 8.1 Market segments
• 8.2 Comparison by Application
• 8.3 Industrial automation - Market size and forecast 2025-2030
• 8.4 Automotive tracking - Market size and forecast 2025-2030
• 8.5 Asset tracking and proximity marketing - Market size and forecast 2025-2030
• 8.6 Consumer electronics - Market size and forecast 2025-2030
• 8.7 Others - Market size and forecast 2025-2030
• 8.8 Market opportunity by Application
  • Market opportunity by Application ($ million)

9 Market Segmentation by Type

• 9.1 Market segments
• 9.2 Comparison by Type
• 9.3 Single mode - Market size and forecast 2025-2030
• 9.4 Dual mode - Market size and forecast 2025-2030
• 9.5 Others - Market size and forecast 2025-2030
• 9.6 Market opportunity by Type
  • Market opportunity by Type ($ million)

10 Market Segmentation by Device

• 10.1 Market segments
• 10.2 Comparison by Device
• 10.3 Computing devices - Market size and forecast 2025-2030
• 10.4 Smart wearables - Market size and forecast 2025-2030
• 10.5 Smart home appliances - Market size and forecast 2025-2030
• 10.6 Others - Market size and forecast 2025-2030
• 10.7 Market opportunity by Device
  • Market opportunity by Device ($ million)

11 Customer Landscape

• 11.1 Customer landscape overview
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

• 12.1 Geographic segmentation
• 12.2 Geographic comparison
• 12.3 APAC - Market size and forecast 2025-2030
  • 12.3.1 China - Market size and forecast 2025-2030
  • 12.3.2 Japan - Market size and forecast 2025-2030
  • 12.3.3 South Korea - Market size and forecast 2025-2030
  • 12.3.4 India - Market size and forecast 2025-2030
  • 12.3.5 Indonesia - Market size and forecast 2025-2030
  • 12.3.6 Australia - Market size and forecast 2025-2030
• 12.4 North America - Market size and forecast 2025-2030
  • 12.4.1 US - Market size and forecast 2025-2030
  • 12.4.2 Canada - Market size and forecast 2025-2030
  • 12.4.3 Mexico - Market size and forecast 2025-2030
• 12.5 Europe - Market size and forecast 2025-2030
  • 12.5.1 Germany - Market size and forecast 2025-2030
  • 12.5.2 UK - Market size and forecast 2025-2030
  • 12.5.3 France - Market size and forecast 2025-2030
  • 12.5.4 Italy - Market size and forecast 2025-2030
  • 12.5.5 The Netherlands - Market size and forecast 2025-2030
  • 12.5.6 Spain - Market size and forecast 2025-2030
• 12.6 Middle East and Africa - Market size and forecast 2025-2030
  • 12.6.1 Saudi Arabia - Market size and forecast 2025-2030
  • 12.6.2 UAE - Market size and forecast 2025-2030
  • 12.6.3 South Africa - Market size and forecast 2025-2030
  • 12.6.4 Israel - Market size and forecast 2025-2030
  • 12.6.5 Turkey - Market size and forecast 2025-2030
• 12.7 South America - Market size and forecast 2025-2030
  • 12.7.1 Brazil - Market size and forecast 2025-2030
  • 12.7.2 Argentina - Market size and forecast 2025-2030
  • 12.7.3 Chile - Market size and forecast 2025-2030
• 12.8 Market opportunity by geography
  • Market opportunity by geography ($ million)
  • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

• 13.1 Market drivers
  • Escalating integration of IoT ecosystems across diverse industries
  • Rising demand for energy efficient and battery operated communication solutions
  • Continuous technological advancements in core specification standards
• 13.2 Market challenges
  • Stringent and fragmented global regulatory certification processes
  • Volatility in semiconductor supply chains and raw material procurement
  • Intense pricing pressures and severe margin compression
• 13.3 Impact of drivers and challenges
  • Impact of drivers and challenges in 2025 and 2030
• 13.4 Market opportunities
  • Integration of AI and ML at edge
  • Progressive miniaturization and system-in-package advancements
  • Expansion of mesh networking and advanced interoperability protocols

14 Competitive Landscape

• 14.1 Overview
• 14.2 Competitive Landscape
  • Overview on criticality of inputs and factors of differentiation
• 14.3 Landscape disruption
  • Overview on factors of disruption
• 14.4 Industry risks
  • Impact of key risks on business

15 Competitive Analysis

• 15.1 Companies profiled
  • Companies covered
• 15.2 Company ranking index
  • Company ranking index
• 15.3 Market positioning of companies
  • Matrix on companies position and classification
• 15.4 Alps Alpine Co. Ltd.
  • Alps Alpine Co. Ltd. - Overview
  • Alps Alpine Co. Ltd. - Business segments
  • Alps Alpine Co. Ltd. - Key offerings
  • Alps Alpine Co. Ltd. - Segment focus
  • SWOT
• 15.5 Espressif Systems Shanghai
  • Espressif Systems Shanghai - Overview
  • Espressif Systems Shanghai - Product / Service
  • Espressif Systems Shanghai - Key offerings
  • SWOT
• 15.6 Ezurio
  • Ezurio - Overview
  • Ezurio - Product / Service
  • Ezurio - Key offerings
  • SWOT
• 15.7 Infineon Technologies AG
  • Infineon Technologies AG - Overview
  • Infineon Technologies AG - Business segments
  • Infineon Technologies AG - Key news
  • Infineon Technologies AG - Key offerings
  • Infineon Technologies AG - Segment focus
  • SWOT
• 15.8 Microchip Technology Inc.
  • Microchip Technology Inc. - Overview
  • Microchip Technology Inc. - Business segments
  • Microchip Technology Inc. - Key offerings
  • Microchip Technology Inc. - Segment focus
  • SWOT
• 15.9 Murata Manufacturing Co. Ltd.
  • Murata Manufacturing Co. Ltd. - Overview
  • Murata Manufacturing Co. Ltd. - Business segments
  • Murata Manufacturing Co. Ltd. - Key offerings
  • Murata Manufacturing Co. Ltd. - Segment focus
  • SWOT
• 15.10 NXP Semiconductors NV
  • NXP Semiconductors NV - Overview
  • NXP Semiconductors NV - Business segments
  • NXP Semiconductors NV - Key news
  • NXP Semiconductors NV - Key offerings
  • NXP Semiconductors NV - Segment focus
  • SWOT
• 15.11 Panasonic Holdings Corp.
  • Panasonic Holdings Corp. - Overview
  • Panasonic Holdings Corp. - Business segments
  • Panasonic Holdings Corp. - Key news
  • Panasonic Holdings Corp. - Key offerings
  • Panasonic Holdings Corp. - Segment focus
  • SWOT
• 15.12 Renesas Electronics Corp.
  • Renesas Electronics Corp. - Overview
  • Renesas Electronics Corp. - Business segments
  • Renesas Electronics Corp. - Key news
  • Renesas Electronics Corp. - Key offerings
  • Renesas Electronics Corp. - Segment focus
  • SWOT
• 15.13 Silicon Laboratories Inc.
  • Silicon Laboratories Inc. - Overview
  • Silicon Laboratories Inc. - Product / Service
  • Silicon Laboratories Inc. - Key news
  • Silicon Laboratories Inc. - Key offerings
  • SWOT
• 15.14 STMicroelectronics NV
  • STMicroelectronics NV - Overview
  • STMicroelectronics NV - Business segments
  • STMicroelectronics NV - Key news
  • STMicroelectronics NV - Key offerings
  • STMicroelectronics NV - Segment focus
  • SWOT
• 15.15 TAIYO YUDEN Co. Ltd.
  • TAIYO YUDEN Co. Ltd. - Overview
  • TAIYO YUDEN Co. Ltd. - Product / Service
  • TAIYO YUDEN Co. Ltd. - Key offerings
  • SWOT
• 15.16 Telit Cinterion
  • Telit Cinterion - Overview
  • Telit Cinterion - Product / Service
  • Telit Cinterion - Key offerings
  • SWOT
• 15.17 Texas Instruments Inc.
  • Texas Instruments Inc. - Overview
  • Texas Instruments Inc. - Business segments
  • Texas Instruments Inc. - Key news
  • Texas Instruments Inc. - Key offerings
  • Texas Instruments Inc. - Segment focus
  • SWOT
• 15.18 u blox AG
  • u blox AG - Overview
  • u blox AG - Business segments
  • u blox AG - Key offerings
  • u blox AG - Segment focus
  • SWOT

16 Appendix

• 16.1 Scope of the report
  • Market definition
  • Objectives
  • Notes and caveats
• 16.2 Inclusions and exclusions checklist
  • Inclusions checklist
  • Exclusions checklist
• 16.3 Currency conversion rates for US$
  • Currency conversion rates for US$
• 16.4 Research methodology
  • Research methodology
• 16.5 Data procurement
  • Information sources
• 16.6 Data validation
  • Data validation
• 16.7 Validation techniques employed for market sizing
  • Validation techniques employed for market sizing
• 16.8 Data synthesis
  • Data synthesis
• 16.9 360 degree market analysis
  • 360 degree market analysis
• 16.10 List of abbreviations
  • List of abbreviations