세계의 5G 인쇄회로기판(PCB) 시장 : 용도별, 재료 유형별 - 예측(2025-2030년)

The 5G Printed Circuit Board Market was valued at USD 17.04 billion in 2023, expected to reach USD 19.45 billion in 2024, and is projected to grow at a CAGR of 14.31%, to USD 43.48 billion by 2030.

The 5G Printed Circuit Board (PCB) market encompasses the design, fabrication, and deployment of circuit boards specifically tailored for 5G telecommunications infrastructure. This segment is vital for enabling the faster data processing and reduced latency required by 5G networks. Its necessity arises from the need for enhanced connectivity, supporting applications such as IoT devices, autonomous vehicles, and smart cities, thus expanding its end-use scope across telecommunications, automotive, and consumer electronics industries. Growth in this market is primarily driven by the global surge in demand for high-speed mobile broadband, rapid digitalization, and the proliferation of connected devices. Another key growth influencer is the increasing investment in 5G infrastructure by telecom companies and governments worldwide.

Recent opportunities lie in the extensive development and roll-out of 5G networks, particularly in emerging markets which are investing in next-generation infrastructure to boost economic growth. Companies can capitalize on this by innovating in materials that offer better thermal management and signal integrity, crucial for 5G applications. However, challenges such as the high cost of developing advanced PCB materials, the complexity of integrating them into existing 5G systems, and the environmental impact of PCB manufacturing could hinder market growth. Firms should focus on the development of environmentally sustainable PCB manufacturing technologies to mitigate these challenges. Innovations in flexible PCBs, which can be used in compact and complex electronic devices, and research into bio-degradable materials, present significant future growth opportunities. The market is dynamic, characterized by rapid technological advancements and a high degree of competition, necessitating continuous innovation and strategic partnerships. To thrive, companies should invest in R&D, collaborate with 5G network developers, and leverage government incentives aimed at technological advancements. In conclusion, the 5G PCB market offers substantial growth prospects, driven by the global shift towards high-speed connectivity, though balanced with challenges that necessitate strategic foresight and sustainable practices.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving 5G Printed Circuit Board Market

The 5G Printed Circuit Board Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Growing implementation of 5G technology in automotive driving market expansion for 5G printed circuit boards
  • The rapid development of smart cities necessitating advanced 5G printed circuit board solutions
  • Expansion of 5G networks in emerging markets fueling demand for printed circuit boards
  • Surge in mobile data traffic increasing the need for reliable 5G printed circuit board technologies
• Market Restraints
  • Consumer electronics manufacturers' demand for smaller and more efficient 5G PCBs creates production challenges
  • Limited availability of raw materials required for 5G PCB manufacturing in the aerospace industry
• Market Opportunities
  • Automotive sector transitioning to 5G technology requiring advanced printed circuit boards
  • Healthcare sector leveraging 5G printed circuit boards for enhanced medical device connectivity
  • Industrial automation and robotics driven by 5G advancements in printed circuit board technology
• Market Challenges
  • Technical complexity and design constraints

Porter's Five Forces: A Strategic Tool for Navigating the 5G Printed Circuit Board Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the 5G Printed Circuit Board Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the 5G Printed Circuit Board Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the 5G Printed Circuit Board Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the 5G Printed Circuit Board Market

A detailed market share analysis in the 5G Printed Circuit Board Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the 5G Printed Circuit Board Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the 5G Printed Circuit Board Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the 5G Printed Circuit Board Market

A strategic analysis of the 5G Printed Circuit Board Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the 5G Printed Circuit Board Market, highlighting leading vendors and their innovative profiles. These include AT&S, Chin Poon Industrial, Compeq Manufacturing Co. Ltd., Ellington Electronics Technology Co., Ltd., Flex Ltd., HannStar Board, Ibiden Co. Ltd., Kingboard Holdings Limited, Kinwong Electronic, Meiko Electronics, Nanya PCB, Nippon Mektron Ltd., Samsung Electro-Mechanics, Sanmina Corporation, Shennan Circuits, Tripod Technology Corporation, TTM Technologies, Unimicron Technology Corporation, WUS Printed Circuit Co. Inc., and Zhen Ding Technology Holding Limited.

Market Segmentation & Coverage

This research report categorizes the 5G Printed Circuit Board Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on By Application, market is studied across Automotive, Consumer Electronics, Healthcare, Industrial, and Telecommunications. The Automotive is further studied across Advanced Driver-Assistance Systems (ADAS), Infotainment Systems, and Vehicle-To-Everything (V2X) Communication. The Consumer Electronics is further studied across Smartphones, Tablets, and Wearables. The Healthcare is further studied across Remote Monitoring, Telemedicine, and Wearable Health Devices. The Industrial is further studied across Industrial IoT (IIoT), Robotics, and Smart Manufacturing. The Telecommunications is further studied across 5G Base Stations, 5G Network Equipment, and 5G Small Cells.
• Based on By Material Type, market is studied across Flexible PCBs, Rigid PCBs, and Rigid-Flex PCBs. The Flexible PCBs is further studied across Double-Sided, Multi-Layer, and Single-Sided. The Rigid PCBs is further studied across Double-Sided, Multi-Layer, and Single-Sided.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Growing implementation of 5G technology in automotive driving market expansion for 5G printed circuit boards
    • 5.1.1.2. The rapid development of smart cities necessitating advanced 5G printed circuit board solutions
    • 5.1.1.3. Expansion of 5G networks in emerging markets fueling demand for printed circuit boards
    • 5.1.1.4. Surge in mobile data traffic increasing the need for reliable 5G printed circuit board technologies
  • 5.1.2. Restraints
    • 5.1.2.1. Consumer electronics manufacturers' demand for smaller and more efficient 5G PCBs creates production challenges
    • 5.1.2.2. Limited availability of raw materials required for 5G PCB manufacturing in the aerospace industry
  • 5.1.3. Opportunities
    • 5.1.3.1. Automotive sector transitioning to 5G technology requiring advanced printed circuit boards
    • 5.1.3.2. Healthcare sector leveraging 5G printed circuit boards for enhanced medical device connectivity
    • 5.1.3.3. Industrial automation and robotics driven by 5G advancements in printed circuit board technology
  • 5.1.4. Challenges
    • 5.1.4.1. Technical complexity and design constraints
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. 5G Printed Circuit Board Market, by By Application

• 6.1. Introduction
• 6.2. Automotive
  • 6.2.1. Advanced Driver-Assistance Systems (ADAS)
  • 6.2.2. Infotainment Systems
  • 6.2.3. Vehicle-To-Everything (V2X) Communication
• 6.3. Consumer Electronics
  • 6.3.1. Smartphones
  • 6.3.2. Tablets
  • 6.3.3. Wearables
• 6.4. Healthcare
  • 6.4.1. Remote Monitoring
  • 6.4.2. Telemedicine
  • 6.4.3. Wearable Health Devices
• 6.5. Industrial
  • 6.5.1. Industrial IoT (IIoT)
  • 6.5.2. Robotics
  • 6.5.3. Smart Manufacturing
• 6.6. Telecommunications
  • 6.6.1. 5G Base Stations
  • 6.6.2. 5G Network Equipment
  • 6.6.3. 5G Small Cells

7. 5G Printed Circuit Board Market, by By Material Type

• 7.1. Introduction
• 7.2. Flexible PCBs
  • 7.2.1. Double-Sided
  • 7.2.2. Multi-Layer
  • 7.2.3. Single-Sided
• 7.3. Rigid PCBs
  • 7.3.1. Double-Sided
  • 7.3.2. Multi-Layer
  • 7.3.3. Single-Sided
• 7.4. Rigid-Flex PCBs

8. Americas 5G Printed Circuit Board Market

• 8.1. Introduction
• 8.2. Argentina
• 8.3. Brazil
• 8.4. Canada
• 8.5. Mexico
• 8.6. United States

9. Asia-Pacific 5G Printed Circuit Board Market

• 9.1. Introduction
• 9.2. Australia
• 9.3. China
• 9.4. India
• 9.5. Indonesia
• 9.6. Japan
• 9.7. Malaysia
• 9.8. Philippines
• 9.9. Singapore
• 9.10. South Korea
• 9.11. Taiwan
• 9.12. Thailand
• 9.13. Vietnam

10. Europe, Middle East & Africa 5G Printed Circuit Board Market

• 10.1. Introduction
• 10.2. Denmark
• 10.3. Egypt
• 10.4. Finland
• 10.5. France
• 10.6. Germany
• 10.7. Israel
• 10.8. Italy
• 10.9. Netherlands
• 10.10. Nigeria
• 10.11. Norway
• 10.12. Poland
• 10.13. Qatar
• 10.14. Russia
• 10.15. Saudi Arabia
• 10.16. South Africa
• 10.17. Spain
• 10.18. Sweden
• 10.19. Switzerland
• 10.20. Turkey
• 10.21. United Arab Emirates
• 10.22. United Kingdom

11. Competitive Landscape

• 11.1. Market Share Analysis, 2023
• 11.2. FPNV Positioning Matrix, 2023
• 11.3. Competitive Scenario Analysis
• 11.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. AT&S
• 2. Chin Poon Industrial
• 3. Compeq Manufacturing Co. Ltd.
• 4. Ellington Electronics Technology Co., Ltd.
• 5. Flex Ltd.
• 6. HannStar Board
• 7. Ibiden Co. Ltd.
• 8. Kingboard Holdings Limited
• 9. Kinwong Electronic
• 10. Meiko Electronics
• 11. Nanya PCB
• 12. Nippon Mektron Ltd.
• 13. Samsung Electro-Mechanics
• 14. Sanmina Corporation
• 15. Shennan Circuits
• 16. Tripod Technology Corporation
• 17. TTM Technologies
• 18. Unimicron Technology Corporation
• 19. WUS Printed Circuit Co. Inc.
• 20. Zhen Ding Technology Holding Limited