기판 대 기판 커넥터 시장 : 제품, 방향, 재료, 패키지 옵션, 최종 사용 산업별 - 세계 예측(2025-2030년)

The Board-to-board Connector Market was valued at USD 4.33 billion in 2023, expected to reach USD 4.57 billion in 2024, and is projected to grow at a CAGR of 6.05%, to USD 6.53 billion by 2030.

Board-to-board connectors serve as essential components in electronic devices, enabling communication between two or more printed circuit boards (PCBs). These connectors are crucial for ensuring reliable signal transmission and power distribution in various electronic applications. Their adoption is widespread across industries like consumer electronics, automotive, aerospace, and telecommunications, primarily driven by the increasing sophistication and miniaturization of electronic products. The market growth for board-to-board connectors is propelled by the surge in connected devices and the Internet of Things (IoT), the rapid advancement in technology driving innovation, and the ongoing development of autonomous vehicles, which require complex electronic systems. However, challenges such as the high cost of advanced connectors, the need for robust reliability and performance standards, and the complexity of design and integration may impede market growth. Despite these challenges, opportunities lie in the development of connectors that support higher data rates and power capabilities, as well as sustainable materials that meet environmental regulations. Market participants should focus on enhancing connector durability and miniaturization, which are paramount due to the increasing need for more compact and reliable electronic systems. Furthermore, investment in research related to developing connectors that can endure harsh environments and integrate with flexible electronics could yield significant returns. The market offers immense scope for innovation in areas such as push-fit designs for easier assembly and maintenance, and materials innovation aimed at enhancing thermal management and electromagnetic interference (EMI) shielding. Although competitive, the market is vibrant with opportunities for companies that can effectively address these new application demands and prioritize resilience and adaptability in product design, thereby aligning their offerings with emerging technological trends and addressing evolving customer needs effectively.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Board-to-board Connector Market

The Board-to-board Connector Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Growing adoption of advanced electronics and miniaturization in consumer devices and applications
  • Rising demand for high-speed data transmission and connectivity solutions
  • Increasing investments in industrial automation and electric vehicles driving connector demand
  • Development of innovative and customized board-to-board connectors for specific industry applications
• Market Restraints
  • Limited availability and supply chain disruptions of critical components for board-to-board connectors
  • Technological advancements leading to rapid obsolescence and increased R&D costs in the board-to-board connector market
• Market Opportunities
  • Growing demand for miniaturization in electronics driving the board-to-board connectors market
  • Expansion of IoT devices necessitating advanced board-to-board connector solutions
  • Increasing adoption of electric vehicles boosting the need for reliable board-to-board connectors
• Market Challenges
  • Evolving customer demands and expectations driving innovation and customization in board-to-board connector solutions
  • Supply chain disruptions and component shortages causing delays and increased costs in board-to-board connector manufacturing

Porter's Five Forces: A Strategic Tool for Navigating the Board-to-board Connector Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Board-to-board Connector Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Board-to-board Connector Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Board-to-board Connector Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Board-to-board Connector Market

A detailed market share analysis in the Board-to-board Connector Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Board-to-board Connector Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Board-to-board Connector Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Board-to-board Connector Market

A strategic analysis of the Board-to-board Connector Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Board-to-board Connector Market, highlighting leading vendors and their innovative profiles. These include Amphenol Corporation, AUK Contractors Co., Ltd., E Connector Solutions, Inc., GCT by Aloco Group Limited, Harting Technology Group, Hirose Electric Co., Ltd., Hon Hai Precision Industry Co. Ltd., Japan Aviation Electronics Industry, Ltd., JST Corporation, Kyocera Corporation, Molex LLC, Omron Corporation, Panasonic Corporation, Phoenix Contact, Rosenberger Hochfrequenztechnik GmbH & Co. KG, Samtec, Tarng Yu Enterprise Co. Ltd., TE Connectivity Ltd., Wurth Elektronik, and Yamaichi Electronics Co., Ltd..

Market Segmentation & Coverage

This research report categorizes the Board-to-board Connector Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Product, market is studied across Memory Card Connectors, Mezzanine Connectors, Pin Headers, Shrouded Headers, Socket Strips, and Unshrouded Headers.
• Based on Orientation, market is studied across Horizontal, Parallel, and Perpendicular.
• Based on Material, market is studied across Composite Materials, Metal, and Plastic.
• Based on Packaging option, market is studied across Bulk, Custom packaging, Tape and Reel (T&R), Trays, and Tubes.
• Based on End-Use Industry, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, Healthcare, Industrial, and Telecommunications.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Growing adoption of advanced electronics and miniaturization in consumer devices and applications
    • 5.1.1.2. Rising demand for high-speed data transmission and connectivity solutions
    • 5.1.1.3. Increasing investments in industrial automation and electric vehicles driving connector demand
    • 5.1.1.4. Development of innovative and customized board-to-board connectors for specific industry applications
  • 5.1.2. Restraints
    • 5.1.2.1. Limited availability and supply chain disruptions of critical components for board-to-board connectors
    • 5.1.2.2. Technological advancements leading to rapid obsolescence and increased R&D costs in the board-to-board connector market
  • 5.1.3. Opportunities
    • 5.1.3.1. Growing demand for miniaturization in electronics driving the board-to-board connectors market
    • 5.1.3.2. Expansion of IoT devices necessitating advanced board-to-board connector solutions
    • 5.1.3.3. Increasing adoption of electric vehicles boosting the need for reliable board-to-board connectors
  • 5.1.4. Challenges
    • 5.1.4.1. Evolving customer demands and expectations driving innovation and customization in board-to-board connector solutions
    • 5.1.4.2. Supply chain disruptions and component shortages causing delays and increased costs in board-to-board connector manufacturing
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Board-to-board Connector Market, by Product

• 6.1. Introduction
• 6.2. Memory Card Connectors
• 6.3. Mezzanine Connectors
• 6.4. Pin Headers
• 6.5. Shrouded Headers
• 6.6. Socket Strips
• 6.7. Unshrouded Headers

7. Board-to-board Connector Market, by Orientation

• 7.1. Introduction
• 7.2. Horizontal
• 7.3. Parallel
• 7.4. Perpendicular

8. Board-to-board Connector Market, by Material

• 8.1. Introduction
• 8.2. Composite Materials
• 8.3. Metal
• 8.4. Plastic

9. Board-to-board Connector Market, by Packaging option

• 9.1. Introduction
• 9.2. Bulk
• 9.3. Custom packaging
• 9.4. Tape and Reel (T&R)
• 9.5. Trays
• 9.6. Tubes

10. Board-to-board Connector Market, by End-Use Industry

• 10.1. Introduction
• 10.2. Aerospace & Defense
• 10.3. Automotive
• 10.4. Consumer Electronics
• 10.5. Healthcare
• 10.6. Industrial
• 10.7. Telecommunications

11. Americas Board-to-board Connector Market

• 11.1. Introduction
• 11.2. Argentina
• 11.3. Brazil
• 11.4. Canada
• 11.5. Mexico
• 11.6. United States

12. Asia-Pacific Board-to-board Connector Market

• 12.1. Introduction
• 12.2. Australia
• 12.3. China
• 12.4. India
• 12.5. Indonesia
• 12.6. Japan
• 12.7. Malaysia
• 12.8. Philippines
• 12.9. Singapore
• 12.10. South Korea
• 12.11. Taiwan
• 12.12. Thailand
• 12.13. Vietnam

13. Europe, Middle East & Africa Board-to-board Connector Market

• 13.1. Introduction
• 13.2. Denmark
• 13.3. Egypt
• 13.4. Finland
• 13.5. France
• 13.6. Germany
• 13.7. Israel
• 13.8. Italy
• 13.9. Netherlands
• 13.10. Nigeria
• 13.11. Norway
• 13.12. Poland
• 13.13. Qatar
• 13.14. Russia
• 13.15. Saudi Arabia
• 13.16. South Africa
• 13.17. Spain
• 13.18. Sweden
• 13.19. Switzerland
• 13.20. Turkey
• 13.21. United Arab Emirates
• 13.22. United Kingdom

14. Competitive Landscape

• 14.1. Market Share Analysis, 2023
• 14.2. FPNV Positioning Matrix, 2023
• 14.3. Competitive Scenario Analysis
  • 14.3.1. Kyocera unveils 5814 Series 0.3mm pitch board-to-board connectors starting February 2024, enhancing smartphones and wearables with innovative space-saving design and rapid charging support
  • 14.3.2. Japan Aviation Electronics introduces DW11 Series: high-power floating board-to-board connector for efficiency in high-speed data devices, aiming at ICT and industrial sectors.
  • 14.3.3. New DF40T series from Hirose Electric enhances automotive applications with floating plug for better alignment and high-speed data, potential for other markets.
• 14.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. Amphenol Corporation
• 2. AUK Contractors Co., Ltd.
• 3. E Connector Solutions, Inc.
• 4. GCT by Aloco Group Limited
• 5. Harting Technology Group
• 6. Hirose Electric Co., Ltd.
• 7. Hon Hai Precision Industry Co. Ltd.
• 8. Japan Aviation Electronics Industry, Ltd.
• 9. JST Corporation
• 10. Kyocera Corporation
• 11. Molex LLC
• 12. Omron Corporation
• 13. Panasonic Corporation
• 14. Phoenix Contact
• 15. Rosenberger Hochfrequenztechnik GmbH & Co. KG
• 16. Samtec
• 17. Tarng Yu Enterprise Co. Ltd.
• 18. TE Connectivity Ltd.
• 19. Wurth Elektronik
• 20. Yamaichi Electronics Co., Ltd.