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CMP Àåºñ ½ÃÀå : Á¦Ç° À¯Çü, ¿ëµµ, ±â¼ú ³ëµå, ÃÖÁ¾»ç¿ëÀÚ, ÆÇ¸Å ä³Îº° - ¼¼°è ¿¹Ãø(2025-2030³â)

CMP Equipment Market by Product Type, Application, Technology Node, End-User, Sales Channel - Global Forecast 2025-2030

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¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

CMP Àåºñ ½ÃÀåÀÇ 2023³â ½ÃÀå ±Ô¸ð´Â 56¾ï ´Þ·¯·Î 2024³â¿¡´Â 60¾ï 3,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµÇ¸ç, CAGR 7.95%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 95¾ï 7,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

CMP(È­ÇÐÀû ±â°èÀû Æòźȭ) Àåºñ ½ÃÀå¿¡´Â ¹ÝµµÃ¼ ¹× ÁýÀû ȸ·Î Á¦Á¶¿¡ ÇʼöÀûÀÎ ¸¶ÀÌÅ©·Î ¹× ³ª³ë ½ºÄÉÀÏ Ç¥¸éÀ» ÆòźȭÇϱâ À§ÇÑ µµ±¸ ¹× ±â°è°¡ Æ÷ÇԵǸç, CMP´Â ºÎǰ ¼ÒÇüÈ­ ¹× ¹ÝµµÃ¼ ±â¼ú ¹ßÀü¿¡ ÇʼöÀûÀΠǥ¸é Æòźȭ¸¦ Á¤¹ÐÇÏ°Ô Á¦¾îÇÒ ¼ö Àֱ⠶§¹®¿¡ ±× Çʿ伺Àº ÀüÀÚ±â±âÀÇ È¿À²°ú ¼º´É Çâ»ó¿¡ ´ëÇÑ ¿ä±¸¿¡¼­ ºñ·ÔµË´Ï´Ù. ÀÀ¿ë ¹üÀ§´Â ¹ÝµµÃ¼, Æ÷Åä´Ð½º, MEMS(¹Ì¼¼ Àü±â ±â°è ½Ã½ºÅÛ) »ê¾÷À¸·Î È®ÀåµË´Ï´Ù. ¹ÝµµÃ¼ °øÀå¿¡¼­´Â CMP¸¦ ÃÖÁ¾ ¿ëµµ¿¡ Ȱ¿ëÇÏ¿© ´ÙÃþ ĨÀÇ È¸·Î ÀûÃþ¿¡ ÇʼöÀûÀÎ ¿þÀÌÆÛ Ç¥¸éÀÇ °áÇÔ ¾ø´Â »óŸ¦ º¸ÀåÇÕ´Ï´Ù.

ÁÖ¿ä ½ÃÀå Åë°è
±âÁØ ¿¬µµ[2023] 56¾ï ´Þ·¯
¿¹Ãø ¿¬µµ[2024] 60¾ï 3,000¸¸ ´Þ·¯
¿¹Ãø ¿¬µµ[2030] 95¾ï 7,000¸¸ ´Þ·¯
CAGR(%) 7.95%

ÁÖ¿ä ¼ºÀå ¿äÀÎÀ¸·Î´Â ¼ÒÇü, °í¼º´É °¡ÀüÁ¦Ç°¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡¿Í Ĩ Á¦Á¶ÀÇ Ã·´Ü ³ëµå·ÎÀÇ ÀüȯÀ» µé ¼ö ÀÖÀ¸¸ç, Á¦Á¶¾÷ü´Â ÃÖ÷´Ü CMP ±â¼úÀ» äÅÃÇØ¾ß ÇÕ´Ï´Ù. Á¦Á¶ °øÁ¤¿¡¼­ AI¿Í IoTÀÇ ÅëÇÕÀº ƯÈ÷ CMP ÀåºñÀÇ ÀÚµ¿È­ ¹× È¿À²¼º Çâ»ó¿¡ ÀÖ¾î Å« ºñÁî´Ï½º ±âȸ¸¦ Á¦°øÇÕ´Ï´Ù. Àεµ, µ¿³²¾Æ½Ã¾Æ µî °­·ÂÇÑ µðÁöÅÐ Á¦Á¶ »ýŰ踦 ±¸ÃàÇÏ·Á´Â ½ÅÈï±¹ ½ÃÀåÀ» À§ÇÑ Àúºñ¿ë, °íÈ¿À² ¼Ö·ç¼ÇÀ» °³¹ßÇÔÀ¸·Î½á »õ·Î¿î ¼ºÀå Æ´»õ½ÃÀåÀ» ãÀ» ¼ö ÀÖ½À´Ï´Ù.

±×·¯³ª ÀÌ ½ÃÀåÀº ³ôÀº Ãʱâ ÅõÀÚ ºñ¿ë, ÷´Ü Àåºñ Ãë±ÞÀÇ º¹À⼺, ½½·¯¸® ó¸®¿Í °ü·ÃµÈ ȯ°æ ¹®Á¦ µîÀÇ ¹®Á¦¿¡ Á÷¸éÇØ ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ¾ö°ÝÇÑ ±ÔÁ¦¿Í ³ôÀº R&D ºñ¿ëµµ ¼ºÀå¿¡ °É¸²µ¹ÀÌ µÉ ¼ö ÀÖ½À´Ï´Ù. ½½·¯¸® ÀçȰ¿ëÀ» ÅëÇÑ È¯°æ ºÎÇÏ °¨¼Ò¿Í ´Ù¾çÇÑ ±âÁú¿¡ ´ëÀÀÇÒ ¼ö ÀÖ´Â ºñ¿ë È¿À²ÀûÀÌ°í ´ÙÀç´Ù´ÉÇÑ Àåºñ °³¹ß¿¡ ÁßÁ¡À» µÐ ±â¼ú Çõ½ÅÀº ´õ ¸¹Àº ÀáÀç·ÂÀ» À̲ø¾î ³¾ ¼ö ÀÖ½À´Ï´Ù. ½ÃÀåÀº ¾îÇöóÀÌµå ¸ÓÆ¼¾î¸®¾óÁî(Applied Materials), ·¥¸®¼­Ä¡(Lam Research) µî ¸î¸î ´ë±â¾÷ÀÌ ÁÖµµÇϰí ÀÖÁö¸¸, Æ´»õ ½ÃÀå¿¡¼­ Çõ½ÅÀûÀÎ ¼Ö·ç¼ÇÀ» Á¦°øÇÏ´Â Áß¼Ò±â¾÷¿¡°Ôµµ ±âȸ°¡ ¿­·Á ÀÖ½À´Ï´Ù. Àü¹ÝÀûÀ¸·Î CMP Àåºñ ½ÃÀåÀº °íµµÀÇ ±â¼ú ÁÖµµÇü ½ÃÀåÀ¸·Î, ºñ¿ë, È¿À²¼º, ȯ°æÀû Áö¼Ó°¡´É¼º °£ÀÇ ±ÕÇüÀ» À¯ÁöÇϸ鼭 ¹ÝµµÃ¼ »ê¾÷ÀÇ ¿ªµ¿ÀûÀÎ ¿ä±¸¿¡ ºÎÀÀÇϱâ À§ÇØ ²÷ÀÓ¾ø´Â ¹ßÀü°ú ÀûÀÀÀÌ ¿ä±¸µË´Ï´Ù.

½ÃÀå ¿ªÇÐ : ºü¸£°Ô ÁøÈ­ÇÏ´Â CMP Àåºñ ½ÃÀåÀÇ ÁÖ¿ä ½ÃÀå ÀλçÀÌÆ® °ø°³

CMP Àåºñ ½ÃÀåÀº ¼ö¿ä¿Í °ø±ÞÀÇ ¿ªµ¿ÀûÀÎ »óÈ£ÀÛ¿ë¿¡ ÀÇÇØ º¯È­Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ½ÃÀå ¿ªÇÐÀÇ ÁøÈ­¸¦ ÀÌÇØÇÔÀ¸·Î½á ±â¾÷Àº Á¤º¸¿¡ ÀÔ°¢ÇÑ ÅõÀÚ °áÁ¤À» ³»¸®°í, Àü·«Àû ÀÇ»ç°áÁ¤À» Á¤±³È­Çϸç, »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Æ÷ÂøÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Æ®·»µå¸¦ Á¾ÇÕÀûÀ¸·Î ÆÄ¾ÇÇÔÀ¸·Î½á ±â¾÷Àº Á¤Ä¡Àû, Áö¸®Àû, ±â¼úÀû, »çȸÀû, °æÁ¦Àû ¿µ¿ª Àü¹Ý¿¡ °ÉÄ£ ´Ù¾çÇÑ ¸®½ºÅ©¸¦ ÁÙÀÏ ¼ö ÀÖÀ¸¸ç, ¼ÒºñÀÚ Çൿ°ú ±×°ÍÀÌ Á¦Á¶ ºñ¿ë ¹× ±¸¸Å µ¿Çâ¿¡ ¹ÌÄ¡´Â ¿µÇâÀ» º¸´Ù ¸íÈ®ÇÏ°Ô ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

  • ½ÃÀå ÃËÁø¿äÀÎ
    • È­Çбâ°èÀû Æòźȭ Á¤¹Ðµµ°¡ ¿ä±¸µÇ´Â ÷´Ü ¹ÝµµÃ¼ ¼ÒÀÚ¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡
    • Çõ½ÅÀûÀÎ CMP Àåºñ ¼Ö·ç¼ÇÀÌ ÇÊ¿äÇÑ ¹ÝµµÃ¼ ¾÷°èÀÇ ½Å±â¼ú
    • CMP ÀåºñÀÇ È¿À²°ú ¼º´É Çâ»óÀ» À§ÇÑ R&D ÅõÀÚ Áõ°¡
    • CMP Àåºñ ½ÃÀå ¿ªÇп¡ ¿µÇâÀ» ¹ÌÄ¡´Â ¹ÝµµÃ¼ Á¦Á¶ÀÇ ¾ö°ÝÇÑ ±ÔÁ¦ ±âÁØ
  • ½ÃÀå ¾ïÁ¦¿äÀÎ
    • Àú°¡ Á¦Á¶¾÷ü¿ÍÀÇ °æÀï ½ÉÈ­·Î ÀÎÇÑ ¼öÀÍ·ü ¹× °¡°Ý Àü·«¿¡ ¹ÌÄ¡´Â ¿µÇâ
    • CMP Àåºñ Á¦Á¶¾÷üÀÇ ÄÄÇöóÀ̾𽺠ºñ¿ëÀ» Áõ°¡½ÃŰ´Â ¾ö°ÝÇÏ°Ô ÁøÈ­ÇÏ´Â ±ÔÁ¦ ¿ä°Ç
  • ½ÃÀå ±âȸ
    • ¹ÝµµÃ¼ »ê¾÷ ¹ßÀü¿¡ µû¸¥ È­Çбâ°è Æòźȭ Àåºñ ½ÃÀåÀÇ »õ·Î¿î ºñÁî´Ï½º ±âȸ
    • CMP Àåºñ ½ÃÀåÀÇ Àü·«Àû ¼ºÀå Àü¸Á : 5G¿Í »ç¹°ÀÎÅͳÝÀÇ µµÀÔ¿¡ ÁÖ¸ñ
    • ÀΰøÁö´É ¾ÖÇø®ÄÉÀ̼ÇÀÇ È®´ë º¸±ÞÀ¸·Î CMP Àåºñ ½ÃÀåÀÇ ÀáÀç ¼ö¿ä °³Ã´
  • ½ÃÀå °úÁ¦
    • CMP Àåºñ ½ÃÀåÀÌ Á÷¸é ÇÑ ÁÖ¿ä ½ÃÀå °úÁ¦
    • CMP Àåºñ ½ÃÀåÀÌ Á÷¸éÇÑ ÁÖ¿ä »ê¾÷º° ½ÃÀå °úÁ¦

Porter's Five Forces : CMP Àåºñ ½ÃÀå Ž»öÀ» À§ÇÑ Àü·«Àû µµ±¸

Porter's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â CMP Àåºñ ½ÃÀåÀÇ °æÀï »óȲÀ» ÀÌÇØÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. Porter's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÇ °æÀï·ÂÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ Ž»öÇÒ ¼ö ÀÖ´Â ¸íÈ®ÇÑ ¹æ¹ýÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» ÆÇ´ÜÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÀλçÀÌÆ®¸¦ ÅëÇØ ±â¾÷Àº °­Á¡À» Ȱ¿ëÇÏ°í ¾àÁ¡À» º¸¿ÏÇϸç ÀáÀçÀûÀÎ µµÀüÀ» ÇÇÇÔÀ¸·Î½á º¸´Ù °­·ÂÇÑ ½ÃÀå Æ÷Áö¼Å´×À» È®º¸ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : CMP Àåºñ ½ÃÀåÀÇ ¿ÜºÎ ¿µÇâ ÆÄ¾Ç

PESTLE ºÐ¼®

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº CMP Àåºñ ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀο¡ ´ëÇÑ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ Á¦°øÇϸç, PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀû À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£µµ, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¼±Á¦ÀûÀ̰í Àû±ØÀûÀÎ ÀÇ»ç°áÁ¤À» ³»¸± Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® : CMP Àåºñ ½ÃÀå¿¡¼­ÀÇ °æÀï »óȲ ÆÄ¾Ç

CMP Àåºñ ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ °ø±Þ¾÷üÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¼öÀÍ, °í°´ ±â¹Ý, ¼ºÀå·ü°ú °°Àº ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀïÀû À§Ä¡¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®Àº ½ÃÀåÀÇ ÁýÁßÈ­, ´ÜÆíÈ­, ÅëÇÕÀÇ Ãß¼¼¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖÀ¸¸ç, °ø±Þ¾÷ü´Â Ä¡¿­ÇÑ °æÀï ¼Ó¿¡¼­ ÀÚ½ÅÀÇ ÀÔÁö¸¦ °­È­ÇÒ ¼ö ÀÖ´Â Àü·«Àû ÀÇ»ç°áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ ÀλçÀÌÆ®¸¦ ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º : CMP Àåºñ ½ÃÀå¿¡¼­ÀÇ º¥´õ ¼º´É Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â CMP Àåºñ ½ÃÀå¿¡¼­ º¥´õ¸¦ Æò°¡ÇÒ ¼ö ÀÖ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. ÀÌ ¸ÅÆ®¸¯½º¸¦ ÅëÇØ ºñÁî´Ï½º Á¶Á÷Àº º¥´õÀÇ ºñÁî´Ï½º Àü·«°ú Á¦Ç° ¸¸Á·µµ¸¦ ±â¹ÝÀ¸·Î Æò°¡ÇÏ¿© ¸ñÇ¥¿¡ ºÎÇÕÇÏ´Â Á¤º¸¿¡ ÀÔ°¢ÇÑ ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖÀ¸¸ç, 4°³ÀÇ »çºÐ¸éÀ¸·Î º¥´õ¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ¼¼ºÐÈ­ÇÏ¿© Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù.

CMP Àåºñ ½ÃÀå¿¡¼­ ¼º°øÇϱâ À§ÇÑ Àü·« ºÐ¼® ¹× Ãßõ CMP Àåºñ ½ÃÀå¿¡¼­ÀÇ ¼º°ø °æ·Î¸¦ ±×¸®´Ù

CMP Àåºñ ½ÃÀå Àü·« ºÐ¼®Àº ¼¼°è ½ÃÀå¿¡¼­ ÀÔÁö¸¦ °­È­ÇϰíÀÚ ÇÏ´Â ±â¾÷¿¡°Ô ÇʼöÀûÀÔ´Ï´Ù. ÁÖ¿ä ÀÚ¿ø, ¿ª·® ¹× ¼º°ú ÁöÇ¥¸¦ °ËÅäÇÔÀ¸·Î½á ±â¾÷Àº ¼ºÀå ±âȸ¸¦ ½Äº°ÇÏ°í °³¼±ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Á¢±Ù ¹æ½ÄÀ» ÅëÇØ ±â¾÷Àº °æÀï ȯ°æÀÇ µµÀüÀ» ±Øº¹ÇÏ°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Ȱ¿ëÇÏ¿© Àå±âÀûÀÎ ¼º°øÀ» °ÅµÑ ¼ö Àִ ü°è¸¦ ±¸ÃàÇÒ ¼ö ÀÖ½À´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ Æ÷°ýÇÏ´Â ½ÃÀå¿¡ ´ëÇÑ Á¾ÇÕÀûÀÎ ºÐ¼®À» Á¦°øÇÕ´Ï´Ù.

1. ½ÃÀå ħÅõµµ : ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·Â Æò°¡.

2. ½ÃÀå °³Ã´µµ : ½ÅÈï ½ÃÀå¿¡¼­ÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇϰí, ±âÁ¸ ºÐ¾ßÀÇ È®Àå °¡´É¼ºÀ» Æò°¡Çϸç, ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» Á¦°øÇÕ´Ï´Ù.

3. ½ÃÀå ´Ù°¢È­ : ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, ¾÷°èÀÇ ÁÖ¿ä ¹ßÀü, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï »óȲÀ» öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ÀÇ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú ¹ßÀü µîÀ» °ËÅäÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ÇâÈÄ ½ÃÀå ¼ºÀåÀ» ÃËÁøÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÷´Ü ±â¼ú, ¿¬±¸ °³¹ß Ȱµ¿ ¹× Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

ÀÌÇØ°ü°èÀÚµéÀÌ ÃæºÐÇÑ Á¤º¸¸¦ ¹ÙÅÁÀ¸·Î ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖµµ·Ï ´ÙÀ½°ú °°Àº Áß¿äÇÑ Áú¹®¿¡ ´ëÇÑ ´äº¯µµ Á¦°øÇÕ´Ï´Ù.

1. ÇöÀç ½ÃÀå ±Ô¸ð¿Í ÇâÈÄ ¼ºÀå Àü¸ÁÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, ºÎ¹®, Áö¿ªÀº ¾îµðÀΰ¡?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ°ú ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õÀÇ ½ÃÀå Á¡À¯À²°ú °æÀï Æ÷Áö¼ÇÀº?

5. º¥´õÀÇ ½ÃÀå ÁøÀÔ ¹× ö¼ö Àü·«ÀÇ ¿øµ¿·ÂÀÌ µÇ´Â ¼öÀÍ¿ø°ú Àü·«Àû ±âȸ´Â ¹«¾ùÀΰ¡?

¸ñÂ÷

Á¦1Àå ¼­¹®

Á¦2Àå Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ½ÃÀå °³¿ä

Á¦5Àå ½ÃÀå ÀλçÀÌÆ®

  • ½ÃÀå ¿ªÇÐ
    • ¼ºÀå ÃËÁø¿äÀÎ
    • ¼ºÀå ¾ïÁ¦¿äÀÎ
    • ±âȸ
    • °úÁ¦
  • ½ÃÀå ¼¼ºÐÈ­ ºÐ¼®
  • Porter's Five Forces ºÐ¼®
  • PESTEL ºÐ¼®
    • Á¤Ä¡
    • °æÁ¦
    • »çȸ
    • ±â¼ú
    • ¹ý·ü
    • ȯ°æ

Á¦6Àå CMP Àåºñ ½ÃÀå : Á¦Ç° À¯Çüº°

  • û¼Ò ¿ë±¸
  • °èÃø ±â±â
  • ¿¬¸¶ Àåºñ
    • CMP ÆÐµå ÄÁµð¼Å³Ê
    • CMP ½½·¯¸®

Á¦7Àå CMP Àåºñ ½ÃÀå : ¿ëµµº°

  • ÅëÇÕ µð¹ÙÀ̽º Á¦Á¶¾÷ü
  • ¸Þ¸ð¸® Á¦Á¶¾÷ü
  • ¹ÝµµÃ¼ ÆÄ¿îµå¸®

Á¦8Àå CMP Àåºñ ½ÃÀå : ±â¼ú ³ëµåº°

  • 10nm
  • 14nm
  • 5nm
  • 7nm

Á¦9Àå CMP Àåºñ ½ÃÀå : ÃÖÁ¾»ç¿ëÀÚº°

  • Ç×°ø¿ìÁÖ ¹× ¹æÀ§
  • ÀÚµ¿Â÷
  • °¡Àü
  • ÀÇ·á±â±â

Á¦10Àå CMP Àåºñ ½ÃÀå : ÆÇ¸Å ä³Îº°

  • Á÷Á¢ ÆÇ¸Å
  • ÆÇ¸Å´ë¸®Á¡
  • ¿Â¶óÀÎ ÆÇ¸Å

Á¦11Àå ¾Æ¸Þ¸®Ä«ÀÇ CMP Àåºñ ½ÃÀå

  • ¾Æ¸£ÇîÆ¼³ª
  • ºê¶óÁú
  • ij³ª´Ù
  • ¸ß½ÃÄÚ
  • ¹Ì±¹

Á¦12Àå ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ CMP Àåºñ ½ÃÀå

  • È£ÁÖ
  • Áß±¹
  • Àεµ
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The CMP Equipment Market was valued at USD 5.60 billion in 2023, expected to reach USD 6.03 billion in 2024, and is projected to grow at a CAGR of 7.95%, to USD 9.57 billion by 2030.

The CMP (Chemical Mechanical Planarization) Equipment market involves tools and machinery used for smoothing surfaces at the micro and nano scale, essential for semiconductor and integrated circuit manufacturing. Its necessity arises from the demand for higher efficiency and performance in electronic devices, as CMP offers precise control over surface planarization, crucial for the miniaturization of components and advancement of semiconductor technology. The application scope extends to semiconductor, photonics, and MEMS (Micro-Electro-Mechanical Systems) industries. Semiconductor fabs utilize CMP in end-use applications to ensure flawless wafer surfaces, critical for layering circuits in multi-layer chips.

KEY MARKET STATISTICS
Base Year [2023] USD 5.60 billion
Estimated Year [2024] USD 6.03 billion
Forecast Year [2030] USD 9.57 billion
CAGR (%) 7.95%

Key growth drivers include the rising demand for smaller, more powerful consumer electronics, and the transition toward advanced nodes in chip fabrication, urging manufacturers to employ cutting-edge CMP technology. The integration of AI and IoT in manufacturing processes presents substantial opportunities, particularly in improving the automation and efficiency of CMP equipment. Emerging growth niches can be found in developing low-cost, high-efficiency solutions tailored for new, upcoming markets like India and Southeast Asia, which are striving to establish strong digital manufacturing ecosystems.

However, the market faces challenges such as high initial investment costs, complexity in handling sophisticated equipment, and environmental concerns related to slurry disposal. Stringent regulations and high R&D expenses can also impede growth. Innovations focusing on reducing environmental impact through slurry recycling methods and developing cost-efficient, versatile equipment capable of handling varying substrate materials may unlock further potential. The market is largely dominated by a few giants, including Applied Materials and Lam Research, with growing opportunities for smaller players offering niche, innovative solutions. Overall, the CMP Equipment market is highly technology-driven, requiring constant advancements and adaptations to meet the dynamic needs of the semiconductor industry while balancing cost, efficiency, and environmental sustainability.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving CMP Equipment Market

The CMP Equipment Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Increasing demand for advanced semiconductor devices requiring precision in chemical mechanical planarization
    • Emerging technologies in the semiconductor industry necessitating innovative CMP equipment solutions
    • Growing investment in research and development for enhancing CMP equipment efficiency and performance
    • Stringent regulatory standards for semiconductor manufacturing impacting CMP equipment market dynamics
  • Market Restraints
    • Intensified competition from lower-cost based manufacturers affecting profit margins and pricing strategies
    • Stringent and evolving regulatory requirements increasing compliance costs for CMP equipment manufacturers
  • Market Opportunities
    • Emerging opportunities in chemical mechanical planarization equipment market driven by semiconductor industry advancements
    • Strategic growth prospects in cmp equipment market with focus on adoption of 5g and internet of things
    • Exploring high demand potential in cmp equipment market due to increasing deployment of artificial intelligence applications
  • Market Challenges
    • Primary market challenges faced by CMP equipment market
    • Primary industry-specific market challenges faced by CMP equipment market

Porter's Five Forces: A Strategic Tool for Navigating the CMP Equipment Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the CMP Equipment Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the CMP Equipment Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the CMP Equipment Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the CMP Equipment Market

A detailed market share analysis in the CMP Equipment Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the CMP Equipment Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the CMP Equipment Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the CMP Equipment Market

A strategic analysis of the CMP Equipment Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the CMP Equipment Market, highlighting leading vendors and their innovative profiles. These include Advanced Dicing Technologies Ltd., Applied Materials, Inc., ASML Holding N.V., Axcelis Technologies, Inc., CIMPOR Technologies, Inc., Disco Corporation, Ebara Corporation, EV Group, GlobalFoundries Inc., Hitachi High-Technologies Corporation, Intevac, Inc., KLA Corporation, Lam Research Corporation, Mitsubishi Electric Corporation, ON Semiconductor Corporation, Screen Holdings Co., Ltd., Semes Co., Ltd., Tokyo Electron Limited, ULVAC, Inc., and Veeco Instruments Inc..

Market Segmentation & Coverage

This research report categorizes the CMP Equipment Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Product Type, market is studied across Cleaning Equipment, Metrology Equipment, and Polishing Equipment. The Polishing Equipment is further studied across CMP Pad Conditioners and CMP Slurries.
  • Based on Application, market is studied across Integrated Device Manufacturer, Memory Manufacturer, and Semiconductor Foundry.
  • Based on Technology Node, market is studied across 10nm, 14nm, 5nm, and 7nm.
  • Based on End-User, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, and Medical Devices.
  • Based on Sales Channel, market is studied across Direct Sales, Distributors, and Online Sales.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Increasing demand for advanced semiconductor devices requiring precision in chemical mechanical planarization
      • 5.1.1.2. Emerging technologies in the semiconductor industry necessitating innovative CMP equipment solutions
      • 5.1.1.3. Growing investment in research and development for enhancing CMP equipment efficiency and performance
      • 5.1.1.4. Stringent regulatory standards for semiconductor manufacturing impacting CMP equipment market dynamics
    • 5.1.2. Restraints
      • 5.1.2.1. Intensified competition from lower-cost based manufacturers affecting profit margins and pricing strategies
      • 5.1.2.2. Stringent and evolving regulatory requirements increasing compliance costs for CMP equipment manufacturers
    • 5.1.3. Opportunities
      • 5.1.3.1. Emerging opportunities in chemical mechanical planarization equipment market driven by semiconductor industry advancements
      • 5.1.3.2. Strategic growth prospects in cmp equipment market with focus on adoption of 5g and internet of things
      • 5.1.3.3. Exploring high demand potential in cmp equipment market due to increasing deployment of artificial intelligence applications
    • 5.1.4. Challenges
      • 5.1.4.1. Primary market challenges faced by CMP equipment market
      • 5.1.4.2. Primary industry-specific market challenges faced by CMP equipment market
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. CMP Equipment Market, by Product Type

  • 6.1. Introduction
  • 6.2. Cleaning Equipment
  • 6.3. Metrology Equipment
  • 6.4. Polishing Equipment
    • 6.4.1. CMP Pad Conditioners
    • 6.4.2. CMP Slurries

7. CMP Equipment Market, by Application

  • 7.1. Introduction
  • 7.2. Integrated Device Manufacturer
  • 7.3. Memory Manufacturer
  • 7.4. Semiconductor Foundry

8. CMP Equipment Market, by Technology Node

  • 8.1. Introduction
  • 8.2. 10nm
  • 8.3. 14nm
  • 8.4. 5nm
  • 8.5. 7nm

9. CMP Equipment Market, by End-User

  • 9.1. Introduction
  • 9.2. Aerospace & Defense
  • 9.3. Automotive
  • 9.4. Consumer Electronics
  • 9.5. Medical Devices

10. CMP Equipment Market, by Sales Channel

  • 10.1. Introduction
  • 10.2. Direct Sales
  • 10.3. Distributors
  • 10.4. Online Sales

11. Americas CMP Equipment Market

  • 11.1. Introduction
  • 11.2. Argentina
  • 11.3. Brazil
  • 11.4. Canada
  • 11.5. Mexico
  • 11.6. United States

12. Asia-Pacific CMP Equipment Market

  • 12.1. Introduction
  • 12.2. Australia
  • 12.3. China
  • 12.4. India
  • 12.5. Indonesia
  • 12.6. Japan
  • 12.7. Malaysia
  • 12.8. Philippines
  • 12.9. Singapore
  • 12.10. South Korea
  • 12.11. Taiwan
  • 12.12. Thailand
  • 12.13. Vietnam

13. Europe, Middle East & Africa CMP Equipment Market

  • 13.1. Introduction
  • 13.2. Denmark
  • 13.3. Egypt
  • 13.4. Finland
  • 13.5. France
  • 13.6. Germany
  • 13.7. Israel
  • 13.8. Italy
  • 13.9. Netherlands
  • 13.10. Nigeria
  • 13.11. Norway
  • 13.12. Poland
  • 13.13. Qatar
  • 13.14. Russia
  • 13.15. Saudi Arabia
  • 13.16. South Africa
  • 13.17. Spain
  • 13.18. Sweden
  • 13.19. Switzerland
  • 13.20. Turkey
  • 13.21. United Arab Emirates
  • 13.22. United Kingdom

14. Competitive Landscape

  • 14.1. Market Share Analysis, 2023
  • 14.2. FPNV Positioning Matrix, 2023
  • 14.3. Competitive Scenario Analysis
  • 14.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Advanced Dicing Technologies Ltd.
  • 2. Applied Materials, Inc.
  • 3. ASML Holding N.V.
  • 4. Axcelis Technologies, Inc.
  • 5. CIMPOR Technologies, Inc.
  • 6. Disco Corporation
  • 7. Ebara Corporation
  • 8. EV Group
  • 9. GlobalFoundries Inc.
  • 10. Hitachi High-Technologies Corporation
  • 11. Intevac, Inc.
  • 12. KLA Corporation
  • 13. Lam Research Corporation
  • 14. Mitsubishi Electric Corporation
  • 15. ON Semiconductor Corporation
  • 16. Screen Holdings Co., Ltd.
  • 17. Semes Co., Ltd.
  • 18. Tokyo Electron Limited
  • 19. ULVAC, Inc.
  • 20. Veeco Instruments Inc.
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