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¼¼°èÀÇ ÀÓº£µðµå ºñÈֹ߼º ¸Þ¸ð¸® ½ÃÀå : ¸Þ¸ð¸® À¯Çü, ¿ëµµ, ÃÖÁ¾ »ç¿ëÀÚ »ê¾÷, ±â¼ú ³ëµå, ¹Ðµµ, ¼³°è ¾ÆÅ°ÅØÃ³, ÀÎÅÍÆäÀ̽ºº° ¿¹Ãø(2025-2030³â)

Embedded Non-Volatile Memory Market by Memory Type, Application, End User Industry, Technology Node, Density, Design Architecture, Interface - Global Forecast 2025-2030

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¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

ÀÓº£µðµå ºñÈֹ߼º ¸Þ¸ð¸® ½ÃÀåÀÇ 2023³â ½ÃÀå ±Ô¸ð´Â 8¾ï 1,505¸¸ ´Þ·¯·Î, 2024³â¿¡´Â 9¾ï 8,473¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, CAGR 20.12%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 29¾ï 4,214¸¸ ´Þ·¯¿¡ µµ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

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ºñ¿ë Àý°¨, ¸Þ¸ð¸® ¿ë·® Çâ»ó, Àü·Â È¿À² °³¼±¿¡ ÁßÁ¡À» µÐ R&D ÅõÀÚ´Â ±â¼ú Çõ½ÅÀÇ ÀÌ»óÀûÀÎ ¹æ¹ýÀÔ´Ï´Ù. Å©·Î½º¹Ù ¸Þ¸ð¸® ¾ÆÅ°ÅØÃ³ÀÇ Çõ½Å°ú ¸Þ¸ð¸® ÃÖÀûÈ­¸¦ À§ÇÑ ÀΰøÁö´É(AI)ÀÇ ÅëÇÕÀº Å« ¼ºÀå ±âȸ¸¦ °¡Á®¿Ã ¼ö ÀÖ½À´Ï´Ù. eNVM ½ÃÀåÀÇ ¼º°ÝÀº ¿ªµ¿ÀûÀÌ°í °æÀïÀûÀ̸ç, ²÷ÀÓ¾ø´Â ±â¼ú Áøº¸¿Í º¸´Ù °í¹Ðµµ·Î È¿À²ÀûÀÎ ¸Þ¸ð¸® ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¿ä±¸°¡ ¿øµ¿·ÂÀÌ µÇ°í ÀÖ½À´Ï´Ù. ÀÌ ºÐ¾ß¿¡¼­ ¼º°øÀ» ¸ñÇ¥·Î ÇÏ´Â ±â¾÷Àº Àü·«Àû ÆÄÆ®³Ê½ÊÀ» ¿ì¼±½ÃÇϰí ÀÎÁ¢ ±â¼úÀÇ Áøº¸¿¡ ´«À» µ¹·Á °¡Ä¡¸¦ ¾ò°í °æÀï·ÂÀ» À¯ÁöÇØ¾ß ÇÕ´Ï´Ù.

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Porter's Five Forces: ÀÓº£µðµå ºñÈֹ߼º ¸Þ¸ð¸® ½ÃÀåÀ» Ž»öÇÏ´Â Àü·« µµ±¸

Porter's Five Forces ÇÁ·¹ÀÓ ¿öÅ©´Â ÀÓº£µðµå ºñ Èֹ߼º ¸Þ¸ð¸® ½ÃÀå °æÀï ±¸µµ¸¦ ÀÌÇØÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. Porter's Five Force Framework´Â ±â¾÷ÀÇ °æÀï·ÂÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ ޱ¸ÇÏ´Â ¸íÈ®ÇÑ ±â¼úÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» °áÁ¤ÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÅëÂûÀ» ÅëÇØ ±â¾÷Àº ÀÚ»çÀÇ °­Á¡À» Ȱ¿ëÇϰí, ¾àÁ¡À» ÇØ°áÇϰí, ÀáÀçÀûÀÎ °úÁ¦¸¦ ÇÇÇÒ ¼ö ÀÖÀ¸¸ç, º¸´Ù °­ÀÎÇÑ ½ÃÀå¿¡¼­ÀÇ Æ÷Áö¼Å´×À» º¸ÀåÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : ÀÓº£µðµå ºñÈֹ߼º ¸Þ¸ð¸® ½ÃÀåÀÇ ¿ÜºÎ ¿µÇâÀ» ÆÄ¾Ç

¿ÜºÎ °Å½ÃÀû ȯ°æ ¿äÀÎÀº ÀÓº£µðµå ºñÈֹ߼º ¸Þ¸ð¸® ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇϴµ¥ À־ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀÎ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ Á¦°øÇÕ´Ï´Ù. PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀûÀÎ À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¾ÕÀ¸·Î ¿¹»óµÇ´Â Àû±ØÀûÀÎ ÀÇ»ç °áÁ¤À» ÇÒ Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® : ÀÓº£µðµå ºñ Èֹ߼º ¸Þ¸ð¸® ½ÃÀå °æÀï ±¸µµ ÆÄ¾Ç

ÀÓº£µðµå ºñÈֹ߼º ¸Þ¸ð¸® ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ °ø±Þ¾÷üÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¼öÀÍ, °í°´ ±â¹Ý, ¼ºÀå·ü µî ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀï Æ÷Áö¼Å´×À» ¹àÈú ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®À» ÅëÇØ ½ÃÀå ÁýÁß, ´ÜÆíÈ­, ÅëÇÕ µ¿ÇâÀ» ¹àÇô³»°í º¥´õµéÀº °æÀïÀÌ Ä¡¿­ÇØÁö´Â °¡¿îµ¥ ÀÚ»çÀÇ ÁöÀ§¸¦ ³ôÀÌ´Â Àü·«Àû ÀÇ»ç °áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ Áö½ÄÀ» ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º : ÀÓº£µðµå ºñ Èֹ߼º ¸Þ¸ð¸® ½ÃÀå¿¡¼­ °ø±Þ¾÷üÀÇ ¼º´É Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â ÀÓº£µðµå ºñÈֹ߼º ¸Þ¸ð¸® ½ÃÀå¿¡¼­ °ø±Þ¾÷ü¸¦ Æò°¡ÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. ÀÌ Çà·ÄÀ» ÅëÇØ ºñÁî´Ï½º Á¶Á÷Àº °ø±Þ¾÷üÀÇ ºñÁî´Ï½º Àü·«°ú Á¦Ç° ¸¸Á·µµ¸¦ ±âÁØÀ¸·Î Æò°¡ÇÏ¿© ¸ñÇ¥¿¡ ¸Â´Â ÃæºÐÇÑ Á¤º¸¸¦ ¹ÙÅÁÀ¸·Î ÀÇ»ç °áÁ¤À» ³»¸± ¼ö ÀÖ½À´Ï´Ù. ³× °¡Áö »çºÐ¸éÀ» ÅëÇØ °ø±Þ¾÷ü¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ¼¼ºÐÈ­ÇÏ¿© Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê ¹× ¼Ö·ç¼ÇÀ» ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù.

Àü·« ºÐ¼® ¹× ±ÇÀå : ÀÓº£µðµå ºñÈֹ߼º ¸Þ¸ð¸® ½ÃÀå¿¡¼­ ¼º°øÀ» À§ÇÑ ±æÀ» ±×¸®±â

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ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ Æ÷°ýÇÏ´Â ½ÃÀåÀÇ Á¾ÇÕÀûÀÎ ºÐ¼®À» Á¦°øÇÕ´Ï´Ù.

1. ½ÃÀå ħÅõ: ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·Â Æò°¡.

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4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú Áøº¸ µîÀ» °ËÁõÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ¹Ì·¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÃÖ÷´Ü ±â¼ú, R&D Ȱµ¿, Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

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JHS 24.10.30

The Embedded Non-Volatile Memory Market was valued at USD 815.05 million in 2023, expected to reach USD 984.73 million in 2024, and is projected to grow at a CAGR of 20.12%, to USD 2,942.14 million by 2030.

Embedded Non-Volatile Memory (eNVM) is a crucial semiconductor technology that retains data even when power is off, playing a vital role in diverse electronics applications. The necessity of eNVM is underscored by its ability to enhance the performance and efficiency of consumer electronics, automotive electronics, industrial applications, and IoT devices by offering reliable data storage and management solutions. Its application scope is broad, encompassing microcontrollers, IoT devices, wearables, automotive electronics, smart cards, and various other forms of embedded systems. The end-use industries heavily relying on eNVM are automotive, aerospace, telecom, and consumer electronics, which leverage the technology for features like firmware storage, data logging, and code storage.

KEY MARKET STATISTICS
Base Year [2023] USD 815.05 million
Estimated Year [2024] USD 984.73 million
Forecast Year [2030] USD 2,942.14 million
CAGR (%) 20.12%

Key growth factors include the burgeoning IoT market and the increasing complexity of electronic devices necessitating efficient memory storage solutions. The expansion of smart consumer electronics and industrial automation also drives demand. Potential opportunities lie in developing eNVM technologies to meet emerging needs for higher performance, power efficiency, and miniaturization, particularly in 5G technology and autonomous vehicles. However, the market faces limitations such as high initial costs of technology development, integration challenges with other semiconductor components, and rapid technological obsolescence. The development of alternatives like Ferroelectric RAM (FRAM) and Magnetoresistive RAM (MRAM) could also pose competitive challenges.

Investments in research and development focusing on reducing costs, enhancing memory capacity, and improving power efficiency are ideal paths for innovation. Innovations in cross-bar memory architectures or the integration of Artificial Intelligence (AI) for memory optimization could offer substantial growth opportunities. The nature of the eNVM market is dynamic and competitive, driven by continuous technological advancements and the need for higher density and more efficient memory solutions. Companies aiming for success in this space should prioritize strategic partnerships and keep a keen eye on advancements in adjacent technologies to capture value and maintain competitive edge.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Embedded Non-Volatile Memory Market

The Embedded Non-Volatile Memory Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Increased implementation of embedded non-volatile memory in medical devices and healthcare technology
    • Surge in demand for compact and low-power memory solutions in wearable electronics
    • Expansion of artificial intelligence and machine learning applications necessitating reliable memory storage
    • Trend towards miniaturization and high-density storage solutions in the industrial automation sector
  • Market Restraints
    • Scalability limitations due to increased complexity of embedded non-volatile memory in advanced applications
    • Supply chain vulnerabilities and dependency on raw material availability in the embedded non-volatile memory market
  • Market Opportunities
    • Increasing demand for embedded non-volatile memory in artificial intelligence and machine learning applications
    • Opportunities in the integration of embedded non-volatile memory with Internet of Things (IoT) devices
    • Development of secure and reliable embedded non-volatile memory for medical devices and healthcare applications
  • Market Challenges
    • Addressing security vulnerabilities associated with data retention in embedded non-volatile memory components

Porter's Five Forces: A Strategic Tool for Navigating the Embedded Non-Volatile Memory Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Embedded Non-Volatile Memory Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Embedded Non-Volatile Memory Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Embedded Non-Volatile Memory Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Embedded Non-Volatile Memory Market

A detailed market share analysis in the Embedded Non-Volatile Memory Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Embedded Non-Volatile Memory Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Embedded Non-Volatile Memory Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Embedded Non-Volatile Memory Market

A strategic analysis of the Embedded Non-Volatile Memory Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Embedded Non-Volatile Memory Market, highlighting leading vendors and their innovative profiles. These include Broadcom Inc., Cypress Semiconductor Corporation, Dialog Semiconductor, GlobalFoundries, Infineon Technologies, Intel Corporation, Microchip Technology, Micron Technology, NXP Semiconductors, ON Semiconductor, Renesas Electronics Corporation, Samsung Electronics, SK hynix, SMIC, STMicroelectronics, Texas Instruments, TSMC, UMC (United Microelectronics Corporation), Western Digital, and Winbond Electronics.

Market Segmentation & Coverage

This research report categorizes the Embedded Non-Volatile Memory Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Memory Type, market is studied across Embedded EEPROM, Embedded Flash, Embedded MRAM, and Embedded PCM. The Embedded Flash is further studied across NAND Flash and NOR Flash.
  • Based on Application, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, Industrial, Medical Devices, and Telecommunications.
  • Based on End User Industry, market is studied across Aftermarket and OEMs.
  • Based on Technology Node, market is studied across 10nm and below, 14nm, 22nm, and 28nm.
  • Based on Density, market is studied across 1 Mb to 16 Mb, 16 Mb to 128 Mb, and Greater than 128 Mb.
  • Based on Design Architecture, market is studied across Integrated Memory and Standalone Memory.
  • Based on Interface, market is studied across Parallel and Serial.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Increased implementation of embedded non-volatile memory in medical devices and healthcare technology
      • 5.1.1.2. Surge in demand for compact and low-power memory solutions in wearable electronics
      • 5.1.1.3. Expansion of artificial intelligence and machine learning applications necessitating reliable memory storage
      • 5.1.1.4. Trend towards miniaturization and high-density storage solutions in the industrial automation sector
    • 5.1.2. Restraints
      • 5.1.2.1. Scalability limitations due to increased complexity of embedded non-volatile memory in advanced applications
      • 5.1.2.2. Supply chain vulnerabilities and dependency on raw material availability in the embedded non-volatile memory market
    • 5.1.3. Opportunities
      • 5.1.3.1. Increasing demand for embedded non-volatile memory in artificial intelligence and machine learning applications
      • 5.1.3.2. Opportunities in the integration of embedded non-volatile memory with Internet of Things (IoT) devices
      • 5.1.3.3. Development of secure and reliable embedded non-volatile memory for medical devices and healthcare applications
    • 5.1.4. Challenges
      • 5.1.4.1. Addressing security vulnerabilities associated with data retention in embedded non-volatile memory components
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Embedded Non-Volatile Memory Market, by Memory Type

  • 6.1. Introduction
  • 6.2. Embedded EEPROM
  • 6.3. Embedded Flash
    • 6.3.1. NAND Flash
    • 6.3.2. NOR Flash
  • 6.4. Embedded MRAM
  • 6.5. Embedded PCM

7. Embedded Non-Volatile Memory Market, by Application

  • 7.1. Introduction
  • 7.2. Aerospace & Defense
  • 7.3. Automotive
  • 7.4. Consumer Electronics
  • 7.5. Industrial
  • 7.6. Medical Devices
  • 7.7. Telecommunications

8. Embedded Non-Volatile Memory Market, by End User Industry

  • 8.1. Introduction
  • 8.2. Aftermarket
  • 8.3. OEMs

9. Embedded Non-Volatile Memory Market, by Technology Node

  • 9.1. Introduction
  • 9.2. 10nm and below
  • 9.3. 14nm
  • 9.4. 22nm
  • 9.5. 28nm

10. Embedded Non-Volatile Memory Market, by Density

  • 10.1. Introduction
  • 10.2. 1 Mb to 16 Mb
  • 10.3. 16 Mb to 128 Mb
  • 10.4. Greater than 128 Mb

11. Embedded Non-Volatile Memory Market, by Design Architecture

  • 11.1. Introduction
  • 11.2. Integrated Memory
  • 11.3. Standalone Memory

12. Embedded Non-Volatile Memory Market, by Interface

  • 12.1. Introduction
  • 12.2. Parallel
  • 12.3. Serial

13. Americas Embedded Non-Volatile Memory Market

  • 13.1. Introduction
  • 13.2. Argentina
  • 13.3. Brazil
  • 13.4. Canada
  • 13.5. Mexico
  • 13.6. United States

14. Asia-Pacific Embedded Non-Volatile Memory Market

  • 14.1. Introduction
  • 14.2. Australia
  • 14.3. China
  • 14.4. India
  • 14.5. Indonesia
  • 14.6. Japan
  • 14.7. Malaysia
  • 14.8. Philippines
  • 14.9. Singapore
  • 14.10. South Korea
  • 14.11. Taiwan
  • 14.12. Thailand
  • 14.13. Vietnam

15. Europe, Middle East & Africa Embedded Non-Volatile Memory Market

  • 15.1. Introduction
  • 15.2. Denmark
  • 15.3. Egypt
  • 15.4. Finland
  • 15.5. France
  • 15.6. Germany
  • 15.7. Israel
  • 15.8. Italy
  • 15.9. Netherlands
  • 15.10. Nigeria
  • 15.11. Norway
  • 15.12. Poland
  • 15.13. Qatar
  • 15.14. Russia
  • 15.15. Saudi Arabia
  • 15.16. South Africa
  • 15.17. Spain
  • 15.18. Sweden
  • 15.19. Switzerland
  • 15.20. Turkey
  • 15.21. United Arab Emirates
  • 15.22. United Kingdom

16. Competitive Landscape

  • 16.1. Market Share Analysis, 2023
  • 16.2. FPNV Positioning Matrix, 2023
  • 16.3. Competitive Scenario Analysis
  • 16.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Broadcom Inc.
  • 2. Cypress Semiconductor Corporation
  • 3. Dialog Semiconductor
  • 4. GlobalFoundries
  • 5. Infineon Technologies
  • 6. Intel Corporation
  • 7. Microchip Technology
  • 8. Micron Technology
  • 9. NXP Semiconductors
  • 10. ON Semiconductor
  • 11. Renesas Electronics Corporation
  • 12. Samsung Electronics
  • 13. SK hynix
  • 14. SMIC
  • 15. STMicroelectronics
  • 16. Texas Instruments
  • 17. TSMC
  • 18. UMC (United Microelectronics Corporation)
  • 19. Western Digital
  • 20. Winbond Electronics
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