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Wi-Fi Ĩ¼Â ½ÃÀå : MIMO ±¸¼º, IEEE Ç¥ÁØ, Á¦Ç°, ´ë¿ªº° - ¼¼°è ¿¹Ãø(2025-2030³â)

Wi-Fi Chipset Market by MIMO Configuration (1x1 MU-MIMO, 2x2 MU-MIMO, 3x3 MU-MIMO), IEEE Standards (IEEE 802.11ac Wave 1, IEEE 802.11ac Wave 2, IEEE 802.11ad), Product, Band - Global Forecast 2025-2030

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2023³â Wi-Fi Ĩ¼Â ½ÃÀå ±Ô¸ð´Â 265¾ï ´Þ·¯·Î 2024³â¿¡´Â 291¾ï 4,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµÇ¸ç, CAGR 10.04%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 518¾ï 1,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

Wi-Fi Ĩ¼Â ½ÃÀåÀº ±¤¹üÀ§ÇÑ ¹«¼± Åë½Å ±â¼ú¿¡ ÇʼöÀûÀÎ ±¸¼º¿ä¼Ò·Î, ÀåÄ¡¸¦ ¹«¼± ³×Æ®¿öÅ©¿¡ ¿¬°áÇϱâ À§ÇÑ ±â¹ÝÀ» Á¦°øÇÕ´Ï´Ù. ¹«¼± Åë½Å ¹× µðÁöÅÐ ½ÅÈ£ ÇÁ·Î¼¼¼­¿Í °°Àº ´Ù¾çÇÑ ±¸¼º¿ä¼Ò¸¦ Ĩ¿¡ ÅëÇÕÇÏ¿© °¡ÀüÁ¦Ç°, ½º¸¶Æ®È¨, ÀÚµ¿Â÷, IoT ±â±âÀÇ Wi-Fi ¿¬°áÀ» ÃËÁøÇϰí ÀÖÀ¸¸ç, ¹«¼± ÀÎÅÍ³Ý Á¢¼Ó¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó Wi-Fi Ĩ¼ÂÀÇ Çʿ伺ÀÌ ´õ¿í °­Á¶µÇ°í ÀÖ½À´Ï´Ù. ½º¸¶Æ® ±â±âÀÇ º¸±Þ°ú ½º¸¶Æ® ½ÃƼ, »ê¾÷ ÀÚµ¿È­, Áõ°­Çö½Ç°ú °°Àº ¿ëµµÀÇ ¹ßÀüÀ¸·Î ÀÎÇØ ´õ¿í °¡¼ÓÈ­µÇ°í ÀÖ½À´Ï´Ù. ÃÖÁ¾ »ç¿ë ¹üÀ§´Â Åë½Å, Ȩ ¿ÀÅä¸ÞÀ̼Ç, ÇコÄɾî, ¿î¼Û µî ´Ù¾çÇÑ ºÐ¾ß·Î È®´ëµÇ°í ÀÖ½À´Ï´Ù. ½ÃÀå ¼ºÀåÀº ÀÎÅÍ³Ý º¸±Þ·ü Áõ°¡, Wi-Fi 6 ¹× Wi-Fi 6E¿Í °°Àº °í±Þ Wi-Fi Ç¥ÁØÀÇ Ãâ½Ã, °í¼Ó ¹× ÀúÁö¿¬ ³×Æ®¿öÅ©¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡¿¡ Å©°Ô ¿µÇâÀ» ¹Þ°í ÀÖ½À´Ï´Ù. »õ·Î¿î ±âȸ·Î´Â Wi-Fi 7ÀÇ °³¹ß, 5G ³×Æ®¿öÅ©¿ÍÀÇ ÅëÇÕ, IoT »ýŰè È®Àå µîÀ» µé ¼ö ÀÖ½À´Ï´Ù. ±×·¯³ª Á֯ļö ÇÒ´ç ¹®Á¦, °æÀï ½ÉÈ­, ³ôÀº ¿¬±¸°³¹ßºñ¿ë µîÀÇ ¹®Á¦°¡ ½ÃÀåÀÇ ÇѰè·Î ÀÛ¿ëÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, Wi-Fi ³×Æ®¿öÅ©¸¦ ÅëÇÑ µ¥ÀÌÅÍ Àü¼Û¿¡ ´ëÇÑ º¸¾È ¹®Á¦µµ ½É°¢ÇÑ ¹®Á¦·Î ´ëµÎµÇ°í ÀÖ½À´Ï´Ù. À̸¦ ±Øº¹Çϱâ À§ÇØ ±â¾÷µéÀº Ĩ¼ÂÀÇ ¿¡³ÊÁö È¿À²¼º Çâ»ó, ¸ÖƼ¹êµå Áö¿ø ±â¼ú °³¹ß, ³×Æ®¿öÅ© º¸¾È ±â´É °³¼±°ú °°Àº Çõ½ÅÀû ºÐ¾ß¿¡ ÁýÁßÇÒ ¼ö ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ¼º´É°ú ´ë¿ªÆøÀ» Çâ»ó½ÃŰ¸é¼­ Ĩ Å©±â¸¦ ÁÙÀÌ·Á´Â Áö¼ÓÀûÀÎ ³ë·ÂÀº À¯¸ÁÇÑ ¿¬±¸ ÀáÀç·ÂÀ» °¡Áö°í ÀÖ½À´Ï´Ù. Àü¹ÝÀûÀ¸·Î, Wi-Fi Ĩ¼Â ½ÃÀåÀº ¿ªµ¿ÀûÀ̰í Áö¼ÓÀûÀ¸·Î ÁøÈ­Çϰí ÀÖÀ¸¸ç, ±â¼ú ¹ßÀü°ú ¼ÒºñÀÚÀÇ ±â´ëÄ¡ »ó½ÂÀÌ ±× ¿øµ¿·ÂÀÌ µÇ°í ÀÖ½À´Ï´Ù. ±â¾÷µéÀº »õ·Î¿î ¹«¼± Ç¥ÁØÀ» Ȱ¿ëÇϰí, »çÀ̹ö º¸¾ÈÀ» °­È­Çϸç, ´Ù¿ëµµ ¹× ÀúÀü·Â ¼Ò¸ð Ĩ¼Â °³¹ß¿¡ ÅõÀÚÇÏ¿© ÀÌ·¯ÇÑ °æÀï ȯ°æ¿¡¼­ »õ·Î¿î ±âȸ¸¦ Ȱ¿ëÇÏ°í ±âÁ¸ ¸®½ºÅ©¸¦ ¿ÏÈ­ÇÏ´Â °ÍÀÌ ¹Ù¶÷Á÷ÇÕ´Ï´Ù.

ÁÖ¿ä ½ÃÀå Åë°è
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CAGR(%) 10.04%

½ÃÀå ¿ªÇÐ : ºü¸£°Ô ÁøÈ­ÇÏ´Â Wi-Fi Ĩ¼Â ½ÃÀåÀÇ ÁÖ¿ä ½ÃÀå ÀλçÀÌÆ® °ø°³

Wi-Fi Ĩ¼Â ½ÃÀåÀº ¼ö¿ä ¹× °ø±ÞÀÇ ¿ªµ¿ÀûÀÎ »óÈ£ÀÛ¿ëÀ» ÅëÇØ º¯È­Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ½ÃÀå ¿ªÇÐÀÇ º¯È­¸¦ ÀÌÇØÇÔÀ¸·Î½á ±â¾÷Àº Á¤º¸¿¡ ÀÔ°¢ÇÑ ÅõÀÚ °áÁ¤À» ³»¸®°í, Àü·«ÀûÀÎ ÀÇ»ç°áÁ¤À» Á¤±³È­Çϸç, »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Æ÷ÂøÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Æ®·»µå¸¦ Á¾ÇÕÀûÀ¸·Î ÆÄ¾ÇÇÔÀ¸·Î½á ±â¾÷Àº Á¤Ä¡Àû, Áö¸®Àû, ±â¼úÀû, »çȸÀû, °æÁ¦Àû ¿µ¿ª Àü¹Ý¿¡ °ÉÄ£ ´Ù¾çÇÑ ¸®½ºÅ©¸¦ ÁÙÀÏ ¼ö ÀÖÀ¸¸ç, ¼ÒºñÀÚ Çൿ°ú ±×°ÍÀÌ Á¦Á¶ ºñ¿ë ¹× ±¸¸Å µ¿Çâ¿¡ ¹ÌÄ¡´Â ¿µÇâÀ» º¸´Ù ¸íÈ®ÇÏ°Ô ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

  • ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ
    • º¸À̽º ¿À¹ö WiFi º¸±Þ È®´ë
    • Wi-Fi¿Í ¸ð¹ÙÀÏ ³×Æ®¿öÅ© ÅëÇÕÀÇ ¹ßÀü
    • ½º¸¶Æ®È¨ ±â¼úÀÇ ¹ßÀü°ú Wi-Fi Áö¿ø ¸ð¹ÙÀÏ ±â±âÀÇ È®»ê
  • ½ÃÀå ¼ºÀå ¾ïÁ¦¿äÀÎ
    • º¸¾È¿¡ ´ëÇÑ ¿ì·Á Áõ°¡
    • PC ¹× ÅÂºí¸´ ÃâÇÏ·® °¨¼Ò
  • ½ÃÀå ±âȸ
    • ¿þ¾î·¯ºí ±â¼úÀÇ µîÀå
    • Áõ°­Çö½Ç(AR) ¹× °¡»óÇö½Ç(VR) ºÐ¾ß¿¡¼­ÀÇ Wi-Fi ¿ëµµÀÇ ¹ßÀü
  • ½ÃÀå °úÁ¦
    • ¹«¸éÇã Á֯ļö ´ë¿ª(LTE-U)¿¡¼­ 5GHz ´ë¿ª ¿ÍÀÌÆÄÀÌ¿Í LTE »ç¿ëÀ¸·Î ÀÎÇÑ ¹®Á¦Á¡

Porter's Five Forces : Wi-Fi Ĩ¼Â ½ÃÀå °ø·«À» À§ÇÑ Àü·«Àû µµ±¸

Porter's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ½ÃÀå »óȲÀÇ °æÀï ±¸µµ¸¦ ÆÄ¾ÇÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. Porter's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÇ °æÀï·ÂÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ Ž»öÇÒ ¼ö ÀÖ´Â ¸íÈ®ÇÑ ¹æ¹ýÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» ÆÇ´ÜÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÀλçÀÌÆ®¸¦ ÅëÇØ ±â¾÷Àº °­Á¡À» Ȱ¿ëÇϰí, ¾àÁ¡À» ÇØ°áÇϰí, ÀáÀçÀûÀÎ µµÀüÀ» ÇÇÇϰí, º¸´Ù °­·ÂÇÑ ½ÃÀå Æ÷Áö¼Å´×À» È®º¸ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : Wi-Fi Ĩ¼Â ½ÃÀåÀÇ ¿ÜºÎ ¿µÇâ ÆÄ¾Ç

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº Wi-Fi Ĩ¼Â ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀο¡ ´ëÇÑ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ Á¦°øÇϸç, PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀû À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£µµ, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¼±Á¦ÀûÀÌ°í ´Éµ¿ÀûÀÎ ÀÇ»ç°áÁ¤À» ³»¸± Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® : Wi-Fi Ĩ¼Â ½ÃÀå °æÀï ±¸µµ ÆÄ¾Ç

Wi-Fi Ĩ¼Â ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ º¥´õÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¼öÀÍ, °í°´ ±â¹Ý, ¼ºÀå·ü µî ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀïÀû Æ÷Áö¼Å´×À» ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®Àº ½ÃÀåÀÇ ÁýÁßÈ­, ´ÜÆíÈ­, ÅëÇÕÀÇ Ãß¼¼¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖÀ¸¸ç, °ø±Þ¾÷ü´Â Ä¡¿­ÇÑ °æÀï ¼Ó¿¡¼­ ÀÚ½ÅÀÇ ÀÔÁö¸¦ °­È­ÇÒ ¼ö ÀÖ´Â Àü·«Àû ÀÇ»ç°áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ ÀλçÀÌÆ®¸¦ ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º : Wi-Fi Ĩ¼Â ½ÃÀå¿¡¼­°ø±Þ¾÷ü ¼º°ú Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â Wi-Fi Ĩ¼Â ½ÃÀå¿¡¼­ º¥´õ¸¦ Æò°¡ÇÒ ¼ö ÀÖ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. ÀÌ ¸ÅÆ®¸¯½º¸¦ ÅëÇØ ºñÁî´Ï½º Á¶Á÷Àº º¥´õÀÇ ºñÁî´Ï½º Àü·«°ú Á¦Ç° ¸¸Á·µµ¸¦ ±â¹ÝÀ¸·Î Æò°¡ÇÏ¿© ¸ñÇ¥¿¡ ºÎÇÕÇÏ´Â Á¤º¸¿¡ ÀÔ°¢ÇÑ ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖÀ¸¸ç, 4°³ÀÇ »çºÐ¸éÀ¸·Î º¥´õ¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ¼¼ºÐÈ­ÇÏ¿© Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù. Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù.

Àü·« ºÐ¼® ¹× Ãßõ : Wi-Fi Ĩ¼Â ½ÃÀå¿¡¼­ ¼º°øÀÇ ±æÀ» ±×¸³´Ï´Ù.

Wi-Fi Ĩ¼Â ½ÃÀå Àü·« ºÐ¼®Àº ¼¼°è ½ÃÀå¿¡¼­ ÀÔÁö¸¦ °­È­ÇϰíÀÚ ÇÏ´Â ±â¾÷¿¡°Ô ÇʼöÀûÀÔ´Ï´Ù. ÁÖ¿ä ÀÚ¿ø, ¿ª·® ¹× ¼º°ú ÁöÇ¥¸¦ °ËÅäÇÔÀ¸·Î½á ±â¾÷Àº ¼ºÀå ±âȸ¸¦ ½Äº°ÇÏ°í °³¼±ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Á¢±Ù ¹æ½ÄÀº °æÀï ȯ°æÀÇ µµÀüÀ» ±Øº¹ÇÏ°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Ȱ¿ëÇÏ¿© Àå±âÀûÀÎ ¼º°øÀ» °ÅµÑ ¼ö Àִ ü°è¸¦ ±¸ÃàÇÒ ¼ö ÀÖµµ·Ï µµ¿ÍÁÝ´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ Æ÷°ýÇÏ´Â ½ÃÀå¿¡ ´ëÇÑ Á¾ÇÕÀûÀÎ ºÐ¼®À» Á¦°øÇÕ´Ï´Ù.

1. ½ÃÀå ħÅõµµ : ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·Â Æò°¡.

2. ½ÃÀå °³Ã´µµ : ½ÅÈï ½ÃÀå¿¡¼­ÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇϰí, ±âÁ¸ ºÐ¾ßÀÇ È®Àå °¡´É¼ºÀ» Æò°¡Çϸç, ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» Á¦°øÇÕ´Ï´Ù.

3. ½ÃÀå ´Ù°¢È­ : ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, ¾÷°èÀÇ ÁÖ¿ä ¹ßÀü, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ÀÇ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú ¹ßÀü µîÀ» °ËÅäÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ÇâÈÄ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÷´Ü ±â¼ú, ¿¬±¸ °³¹ß Ȱµ¿ ¹× Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

ÀÌÇØ°ü°èÀÚµéÀÌ ÃæºÐÇÑ Á¤º¸¸¦ ¹ÙÅÁÀ¸·Î ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖµµ·Ï ´ÙÀ½°ú °°Àº Áß¿äÇÑ Áú¹®¿¡ ´ëÇÑ ´äº¯µµ Á¦°øÇÕ´Ï´Ù.

1. ÇöÀç ½ÃÀå ±Ô¸ð¿Í ÇâÈÄ ¼ºÀå Àü¸ÁÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, ºÎ¹®, Áö¿ªÀº?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ°ú ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õ ½ÃÀå Á¡À¯À²°ú °æÀï Æ÷Áö¼ÇÀº?

5. º¥´õ ½ÃÀå ÁøÀÔ ¹× ö¼ö Àü·«ÀÇ ¿øµ¿·ÂÀÌ µÇ´Â ¼öÀÍ¿ø°ú Àü·«Àû ±âȸ´Â ¹«¾ùÀΰ¡?

¸ñÂ÷

Á¦1Àå ¼­¹®

Á¦2Àå Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ½ÃÀå °³¿ä

Á¦5Àå ½ÃÀå ÀλçÀÌÆ®

  • ½ÃÀå ¿ªÇÐ
    • ¼ºÀå ÃËÁø¿äÀÎ
    • ¼ºÀå ¾ïÁ¦¿äÀÎ
    • ±âȸ
    • °úÁ¦
  • ½ÃÀå ¼¼ºÐÈ­ ºÐ¼®
  • Porter's Five Forces ºÐ¼®
  • PESTEL ºÐ¼®
    • Á¤Ä¡
    • °æÁ¦
    • »çȸ
    • ±â¼ú
    • ¹ý·ü
    • ȯ°æ

Á¦6Àå Wi-Fi Ĩ¼Â ½ÃÀå : MIMO ±¸¼ºº°

  • 1x1 MU-MIMO
  • 2x2 MU-MIMO
  • 3x3 MU-MIMO
  • 4x4 MU-MIMO
  • 8x8 MU-MIMO
  • MU-MIMO
  • SU-MIMO

Á¦7Àå Wi-Fi Ĩ¼Â ½ÃÀå : IEEE ±Ô°Ýº°

  • IEEE 802.11ac Wave 1
  • IEEE 802.11ac Wave 2
  • IEEE 802.11ad
  • IEEE 802.11ax
  • IEEE 802.11ay
  • IEEE 802.11b/G
  • IEEE 802.11n(SB ¹× DB)

Á¦8Àå Wi-Fi Ĩ¼Â ½ÃÀå : Á¦Ç°º°

  • ¾×¼¼½º Æ÷ÀÎÆ® Àåºñ
  • Ä¿³ØÆ¼µåȨ µð¹ÙÀ̽º
  • PCS
  • ½º¸¶Æ®Æù
  • Á¤Á¦

Á¦9Àå Wi-Fi Ĩ¼Â ½ÃÀå : ¹êµåº°

  • µà¾ó ¹êµå
  • ½Ì±Û ¹êµå
  • Æ®¶óÀÌ ¹êµå

Á¦10Àå ¾Æ¸Þ¸®Ä«ÀÇ Wi-Fi Ĩ¼Â ½ÃÀå

  • ¾Æ¸£ÇîÆ¼³ª
  • ºê¶óÁú
  • ij³ª´Ù
  • ¸ß½ÃÄÚ
  • ¹Ì±¹

Á¦11Àå ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ Wi-Fi Ĩ¼Â ½ÃÀå

  • È£ÁÖ
  • Áß±¹
  • Àεµ
  • Àεµ³×½Ã¾Æ
  • ÀϺ»
  • ¸»·¹À̽þÆ
  • Çʸ®ÇÉ
  • ½Ì°¡Æ÷¸£
  • Çѱ¹
  • ´ë¸¸
  • ű¹
  • º£Æ®³²

Á¦12Àå À¯·´, Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ Wi-Fi Ĩ¼Â ½ÃÀå

  • µ§¸¶Å©
  • ÀÌÁýÆ®
  • Çɶõµå
  • ÇÁ¶û½º
  • µ¶ÀÏ
  • À̽º¶ó¿¤
  • ÀÌÅ»¸®¾Æ
  • ³×´ú¶õµå
  • ³ªÀÌÁö¸®¾Æ
  • ³ë¸£¿þÀÌ
  • Æú¶õµå
  • īŸ¸£
  • ·¯½Ã¾Æ
  • »ç¿ìµð¾Æ¶óºñ¾Æ
  • ³²¾ÆÇÁ¸®Ä«°øÈ­±¹
  • ½ºÆäÀÎ
  • ½º¿þµ§
  • ½ºÀ§½º
  • ÅÍŰ
  • ¾Æ¶ø¿¡¹Ì¸®Æ®
  • ¿µ±¹

Á¦13Àå °æÀï »óȲ

  • ½ÃÀå Á¡À¯À² ºÐ¼® 2023
  • FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º, 2023
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  • Blu Wireless Technology Ltd
  • Broadcom Inc.
  • Celeno Communications, Ltd.
  • Cypress Semiconductor Corporation
  • Espressif Systems Pte., Ltd.
  • Intel Corporation
  • Marvell Technology Group Ltd.
  • MediaTek Inc.
  • Microchip Technology, Inc.
  • Peraso Technologies, Inc.
  • Qualcomm Technologies, Inc.
  • Quantenna Communications, Inc.
  • Samsung Electronics Co., Ltd.
  • Stmicroelectronics N.V.
  • Texas Instruments Inc.
ksm 24.12.04

The Wi-Fi Chipset Market was valued at USD 26.50 billion in 2023, expected to reach USD 29.14 billion in 2024, and is projected to grow at a CAGR of 10.04%, to USD 51.81 billion by 2030.

The Wi-Fi chipset market is an essential component of the broader wireless communication technology landscape, providing the foundation for connecting devices to wireless networks. It encompasses a variety of components such as radios and digital signal processors integrated into a chip, facilitating Wi-Fi connectivity in consumer electronics, smart homes, automotive sectors, and IoT devices. The necessity for Wi-Fi chipsets is underscored by the ubiquitous demand for wireless internet access, further accelerated by the proliferation of smart devices and advances in applications such as smart cities, industrial automation, and augmented reality. End-use scope extends across numerous sectors, including telecommunications, home automation, healthcare, and transportation. Market growth is significantly influenced by increased internet penetration, the rollout of advanced Wi-Fi standards like Wi-Fi 6 and Wi-Fi 6E, and the escalating demand for faster, low-latency networks. Emerging opportunities include the development of Wi-Fi 7, integration with 5G networks, and expanding IoT ecosystems. However, challenges such as spectrum allocation issues, intense competition, and high research and development costs contribute to market limitations. Additionally, security concerns regarding data transmission over Wi-Fi networks present critical challenges. To overcome these, businesses can focus on innovative areas such as enhancing energy efficiency of chipsets, developing multi-band support technologies, and improving network security features. Moreover, the continuous effort in reducing chip size while increasing performance and bandwidth holds promising research potential. Overall, the Wi-Fi chipset market is dynamic and continuously evolving, driven by technological advancements and rising consumer expectations. Businesses are recommended to invest in leveraging new wireless standards, enhancing cybersecurity measures, and developing versatile, low-power-consuming chipsets to capitalize on emerging opportunities and mitigate existing risks in this competitive landscape.

KEY MARKET STATISTICS
Base Year [2023] USD 26.50 billion
Estimated Year [2024] USD 29.14 billion
Forecast Year [2030] USD 51.81 billion
CAGR (%) 10.04%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Wi-Fi Chipset Market

The Wi-Fi Chipset Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Increasing popularity of voice over Wi-Fi
    • Growing integration between Wi-Fi and mobile networks
    • Development of smart-home technology and the proliferation of Wi-Fi-enabled mobile devices
  • Market Restraints
    • Growing security concern
    • Declining shipment of PCs and Tablets
  • Market Opportunities
    • Emergence of wearable technology
    • Application advancement of Wi-Fi in Augmented Reality (AR) and Virtual Reality (VR)
  • Market Challenges
    • Issues due to use of 5 GHz band Wi-Fi with LTE in unlicensed spectrum (LTE-U)

Porter's Five Forces: A Strategic Tool for Navigating the Wi-Fi Chipset Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Wi-Fi Chipset Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Wi-Fi Chipset Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Wi-Fi Chipset Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Wi-Fi Chipset Market

A detailed market share analysis in the Wi-Fi Chipset Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Wi-Fi Chipset Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Wi-Fi Chipset Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Wi-Fi Chipset Market

A strategic analysis of the Wi-Fi Chipset Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Wi-Fi Chipset Market, highlighting leading vendors and their innovative profiles. These include Blu Wireless Technology Ltd, Broadcom Inc., Celeno Communications, Ltd., Cypress Semiconductor Corporation, Espressif Systems Pte., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., Microchip Technology, Inc., Peraso Technologies, Inc., Qualcomm Technologies, Inc., Quantenna Communications, Inc., Samsung Electronics Co., Ltd., Stmicroelectronics N.V., and Texas Instruments Inc..

Market Segmentation & Coverage

This research report categorizes the Wi-Fi Chipset Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on MIMO Configuration, market is studied across 1x1 MU-MIMO, 2x2 MU-MIMO, 3x3 MU-MIMO, 4x4 MU-MIMO, 8x8 MU-MIMO, MU-MIMO, and SU-MIMO.
  • Based on IEEE Standards, market is studied across IEEE 802.11ac Wave 1, IEEE 802.11ac Wave 2, IEEE 802.11ad, IEEE 802.11ax, IEEE 802.11ay, IEEE 802.11b/G, and IEEE 802.11n (SB and DB).
  • Based on Product, market is studied across Access Point Equipment, Connected Home Devices, PCS, Smartphones, and Tablet.
  • Based on Band, market is studied across Dual Band, Single Band, and TRI Band.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Increasing popularity of voice over Wi-Fi
      • 5.1.1.2. Growing integration between Wi-Fi and mobile networks
      • 5.1.1.3. Development of smart-home technology and the proliferation of Wi-Fi-enabled mobile devices
    • 5.1.2. Restraints
      • 5.1.2.1. Growing security concern
      • 5.1.2.2. Declining shipment of PCs and Tablets
    • 5.1.3. Opportunities
      • 5.1.3.1. Emergence of wearable technology
      • 5.1.3.2. Application advancement of Wi-Fi in Augmented Reality (AR) and Virtual Reality (VR)
    • 5.1.4. Challenges
      • 5.1.4.1. Issues due to use of 5 GHz band Wi-Fi with LTE in unlicensed spectrum (LTE-U)
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Wi-Fi Chipset Market, by MIMO Configuration

  • 6.1. Introduction
  • 6.2. 1x1 MU-MIMO
  • 6.3. 2x2 MU-MIMO
  • 6.4. 3x3 MU-MIMO
  • 6.5. 4x4 MU-MIMO
  • 6.6. 8x8 MU-MIMO
  • 6.7. MU-MIMO
  • 6.8. SU-MIMO

7. Wi-Fi Chipset Market, by IEEE Standards

  • 7.1. Introduction
  • 7.2. IEEE 802.11ac Wave 1
  • 7.3. IEEE 802.11ac Wave 2
  • 7.4. IEEE 802.11ad
  • 7.5. IEEE 802.11ax
  • 7.6. IEEE 802.11ay
  • 7.7. IEEE 802.11b/G
  • 7.8. IEEE 802.11n (SB and DB)

8. Wi-Fi Chipset Market, by Product

  • 8.1. Introduction
  • 8.2. Access Point Equipment
  • 8.3. Connected Home Devices
  • 8.4. PCS
  • 8.5. Smartphones
  • 8.6. Tablet

9. Wi-Fi Chipset Market, by Band

  • 9.1. Introduction
  • 9.2. Dual Band
  • 9.3. Single Band
  • 9.4. TRI Band

10. Americas Wi-Fi Chipset Market

  • 10.1. Introduction
  • 10.2. Argentina
  • 10.3. Brazil
  • 10.4. Canada
  • 10.5. Mexico
  • 10.6. United States

11. Asia-Pacific Wi-Fi Chipset Market

  • 11.1. Introduction
  • 11.2. Australia
  • 11.3. China
  • 11.4. India
  • 11.5. Indonesia
  • 11.6. Japan
  • 11.7. Malaysia
  • 11.8. Philippines
  • 11.9. Singapore
  • 11.10. South Korea
  • 11.11. Taiwan
  • 11.12. Thailand
  • 11.13. Vietnam

12. Europe, Middle East & Africa Wi-Fi Chipset Market

  • 12.1. Introduction
  • 12.2. Denmark
  • 12.3. Egypt
  • 12.4. Finland
  • 12.5. France
  • 12.6. Germany
  • 12.7. Israel
  • 12.8. Italy
  • 12.9. Netherlands
  • 12.10. Nigeria
  • 12.11. Norway
  • 12.12. Poland
  • 12.13. Qatar
  • 12.14. Russia
  • 12.15. Saudi Arabia
  • 12.16. South Africa
  • 12.17. Spain
  • 12.18. Sweden
  • 12.19. Switzerland
  • 12.20. Turkey
  • 12.21. United Arab Emirates
  • 12.22. United Kingdom

13. Competitive Landscape

  • 13.1. Market Share Analysis, 2023
  • 13.2. FPNV Positioning Matrix, 2023
  • 13.3. Competitive Scenario Analysis
  • 13.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Blu Wireless Technology Ltd
  • 2. Broadcom Inc.
  • 3. Celeno Communications, Ltd.
  • 4. Cypress Semiconductor Corporation
  • 5. Espressif Systems Pte., Ltd.
  • 6. Intel Corporation
  • 7. Marvell Technology Group Ltd.
  • 8. MediaTek Inc.
  • 9. Microchip Technology, Inc.
  • 10. Peraso Technologies, Inc.
  • 11. Qualcomm Technologies, Inc.
  • 12. Quantenna Communications, Inc.
  • 13. Samsung Electronics Co., Ltd.
  • 14. Stmicroelectronics N.V.
  • 15. Texas Instruments Inc.
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