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¼¼°èÀÇ Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀå : Á¦Ç°º°, ¿ëµµº° - ¿¹Ãø(2025-2030³â)

LTCC & HTCC Market by Product (High-Temperature Co-Fired Ceramic, Low Temperature Co-Fired Ceramic), Application (Aerospace & Defense, Automotive, Consumer Electronics) - Global Forecast 2025-2030

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¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀåÀº 2023³â¿¡ 10¾ï 8,000¸¸ ´Þ·¯·Î Æò°¡µÇ¾ú°í, 2024³â¿¡´Â 11¾ï 3,000¸¸ ´Þ·¯·Î ÃßÁ¤µÇ¸ç, CAGR 4.55%·Î ¼ºÀåÇÒ Àü¸ÁÀ̰í, 2030³â¿¡´Â 14¾ï 8,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC)´Â Àμâ ȸ·Î ±âÆÇ, ¼¾¼­, ¸¶ÀÌÅ©·Î ÀÏ·ºÆ®·Î´Ð½º µð¹ÙÀ̽º¿¡ °ß°íÇÑ ±âÆÇÀ» Á¦°øÇϸç, ÀüÀÚ ºÎǰÀÇ Á¦Á¶ dz°æ¿¡ ÇʼöÀûÀÔ´Ï´Ù. LTCC¿Í HTCCÀÇ Çʿ伺Àº ÀÚµ¿Â÷, Ç×°ø¿ìÁÖ, Åë½Å, ÀÇ·á »ê¾÷¿¡¼­ °í½Å·Ú¼º ¿ëµµ¿¡ ÀûÇÕÇÑ ¼º´É Ư¼ºÀÌ Çâ»óµÈ ¼ÒÇüÈ­ ÀüÀÚÁ¦Ç°¿¡ ´ëÇÑ ¼ö¿ä¿¡¼­ ºñ·ÔµË´Ï´Ù. LTCC´Â ³ôÀº ¿­ÀüµµÀ²°ú ¿©·¯ ¼öµ¿ ºÎǰÀ» ÅëÇÕÇÏ´Â ´É·Â µîÀÇ ÀÌÁ¡À» Á¦°øÇÏ´Â ¹Ý¸é, HTCC´Â ¶Ù¾î³­ ±â°èÀû °­µµ¿Í ¿Âµµ º¹¿ø·ÂÀ» Á¦°øÇϱ⠶§¹®¿¡ ¸ðµÎ ¼±Áø ÀüÀÚ ½Ã½ºÅÛ¿¡ ÇʼöÀûÀÔ´Ï´Ù. ½ÃÀå ¼ºÀåÀÇ ÁÖ¿ä ¿øÀÎÀº ÄÞÆÑÆ®Çϰí È¿À²ÀûÀÎ µð¹ÙÀ̽º¿¡ ´ëÇÑ ¼ÒºñÀÚ ¼ö¿ä Áõ°¡¿Í 5G ÀÎÇÁ¶ó¿Í IoT ±â¼ú¿¡ ´ëÇÑ ÅõÀÚ Áõ°¡ÀÔ´Ï´Ù. ÃÖ±ÙÀÇ ºñÁî´Ï½º ±âȸ´Â, ¿þ¾î·¯ºíÀ̳ª ÀÚÀ² ÁÖÇàÂ÷ÀÇ Æø³ÐÀº ä¿ëÀ¸·ÎºÎÅÍ Å¾, º¸´Ù ÁÁÀº ºñ¿ë È¿À²°ú ¼º´É ÁöÇ¥¸¦ ½ÇÇöÇϱâ À§ÇÑ µ¿½Ã ¼Ò¼º ¼¼¶ó¹ÍÀÇ ÃÖÀûÈ­¿¡¼­ ¿¬±¸ °³¹ßÀ» µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù. ±×·¯³ª °úÁ¦·Î´Â ³ôÀº Á¦Á¶ ºñ¿ë, º¹ÀâÇÑ Á¦Á¶ ÇÁ·Î¼¼½º, ¾ö°ÝÇÑ ±ÔÁ¦ ±âÁØ µîÀÌ ÀÖ½À´Ï´Ù. °ø±Þ¸ÁÀÇ È¥¶õ°ú ¿ø·á ºÎÁ·µµ ÀáÀçÀûÀÎ ¼ºÀå ¾ïÁ¦ ¿äÀÎÀÌ µÇ°í ÀÖ½À´Ï´Ù. ¼öÃàÀ» ¾ïÁ¦ÇØ À¯Àü Ư¼ºÀ» Çâ»ó½ÃŰ´Â ½Å±Ô Á¶¼º¿¡ ÃÊÁ¡À» ¸ÂÃá Àç·á °úÇÐÀÇ Áøº¸ µîÀÇ ºÎ¹®¿¡¼­´Â, Çõ½ÅÀÇ ¸¶Áß¹°ÀÌ µÇ°í ÀÖ½À´Ï´Ù. ¼¼¶ó¹Í °¡°ø¿¡¼­ÀÇ ¿¹Ãø ¸ðµ¨¸µÀ» À§ÇØ AI³ª ±â°è ÇнÀÀ» äÅÃÇÏ´Â °Íµµ Å« ÆøÀÇ È¿À²È­¸¦ °¡Á®¿Ã °¡´É¼ºÀÌ ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ °úÁ¦¸¦ ±Øº¹Çϱâ À§ÇØ ±â¾÷Àº ±â¼ú ±³·ù¸¦ ÃËÁøÇÏ´Â ÆÄÆ®³Ê½Ê°ú Çù¾÷¿¡ ÁÖ·ÂÇϰí, ½Ç½Ã°£ ÇÁ·Î¼¼½º ÃÖÀûÈ­¸¦ À§ÇØ µðÁöÅÐ Æ®À©°ú IoT¸¦ ÅëÇÕÇÏ´Â ÀûÀÀÇü Á¦Á¶ ±â¼ú¿¡ ÅõÀÚÇØ¾ß ÇÕ´Ï´Ù. °æÀï »óȲ¿¡¼­µµ Àü·«Àû Á¦ÈÞ³ª ¼öÁ÷ÅëÇÕÀ» Ȱ¿ëÇØ ÀÔÁö¸¦ ´ÙÁö°í °ø±Þ¸ÁÀÇ Ãë¾à¼º¿¡ ´ëÇÑ ³»¼ºÀ» È®º¸Çϸ鼭 ÃÖÁ¾ »ç¿ëÀÚÀÇ »õ·Î¿î ±â¼úÀû ¿ä±¸¿¡ µû¸¥ »õ·Î¿î ¼ºÀå ±âȸ¸¦ ȹµæÇÏ´Â ±â¾÷¿¡°Ô ½ÃÀåÀÇ ¼ºÁúÀº ¹«¸£ÀͰí ÀÖ½À´Ï´Ù.

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±âÁسâ(2023³â) 10¾ï 8,000¸¸ ´Þ·¯
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¿¹Ãø³â(2030³â) 14¾ï 8,000¸¸ ´Þ·¯
CAGR(%) 4.55%

½ÃÀå ¿ªÇÐ : ºü¸£°Ô ÁøÈ­ÇÏ´Â Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀåÀÇ ÁÖ¿ä ½ÃÀå ÀλçÀÌÆ® °ø°³

Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀåÀº ¼ö¿ä ¹× °ø±ÞÀÇ ¿ªµ¿ÀûÀÎ »óÈ£ ÀÛ¿ë¿¡ ÀÇÇØ º¯¸ð¸¦ ÀÌ·ç°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ½ÃÀå ¿ªÇÐÀÇ ÁøÈ­¸¦ ÀÌÇØÇÔÀ¸·Î½á ±â¾÷Àº ÃæºÐÇÑ Á¤º¸¸¦ ¹ÙÅÁÀ¸·Î ÅõÀÚ°áÁ¤, Àü·«Àû °áÁ¤ Á¤¹ÐÈ­, »õ·Î¿î ºñÁî´Ï½º ±âȸ ȹµæ¿¡ ´ëºñÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ µ¿ÇâÀ» Á¾ÇÕÀûÀ¸·Î ÆÄ¾ÇÇÔÀ¸·Î½á ±â¾÷Àº Á¤Ä¡Àû, Áö¸®Àû, ±â¼úÀû, »çȸÀû, °æÁ¦Àû ¿µ¿ª¿¡ °ÉÄ£ ´Ù¾çÇÑ À§ÇèÀ» ¿ÏÈ­ÇÒ ¼ö ÀÖÀ¸¸ç, ¼ÒºñÀÚ Çൿ°ú ±×°ÍÀÌ Á¦Á¶ ºñ¿ë°ú ±¸¸Å µ¿Çâ¿¡ ¹ÌÄ¡´Â ¿µÇâÀ» º¸´Ù ¸íÈ®ÇÏ°Ô ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

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    • »ý»ê °øÁ¤ÀÇ º¹À⼺

Porter's Five Forces : Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀåÀ» Ž»öÇÏ´Â Àü·« µµ±¸

Porter's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ½ÃÀå »óȲÀÇ °æÀï ±¸µµ¸¦ ÆÄ¾ÇÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. Porter's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÇ °æÀïÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ ޱ¸ÇÏ´Â ¸íÈ®ÇÑ ±â¼úÀ» ¼³¸íÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» ÆÇ´ÜÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÀλçÀÌÆ®¸¦ ÅëÇØ ±â¾÷Àº ÀÚ»çÀÇ °­Á¡À» Ȱ¿ëÇϰí, ¾àÁ¡À» ÇØ°áÇϰí, ÀáÀçÀûÀÎ °úÁ¦¸¦ ÇÇÇÒ ¼ö ÀÖÀ¸¸ç, º¸´Ù °­ÀÎÇÑ ½ÃÀå¿¡¼­ÀÇ Æ÷Áö¼Å´×À» È®º¸ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀå¿¡¼­ ¿ÜºÎ ¿µÇâ ÆÄ¾Ç

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇϴµ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀÎ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ ¼³¸íÇÕ´Ï´Ù. PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀûÀÎ À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¾ÕÀ¸·Î ¿¹»óµÇ´Â Àû±ØÀûÀÎ ÀÇ»ç °áÁ¤À» ÇÒ Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® : Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀå¿¡¼­ °æÀï ±¸µµ ÆÄ¾Ç

Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ °ø±Þ¾÷üÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¼öÀÍ, °í°´ ±â¹Ý, ¼ºÀå·ü µî ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀï Æ÷Áö¼Å´×À» ¹àÈú ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®À» ÅëÇØ ½ÃÀå ÁýÁß, ¼¼ºÐÈ­ ¹× ÅëÇÕ µ¿ÇâÀ» ¹àÇô³»°í °ø±Þ¾÷ü´Â °æÀïÀÌ Ä¡¿­ÇØÁö¸é¼­ ÀÚ½ÅÀÇ ÁöÀ§¸¦ ³ôÀÌ´Â Àü·«Àû ÀÇ»ç °áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ Áö½ÄÀ» ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º : LTCC ¹× HTCC ½ÃÀå¿¡¼­ °ø±Þ¾÷üÀÇ ¼º´É Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀå¿¡¼­ °ø±Þ¾÷ü¸¦ Æò°¡Çϱâ À§ÇÑ Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. ÀÌ ¸ÅÆ®¸¯½º¸¦ ÅëÇØ ºñÁî´Ï½º Á¶Á÷Àº °ø±Þ¾÷üÀÇ ºñÁî´Ï½º Àü·«°ú Á¦Ç° ¸¸Á·µµ¸¦ ±âÁØÀ¸·Î Æò°¡ÇÏ¿© ¸ñÇ¥¿¡ ¸Â´Â ÃæºÐÇÑ Á¤º¸¸¦ ¹ÙÅÁÀ¸·Î ÀÇ»ç °áÁ¤À» ³»¸± ¼ö ÀÖ½À´Ï´Ù. ³× °¡Áö »çºÐ¸éÀ» ÅëÇØ °ø±Þ¾÷ü¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ºÎ¹®È­Çϰí Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê ¹× ¼Ö·ç¼ÇÀ» ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù.

Àü·« ºÐ¼® ¹× Ãßõ : Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀå¿¡¼­ ¼º°øÀ» À§ÇÑ ±æÀ» ±×¸®±â

Àú¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(LTCC) ¹× °í¿Â µ¿½Ã ¼Ò¼º ¼¼¶ó¹Í(HTCC) ½ÃÀåÀÇ Àü·«Àû ºÐ¼®Àº ¼¼°è ½ÃÀå¿¡¼­ÀÇ ÇÁ·¹Á𽺠°­È­¸¦ ¸ñÇ¥·Î ÇÏ´Â ±â¾÷¿¡ ÇʼöÀûÀÎ ¿ä¼ÒÀÔ´Ï´Ù. ÁÖ¿ä ÀÚ¿ø, ´É·Â ¹× ¼º°ú ÁöÇ¥¸¦ °ËÅäÇÔÀ¸·Î½á ±â¾÷Àº ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇÏ°í °³¼±À» À§ÇØ ³ë·ÂÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Á¢±Ù ¹æ½ÄÀ» ÅëÇØ °æÀï ±¸µµ¿¡¼­ °úÁ¦¸¦ ±Øº¹ÇÏ°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Ȱ¿ëÇÏ¿© Àå±âÀûÀÎ ¼º°øÀ» °ÅµÑ ¼ö Àִ üÁ¦¸¦ ±¸ÃàÇÒ ¼ö ÀÖ½À´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ ´Ù·ç´Â ½ÃÀå¿¡ ´ëÇÑ Á¾ÇÕÀûÀÎ ºÐ¼®À» Á¦°øÇÕ´Ï´Ù.

1. ½ÃÀå ħÅõ : ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·ÂÀ» Æò°¡ÇÕ´Ï´Ù.

2. ½ÃÀå °³Ã´µµ : ½ÅÈï ½ÃÀåÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇϰí, ±âÁ¸ ºÎ¹®¿¡¼­ÀÇ È®Àå °¡´É¼ºÀ» Æò°¡Çϸç, ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» ¼³¸íÇÕ´Ï´Ù.

3. ½ÃÀå ´Ù¾çÈ­ : ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, »ê¾÷ÀÇ ÁÖ¿ä Áøº¸, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú Áøº¸ µîÀ» °ËÁõÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ¹Ì·¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÃÖ÷´Ü ±â¼ú, ¿¬±¸°³¹ß Ȱµ¿, Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

¶ÇÇÑ ÀÌÇØ°ü°èÀÚ°¡ ÃæºÐÇÑ Á¤º¸¸¦ ¾òÀº ÈÄ ÀÇ»ç°áÁ¤ÇÒ ¼ö ÀÖµµ·Ï Áß¿äÇÑ Áú¹®¿¡µµ ´ë´äÇϰí ÀÖ½À´Ï´Ù.

1. ÇöÀç ½ÃÀå ±Ô¸ð ¹× ÇâÈÄ ¼ºÀå ¿¹ÃøÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, Áö¿ªÀº ¾îµðÀԴϱî?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ ¹× ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õÀÇ ½ÃÀå Á¡À¯À² ¹× °æÀï Æ÷Áö¼ÇÀº?

5. º¥´õ ½ÃÀå ÁøÀÔ ¹× ö¼ö Àü·«ÀÇ ¿øµ¿·ÂÀÌ µÇ´Â ¼öÀÍ¿ø°ú Àü·«Àû ±âȸ´Â ¹«¾ùÀΰ¡?

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  • API TECHNOLOGIES CORP.
  • DuPont de Nemours, Inc.
  • EGIDE SA
  • Hitachi Metals, Ltd.
  • KOA Speer Electronics, Inc.
  • KYOCERA Corporation
  • MARUWA CO., LTD.
  • Micro Systems Technologies Management GmbH
  • Mirion Technologies(Selmic) Oy
  • Murata Manufacturing Co., Ltd.
  • NGK SPARK PLUG CO., LTD.
  • Nikko Company
  • SCHOTT AG
  • Soar Technology Co., Ltd.
  • TDK Corporation
  • Yokowo Co., Ltd.
AJY 24.12.20

The LTCC & HTCC Market was valued at USD 1.08 billion in 2023, expected to reach USD 1.13 billion in 2024, and is projected to grow at a CAGR of 4.55%, to USD 1.48 billion by 2030.

LTCC (Low Temperature Co-fired Ceramics) and HTCC (High Temperature Co-fired Ceramics) are integral to the manufacturing landscape of electronic components, providing robust substrates for printed circuit boards, sensors, and microelectronic devices. The necessity for LTCC and HTCC arises from the demand for miniaturized electronics with enhanced performance characteristics, suitable for high-reliability applications in automotive, aerospace, telecommunications, and medical industries. LTCC offers benefits such as high thermal conductivity and the ability to integrate multiple passive components, whereas HTCC provides superior mechanical strength and temperature resilience, making them both vital for advanced electronic systems. Market growth is primarily driven by increased consumer demand for compact, efficient devices, and rising investments in 5G infrastructure and IoT technology. Recent opportunities emerge from the wider adoption of wearables and autonomous vehicles, encouraging R&D in optimizing co-fired ceramics for better cost-efficiency and performance metrics. However, challenges include high production costs, intricate manufacturing processes, and stringent regulatory standards. The supply chain disruptions and scarcity of raw materials also pose potential growth impediments. Innovation is primed within areas such as material science advancements focusing on novel compositions that reduce shrinkage and improve dielectric properties; employing AI and machine learning for predictive modeling in ceramics processing can also yield significant efficiencies. To navigate and conquer these challenges, businesses should focus on partnerships and collaborations fostering technological exchange and invest in adaptive manufacturing techniques that integrate digital twins and IoT for real-time process optimization. Even in a competitive landscape, the nature of the market is ripe for companies leveraging strategic alliances and vertical integration to consolidate their positions, ensuring resilience against supply chain vulnerabilities while capturing new growth opportunities aligned with emerging end-user technological demands.

KEY MARKET STATISTICS
Base Year [2023] USD 1.08 billion
Estimated Year [2024] USD 1.13 billion
Forecast Year [2030] USD 1.48 billion
CAGR (%) 4.55%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving LTCC & HTCC Market

The LTCC & HTCC Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growing requirement of microelectronics in vehicles and aircraft for a safer experience
    • Applications in automotive and telecommunication sector
    • Rising concerns to develop high-performance small-sized circuit boards for electronic components
  • Market Restraints
    • Limitations of LTCC & HTCC
  • Market Opportunities
    • Growing prominence of emerging technologies such as the Internet of Things (IoT) and 5G technology
    • Rising research spending for developing next-generation wireless technologies
  • Market Challenges
    • Complexities in production process

Porter's Five Forces: A Strategic Tool for Navigating the LTCC & HTCC Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the LTCC & HTCC Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the LTCC & HTCC Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the LTCC & HTCC Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the LTCC & HTCC Market

A detailed market share analysis in the LTCC & HTCC Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the LTCC & HTCC Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the LTCC & HTCC Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the LTCC & HTCC Market

A strategic analysis of the LTCC & HTCC Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the LTCC & HTCC Market, highlighting leading vendors and their innovative profiles. These include API TECHNOLOGIES CORP., DuPont de Nemours, Inc., EGIDE S.A., Hitachi Metals, Ltd., KOA Speer Electronics, Inc., KYOCERA Corporation, MARUWA CO., LTD., Micro Systems Technologies Management GmbH, Mirion Technologies (Selmic) Oy, Murata Manufacturing Co., Ltd., NGK SPARK PLUG CO., LTD., Nikko Company, SCHOTT AG, Soar Technology Co., Ltd., TDK Corporation, and Yokowo Co., Ltd..

Market Segmentation & Coverage

This research report categorizes the LTCC & HTCC Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Product, market is studied across High-Temperature Co-Fired Ceramic and Low Temperature Co-Fired Ceramic.
  • Based on Application, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, and Telecommunication.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing requirement of microelectronics in vehicles and aircraft for a safer experience
      • 5.1.1.2. Applications in automotive and telecommunication sector
      • 5.1.1.3. Rising concerns to develop high-performance small-sized circuit boards for electronic components
    • 5.1.2. Restraints
      • 5.1.2.1. Limitations of LTCC & HTCC
    • 5.1.3. Opportunities
      • 5.1.3.1. Growing prominence of emerging technologies such as the Internet of Things (IoT) and 5G technology
      • 5.1.3.2. Rising research spending for developing next-generation wireless technologies
    • 5.1.4. Challenges
      • 5.1.4.1. Complexities in production process
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. LTCC & HTCC Market, by Product

  • 6.1. Introduction
  • 6.2. High-Temperature Co-Fired Ceramic
  • 6.3. Low Temperature Co-Fired Ceramic

7. LTCC & HTCC Market, by Application

  • 7.1. Introduction
  • 7.2. Aerospace & Defense
  • 7.3. Automotive
  • 7.4. Consumer Electronics
  • 7.5. Telecommunication

8. Americas LTCC & HTCC Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific LTCC & HTCC Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa LTCC & HTCC Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. API TECHNOLOGIES CORP.
  • 2. DuPont de Nemours, Inc.
  • 3. EGIDE S.A.
  • 4. Hitachi Metals, Ltd.
  • 5. KOA Speer Electronics, Inc.
  • 6. KYOCERA Corporation
  • 7. MARUWA CO., LTD.
  • 8. Micro Systems Technologies Management GmbH
  • 9. Mirion Technologies (Selmic) Oy
  • 10. Murata Manufacturing Co., Ltd.
  • 11. NGK SPARK PLUG CO., LTD.
  • 12. Nikko Company
  • 13. SCHOTT AG
  • 14. Soar Technology Co., Ltd.
  • 15. TDK Corporation
  • 16. Yokowo Co., Ltd.
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