저온 동시 소성 세라믹(LTCC)와 고온 동시 소성 세라믹(HTCC) 시장 예측(-2030년) : 제품 유형, 공정 유형, 재료 유형, 용도, 최종 사용자 및 지역별 분석

According to Stratistics MRC, the Global LTCC And HTCC Market is accounted for $3.14 billion in 2024 and is expected to reach $4.34 billion by 2030 growing at a CAGR of 5.5% during the forecast period. Low-Temperature Co-fired Ceramics (LTCC) and High-Temperature Co-fired Ceramics (HTCC) are technologies used in the manufacturing of electronic components. LTCC involves the use of ceramic materials that can be co-fired at temperatures below 900°C. This method allows for the integration of passive components like resistors, capacitors, and inductors within the ceramic substrate, making it suitable for high-frequency and high-density applications, such as RF modules and medical devices. HTCC, on the other hand, uses ceramic materials that require firing at temperatures above 1600°C. This process is typically used for applications that demand higher thermal and mechanical stability, such as aerospace and military electronics.

Market Dynamics:

Driver:

Demand for miniaturized electronics

LTCC and HTCC benefits from this trend due to its capability to integrate multiple passive components within a small footprint, making it ideal for compact devices such as smartphones, medical implants, and IoT devices. The low dielectric loss and excellent thermal properties of LTCC also support the performance and reliability required in these applications. This includes aerospace, military, and industrial electronics, where HTCC's superior thermal and mechanical stability is essential. Overall, the push for smaller, more efficient electronic devices accelerates advancements and adoption in both LTCC and HTCC technologies

Restraint:

High Initial Investment

Setting up manufacturing facilities for these advanced ceramic technologies involves substantial capital expenditure on specialized equipment, materials, and skilled labor. This financial barrier can deter small and medium-sized enterprises (SMEs) from entering the market, limiting innovation and competition. Additionally, the significant costs associated with research and development (R&D) for improving these technologies further strain potential investors and manufacturers. As a result, the market can become dominated by larger companies with sufficient resources, potentially leading to less competitive pricing and slower advancements.

Opportunity:

Telecom infrastructure expansion

LTCC technology benefits due to its capability to handle high-frequency signals, making it ideal for compact, efficient components in 5G networks and other advanced telecom systems. This drives demand for LTCC-based filters, antennas, and modules. On the other hand HTCC technology, with its superior thermal and mechanical stability, supports high-power telecom applications, ensuring reliable performance under demanding conditions propel the growth of the market.

Threat:

Limited material availability

Scarcity of specialized raw materials, such as high-purity ceramics and specific metal pastes, can lead to supply chain disruptions and higher prices, affecting manufacturers' ability to meet demand. This limitation can also hinder research and development efforts, slowing innovation and the introduction of new products. Consequently, companies may face challenges in scaling their operations and maintaining competitive pricing, which can deter market growth

Covid-19 Impact

The epidemic caused extensive supply chain delays since industrial plants had to close temporarily to comply with lockdown procedures and protect employees. The manufacture and delivery of LTCC and HTCC materials and components were delayed as a result of this interruption, making it difficult to satisfy demand and complete obligations. In addition, the economic recession brought on by the pandemic changed consumer spending habits and investment choices, which resulted in a decline in demand for goods and services in some industries, including healthcare, telecommunications, automotive, aerospace and the automotive industry all of which are important users of LTCC and HTCC components.

The multi-chip modules segment is expected to be the largest during the forecast period

The multi-chip modules is expected to be the largest during the forecast period as which integrate multiple semiconductor dies into a single package, demand advanced substrates to support their compact and high-performance nature. LTCC and HTCC materials are ideal for these substrates due to their excellent thermal stability, electrical properties, and compatibility with miniaturized electronic components. Thus the use of LTCC and HTCC in MCMs enables enhanced functionality, reduced signal loss, and improved heat dissipation, which are crucial for high-frequency and high-power applications.

The telecommunications segment is expected to have the highest CAGR during the forecast period

The telecommunications segment is expected to have the highest CAGR during the forecast period due to the penetration of LTCC technology is rapidly increasing for applications in microwave and millimeter-wave frequency band in areas including Bluetooth module, front end module of mobile phones, and WLAN. Moreover, new opportunities lie ahead as various companies are developing advanced LTCC products, which are projected to benefit these companies to expand their footprint in 5G communication.

Region with largest share:

North America is projected to hold the largest market share during the forecast period attributed to the rising demand for LTCC based PCBs and the flourishing wireless communication industry in the region. In Europe, market growth is attributed to the development of the EV industry. In 2020, Europe exceeded China and became the largest EV market. With 1.4 million EVs sold, the region held a revenue share of 45.0% of EV sales in 2020. Growth in the EV industry will augment demand for auto electronics and positively influence product demand over the forecast period.

Region with highest CAGR:

Asia Pacific is projected to hold the highest CAGR over the forecast period owing to the rapidly flourishing automotive, consumer, and industrial electronics sectors in countries such as India, China, South Korea, and Japan. The ongoing incentive schemes for EVs by governments of different countries are anticipated to attract auto-electronic product manufacturers to the region. Furthermore, with the advent of 5G technology, China is witnessing investments in its power electronics industry, which is anticipated to benefit market growth.

Key players in the market

Some of the key players in LTCC And HTCC market include ACX Corp., API Technologies, ECRI Microelectronics, Hitachi Metals Ltd, KOA Corporation, Kyocera Corporation, Maruwa Co. Ltd., Micro Systems Technologies, Murata Manufacturing Co., Ltd., NGK Spark Plug Ltd., NIKKO Company, Selmic Oy, Soar Technology Co., Ltd., TDK Corporation and Yokowo co., ltd

Key Developments:

In June 2024, Kyocera launches new cut-off solution "KGZ" for small parts machining. In addition, there are some challenges regarding the workability of the machine, such as the need for a skilled operator to quickly and accurately replace and install inserts in a narrow space.

In June 2024, Kyocera Installs World's First*1 Fine Cordierite Ceramic Mirror for International Space Station's Experimental Optical Communications. This demonstration was conducted jointly by the National Institute of Information and Communications Technology

In June 2024, Hitachi Energy launches innovative oil-free and plug-and-play traction transformer. This plug-and-play solution is a breakthrough technology for dry-type on-board traction transformer.

Product Types Covered:

• Substrates
• Packages
• Modules

Process Types Covered:

• Capacitors
• Multi-Chip Modules
• Inductors
• Conductors
• Radio Recurrence Transformers
• Other Process Types

Material Types Covered:

• Glass-Ceramic
• Ceramic

Applications Covered:

• Mobile Phone Base Stations
• Microwave Filters
• Radio Frequency (RF) Modules
• Engine Control Units (ECUs)
• Airbag Control Modules
• Advanced Driver-Assistance Systems (ADAS) Sensors
• Smartphones & Tablets
• Pacemakers & Defibrillators
• Hearing Aids & Microfluidic Devices
• Satellites & Military Communication Systems
• Other Applications

End Users Covered:

• Aerospace and Defense
• Automotive
• Telecommunications
• Medical
• Consumer Electronics
• Industrial
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 Application Analysis
• 3.8 End User Analysis
• 3.9 Emerging Markets
• 3.10 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global LTCC And HTCC Market, By Product Type

• 5.1 Introduction
• 5.2 Substrates
• 5.3 Packages
• 5.4 Modules
  • 5.4.1 Multi Chip Modules
  • 5.4.2 High Recurrence Modules

6 Global LTCC And HTCC Market, By Process Type

• 6.1 Introduction
• 6.2 Capacitors
• 6.3 Multi-Chip Modules
• 6.4 Inductors
• 6.5 Conductors
• 6.6 Radio Recurrence Transformers
• 6.7 Other Process Types

7 Global LTCC And HTCC Market, By Material Type

• 7.1 Introduction
• 7.2 Glass-Ceramic
• 7.3 Ceramic

8 Global LTCC And HTCC Market, By Application

• 8.1 Introduction
• 8.2 Mobile Phone Base Stations
• 8.3 Microwave Filters
• 8.4 Radio Frequency (RF) Modules
• 8.5 Engine Control Units (ECUs)
• 8.6 Airbag Control Modules
• 8.7 Advanced Driver-Assistance Systems (ADAS) Sensors
• 8.8 Smartphones & Tablets
• 8.9 Pacemakers & Defibrillators
• 8.10 Hearing Aids & Microfluidic Devices
• 8.11 Satellites & Military Communication Systems
• 8.12 Other Applications

9 Global LTCC And HTCC Market, By End User

• 9.1 Introduction
• 9.2 Aerospace and Defense
• 9.3 Automotive
• 9.4 Telecommunications
• 9.5 Medical
• 9.6 Consumer Electronics
• 9.7 Industrial
• 9.8 Other End Users

10 Global LTCC And HTCC Market, By Geography

• 10.1 Introduction
• 10.2 North America
  • 10.2.1 US
  • 10.2.2 Canada
  • 10.2.3 Mexico
• 10.3 Europe
  • 10.3.1 Germany
  • 10.3.2 UK
  • 10.3.3 Italy
  • 10.3.4 France
  • 10.3.5 Spain
  • 10.3.6 Rest of Europe
• 10.4 Asia Pacific
  • 10.4.1 Japan
  • 10.4.2 China
  • 10.4.3 India
  • 10.4.4 Australia
  • 10.4.5 New Zealand
  • 10.4.6 South Korea
  • 10.4.7 Rest of Asia Pacific
• 10.5 South America
  • 10.5.1 Argentina
  • 10.5.2 Brazil
  • 10.5.3 Chile
  • 10.5.4 Rest of South America
• 10.6 Middle East & Africa
  • 10.6.1 Saudi Arabia
  • 10.6.2 UAE
  • 10.6.3 Qatar
  • 10.6.4 South Africa
  • 10.6.5 Rest of Middle East & Africa

11 Key Developments

• 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 11.2 Acquisitions & Mergers
• 11.3 New Product Launch
• 11.4 Expansions
• 11.5 Other Key Strategies

12 Company Profiling

• 12.1 ACX Corp.
• 12.2 API Technologies
• 12.3 ECRI Microelectronics
• 12.4 Hitachi Metals Ltd
• 12.5 KOA Corporation
• 12.6 Kyocera Corporation
• 12.7 Maruwa Co. Ltd.
• 12.8 Micro Systems Technologies
• 12.9 Murata Manufacturing Co., Ltd.
• 12.10 NGK Spark Plug Ltd.
• 12.11 NIKKO Company
• 12.12 Selmic Oy
• 12.13 Soar Technology Co., Ltd.
• 12.14 TDK Corporation
• 12.15 Yokowo co., ltd