시장보고서
상품코드
1676838

세계의 반도체 계측 및 검사 시장 : 유형별, 기술 유형별, 구성 요소별, 최종 사용자별, 용도별, 산업 분야별(2025-2030년)

Semiconductor Metrology & Inspection Market by Type, Technology Type, Component Type, End User, Application, Industry Vertical - Global Forecast 2025-2030

발행일: | 리서치사: 360iResearch | 페이지 정보: 영문 182 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    




■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

반도체 계측 및 검사 시장의 2024년 120억 9,000만 달러로 평가되었으며 2025년에는 7.41%의 연평균 성장률로 129억 5,000만 달러로 성장하여 2030년에는 185억 8,000만 달러에 달할 것으로 예상됩니다.

주요 시장 통계
기준 연도(2024년) 120억 9,000만 달러
추정 연도(2025년) 129억 5,000만 달러
예측 연도(2030년) 185억 8,000만 달러
CAGR 7.41%

빠르게 진화하는 기술 환경 속에서 반도체 계측 및 검사 시장은 혁신과 운영 우수성의 최전선에 서 있습니다. 이 요약본에서는 시장 역학에 영향을 미치는 주요 요인, 기술의 혁신적 영향, 오늘날 업계 리더를 이끄는 전략적 인사이트에 대해 심층적으로 살펴봅니다. 품질 관리, 프로세스 최적화 및 기술 통합에 새롭게 초점을 맞춘 반도체 분야의 전문가들은 운영 벤치마크를 지속적으로 재정의하고 있습니다. 계측 정확도, 비파괴 검사 및 실시간 분석의 발전으로 검사 표준이 향상되고 반도체 제조의 신뢰성이 강화되었습니다. 본 분석은 새로운 트렌드, 시장 부문 및 지역 역학 관계를 심층적으로 분석하여 정보에 입각한 의사결정을 내릴 수 있는 기반을 마련합니다. 정밀도가 성공과 실패를 가르는 산업에서 이러한 요소를 이해하는 것은 장기적인 성공을 위해 필수적입니다. 디지털 전환과 복잡성 증가의 시대를 헤쳐나가는 이 포괄적인 개요는 시장 현황에 대한 상세한 설명을 제공하여 이해관계자들이 기회를 활용하고 도전과제를 효과적으로 해결할 수 있도록 지원합니다.

환경의 혁신적 변화 : 혁신과 효율성 촉진

반도체 계측 및 검사 업계는 업계 전반의 운영 프레임워크를 재정의하는 혁신적인 변화를 목격했습니다. 첨단 센서 기술, 자동화, 인공 지능이 빠르게 통합되면서 전례 없는 수준의 정밀도와 효율성을 달성할 수 있는 길이 열렸습니다. 기존의 검사 프로세스는 생산 주기를 가속화할 뿐만 아니라 품질 관리를 강화하는 실시간 데이터 기반 방법론으로 대체되었습니다. 시장 참여자들은 향상된 결함 감지 및 특성화를 제공하여 가동 중단 시간을 최소화하고 비용을 절감할 수 있는 디지털 솔루션에 점점 더 의존하고 있습니다. 이러한 진화는 기술 업그레이드에만 국한되지 않고 생산 방법론과 품질 프레임워크의 전략적 재편도 포함합니다. 계측 기기의 현대화를 통해 제조업체는 미세한 수준의 편차를 식별하여 모든 구성 요소가 엄격한 산업 표준을 충족하도록 보장할 수 있게 되었습니다. 또한 지속 가능성과 자원 최적화에 대한 관심은 높은 처리량과 에너지 효율성을 모두 제공하는 장비에 대한 투자를 촉진했습니다. 시장의 역학관계가 빠르게 변화함에 따라 업계 전문가들은 경쟁력을 유지하기 위해 혁신적인 기술을 수용하며 계속해서 적응하고 있습니다. 통합 디지털 에코시스템과 클라우드 기반 분석으로의 전환은 큰 도약을 의미하며, 더 많은 개선을 약속하고 반도체 품질 보증의 새로운 시대를 여는 발판이 될 것입니다.

주요 세분화 인사이트

반도체 계측 및 검사 시장을 평가하면 경쟁 전략과 고객 니즈를 더 깊이 이해할 수 있는 복잡한 부분의 모자이크가 드러납니다. 유형별로 시장을 분석할 때는 범프 검사, 리드 프레임 검사, 마스크 검사 시스템, 패키지 검사, 프로브 카드 검사, 박막 계측, 웨이퍼 검사 시스템 등 다양한 검사 방법론에 중점을 두고 분석합니다. 각 부문은 고유한 장점을 제공하며 특정 제조 과제를 해결합니다. 기술 유형별로는 음향, 전자빔, 광학, X선 방식이 있으며, 각 방식은 해상도, 속도, 다양한 재료 특성에 대한 적응성 측면에서 뚜렷한 이점을 제공합니다. 기술적 응용 분야 외에도 구성 요소별 세분화는 물리적 계측과 디지털 분석의 상호 의존적인 특성을 반영하여 하드웨어 장치와 소프트웨어 솔루션에 대한 이중적인 초점을 강조합니다. 또한 최종 사용자 범주를 대상으로 분석하여 팹리스 기업, 파운드리, 통합 장치 제조업체, 연구 실험실 및 검사 시설의 요구 사항을 조사합니다. 아날로그 장치, 논리 장치, 메모리 장치(DRAM 및 플래시 메모리와 같은 전문 하위 카테고리 포함), 광전자, 전력 장치 전반의 시장을 연구하는 용도를 조사할 때는 더욱 세분화된 분석이 이루어집니다. 또한 산업별 세분화는 자동차, 소비자 가전, 의료, 통신과 같은 주요 부문을 다루며, 각 부문은 시장 행동에 영향을 미치는 뚜렷한 과제와 기회를 제시합니다. 이러한 다각적인 인사이트를 통해 이해관계자는 성장 분야를 정확히 파악하고 진화하는 수요에 맞춰 제품을 맞춤화할 수 있습니다.

목차

제1장 서문

제2장 조사 방법

제3장 주요 요약

제4장 시장 개요

제5장 시장 인사이트

  • 시장 역학
    • 성장 촉진요인
      • 전자 제품에서 반도체 칩에 대한 수요 증가
      • 세계 소비자들의 가전제품 및 웨어러블 기기 채택 증가
      • 첨단 패키징 공정을 위한 계측 및 검사 사용 증가
    • 억제요인
      • 계측 및 검사 장비의 높은 설치 비용
    • 기회
      • 혁신적인 결함 검사 시스템의 지속적인 개발
      • 계측 및 검사 시스템에 있어서의 AI의 도입 증가
    • 과제
      • 반도체 계측 검사 장치에 대한 엄격한 규제 표준
  • 시장 세분화 분석
    • 유형 : 첨단 패키징을 위한 생산 라인 통합을 위한 범프 검사에 대한 선호도 증가
    • 최종 사용자 : 다양한 비즈니스 모델을 운영하는 파운드리에서 반도체 계측 도입 확대
  • Porter's Five Forces 분석
  • PESTEL 분석
    • 정치
    • 경제
    • 사회
    • 기술
    • 법률
    • 환경

제6장 반도체 계측 및 검사 시장 : 유형별

  • 범프 검사
  • 리드 프레임 검사
  • 마스크 검사 시스템
  • 패키지 검사
  • 프로브 카드 검사
  • 박막 계측
  • 웨이퍼 검사

제7장 반도체 계측 및 검사 시장 : 기술 유형별

  • 음향
  • 전자빔
  • 광학
  • X선

제8장 반도체 계측 및 검사 시장 : 구성 요소별

  • 하드웨어 장치
  • 소프트웨어 솔루션

제9장 반도체 계측 및 검사 시장 : 최종 사용자별

  • 팹리스 기업
  • 파운드리
  • 통합 장치 제조업체
  • 연구 실험실
  • 검사 시설

제10장 반도체 계측 및 검사 시장 : 용도별

  • 아날로그 장치
  • 논리 장치
  • 메모리 장치
    • DRAM
    • 플래시 메모리
  • 광전자
  • 전력 장치

제11장 반도체 계측 및 검사 시장 : 산업 분야별

  • 자동차
  • 소비자 가전
  • 의료
  • 통신

제12장 아메리카의 반도체 계측 및 검사 시장

  • 아르헨티나
  • 브라질
  • 캐나다
  • 멕시코
  • 미국

제13장 아시아태평양의 반도체 계측 및 검사 시장

  • 호주
  • 중국
  • 인도
  • 인도네시아
  • 일본
  • 말레이시아
  • 필리핀
  • 싱가포르
  • 한국
  • 대만
  • 태국
  • 베트남

제14장 유럽, 중동 및 아프리카의 반도체 계측 및 검사 시장

  • 덴마크
  • 이집트
  • 핀란드
  • 프랑스
  • 독일
  • 이스라엘
  • 이탈리아
  • 네덜란드
  • 나이지리아
  • 노르웨이
  • 폴란드
  • 카타르
  • 러시아
  • 사우디아라비아
  • 남아프리카
  • 스페인
  • 스웨덴
  • 스위스
  • 터키
  • 아랍에미리트(UAE)
  • 영국

제15장 경쟁 구도

  • 시장 점유율 분석(2024년)
  • FPNV 포지셔닝 매트릭스(2024년)
  • 경쟁 시나리오 분석
  • 전략 분석과 제안

기업 목록

  • ADVANTEST Corporation
  • Applied Materials, Inc.
  • ASML Holding NV
  • Camtek Ltd
  • Canon, Inc.
  • CyberOptics Corporation
  • HAMAMATSU Group
  • Hitachi High-Tech Corporation
  • HORIBA, Ltd.
  • JEOL Ltd.
  • KLA Corporation
  • Lam Research Corporation
  • Lasertec Corporation
  • Mirtec Co., Ltd.
  • Nova Measuring Instruments Ltd.
  • Onto Innovation, Inc.
  • Oxford Instruments Plc
  • Rohde & Schwarz GmbH & Co KG
  • SCREEN Holdings Co., Ltd.
  • SUSS MicroTec SE
  • Thermo Fisher Scientific Inc.
  • Toray Engineering Co., Ltd
  • Zeiss Group
HBR 25.03.20

The Semiconductor Metrology & Inspection Market was valued at USD 12.09 billion in 2024 and is projected to grow to USD 12.95 billion in 2025, with a CAGR of 7.41%, reaching USD 18.58 billion by 2030.

KEY MARKET STATISTICS
Base Year [2024] USD 12.09 billion
Estimated Year [2025] USD 12.95 billion
Forecast Year [2030] USD 18.58 billion
CAGR (%) 7.41%

In a rapidly evolving technological landscape, the semiconductor metrology and inspection market is at the forefront of innovation and operational excellence. This executive summary provides an in-depth look at the critical factors influencing market dynamics, the transformative impact of technology, and the strategic insights that guide today's industry leaders. With a renewed focus on quality control, process optimization, and technology integration, professionals across the semiconductor space are continually redefining operational benchmarks. Advances in measurement accuracy, non-destructive testing, and real-time analytics have elevated inspection standards and bolstered the reliability of semiconductor manufacturing. The present analysis delves into emerging trends, market segments, and regional dynamics, setting the stage for informed decision-making. In an industry where precision can make the difference between success and obsolescence, understanding these elements is essential for long-term success. As we navigate an era of digital transformation and increasing complexity, this comprehensive overview offers a detailed narrative on the current state of the market, ensuring that stakeholders are well-equipped to harness opportunities and address challenges effectively.

Transformative Shifts in the Landscape: Driving Innovation and Efficiency

The semiconductor metrology and inspection industry has witnessed transformative shifts that are redefining the operational framework across the sector. The rapid integration of advanced sensor technologies, automation, and artificial intelligence has paved the way for unprecedented levels of precision and efficiency. Traditional inspection processes have given way to real-time, data-driven methodologies that not only accelerate production cycles but also enhance quality control. Market players are increasingly relying on digital solutions that offer improved defect detection and characterization, thus minimizing downtime and reducing costs. This evolution is not limited to technological upgrades; it also encompasses strategic realignments in production methodologies and quality frameworks. The modernization of metrology instruments has enabled manufacturers to identify subtle deviations at the microscopic level, ensuring that every component meets rigorous industry standards. Furthermore, the focus on sustainability and resource optimization has spurred investments in equipment that delivers both high throughput and energy efficiency. As market dynamics shift rapidly, industry experts continue to adapt, embracing innovative techniques to maintain competitiveness. The shift toward integrated digital ecosystems and cloud-based analytics represents a major leap forward, promising further improvements and setting the stage for a new era in semiconductor quality assurance.

Key Segmentation Insights: Diverse Classifications Guiding Market Intelligence

Evaluating the semiconductor metrology and inspection market reveals a complex mosaic of segments that drive a deeper understanding of competitive strategies and customer needs. When analyzing the market based on type, the study emphasizes a wide range of inspection methodologies that include bump inspection, lead frame inspection, mask inspection system, package inspection, probe card inspection, thin film metrology, and wafer inspection system. Each segment provides unique advantages and caters to specific manufacturing challenges. In terms of technology type, the research spans across acoustic, e-beam, optical, and x-ray methods, each offering distinct benefits in terms of resolution, speed, and adaptability to various material properties. Beyond technical applications, segmentation by component underscores a dual focus on hardware devices as well as software solutions, reflecting the interdependent nature of physical instrumentation and digital analytics. The analysis also targets the end-user categories, examining the needs of fabless companies, foundries, integrated device manufacturers, research laboratories, and testing facilities. Further granularity is achieved when inspecting applications, where the market is studied across analog devices, logic devices, memory devices - with specialized sub-categories such as DRAM and flash memory - optoelectronics, and power devices. Additionally, industry vertical segmentation covers key sectors such as automotive, consumer electronics, healthcare, and telecommunications, each of which presents distinct challenges and opportunities that influence market behavior. These multi-faceted insights empower stakeholders to pinpoint growth areas and tailor offerings to meet evolving demands.

Based on Type, market is studied across Bump Inspection, Lead Frame Inspection, Mask Inspection System, Package Inspection, Probe Card Inspection, Thin Film Metrology, and Wafer Inspection System.

Based on Technology Type, market is studied across Acoustic, E-Beam, Optical, and X-Ray.

Based on Component Type, market is studied across Hardware Devices and Software Solutions.

Based on End User, market is studied across Fabless Companies, Foundries, Integrated Device Manufacturer, Research Laboratories, and Testing Facilities.

Based on Application, market is studied across Analog Devices, Logic Devices, Memory Devices, Optoelectronics, and Power Devices. The Memory Devices is further studied across DRAM and Flash Memory.

Based on Industry Vertical, market is studied across Automotive, Consumer Electronics, Healthcare, and Telecommunications.

Key Regional Insights: Navigating Global Dynamics

The global semiconductor metrology and inspection market is marked by significant regional diversification and dynamic variations in demand. Analysis of the Americas shows a robust mix of industrial innovation and high adoption rates of quality assurance technologies, driven by extensive manufacturing ecosystems and a strong emphasis on research and development. In regions covering Europe, the Middle East, and Africa, a blend of technological advancement and emerging market potentials creates an environment ripe for investment and technological transformation. Companies operating in these areas are continuously upgrading their metrology infrastructures to align with global best practices, while local regulatory frameworks further enhance the shift towards higher standardization. The Asia-Pacific region remains a powerhouse due to its considerable concentration of semiconductor manufacturing hubs. Innovations rooted in advanced process technologies and stringent quality controls drive competitive advantage here, supported by significant government backing and aggressive technology rollouts. Overall, each region contributes uniquely to the global narrative of semiconductor metrology and inspection. The interplay between mature markets and emerging economies establishes a rich, interconnected ecosystem where regional insights serve as critical indicators for strategic expansion and localized innovation.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Key Companies Insights: Market Leaders Shaping the Future

A closer look at the competitive landscape reveals a constellation of key companies that are significantly shaping market trends and technological advancements in semiconductor metrology and inspection. Industry pioneers such as ADVANTEST Corporation, Applied Materials, Inc., and ASML Holding N.V. have set high benchmarks by consistently pushing the limits of measurement precision and operational efficiency. Companies like Camtek Ltd, Canon, Inc., and CyberOptics Corporation have carved out significant niches by emphasizing innovation and agile market responsiveness. These leaders work in concert with well-established entities such as HAMAMATSU Group, Hitachi High-Tech Corporation, and HORIBA, Ltd., all of which contribute extensive research and development prowess to the sector. JEOL Ltd., KLA Corporation, and Lam Research Corporation further underscore the value of integrating cutting-edge technology with robust service networks. Additional influential players including Lasertec Corporation, Mirtec Co., Ltd., Nova Measuring Instruments Ltd., and Onto Innovation, Inc. continue to drive technological evolution by focusing on data integration and enhanced diagnostic capabilities. Meanwhile, Oxford Instruments Plc, Rohde & Schwarz GmbH & Co KG, SCREEN Holdings Co., Ltd., SUSS MicroTec SE, Thermo Fisher Scientific Inc., Toray Engineering Co., Ltd, and Zeiss Group collectively illustrate the market's commitment to innovation and quality. Their efforts, ranging from advanced imaging to precision analysis, shape the emerging contours of a market that is agile, forward-thinking, and attuned to the demands of modern semiconductor manufacturing.

The report delves into recent significant developments in the Semiconductor Metrology & Inspection Market, highlighting leading vendors and their innovative profiles. These include ADVANTEST Corporation, Applied Materials, Inc., ASML Holding N.V., Camtek Ltd, Canon, Inc., CyberOptics Corporation, HAMAMATSU Group, Hitachi High-Tech Corporation, HORIBA, Ltd., JEOL Ltd., KLA Corporation, Lam Research Corporation, Lasertec Corporation, Mirtec Co., Ltd., Nova Measuring Instruments Ltd., Onto Innovation, Inc., Oxford Instruments Plc, Rohde & Schwarz GmbH & Co KG, SCREEN Holdings Co., Ltd., SUSS MicroTec SE, Thermo Fisher Scientific Inc., Toray Engineering Co., Ltd, and Zeiss Group. Actionable Recommendations for Industry Leaders: Steer Towards Sustainable Growth

For industry leaders seeking to maintain a competitive edge in a landscape marked by constant technological innovation and evolving market demands, several actionable recommendations can serve as strategic cornerstones. First, it is crucial to invest in next-generation metrology and inspection technologies that leverage artificial intelligence, machine learning, and real-time data analytics. By integrating these advanced tools, companies can significantly enhance process efficiency, improve accuracy in defect detection, and reduce production downtimes. Additionally, considering the diverse segmentation insights, there is an opportunity to foster synergistic collaborations between hardware and software providers, ensuring that solutions are not only technologically robust but also seamlessly integrated with broader manufacturing systems. Leaders should also prioritize the development of cross-functional teams that can deploy innovative quality assurance strategies and tailor them to the specific demands of various end-user segments, including fabless companies and integrated device manufacturers. Another important recommendation is to leverage regional strengths by localizing technology rollouts and investing in region-specific research and development initiatives. This approach can better align operational capabilities with local market conditions and regulatory frameworks. Finally, establishing strategic partnerships with key suppliers and technology innovators can provide access to cutting-edge research, thereby driving long-term growth and operational excellence. These recommendations are designed to empower decision-makers to create sustainable competitive advantages while addressing challenges inherent in a complex, fast-paced industry environment.

Conclusion: Summarizing Insights and Charting the Path Forward

In summary, the semiconductor metrology and inspection market is navigating a period of significant transformation. This comprehensive review has highlighted the critical drivers behind market evolution, including technological innovation, regional diversification, and strategic segmentation. From the integration of advanced metrology instruments and digital solutions to the evolving needs of diverse end-user segments, every aspect of this market is being redefined by emerging trends and dynamic technological shifts. Global regions display unique patterns of demand, with mature markets fostering high adoption rates and emerging economies paving the way for rapid technological advancements. The presence of key industry players underscores the competitive and innovative nature of the market, where each company contributes uniquely to advancing measurement precision and operational agility. Ultimately, the convergence of these elements opens up a wealth of opportunities for companies willing to invest in innovation and establish strategic partnerships. As the market continues to evolve, stakeholders are encouraged to leverage these insights to drive future growth, enhance operational efficiencies, and sustain competitive advantages in an increasingly complex industry landscape.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing demand for semiconductor chips in electronics
      • 5.1.1.2. Increasing adoption of consumer electronics and wearable devices among consumers globally
      • 5.1.1.3. Rising use of metrology and inspection for advanced packaging processes
    • 5.1.2. Restraints
      • 5.1.2.1. High setup cost of metrology and inspection equipment
    • 5.1.3. Opportunities
      • 5.1.3.1. Ongoing development of innovative defect inspection systems
      • 5.1.3.2. Increasing adoption of AI in metrology and inspection systems
    • 5.1.4. Challenges
      • 5.1.4.1. Stringent regulatory standards for semiconductor metrology inspection devices
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type: Increasing preferences for bump inspection to integrate into production lines for advanced packaging
    • 5.2.2. End User: Expanding adoption of semiconductor metrology in foundries that operate different business models
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Semiconductor Metrology & Inspection Market, by Type

  • 6.1. Introduction
  • 6.2. Bump Inspection
  • 6.3. Lead Frame Inspection
  • 6.4. Mask Inspection System
  • 6.5. Package Inspection
  • 6.6. Probe Card Inspection
  • 6.7. Thin Film Metrology
  • 6.8. Wafer Inspection System

7. Semiconductor Metrology & Inspection Market, by Technology Type

  • 7.1. Introduction
  • 7.2. Acoustic
  • 7.3. E-Beam
  • 7.4. Optical
  • 7.5. X-Ray

8. Semiconductor Metrology & Inspection Market, by Component Type

  • 8.1. Introduction
  • 8.2. Hardware Devices
  • 8.3. Software Solutions

9. Semiconductor Metrology & Inspection Market, by End User

  • 9.1. Introduction
  • 9.2. Fabless Companies
  • 9.3. Foundries
  • 9.4. Integrated Device Manufacturer
  • 9.5. Research Laboratories
  • 9.6. Testing Facilities

10. Semiconductor Metrology & Inspection Market, by Application

  • 10.1. Introduction
  • 10.2. Analog Devices
  • 10.3. Logic Devices
  • 10.4. Memory Devices
    • 10.4.1. DRAM
    • 10.4.2. Flash Memory
  • 10.5. Optoelectronics
  • 10.6. Power Devices

11. Semiconductor Metrology & Inspection Market, by Industry Vertical

  • 11.1. Introduction
  • 11.2. Automotive
  • 11.3. Consumer Electronics
  • 11.4. Healthcare
  • 11.5. Telecommunications

12. Americas Semiconductor Metrology & Inspection Market

  • 12.1. Introduction
  • 12.2. Argentina
  • 12.3. Brazil
  • 12.4. Canada
  • 12.5. Mexico
  • 12.6. United States

13. Asia-Pacific Semiconductor Metrology & Inspection Market

  • 13.1. Introduction
  • 13.2. Australia
  • 13.3. China
  • 13.4. India
  • 13.5. Indonesia
  • 13.6. Japan
  • 13.7. Malaysia
  • 13.8. Philippines
  • 13.9. Singapore
  • 13.10. South Korea
  • 13.11. Taiwan
  • 13.12. Thailand
  • 13.13. Vietnam

14. Europe, Middle East & Africa Semiconductor Metrology & Inspection Market

  • 14.1. Introduction
  • 14.2. Denmark
  • 14.3. Egypt
  • 14.4. Finland
  • 14.5. France
  • 14.6. Germany
  • 14.7. Israel
  • 14.8. Italy
  • 14.9. Netherlands
  • 14.10. Nigeria
  • 14.11. Norway
  • 14.12. Poland
  • 14.13. Qatar
  • 14.14. Russia
  • 14.15. Saudi Arabia
  • 14.16. South Africa
  • 14.17. Spain
  • 14.18. Sweden
  • 14.19. Switzerland
  • 14.20. Turkey
  • 14.21. United Arab Emirates
  • 14.22. United Kingdom

15. Competitive Landscape

  • 15.1. Market Share Analysis, 2024
  • 15.2. FPNV Positioning Matrix, 2024
  • 15.3. Competitive Scenario Analysis
    • 15.3.1. Merck enhances semiconductor capability by acquiring Unity-SC for advanced metrology solutions
    • 15.3.2. Nearfield Instruments secures EUR 135 Million to enhance semiconductor metrology capabilities
    • 15.3.3. Cohu unveils AI inspection software with advanced deep learning
  • 15.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. ADVANTEST Corporation
  • 2. Applied Materials, Inc.
  • 3. ASML Holding N.V.
  • 4. Camtek Ltd
  • 5. Canon, Inc.
  • 6. CyberOptics Corporation
  • 7. HAMAMATSU Group
  • 8. Hitachi High-Tech Corporation
  • 9. HORIBA, Ltd.
  • 10. JEOL Ltd.
  • 11. KLA Corporation
  • 12. Lam Research Corporation
  • 13. Lasertec Corporation
  • 14. Mirtec Co., Ltd.
  • 15. Nova Measuring Instruments Ltd.
  • 16. Onto Innovation, Inc.
  • 17. Oxford Instruments Plc
  • 18. Rohde & Schwarz GmbH & Co KG
  • 19. SCREEN Holdings Co., Ltd.
  • 20. SUSS MicroTec SE
  • 21. Thermo Fisher Scientific Inc.
  • 22. Toray Engineering Co., Ltd
  • 23. Zeiss Group
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