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GaN ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀå : µð¹ÙÀ̽º À¯Çüº°, Á¤°Ý Àü¾Ðº°, Àç·á À¯Çüº°, ÃÖÁ¾»ç¿ëÀÚº° - ¼¼°è ¿¹Ãø(2025-2030³â)

GaN Power Device Market by Device Type, Voltage Ratings, Material Type, End-Users - Global Forecast 2025-2030

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GaN ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀåÀº 2024³â¿¡´Â 3¾ï 8,118¸¸ ´Þ·¯·Î Æò°¡µÇ¾úÀ¸¸ç, 2025³â¿¡´Â 4¾ï 7,076¸¸ ´Þ·¯, CAGR 24.37%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 14¾ï 1,070¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

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±âÁØ ¿¬µµ 2024³â 3¾ï 8,118¸¸ ´Þ·¯
ÃßÁ¤ ¿¬µµ 2025³â 4¾ï 7,076¸¸ ´Þ·¯
¿¹Ãø ¿¬µµ 2030³â 14¾ï 1,070¸¸ ´Þ·¯
CAGR(%) 24.37%

GaN ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀåÀº ¸ðµç »ê¾÷ ºÐ¾ß¿¡¼­ Àü·Ê ¾ø´Â È¿À²°ú ¼º´É Çâ»óÀ» °¡Á®¿À´Â ¿ªµ¿ÀûÀÎ ±â¼ú Çõ¸íÀÇ ÃÖÀü¼±¿¡ ÀÖ½À´Ï´Ù. ÁúÈ­°¥·ý(GaN) µð¹ÙÀ̽º´Â ¼Óµµ, ¿­ °ü¸® ¹× Àü·Â ¹Ðµµ Ãø¸é¿¡¼­ °íÀ¯ÇÑ ÀåÁ¡À» °¡Áö°í ÀÖ¾î ±âÁ¸ ½Ç¸®ÄÜ ±â¹Ý Àü·Â ¼Ö·ç¼Ç¿¡ ´ëÇÑ ´ë¾ÈÀ¸·Î ¶°¿À¸£°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¹ßÀüÀº ¼ÒÇü, ¿¡³ÊÁö È¿À²ÀûÀÌ¸ç ¿­¾ÇÇÑ Á¶°Ç¿¡¼­µµ ¾ÈÁ¤ÀûÀ¸·Î ÀÛµ¿ÇÒ ¼ö ÀÖ´Â °íÁÖÆÄ ºÎǰ¿¡ ´ëÇÑ ¼ö¿ä·Î ÀÎÇØ ÀÌ·ç¾îÁ³½À´Ï´Ù.

¿À´Ã³¯ÀÇ °æÀï ȯ°æ¿¡¼­ GaN ±â¼ú·ÎÀÇ ÀüȯÀº ´Ü¼øÈ÷ ¿À·¡µÈ ½Ã½ºÅÛÀ» ±³Ã¼ÇÏ´Â °ÍÀÌ ¾Æ´Ï¶ó Àü·Â °ü¸® ¹× ºÐ¹è ¹æ½ÄÀ» Àü¸éÀûÀ¸·Î Àç°ËÅäÇÏ´Â °ÍÀ» ÀǹÌÇϸç, GaN Àü·Â µð¹ÙÀ̽º´Â ¼ÒºñÀÚ ÀüÀÚÁ¦Ç°¿¡¼­ »ê¾÷ ȯ°æÀÇ ÇÙ½É ÀÎÇÁ¶ó¿¡ À̸£±â±îÁö ±¤¹üÀ§ÇÑ ¾ÖÇø®ÄÉÀ̼ǿ¡ »ç¿ëµÇ¸ç, Â÷¼¼´ë ¼º´ÉÀÇ ´ë¸í»ç°¡ µÇ¾ú½À´Ï´Ù. Â÷¼¼´ë ¼º´ÉÀÇ ´ë¸í»ç°¡ µÇ¾ú½À´Ï´Ù. Àü·Â °ü¸® ¾ÆÅ°ÅØÃ³¿¡ GaN ±â¹Ý ¼Ö·ç¼ÇÀÇ ÅëÇÕÀº º¥Ä¡¸¶Å©¸¦ ÀçÁ¤ÀÇÇϰí È¿À²¼º°ú È®À强¿¡ ´ëÇÑ »õ·Î¿î ±âÁØÀ» ¼³Á¤Çϰí ÀÖ½À´Ï´Ù.

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±â¾÷ ¸®½ºÆ®

  • AIXTRON SE
  • Analog Devices, Inc.
  • Broadcom Inc.
  • Efficient Power Conversion Corporation
  • GaNPower International Inc.
  • Infineon Technologies AG
  • Infinitum Electric
  • Kemet Corporation
  • Lite-On Technology Corporation
  • MaxLinear, Inc.
  • Microchip Technology Incorporated
  • Mitsubishi Electric Corporation
  • Monolithic Power Systems, Inc.
  • Navitas Semiconductor
  • Nexperia B.V.
  • NXP Semiconductors N.V.
  • ON Semiconductor Corporation
  • Oxford Instruments
  • Power Integrations, Inc.
  • Qorvo, Inc.
  • Renesas Electronics Corporation
  • ROHM Semiconductor
  • Sanken Electric Co., Ltd.
  • STMicroelectronics N.V.
  • Texas Instruments Incorporated
  • Toshiba Corporation
  • Vishay Intertechnology, Inc.
  • Wolfspeed, Inc.
ksm 25.05.14

The GaN Power Device Market was valued at USD 381.18 million in 2024 and is projected to grow to USD 470.76 million in 2025, with a CAGR of 24.37%, reaching USD 1,410.70 million by 2030.

KEY MARKET STATISTICS
Base Year [2024] USD 381.18 million
Estimated Year [2025] USD 470.76 million
Forecast Year [2030] USD 1,410.70 million
CAGR (%) 24.37%

The GaN power device market is at the forefront of a dynamic technological revolution, offering unprecedented efficiency and performance gains across industries. Gallium nitride (GaN) devices have emerged as a viable alternative to traditional silicon-based power solutions due to their inherent advantages in speed, thermal management, and power density. This evolution has been driven by a demand for compact, energy-efficient, and high-frequency components that can perform reliably under harsh conditions.

In today's competitive landscape, the shift towards GaN technology is not simply about replacing older systems; it signifies a comprehensive rethinking of how power is managed and distributed. With applications spanning from consumer electronics to critical infrastructure in industrial settings, GaN power devices have quickly become synonymous with next-generation performance. The integration of GaN-based solutions into power management architectures is redefining benchmarks and setting new standards for efficiency and scalability.

This introduction lays the foundation for an in-depth exploration of market dynamics, breakthrough innovations, and the broad array of segmentation factors shaping the future of GaN power devices.

Transformative Shifts Redefining the GaN Landscape

The industry is experiencing transformative shifts that are reshaping the GaN power device landscape. Rapid technological advancements coupled with escalating demand for energy-efficient systems have spurred a surge in both research and investment. Manufacturers are consistently pushing the envelope, optimizing design frameworks to harness the superior properties of GaN technology.

Transitioning from conventional silicon components to GaN-based devices has brought about improvements in switching speed, thermal management, and overall system miniaturization. This paradigm shift is catalyzed by an ecosystem that values innovation and performance, leading to an appreciated blend of enhanced reliability and cost-effectiveness. Emerging applications in sectors such as automotive electrification, renewable energy infrastructure, and advanced telecommunications have necessitated performance optimization and have accelerated the development of high-power, high-efficiency GaN devices.

In addition, collaborative efforts between research institutions and industry leaders are fostering a climate of breakthrough discoveries, propelling GaN technology into new domains. By integrating data-driven analysis with forward-thinking design strategies, the landscape is witnessing a blend of quality improvements and operational efficiencies that are poised to transform the market completely.

Key Segmentation Insights Shaping the Market Dynamics

In-depth analysis of the GaN power device market reveals a multi-dimensional segmentation framework that elucidates several key categories. When assessing the market based on device type, the sector is studied across diodes, integrated circuits, rectifiers, and transistors. Diodes, examined through the specific lenses of schottky and zener variants, present unique performance characteristics tailored for varied applications, while rectifiers being further differentiated into Gallium Nitride rectifiers and silicon rectifiers ensure that technological advances are not limited to one material source alone. Transistors, with a keen focus on high electron mobility and multi-gate variants, drive performance nuances in frequency and power handling capabilities.

Segmentation also plays a crucial role when evaluated with voltage ratings. The market analysis divides voltage characteristics into high voltage above 1200V, low voltage below 600V, and a moderate range between 600V and 1200V, each representing different operational environments and application requirements. In addition, material type segmentation by comparing Gallium Nitride-on-Sapphire with Gallium Nitride-on-Silicon results emphasizes performance, cost, and integration efficiency, all of which are essential for customizing end-use solutions.

Furthermore, understanding the end-user environment broadens the segmentation perspective. Applications encompassing aerospace and defense, automotive, consumer electronics, industrial, renewable energy, and telecommunications illustrate the technology's universal appeal. This nuanced segmentation helps stakeholders pinpoint market potential, identify growth opportunities, and forecast future trends based on a granular understanding of product and application diversity.

Based on Device Type, market is studied across Diodes, Integrated Circuits, Rectifiers, and Transistors. The Diodes is further studied across Schottky Diodes and Zener Diodes. The Rectifiers is further studied across Gallium Nitride Rectifiers and Silicon Rectifiers. The Transistors is further studied across High Electron Mobility Transistors and Multi-Gate Transistors.

Based on Voltage Ratings, market is studied across High Voltage (>1200V), Low Voltage (

Based on Material Type, market is studied across Gallium Nitride-on-Sapphire and Gallium Nitride-on-Silicon.

Based on End-Users, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, Industrial, Renewable Energy, and Telecommunications.

Regional trends in the GaN power device market offer a compelling view of how geographic factors are influencing the adoption and evolution of next-generation power solutions. In the Americas, market maturity is driven by robust research and development initiatives coupled with high commercial demand across diverse applications. The region benefits from an established industrial ecosystem that supports rapid prototyping and early-stage commercialization of GaN innovations.

Conversely, the Europe, Middle East & Africa region is characterized by its blend of stringent regulatory standards and a progressive shift towards adopting energy-efficient technologies. Innovation hubs across Europe are paving the way for the integration of GaN devices into critical applications, from precision industrial equipment to advanced consumer electronics. Meanwhile, emerging markets in the Middle East and Africa are beginning to tap into the potential of GaN technology, leveraging its competitive advantages to enhance infrastructure and meet growing energy demands.

The Asia-Pacific region stands out as a powerhouse in manufacturing and technological adaptation. This dynamic region not only leads in high-volume production but also demonstrates a rapid assimilation of new technologies in telecommunications and automotive sectors. As innovation and market demand converge, the Asia-Pacific region is set to drive significant growth, making it an essential component of the global GaN power device narrative.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Key Corporate Insights Driving Innovation and Market Leadership

A diverse array of companies is spearheading the evolution of GaN power devices, each contributing to a competitive yet collaborative global landscape. Leading the charge are research and development pioneers that have successfully integrated GaN technology into a wide spectrum of applications by leveraging deep engineering expertise and robust manufacturing capabilities. Corporations like AIXTRON SE, Analog Devices, Inc., and Broadcom Inc. have led technological breakthroughs, setting benchmarks for performance while expanding the commercial scope of GaN applications.

Other industry players including Efficient Power Conversion Corporation, GaNPower International Inc., Infineon Technologies AG, and Infinitum Electric have harnessed innovation to drive industry standards in efficiency and reliability. Meanwhile, companies such as Kemet Corporation, Lite-On Technology Corporation, MaxLinear, Inc., and Microchip Technology Incorporated have diversified their portfolios to integrate GaN into more demanding and energy-sensitive applications.

Innovative contributions from renowned firms like Mitsubishi Electric Corporation, Monolithic Power Systems, Inc., Navitas Semiconductor, and Nexperia B.V. underline the sector's commitment to future-proofing power solutions. This is further augmented by technological strides from leading players like NXP Semiconductors N.V., ON Semiconductor Corporation, Oxford Instruments, Power Integrations, Inc., Qorvo, Inc., Renesas Electronics Corporation, and ROHM Semiconductor. The diligence and advanced R&D capabilities of Sanken Electric Co., Ltd., STMicroelectronics N.V., Texas Instruments Incorporated, Toshiba Corporation, Vishay Intertechnology, Inc., and Wolfspeed, Inc. exemplify the organized moves towards comprehensive market understanding and industrial consolidation.

These company profiles offer an overarching view of how innovation frameworks and strategic collaborations enable market leaders to adapt to evolving industry demands as well as regulatory challenges.

The report delves into recent significant developments in the GaN Power Device Market, highlighting leading vendors and their innovative profiles. These include AIXTRON SE, Analog Devices, Inc., Broadcom Inc., Efficient Power Conversion Corporation, GaNPower International Inc., Infineon Technologies AG, Infinitum Electric, Kemet Corporation, Lite-On Technology Corporation, MaxLinear, Inc., Microchip Technology Incorporated, Mitsubishi Electric Corporation, Monolithic Power Systems, Inc., Navitas Semiconductor, Nexperia B.V., NXP Semiconductors N.V., ON Semiconductor Corporation, Oxford Instruments, Power Integrations, Inc., Qorvo, Inc., Renesas Electronics Corporation, ROHM Semiconductor, Sanken Electric Co., Ltd., STMicroelectronics N.V., Texas Instruments Incorporated, Toshiba Corporation, Vishay Intertechnology, Inc., and Wolfspeed, Inc.. Actionable Recommendations for Steady Leadership in GaN Market Evolution

Industry leaders looking to capitalize on the momentum in the GaN power device market should consider a set of targeted strategies to enhance both product offerings and market penetration. To begin with, investing in robust research and development efforts remains crucial. Companies must allocate resources towards exploring innovative design architectures that leverage GaN's inherent advantages, thereby driving cost reductions and performance gains. An emphasis on strategic partnerships with key research institutions and technology incubators can foster an environment ripe for breakthrough innovations.

Optimization of supply chains is another vital area. The integration of advanced manufacturing processes not only streamlines production timelines but also significantly reduces waste and inefficiencies in the system. Market leaders should work to establish stronger partnerships with material suppliers to ensure the consistent quality of raw materials, be it for Gallium Nitride-on-Sapphire or Gallium Nitride-on-Silicon. Enhanced visibility throughout the supply chain can lead to faster adaptation in response to market fluctuations and regulatory challenges.

A focus on end-user requirements is equally important. Aligning product development with specific industry needs-whether in aerospace and defense, automotive, consumer electronics, industrial, renewable energy, or telecommunications-ensures that offerings are not just technically sound but also commercially viable. Embracing digital transformation initiatives, such as applying machine learning for predictive maintenance and smart integration of IoT in power systems, can further solidify a company's competitive edge. Finally, policymakers and corporate strategists should develop frameworks that facilitate easier market entry and interoperability among emerging technologies, ensuring that these devices can coexist in a broader ecosystem of smart energy solutions.

Conclusion: Charting the Future Landscape of GaN Power Devices

In summary, the GaN power device market is emerging as a disruptive force, characterized by rapid technological advancements and an evolving array of applications. The study of market segmentation based on device type, voltage ratings, material composition, and end-user applications provides a granular view of the diverse opportunities available. Detailed regional analysis further underscores the varied dynamics across the Americas, Europe, Middle East & Africa, and Asia-Pacific, each narrating its unique story of adoption and growth.

At its core, the industry is propelled by forward-thinking companies that are steering innovations and redefining performance benchmarks. This collective push for excellence across R&D, manufacturing, and strategic partnerships is not only setting a new trajectory for power devices but also influencing broader sector trends. Leaders in this space must continue to navigate complexities with agile strategies, ensuring they remain ahead in a highly competitive global environment.

The journey of GaN power devices is a testament to the value of innovation, critical investment, and timely market insights. As technology continues to evolve, embracing change will be instrumental in shaping a sustainable, efficient, and resilient power ecosystem.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Proliferation of data centers and cloud computing fueling the need for high-performance GaN devices
      • 5.1.1.2. Expansion of renewable energy systems enhancing the need for efficient GaN power devices
      • 5.1.1.3. Rising adoption of GaN power devices for fast-charging applications across consumer electronics
    • 5.1.2. Restraints
      • 5.1.2.1. Technical issues associated with the design and manufacturing of GaN power devices
    • 5.1.3. Opportunities
      • 5.1.3.1. Increasing investments in R&D for leveraging GaN for solar and wind energy solutions in renewable energy sectors
      • 5.1.3.2. Innovations in healthcare technology with GaN power devices for efficient medical equipments
    • 5.1.4. Challenges
      • 5.1.4.1. Concerns related to thermal management and reliability in high-performance GaN power applications
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Device Type: Increasing preference for diodes in high-frequency applications owing to their enhanced voltage regulation
    • 5.2.2. End-Users: Rising adoption of GaN power device in the aerospace & defense to operate in high-temperature environments
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. GaN Power Device Market, by Device Type

  • 6.1. Introduction
  • 6.2. Diodes
    • 6.2.1. Schottky Diodes
    • 6.2.2. Zener Diodes
  • 6.3. Integrated Circuits
  • 6.4. Rectifiers
    • 6.4.1. Gallium Nitride Rectifiers
    • 6.4.2. Silicon Rectifiers
  • 6.5. Transistors
    • 6.5.1. High Electron Mobility Transistors
    • 6.5.2. Multi-Gate Transistors

7. GaN Power Device Market, by Voltage Ratings

  • 7.1. Introduction
  • 7.2. High Voltage (>1200V)
  • 7.3. Low Voltage (<600V)
  • 7.4. Moderate Voltage (600V - 1200V)

8. GaN Power Device Market, by Material Type

  • 8.1. Introduction
  • 8.2. Gallium Nitride-on-Sapphire
  • 8.3. Gallium Nitride-on-Silicon

9. GaN Power Device Market, by End-Users

  • 9.1. Introduction
  • 9.2. Aerospace & Defense
  • 9.3. Automotive
  • 9.4. Consumer Electronics
  • 9.5. Industrial
  • 9.6. Renewable Energy
  • 9.7. Telecommunications

10. Americas GaN Power Device Market

  • 10.1. Introduction
  • 10.2. Argentina
  • 10.3. Brazil
  • 10.4. Canada
  • 10.5. Mexico
  • 10.6. United States

11. Asia-Pacific GaN Power Device Market

  • 11.1. Introduction
  • 11.2. Australia
  • 11.3. China
  • 11.4. India
  • 11.5. Indonesia
  • 11.6. Japan
  • 11.7. Malaysia
  • 11.8. Philippines
  • 11.9. Singapore
  • 11.10. South Korea
  • 11.11. Taiwan
  • 11.12. Thailand
  • 11.13. Vietnam

12. Europe, Middle East & Africa GaN Power Device Market

  • 12.1. Introduction
  • 12.2. Denmark
  • 12.3. Egypt
  • 12.4. Finland
  • 12.5. France
  • 12.6. Germany
  • 12.7. Israel
  • 12.8. Italy
  • 12.9. Netherlands
  • 12.10. Nigeria
  • 12.11. Norway
  • 12.12. Poland
  • 12.13. Qatar
  • 12.14. Russia
  • 12.15. Saudi Arabia
  • 12.16. South Africa
  • 12.17. Spain
  • 12.18. Sweden
  • 12.19. Switzerland
  • 12.20. Turkey
  • 12.21. United Arab Emirates
  • 12.22. United Kingdom

13. Competitive Landscape

  • 13.1. Market Share Analysis, 2024
  • 13.2. FPNV Positioning Matrix, 2024
  • 13.3. Competitive Scenario Analysis
    • 13.3.1. Strategic collaboration between ROHM and TSMC advances GaN power devices for the automotive industry
    • 13.3.2. Infineon's new CoolGaN 650 V G5 transistors enhance efficiency and power density in global GaN market
    • 13.3.3. Texas Instruments amplifies GaN semiconductor manufacturing with Aizu expansion, increasing energy-efficient solutions
    • 13.3.4. GlobalFoundries acquisition of Tagore Technology's GaN IP accelerates innovative power management solutions for AI and IoT advancement
    • 13.3.5. Guerrilla RF's strategic acquisition of Gallium Semiconductor's GaN portfolio accelerates growth in telecom, military, and satellite markets
  • 13.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. AIXTRON SE
  • 2. Analog Devices, Inc.
  • 3. Broadcom Inc.
  • 4. Efficient Power Conversion Corporation
  • 5. GaNPower International Inc.
  • 6. Infineon Technologies AG
  • 7. Infinitum Electric
  • 8. Kemet Corporation
  • 9. Lite-On Technology Corporation
  • 10. MaxLinear, Inc.
  • 11. Microchip Technology Incorporated
  • 12. Mitsubishi Electric Corporation
  • 13. Monolithic Power Systems, Inc.
  • 14. Navitas Semiconductor
  • 15. Nexperia B.V.
  • 16. NXP Semiconductors N.V.
  • 17. ON Semiconductor Corporation
  • 18. Oxford Instruments
  • 19. Power Integrations, Inc.
  • 20. Qorvo, Inc.
  • 21. Renesas Electronics Corporation
  • 22. ROHM Semiconductor
  • 23. Sanken Electric Co., Ltd.
  • 24. STMicroelectronics N.V.
  • 25. Texas Instruments Incorporated
  • 26. Toshiba Corporation
  • 27. Vishay Intertechnology, Inc.
  • 28. Wolfspeed, Inc.
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