세계의 칩렛 시장 : 프로세서, 포장 기술, 최종 용도별 - 예측(2025-2030년)

The Chiplet Market was valued at USD 10.53 billion in 2023 and is projected to grow to USD 14.22 billion in 2024, with a CAGR of 36.74%, reaching USD 94.17 billion by 2030.

The continuous evolution of semiconductor technologies has ushered in a new era, one where chiplet architecture takes center stage. As innovative design paradigms shift from traditional monolithic solutions to modular systems, the landscape of high-performance computing and advanced electronic integration is rapidly evolving.

Chiplets are small, pre-validated integrated circuits that combine to create highly sophisticated systems on a chip. This approach not only accelerates development cycles but also offers unparalleled flexibility in meeting diverse application demands. Over the past few years, the industry has witnessed a surge in research and commercialization efforts aimed at exploiting the benefits of chiplet technology. Customization, improved power efficiency, and reduced time-to-market are just a few of the compelling advantages driving this transformation.

As global players invest in new strategies and emerging startups bring fresh insights, the chiplet market is becoming a hotbed for technological breakthroughs. Companies are increasingly embracing chiplets as a way to overcome traditional limitations in cost, performance, and scalability. This introductory overview provides a clear understanding of the significant transformation underway and sets the stage for a detailed exploration of segmentation, regional dynamics, key players, and strategic recommendations that will shape the future of the semiconductor industry.

Transformative Shifts in the Chiplet Landscape

Recent technological progress coupled with evolving market demands has precipitated a transformative shift in the chiplet landscape. The industry's move towards modular design is breaking conventional barriers, introducing substantial improvements in performance, cost efficiency, and adaptability.

Historically, integrated circuits were designed as single, monolithic entities. However, the increasing complexity of modern applications has necessitated a more versatile approach. Chiplets enable designers to segregate functionalities among specialized components, each optimally engineered for its purpose. This pragmatism reduces development risks and fosters innovation by allowing companies to mix and match technology blocks tailored for specific functions.

The drive for faster time-to-market has also accelerated the adoption of chiplets. By leveraging pre-validated modules, organizations can streamline product development processes and considerably shorten design cycles. The industry is now witnessing a surge in collaborative initiatives between foundries, design houses, and system integrators who are working collectively to develop solutions that meet the high demands of modern computing. In doing so, the semiconductor landscape is experiencing an unprecedented transformation that not only redefines performance metrics but also enhances the overall sustainability of the innovation process.

Key Segmentation Insights in the Chiplet Market

A deep dive into market segmentation reveals how the chiplet sector is meticulously categorized to target high-demand growth areas. One major segmentation is based on Processor types. The market is comprehensively analyzed by tracking diverse components such as Application Processing Units, Artificial Intelligence Application-Specific Integrated Circuit Compressors, Central Processing Units, Field-Programmable Gate Arrays, and Graphic Processing Units. These processor classifications play a pivotal role in tailoring chiplets that meet increasingly specific performance and computational requirements.

Another significant segmentation is based on Packaging Technology. Evaluating the market across various packaging innovations like 2.5 & 3D structures, Flip Chip Ball Grid Array, Flip Chip Scale Package, System-in-Package solutions, and Wafer-Level Chip Scale Packages provides vital insights into the integration and performance efficiencies that each technology offers. This segmentation underlines the diverse approaches that manufacturers are adopting to address thermal management, interconnect density, and mechanical integrity while optimizing space and resource utilization.

Furthermore, segmentation based on End-use presents a detailed view into application dynamics. With industries such as Automotive, Consumer Electronics, Defense & Aerospace, Healthcare, Manufacturing, and Telecommunications demanding ever higher levels of performance and reliability, chiplets are being engineered to satisfy specific standards and rigorous industry-specific requirements. These segmentation insights collectively illustrate a market that is not only diversified in technical offerings but also finely tuned to cater to a wide array of application-driven challenges.

Based on Processor, market is studied across Application Processing Unit, Artificial Intelligence Application-Specific Integrated Circuit Compressor, Central Processing Unit, Field-Programmable Gate Array, and Graphic Processing Unit.

Based on Packaging Technology, market is studied across 2.5 & 3D, Flip Chip Ball Grid Array, Flip Chip Scale Package, System-in-Package, and Wafer-Level Chip Scale Package.

Based on End-use, market is studied across Automotive, Consumer Electronics, Defense & Aerospace, Healthcare, Manufacturing, and Telecommunications.

Key Regional Insights Shaping the Market

An analysis of regional trends shows that the evolution of chiplet technology is a global phenomenon driven by varied market dynamics and regional innovations. In the Americas, industry leaders are pioneering cutting-edge developments in semiconductor manufacturing and integration. Robust investment in research and development along with strategic collaborations have established this region as a hub for technological breakthroughs and commercialization strategies.

In regions spanning Europe, the Middle East, and Africa, well-established industrial infrastructures and governmental initiatives are driving adoption. These regions are actively focusing on advanced packaging solutions and integrated circuit innovations, ensuring that chiplet technology remains at the forefront of local semiconductor strategies. Meanwhile, in the Asia-Pacific region, rapid industrialization coupled with government support in emerging technology sectors has fostered a fertile environment for the mass adoption of chiplets. Here, a synergy between mature production capabilities and aggressive innovation policies has positioned the region as a central player in the global semiconductor arena.

These regional insights underscore varied yet complementary approaches to technological adoption and highlight opportunities for cross-regional collaboration as the global market converges around chiplet-based design paradigms.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across Arizona, California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Key Company Insights Driving Innovation

Numerous players are making significant strides in unlocking the full potential of chiplet technology, demonstrating both innovation and strategic acumen. Industry frontrunners include Achronix Semiconductor Corporation, Advanced Micro Devices, Inc., and Alphawave IP Group PLC, each excelling in creating solutions that push the boundaries of performance and efficiency. Major technology giants such as Apple Inc., Arm Holdings PLC, as well as ASE Technology Holding Co, Ltd., are reshaping the market narrative by integrating chiplets into next-generation devices, thereby redefining power and speed metrics.

Other influential firms like Ayar Labs, Inc., Beijing ESWIN Technology Group Co., Ltd., and Broadcom Inc. have undertaken initiatives that merge traditional semiconductor technology with advanced chiplet architectures. These companies are continuously harnessing the capabilities of chiplets to deliver products that are more scalable and efficient. Noteworthy contributions from Cadence Design Systems, Inc. and Chipuller further bolster design innovation, while companies such as Eliyan Corp, GlobalFoundries Inc., and Huawei Technologies Co., Ltd. are leveraging chiplets to optimize both functionality and energy consumption.

Prominent names like Intel Corporation, International Business Machines Corporation, and JCET Group are driving expansive research in chiplet integration, setting standards through collaborative breakthroughs. Further, Kandou Bus, S.A., Marvell Technology, Inc., Mercury Systems, Inc., and Netronome Systems, Inc. are advancing this field with robust market strategies. Companies such as NHanced Semiconductors, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Palo Alto Electron, Inc., and Qualcomm Incorporated continue to push the envelope, along with RANVOUS Inc., Samsung Electronics Co., Ltd., Socionext Inc., Synopsys, Inc., Tachyum S.r.o., Taiwan Semiconductor Manufacturing Company Limited, Tenstorrent Inc., TongFu Microelectronics Co., Ltd., and X-Celeprint by Xtrion N.V. Their combined efforts highlight a competitive and rapidly progressing industry where strategic investments in chiplets are driving a paradigm shift towards modular and highly integrated system designs.

The report delves into recent significant developments in the Chiplet Market, highlighting leading vendors and their innovative profiles. These include Achronix Semiconductor Corporation, Advanced Micro Devices, Inc., Alphawave IP Group PLC, Apple Inc., Arm Holdings PLC, ASE Technology Holding Co, Ltd., Ayar Labs, Inc., Beijing ESWIN Technology Group Co., Ltd., Broadcom Inc., Cadence Design Systems, Inc., Chipuller, Eliyan Corp, GlobalFoundries Inc., Huawei Technologies Co., Ltd., Intel Corporation, International Business Machines Corporation, JCET Group, Kandou Bus, S.A., Marvell Technology, Inc., Mercury Systems, Inc., Netronome Systems, Inc., NHanced Semiconductors, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Palo Alto Electron, Inc., Qualcomm Incorporated, RANVOUS Inc., Samsung Electronics Co., Ltd., Socionext Inc., Synopsys, Inc., Tachyum S.r.o., Taiwan Semiconductor Manufacturing Company Limited, Tenstorrent Inc., TongFu Microelectronics Co., Ltd., and X-Celeprint by Xtrion N.V.. Actionable Recommendations for Industry Leaders

For decision-makers and industry experts aiming to remain at the forefront of technological innovation, it is crucial to adapt proactively to the changing dynamics of chiplet integration. Industry leaders are advised to invest in flexible design methodologies that leverage the inherent advantages of chiplet architecture. Embracing a modular approach can significantly reduce time-to-market while providing the agility necessary to meet evolving market demands.

Furthermore, continuous collaboration with research institutions, technological partners, and strategic suppliers is essential for developing state-of-the-art packaging and integration solutions. By adopting cross-functional teams that bring together expertise from software engineering, hardware design, and advanced manufacturing processes, organizations can foster an environment of innovation that drives competitive advantage. It is important to monitor emerging trends and incorporate advanced packaging technologies that promise heightened performance, reliability, and energy efficiency.

Adopting a customer-centric strategy that aligns product development with end-user needs, particularly in high-demand sectors such as Automotive, Consumer Electronics, and Telecommunications, remains paramount. Integrating feedback loops into the development cycle can further optimize chiplet-based solutions. In summary, seizing the opportunities presented by chiplet technologies necessitates a holistic approach that encourages both internal innovation and external collaboration.

Conclusion: Embracing the Chiplet Future

In conclusion, the chiplet revolution is redefining the semiconductor industry by offering advanced, flexible, and scalable solutions. The shift toward modular architectures is not merely a technological upgrade but a strategic move that aligns with the broader trend of rapid innovation and customized performance. Comprehensive segmentation insights reveal specialized approaches based on processors, packaging technologies, and distinct end-use applications. Regional dynamics highlight varied market trends, while leading companies continue to drive transformative changes through innovation and strategic positioning.

This new paradigm necessitates that industry stakeholders reassess their strategies and invest in future-proof solutions to remain competitive. The profound shifts witnessed across manufacturing techniques, market segmentation, and regional influences serve as a testament to the immense potential of chiplets in reshaping the electronics landscape.

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Growing demand for smaller and more compact electronic devices
    • 5.1.1.2. Increase in the number of data centers globally
    • 5.1.1.3. Growing demand to enhance in-vehicle processing for ADAS
  • 5.1.2. Restraints
    • 5.1.2.1. Interconnection complexity issues with chiplets
  • 5.1.3. Opportunities
    • 5.1.3.1. Potential deployment of chiplets in UAVs due to advanced processing needs
    • 5.1.3.2. Continuous investments and roll-out of 5G network
  • 5.1.4. Challenges
    • 5.1.4.1. Scalability and security concerns associated with chiplets
• 5.2. Market Segmentation Analysis
  • 5.2.1. Processor: Growing significance of application processing units in consumer electronics due to power efficiency and versatility
  • 5.2.2. Packaging Technology: Emerging applications of wafer-level chip scale packages due to highly compact and high-performance packages with low-cost
  • 5.2.3. End-use: Rising adoption of chiplets in the healthcare sector owing to precision and reliability properties
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Chiplet Market, by Processor

• 6.1. Introduction
• 6.2. Application Processing Unit
• 6.3. Artificial Intelligence Application-Specific Integrated Circuit Compressor
• 6.4. Central Processing Unit
• 6.5. Field-Programmable Gate Array
• 6.6. Graphic Processing Unit

7. Chiplet Market, by Packaging Technology

• 7.1. Introduction
• 7.2. 2.5 & 3D
• 7.3. Flip Chip Ball Grid Array
• 7.4. Flip Chip Scale Package
• 7.5. System-in-Package
• 7.6. Wafer-Level Chip Scale Package

8. Chiplet Market, by End-use

• 8.1. Introduction
• 8.2. Automotive
• 8.3. Consumer Electronics
• 8.4. Defense & Aerospace
• 8.5. Healthcare
• 8.6. Manufacturing
• 8.7. Telecommunications

9. Americas Chiplet Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Chiplet Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Chiplet Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
  • 12.3.1. PseudolithIC Inc. secures USD 6 million seed funding to accelerate compound semiconductor chiplet innovation
  • 12.3.2. Baya Systems secures over USD 36 million in Series B funding
  • 12.3.3. Intel unveiled chiplet at OFC 2024, revolutionizing high-speed data transmission and integrated photonics technology
  • 12.3.4. Rapidus and International Business Machines Corporation expand collaboration on advancing chiplet packaging technology
  • 12.3.5. Advanced Micro Devices, Inc. receives IEEE 2024 Corporate Innovation Award for chiplet technology
  • 12.3.6. Eliyan secures USD 60 million funding to advance chiplet interconnect technology for AI chips
  • 12.3.7. Cadence Design Systems Inc. and Arm revolutionize automotive with advanced chiplet platform for software-defined vehicles and ADAS
  • 12.3.8. Tenstorrent adopts Blue Cheetah's chiplet interconnect IP for enhanced AI and RISC-V solutions
  • 12.3.9. TDK Ventures invests in Silicon Box's chiplet packaging design to drive semiconductor innovation
  • 12.3.10. ASE Technology Holding Co., Ltd. introduces an integrated design ecosystem to halve silicon package design time
  • 12.3.11. Intel unveils a UCIe-connected chiplet-based test chip at Innovation 2023 by integrating Intel and Synopsys IPs using the EMIB interface.
  • 12.3.12. Marvell Technology collaborates with IMEC on automotive chiplet initiative for advanced computing SoCs
  • 12.3.13. Alphawave Semi expands collaboration with Samsung Electronics Co., Ltd. by introducing 3nm connectivity IP solutions
  • 12.3.14. International Business Machines Corporation advances chiplets with hybrid bonding for thinner, smaller connections
• 12.4. Strategy Analysis & Recommendation
  • 12.4.1. Advanced Micro Devices, Inc.
  • 12.4.2. Intel Corporation
  • 12.4.3. Taiwan Semiconductor Manufacturing Company Limited
  • 12.4.4. NVIDIA Corporation

Companies Mentioned

• 1. Achronix Semiconductor Corporation
• 2. Advanced Micro Devices, Inc.
• 3. Alphawave IP Group PLC
• 4. Apple Inc.
• 5. Arm Holdings PLC
• 6. ASE Technology Holding Co, Ltd.
• 7. Ayar Labs, Inc.
• 8. Beijing ESWIN Technology Group Co., Ltd.
• 9. Broadcom Inc.
• 10. Cadence Design Systems, Inc.
• 11. Chipuller
• 12. Eliyan Corp
• 13. GlobalFoundries Inc.
• 14. Huawei Technologies Co., Ltd.
• 15. Intel Corporation
• 16. International Business Machines Corporation
• 17. JCET Group
• 18. Kandou Bus, S.A.
• 19. Marvell Technology, Inc.
• 20. Mercury Systems, Inc.
• 21. Netronome Systems, Inc.
• 22. NHanced Semiconductors, Inc.
• 23. NVIDIA Corporation
• 24. NXP Semiconductors N.V.
• 25. Palo Alto Electron, Inc.
• 26. Qualcomm Incorporated
• 27. RANVOUS Inc.
• 28. Samsung Electronics Co., Ltd.
• 29. Socionext Inc.
• 30. Synopsys, Inc.
• 31. Tachyum S.r.o.
• 32. Taiwan Semiconductor Manufacturing Company Limited
• 33. Tenstorrent Inc.
• 34. TongFu Microelectronics Co., Ltd.
• 35. X-Celeprint by Xtrion N.V.