![]() |
½ÃÀ庸°í¼
»óǰÄÚµå
1410229
¼¼°è ¾×ü ÀÎĸ½¶·¹ÀÌ¼Ç ½ÃÀå ¿¹Ãø(2023-2028³â)Liquid Encapsulation Market - Forecasts from 2023 to 2028 |
¾×ü ÀÎĸ½¶·¹ÀÌ¼Ç ½ÃÀåÀº ¿¹Ãø ±â°£ µ¿¾È CAGR 4.59%·Î ¼ºÀåÇÏ¿© 2021³â 17¾ï 300¸¸ ´Þ·¯¿¡¼ 2028³â±îÁö 23¾ï 3,200¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.
¾×ü ÀÎĸ½¶·¹À̼ÇÀº Ãæ°ÝÀ̳ª ½À±â·ÎºÎÅÍ ÀåÄ¡¸¦ º¸È£Çϱâ À§ÇØ °íºÐÀÚ, ±Ý¼Ó, ¼¼¶ó¹Í µîÀÇ ¹°ÁúÀ» °íü ¶Ç´Â ¾×ü ÀåÄ¡¿¡ Àû¿ëÇÏ´Â ¹æ¹ýÀÔ´Ï´Ù. ÀÌ º¸È£ ÃþÀº ÀåÄ¡ÀÇ ±â´ÉÀ» À¯ÁöÇϰí Àü±â ºÎǰ °£ÀÇ ´Ü¼±À» ¹æÁöÇϱâ À§ÇØ Ã¤Åõ˴ϴÙ. ÀÌ ¹ÐºÀ °øÁ¤¿¡´Â ¿¡Æø½Ã ¼öÁö ¹× ¿¡Æø½Ã º¯¼º ¹°ÁúÀÌ ÀϹÝÀûÀ¸·Î »ç¿ëµË´Ï´Ù.
¾×ü ÀÎĸ½¶·¹ÀÌ¼Ç ½ÃÀåÀÇ ¿ªµ¿ÀûÀÎ ¼ºÀåÀº ¸î °¡Áö Áß¿äÇÑ ¿äÀο¡ ±âÀÎÇÕ´Ï´Ù. ù°, ÀüÀÚ±â±âÀÇ º¹ÀâÈ¿Í Á¶ÀÛ¼ºÀÇ Çâ»óÀÌ Àü±â ºÎǰÀÇ ¼ÒÇüÈÀÇ µ¿Çâ°ú ÇÔ²² ½ÃÀå È®´ëÀÇ ¿øµ¿·ÂÀÌ µÇ°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ Åë½Å ¹× ÀüÀÚ »ê¾÷ÀÇ ±Þ¼ºÀå°ú ¼¾¼ ÀåÄ¡, ¹«¼± ±â¼ú ¹× ±¤ÀüÀÚ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó ÀÎĸ½¶·¹ÀÌ¼Ç ±â¼úÀÇ »ç¿ëÀÌ È®´ëµÇ°í ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î, ¿öÅÐ·ç ´ëÇÐÀº 2023³â 6¿ù, ÀÌ ´ëÇÐÀÇ ¿¬±¸ºÎ°¡ °³¹ßÇÑ »õ·Î¿î ÀÎĸ½¶·¹ÀÌ¼Ç ±â¼ú 'liquid-¾×ü ÀÎĸ½¶·¹ÀÌ¼Ç ½Ã½ºÅÛ'À» ¹ßÇ¥Çß½À´Ï´Ù. ÀÌ ±â¼ú Çõ½ÅÀº ÃÖ¼ÒÇÑ 5000ºÐÀÇ 1À̶ó´Â »ó´çÇÑ ¿¡³ÊÁö ¼Òºñ °¨¼Ò¸¦ ÀÚ¶ûÇϸç ÀÎĸ½¶·¹ÀÌ¼Ç ½Ã ¸¶ÀÌÅ©·ÎÇÃ¶ó½ºÆ½À» »ç¿ëÇÏÁö ¾Ê½À´Ï´Ù.
¹ÝµµÃ¼ µð¹ÙÀ̽ºÀÇ ¼ÒÇüȸ¦ À§ÇÑ µ¿Çâ Áõ°¡°¡ ¾×ü ÀÎĸ½¶·¹ÀÌ¼Ç ±â¼ú ¼ö¿ä¸¦ µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù. ÀÌ ¹æ¹ýÀº ¾ð´õÇʸµ, ijºñƼ Çʸµ, ÷´Ü ÆÐŰ¡, ±Û·Îºêž ÀÎĸ½¶·¹ÀÌ¼Ç µîÀÇ ÀÛ¾÷¿¡ »ç¿ëµÇ¸ç, ¹ÝµµÃ¼ µð¹ÙÀ̽ºÀÇ »ý»ê¿¡ ÇʼöÀûÀÔ´Ï´Ù. ǰÁúÀ» ÀúÇϽÃŰÁö ¾ÊÀ¸¸é¼ º¸´Ù ÀÛ°í º¹ÀâÇÑ ÀüÀÚ ÀåÄ¡ÀÇ È¿À²À» ³ôÀÏ ¼ö ÀÖ½À´Ï´Ù. ÀüÀÚ±â±â³ª ¹ÝµµÃ¼´Â Á¤¹ÐÇÑ ¹èÄ¡¸¦ ÇÊ¿ä·Î ÇÏ´Â ¼¶¼¼ÇÑ ºÎǰÀ¸·Î ±¸¼ºµÇ¾î Àֱ⠶§¹®¿¡ ÀÌ·¯ÇÑ ¿äÀÎÀÌ ½ÃÀåÀÇ ¼ºÀåÀ» ¹Ð¾î¿Ã¸± °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ¶ÇÇÑ ¾×ü ÀÎĸ½¶·¹À̼Ǵ ÀåÄ¡ ÀÛµ¿¿¡ ÇʼöÀûÀ̸ç ÀüÀÚ ÀåÄ¡ ºÎǰÀÇ ¿ÀÀÛµ¿À» ¹æÁöÇϱâ À§ÇØ ¼ºÀåÀ» °¡¼ÓÈÇÕ´Ï´Ù.
The Semiconductor Industry Association(SIA)ÀÇ Áö¿ªº° ¼¼°è ¹ÝµµÃ¼ »ê¾÷ ¸ÅÃâ¿¡ µû¸£¸é 2022³â ¼¼°è ¹ÝµµÃ¼ »ê¾÷ ¸ÅÃâÀº Áß±¹ÀÌ ¼±µµÇÏ°í ¸ÅÃâÀº 156¾ï 7,000¸¸ ´Þ·¯¿¡ ´ÞÇϰí, ¾à°£ Â÷ÀÌ·Î ¾Æ¸Þ¸®Ä«°¡ À̾îÁ® ¸ÅÃâ ³ôÀÌ´Â 118¾ï 4,000¸¸ ´Þ·¯¸¦ ±â·ÏÇß½À´Ï´Ù. ÀÌ¾î ¾Æ½Ã¾ÆÅÂÆò¾ç/±âŸ Áö¿ªµµ »ó´çÇÑ ¸ÅÃâÀ» º¸¿´À¸¸ç ÃÑ 129¾ï 1,000¸¸ ´Þ·¯·Î ¿ªµ¿ÀûÀÌ°í °æÀïÀûÀÎ ¼¼°è ½ÃÀåÀ» ¹Ý¿µÇÕ´Ï´Ù. ¹ÝµµÃ¼ ¸ÅÃâ Áõ°¡´Â ¾×ü ÀÎĸ½¶·¹ÀÌ¼Ç ½ÃÀåÀ» °ÈÇÏ´Â µ¥ ÀÖ¾î ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù.
¾×ü ÀÎĸ½¶·¹À̼ÇÀ̶õ MEMS µð¹ÙÀ̽º °³¹ß ±â¼ú·Î, ¿¡Æø½Ã ¼öÁö ¹ÐºÀÀç¿¡ ºñÇØ ¾×ü ÀÎĸ½¶·¹À̼Ǵ À¯¿¬¼ºÀÌ ³ô±â ¶§¹®¿¡ ¹ÝµµÃ¼, Ĩ ¿Âº¸µå, IC, Æ®·£Áö½ºÅÍ µîÀÇ ¿ëµµ¿¡ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. ´ë¸¸Àº ÁÖ¿ä ¹ÝµµÃ¼ Á¦Á¶±¹ Áß ÇϳªÀ̸ç Àü±â ¹× ÀüÀÚ±â±â ¹× ÀÚµ¿Â÷ IC¿¡ ´ëÇÑ ÃÖÁ¾ »ç¿ëÀÚ ¼ö¿ä°¡ ±ÞÁõÇϰí ÀÖ¾î IC »ý»êÀÌ Å©°Ô Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î ´ë¸¸ ¹ÝµµÃ¼ »ê¾÷Çùȸ¿¡ µû¸£¸é 2022³â ´ë¸¸ÀÇ IC ¸ÅÃâÀº 4Á¶8,370¾ï ´º´ë¸¸ ´Þ·¯·Î, 2021³â 4Á¶820¾ï ´º´ë¸¸ ´Þ·¯¿¡¼ 18.5% Áõ°¡Çß½À´Ï´Ù.
°Ô´Ù°¡ ´ë¸¸ÀÇ ±¹°¡°úÇбâ¼úÀ§¿øÈ¸°¡ ¼¼°è ±Ô¸ðÀÇ IC Á¦Á¶¿¡ ÀÖ¾î¼ ´ë¸¸ÀÇ Á¸À縦 °ÈÇϱâ À§ÇØ ½Ç½ÃÇÑ Àû±ØÀûÀÎ ³ë·ÂÀÌ ½ÃÀåÀÇ ¼ºÀåÀ» ´õ¿í Áõ´ë½Ã۰í ÀÖ½À´Ï´Ù. ¶ÇÇÑ Nitto Denko Corporation ¹× Taiwan PU Corporation°ú °°Àº ÁÖ¿ä ¾×ü ¹ÐºÀÁ¦ °ø±ÞÀÚ°¡ È®°íÇÑ ÁöÀ§¸¦ ±¸ÃàÇϰí ÀÖ´Â °Íµµ ½ÃÀåÀ» °ßÀÎÇÏ´Â ¿äÀÎÀÌ µÇ°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ °ü¼º¼¾¼, °¡½º¼¾¼, ±¤Çм¾¼, ¾Ð·Â ¼¾¼ µî Â÷·®¿ë MEMSÀÇ ¿ëµµ°¡ È®´ëµÇ°í ÀÖÀ¸¸ç, ÀÌ·¯ÇÑ ÃÖÁ¾ »ç¿ëÀÚÀÇ ¼ºÀåÀÌ °¡¼ÓµÇ°í ÀÖ´Â °Íµµ ¿ÜºÎ ȯ°æ ¿äÀÎÀ¸·ÎºÎÅÍ MEMS¸¦ º¸È£ÇÏ´Â ¾×ü ÀÎĸ½¶·¹ÀÌ¼Ç ¼ö¿ä¸¦ µ¿½Ã¿¡ ³ôÀÏ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ±¹Á¦ÀÚµ¿Â÷°ø¾÷ȸ(International Organization of Motor Vehicle Manufacturers)¿¡ µû¸£¸é 2022³â ´ë¸¸ÀÇ ÀÚµ¿Â÷ »ý»ê ´ë¼ö´Â 26¸¸ 5,320´ë·Î 2020³â »ý»ê ´ë¼ö 24¸¸ 5,615´ë¿¡¼ 6% Áõ°¡Çß½À´Ï´Ù.
2022³â 1¿ù, TDK´Â ÃÖ÷´Ü BalancedGyro(TM) ±â¼ú°ú ¹Î»ý ¿ëµµ¿¡¼ »ç¿ëÇÒ ¼ö ÀÖ´Â ÃÖÀú Àü·Â ¼Òºñ¸¦ Ư¡À¸·Î ÇÏ´Â SmartMotion(TM) ÃÊ°í¼º´É Á¦Ç°±ºÀ» ¹ßÇ¥Çß½À´Ï´Ù. TDK CorporationÀº InvenSense ICM-45xxx SmartMotion(TM) ÃÊ°í¼º´É(UHP) 6Ãà MEMS ¸ð¼Ç ¼¾¼ Á¦Ç°±ºÀ» ¹ßÇ¥ÇÏ¿© ¾÷°èÀÇ ¼º´É°ú È¿À²¼º¿¡ ´ëÇÑ »õ·Î¿î ±âÁØÀ» ¼¼¿ü½À´Ï´Ù. 2021³â 6¿ù, HenkelÀÇ Å×Å©³ë¸áÆ® Àú¾Ð ¼ºÇü ±â¼úÀº ÀüÀÚ±â±â ¹× ÀÇ·áºÎǰÀÇ ¹ÐºÀ¿¡ ´ëÇÑ ÃֽŠ¿ä±¸»çÇ׿¡ ºÎÇÕÇÏ¿© ´Ù¾çÇÑ »ê¾÷¿¡¼ ÁöÁö¸¦ ¹Þ°í ÀÖ½À´Ï´Ù. ÀÌ ±â¼úÀº ÀÇ·á, ÀüÀÚ ºÎǰ, Àü·Â, »ê¾÷ ÀÚµ¿È, HVAC, Á¶¸í ºÐ¾ß¿¡¼ ÀÀ¿ë ºÐ¾ß°¡ È®´ëµÇ°í ÀÖ½À´Ï´Ù. ÀÌ ±â¼úÀº ¹ÝÀÀ¼º ¼öÁö ½Ã½ºÅÛ¿¡ ÀÇÇÑ Æ÷ÆÃ ¹× °í¾Ð »çÃâ ¼ºÇü°ú °°Àº ´ëü ¹æ¹ý¿¡ ºñÇØ °æÁ¦Àû, °øÁ¤ °ü¸®Àû, ¼³°èÀû, ȯ°æÀûÀ¸·Î ¸î °¡Áö ÀåÁ¡À» Á¦°øÇÔÀ¸·Î½á µÎµå·¯Áý´Ï´Ù.
The liquid encapsulation market is projected to grow at a CAGR of 4.59% during the forecast period to reach US$2.332 billion by 2028, from US$1.703 billion in 2021.
Liquid encapsulation is a method that entails the application of substances such as polymers, metals, and ceramics to solid or liquid devices to shield them from shocks and moisture. This protective layer is employed to maintain device functionality and prevent disconnections among electrical components. Epoxy resin and epoxy-modified substances are commonly employed for this encapsulation process.
The dynamic growth of the liquid encapsulation market can be attributed to several key factors. Firstly, the increasing complexity and operability of electronic devices, coupled with the trend toward miniaturized electrical components, are driving market expansion. Additionally, the rapid growth of the telecommunications and electronics industries, alongside the rising demand for sensor devices, wireless technologies, and optoelectronics, has led to greater utilization of encapsulation methods. For example, in June 2023, the University of Waterloo introduced a novel encapsulation technology developed by its research department known as the liquid-liquid encapsulation system. This innovation boasts significantly lower energy consumption, being at least 5000 times less intensive, and it eliminates the use of microplastics during encapsulation.
The surging trend towards miniaturized semiconductor devices is fueling the demand for liquid encapsulation technology. This method is vital in the production of semiconductor devices, used for tasks like under-filling, cavity filling, advanced packaging, and glob-top encapsulation. It enhances the efficiency of smaller, more intricate electronic devices without compromising quality. As electronics and semiconductors consist of delicate components requiring precise placement, this factor is expected to boost market growth. Liquid encapsulation is also crucial for device operation, preventing component malfunctions in electronic devices, thus accelerating its growth.
According to The Semiconductor Industry Association (SIA) global semiconductor industry sales by region, data shows that in 2022, the global semiconductor industry sales were led by China, with sales figures reaching $15.67 billion, closely followed by the Americas, which recorded sales of $11.84 billion. Subsequently, the Asia-Pacific/all other regions also showed substantial sales, totalling $12.91 billion, reflecting a dynamic and competitive global market. Increased sales of semiconductor plays a pivotal role in bolstering the liquid encapsulation market as they create demand for miniaturized semiconductor devices resulting in a surge in its market growth.
Liquid encapsulation refers to the technology of developing MEMS devices and in comparison, to epoxy molded compounds liquid encapsulant's high flexibility enables them to be used in semiconductor, chip-on-board, ICs, and transistors applications. Taiwan is one of the leading semiconductor manufacturing countries and with booming end-user demand for ICs in electrical & electronics and automotive, the country is witnessing a significant increase in its ICs production which is expected to provide a positive scope for the usage of liquid encapsulation technology for boosting the mechanical strength of wire-bonded devices. For instance, according to the Taiwan Semiconductor Industry Association, in 2022, Taiwan's IC revenue stood at NT$4,837 billion which represented an 18.5% increase over 2021's revenue figure of NT$4,082 billion.
Moreover, the favorable initiatives undertaken by the National Science and Technology Council, Taiwan to bolster the country's presence in IC manufacturing on a global scale has further augmented the market growth. Furthermore, the well-established presence of major liquid encapsulant providers such as Nitto Denko Corporation and Taiwan PU Corporation is acting as an additional driving factor. Also, the growing applicability of MEMS in automotive for inertia, gas, optical, and pressure sensors coupled with the bolstering growth in such end-users is anticipated to simultaneously increase the demand for liquid encapsulation for safeguarding MEMS from external environment factors. According to the International Organization of Motor Vehicle Manufacturers, in 2022, Taiwan's automotive production stood at 2,65,320 units which signified a 6% increase over 2020's production volume of 2,45,615.