세계 액체 인캡슐레이션 시장 예측(2023-2028년)

The liquid encapsulation market is projected to grow at a CAGR of 4.59% during the forecast period to reach US$2.332 billion by 2028, from US$1.703 billion in 2021.

Liquid encapsulation is a method that entails the application of substances such as polymers, metals, and ceramics to solid or liquid devices to shield them from shocks and moisture. This protective layer is employed to maintain device functionality and prevent disconnections among electrical components. Epoxy resin and epoxy-modified substances are commonly employed for this encapsulation process.

The dynamic growth of the liquid encapsulation market can be attributed to several key factors. Firstly, the increasing complexity and operability of electronic devices, coupled with the trend toward miniaturized electrical components, are driving market expansion. Additionally, the rapid growth of the telecommunications and electronics industries, alongside the rising demand for sensor devices, wireless technologies, and optoelectronics, has led to greater utilization of encapsulation methods. For example, in June 2023, the University of Waterloo introduced a novel encapsulation technology developed by its research department known as the liquid-liquid encapsulation system. This innovation boasts significantly lower energy consumption, being at least 5000 times less intensive, and it eliminates the use of microplastics during encapsulation.

The growing application of semiconductors across various industries is propelling the market growth.

The surging trend towards miniaturized semiconductor devices is fueling the demand for liquid encapsulation technology. This method is vital in the production of semiconductor devices, used for tasks like under-filling, cavity filling, advanced packaging, and glob-top encapsulation. It enhances the efficiency of smaller, more intricate electronic devices without compromising quality. As electronics and semiconductors consist of delicate components requiring precise placement, this factor is expected to boost market growth. Liquid encapsulation is also crucial for device operation, preventing component malfunctions in electronic devices, thus accelerating its growth.

According to The Semiconductor Industry Association (SIA) global semiconductor industry sales by region, data shows that in 2022, the global semiconductor industry sales were led by China, with sales figures reaching $15.67 billion, closely followed by the Americas, which recorded sales of $11.84 billion. Subsequently, the Asia-Pacific/all other regions also showed substantial sales, totalling $12.91 billion, reflecting a dynamic and competitive global market. Increased sales of semiconductor plays a pivotal role in bolstering the liquid encapsulation market as they create demand for miniaturized semiconductor devices resulting in a surge in its market growth.

It is projected that the Taiwan liquid encapsulation market will grow steadily.

Liquid encapsulation refers to the technology of developing MEMS devices and in comparison, to epoxy molded compounds liquid encapsulant's high flexibility enables them to be used in semiconductor, chip-on-board, ICs, and transistors applications. Taiwan is one of the leading semiconductor manufacturing countries and with booming end-user demand for ICs in electrical & electronics and automotive, the country is witnessing a significant increase in its ICs production which is expected to provide a positive scope for the usage of liquid encapsulation technology for boosting the mechanical strength of wire-bonded devices. For instance, according to the Taiwan Semiconductor Industry Association, in 2022, Taiwan's IC revenue stood at NT$4,837 billion which represented an 18.5% increase over 2021's revenue figure of NT$4,082 billion.

Moreover, the favorable initiatives undertaken by the National Science and Technology Council, Taiwan to bolster the country's presence in IC manufacturing on a global scale has further augmented the market growth. Furthermore, the well-established presence of major liquid encapsulant providers such as Nitto Denko Corporation and Taiwan PU Corporation is acting as an additional driving factor. Also, the growing applicability of MEMS in automotive for inertia, gas, optical, and pressure sensors coupled with the bolstering growth in such end-users is anticipated to simultaneously increase the demand for liquid encapsulation for safeguarding MEMS from external environment factors. According to the International Organization of Motor Vehicle Manufacturers, in 2022, Taiwan's automotive production stood at 2,65,320 units which signified a 6% increase over 2020's production volume of 2,45,615.

Market Key Developments

• In January 2022, TDK introduced its SmartMotion™ ultra-high-performance family, featuring cutting-edge BalancedGyro™ technology and the lowest power consumption available for consumer applications. TDK Corporation unveiled the InvenSense ICM-45xxx SmartMotion™ ultra-high-performance (UHP) family of 6-axis MEMS motion sensors, setting new standards for performance and efficiency in the industry.
• In June 2021, Henkel's Technomelt Low-Pressure Molding technology, which aligns with the latest requirements for encapsulating electronics and medical components, is gaining traction in various industries. This technology is finding increased application in medical, electronic components, power, industrial automation, HVAC, and lighting sectors. It stands out by providing several economic, process control, design, and environmental benefits when compared to alternative methods, including potting with reactive resin systems and high-pressure injection molding.

Segmentation:

By Materials

• Epoxy Resins
• Epoxy-Modified Resins
• Others

By Product

• Integrated circuit
• Optoelectronics
• Sensors
• Others

By Application

• Automotive
• Communication and Technology
• Consumer Electronics
• Manufacturing

By Geography

• Americas
• USA
• Others
• Europe, Middle East and Africa
• Germany
• UK
• France
• Others
• Asia Pacific
• China
• Japan
• Taiwan
• South Korea
• Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study
• 1.4. Market Segmentation
• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

• 2.1. Research Data
• 2.2. Assumptions

3. EXECUTIVE SUMMARY

• 3.1. Research Highlights

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Force Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis

5. LIQUID ENCAPSULATION MARKET BY MATERIALS

• 5.1. Introduction
• 5.2. Epoxy Resins
• 5.3. Epoxy-Modified Resins
• 5.4. Others

6. LIQUID ENCAPSULATION MARKET BY PRODUCT

• 6.1. Introduction
• 6.2. Integrated circuit
• 6.3. Optoelectronics
• 6.4. Sensors
• 6.5. Others

7. LIQUID ENCAPSULATION MARKET BY APPLICATION

• 7.1. Introduction
• 7.2. Automotive
• 7.3. Communication and Technology
• 7.4. Consumer Electronics
• 7.5. Manufacturing

8. LIQUID ENCAPSULATION MARKET BY GEOGRAPHY

• 8.1. Introduction
• 8.2. Americas
  • 8.2.1. USA
  • 8.2.2. Others
• 8.3. Europe, Middle East and Africa
  • 8.3.1. Germany
  • 8.3.2. UK
  • 8.3.3. France
  • 8.3.4. Others
• 8.4. Asia Pacific
  • 8.4.1. China
  • 8.4.2. Japan
  • 8.4.3. Taiwan
  • 8.4.4. South Korea
  • 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 9.1. Major Players and Strategy Analysis
• 9.2. Market Share Analysis
• 9.3. Mergers, Acquisitions, Agreements, and Collaborations

10. COMPANY PROFILES

• 10.1. BASF
• 10.2. Epic Resins
• 10.3. Panasonic Corporation
• 10.4. Sumitomo Bakelite
• 10.5. KYOCERA Chemical Corporation
• 10.6. Shin-Etsu Chemical
• 10.7. Nagase & Co.
• 10.8. Nitto Denko Corporation
• 10.9. Resin Technical systems
• 10.10. CAPLINQ Corporation BAE Systems