세계의 밀폐 포장 시장 예측(2024-2029년)

The hermetic packaging market is expected to experience a CAGR of 4.89% throughout the forecast period, reaching a market size of US$5.857 billion by 2029. This represents a substantial increase from US$4.193 billion recorded in 2022.

The Hermetic packaging market is a specialized sector within the broader packaging industry, focusing on the creation and production of hermetically sealed packaging solutions. Hermetic packaging involves creating airtight and completely sealed enclosures for sensitive electronic and optoelectronic components. This specialized form of packaging is crucial in protecting these components from environmental factors such as moisture, gases, and other contaminants that could compromise their functionality and reliability.

Market Drivers:

• Rise in demand for reliable and durable packaging fuels the growth

Several factors are contributing to the Hermetic packaging market growth. One significant driver is the increasing demand for reliable and durable packaging solutions in the electronics industry. As electronic devices become more compact and sophisticated, the need to protect sensitive components from external elements becomes paramount.

Hermetic packaging ensures the longevity and optimal performance of electronic and optoelectronic devices in challenging environments, making it an indispensable solution for various applications, including aerospace, automotive, medical devices, and telecommunications. Furthermore, the growth of industries like automotive and aerospace, where stringent safety and reliability standards are essential, is propelling the demand for Hermetic packaging. These industries often require electronic components to function flawlessly under extreme conditions, such as high temperatures, pressure differentials, and exposure to harsh chemicals. Hermetic packaging provides a reliable shield against these challenging conditions, contributing to the market's expansion.

In addition, the healthcare sector is emerging as a significant contributor to the Hermetic packaging market. The increasing use of implantable medical devices, sensors, and other electronic components in medical applications necessitates packaging solutions that ensure the longevity and reliability of these critical devices. Hermetic packaging, with its ability to provide a secure and protective environment, is becoming increasingly integral in the healthcare industry.

• Growth in the electronics industry propels the market.

The growth in the electronic industry has emerged as a significant catalyst for the Hermetic packaging market expansion. As the electronic industry continues to evolve and innovate, there is an increasing demand for compact, high-performance electronic components that can operate in diverse and challenging environments.

Hermetic packaging plays a crucial role in meeting these demands by providing a protective barrier that shields sensitive electronic elements from external factors, ensuring their reliability and longevity. The growth of India's domestic production in the electronics sector has significantly contributed to an increase in electronics exports, consequently driving the Hermetic packaging market growth. As India establishes itself as a prominent player in electronics manufacturing, the need for reliable packaging solutions, such as Hermetic packaging, becomes crucial to ensure the export of high-quality electronic products. One of the key factors influencing the Hermetic packaging market growth in tandem with India's electronics export expansion is the emphasis on producing components that meet international quality standards.

Many countries that import electronic goods have stringent quality and reliability requirements. Hermetic packaging, with its ability to provide airtight and protective enclosures for sensitive electronic components, ensures that these components maintain their functionality and integrity during transportation and use. This reliability is a significant factor in boosting the confidence of international buyers and promoting the export of Indian electronic products.

Furthermore, as India's domestic electronics production capabilities grow, there is an increased focus on manufacturing complex and advanced electronic devices. According to Invest India, at present, India's domestic production has increased at a CAGR of 13% from $49 Bn in FY17 to $101 Bn in FY23. The country's electronics exports are expected to reach $120 Bn by FY26.

These sophisticated devices often contain components that are sensitive to environmental factors, making Hermetic packaging an essential element in preserving their performance. The adoption of Hermetic packaging in the manufacturing process enhances the export competitiveness of Indian electronics by assuring end-users and global markets of the durability and reliability of the products.

• It is projected that the market in North America will grow steadily.

High-performance features provided by hermetic packages such as preventing gas & moisture permeation and helping components form systems have made such instruments an integral part of major sectors such as aerospace, automotive, military, and electronics. With the bolstering growth of such major end-users in the United States coupled with the favourable efforts to protect sensitive electrical components, the demand for hermetic packages is expected to experience a growing trend in the coming years.

For instance, according to the General Aviation Manufacturers Association, in Q2 of 2023, the total number of aircraft consisting of piston, turboprop, and turbine planes manufactured in the United States stood at 538 units which signified an increase of 18.5% over Q3 2022 and 55.5% over Q1 2023.

Moreover, besides aerospace, the automotive sector relies upon hermetic packages & seals to ensure the functionality of sensors, airbags, and rollover devices. According to the International Organization of Motor Vehicle Manufacturers, in 2022, the USA's automotive production witnessed a 10% increase over 2021's production with volume reaching up to 10.06 million units.

Likewise, booming consumer electronic demand coupled with investments in the energy sector has resulted in an upward market trajectory. Additionally, the changes in atmospheric pressure and environmental conditions have accelerated the need for providing better production to electronics components and preventing their damage which has further stimulated the overall market demand for hermetic packages and seal products.

Key Developments:

• In March 2023, CPS Technologies Corporation revealed that it had received $5.0M worth of purchase orders for hermetic packages from a prominent aerospace electronics manufacturer. These orders are intended to support various U.S. space missions and large-scale production tactical programs. CPS specializes in providing hermetic packages classified as Class-H and Class-K, which are designed to withstand extreme conditions encountered in environments like Low Earth Orbit, Medium Earth Orbit, and Geosynchronous Equatorial Orbit satellites, as well as other deep space initiatives.
• In January 2022, SCHOTT introduced hermetic packaging components designed specifically for augmented reality (AR) applications, leveraging its extensive expertise in glass-to-metal sealing. These innovative solutions cater to the needs of AR technologies, including RGB laser chips and MEMS mirrors. SCHOTT, for the first time, will be unveiling its SCHOTT(R) LightView packaging components at SPIE AR/VR/MR. The primary goal of these cutting-edge packaging solutions is to downsize and improve the optoelectronic performance of augmented reality light engine systems.

Segmentation:

By Configuration:

• Multilayer Ceramic Packages
• Metal Can Packages
• Pressed Ceramic Packages

By Type:

• Ceramic Metal Sealing
• Glass Material Sealing
• Passivation Glass
• Transponder Glass
• Reed Glass

By Application:

• Transistors
• Lasers
• Photo Diodes
• Airbag Ignitors
• Others

By End-User Industry:

• Military and Defence
• Aerospace
• Automotive
• Energy
• Others

By Geography

• North America
• United States
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• UK
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• Israel
• Others
• Asia Pacific
• China
• Japan
• South Korea
• India
• Indonesia
• Taiwan
• Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study
• 1.4. Market Segmentation
• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base, and Forecast Years Timeline
• 1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

• 2.1. Research Design
• 2.2. Research Process

3. EXECUTIVE SUMMARY

• 3.1. Key Findings
• 3.2. Analyst View

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Forces Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis
• 4.5. Analyst View

5. HERMETIC PACKAGING MARKET, BY CONFIGURATION

• 5.1. Introduction
• 5.2. Multilayer Ceramic Packages
  • 5.2.1. Market Opportunities and Trends
  • 5.2.2. Growth Prospects
  • 5.2.3. Geographic Lucrativeness
• 5.3. Metal Can Packages
  • 5.3.1. Market Opportunities and Trends
  • 5.3.2. Growth Prospects
  • 5.3.3. Geographic Lucrativeness
• 5.4. Pressed Ceramic Packages
  • 5.4.1. Market Opportunities and Trends
  • 5.4.2. Growth Prospects
  • 5.4.3. Geographic Lucrativeness

6. HERMETIC PACKAGING MARKET, BY TYPE

• 6.1. Introduction
• 6.2. Ceramic Metal Sealing
  • 6.2.1. Market Opportunities and Trends
  • 6.2.2. Growth Prospects
  • 6.2.3. Geographic Lucrativeness
• 6.3. Glass Material Sealing
  • 6.3.1. Market Opportunities and Trends
  • 6.3.2. Growth Prospects
  • 6.3.3. Geographic Lucrativeness
• 6.4. Passivation Glass
  • 6.4.1. Market Opportunities and Trends
  • 6.4.2. Growth Prospects
  • 6.4.3. Geographic Lucrativeness
• 6.5. Transponder Glass
  • 6.5.1. Market Opportunities and Trends
  • 6.5.2. Growth Prospects
  • 6.5.3. Geographic Lucrativeness
• 6.6. Reed Glass
  • 6.6.1. Market Opportunities and Trends
  • 6.6.2. Growth Prospects
  • 6.6.3. Geographic Lucrativeness

7. HERMETIC PACKAGING MARKET, BY APPLICATION

• 7.1. Introduction
• 7.2. Transistors
  • 7.2.1. Market Opportunities and Trends
  • 7.2.2. Growth Prospects
  • 7.2.3. Geographic Lucrativeness
• 7.3. Lasers
  • 7.3.1. Market Opportunities and Trends
  • 7.3.2. Growth Prospects
  • 7.3.3. Geographic Lucrativeness
• 7.4. Photo Diodes
  • 7.4.1. Market Opportunities and Trends
  • 7.4.2. Growth Prospects
  • 7.4.3. Geographic Lucrativeness
• 7.5. Airbag Ignitors
  • 7.5.1. Market Opportunities and Trends
  • 7.5.2. Growth Prospects
  • 7.5.3. Geographic Lucrativeness
• 7.6. Others
  • 7.6.1. Market Opportunities and Trends
  • 7.6.2. Growth Prospects
  • 7.6.3. Geographic Lucrativeness

8. HERMETIC PACKAGING MARKET, BY END-USER INDUSTRY

• 8.1. Introduction
• 8.2. Military and Defence
  • 8.2.1. Market Opportunities and Trends
  • 8.2.2. Growth Prospects
  • 8.2.3. Geographic Lucrativeness
• 8.3. Aerospace
  • 8.3.1. Market Opportunities and Trends
  • 8.3.2. Growth Prospects
  • 8.3.3. Geographic Lucrativeness
• 8.4. Automotive
  • 8.4.1. Market Opportunities and Trends
  • 8.4.2. Growth Prospects
  • 8.4.3. Geographic Lucrativeness
• 8.5. Energy
  • 8.5.1. Market Opportunities and Trends
  • 8.5.2. Growth Prospects
  • 8.5.3. Geographic Lucrativeness
• 8.6. Others
  • 8.6.1. Market Opportunities and Trends
  • 8.6.2. Growth Prospects
  • 8.6.3. Geographic Lucrativeness

9. HERMETIC PACKAGING MARKET, BY GEOGRAPHY

• 9.1. Introduction
• 9.2. North America
  • 9.2.1. By Configuration
  • 9.2.2. By Type
  • 9.2.3. By Application
  • 9.2.4. By End User
  • 9.2.5. By Country
    • 9.2.5.1. United States
      • 9.2.5.1.1. Market Opportunities and Trends
      • 9.2.5.1.2. Growth Prospects
    • 9.2.5.2. Canada
      • 9.2.5.2.1. Market Opportunities and Trends
      • 9.2.5.2.2. Growth Prospects
    • 9.2.5.3. Mexico
      • 9.2.5.3.1. Market Opportunities and Trends
      • 9.2.5.3.2. Growth Prospects
• 9.3. South America
  • 9.3.1. By Configuration
  • 9.3.2. By Type
  • 9.3.3. By Application
  • 9.3.4. By End User
  • 9.3.5. By Country
    • 9.3.5.1. Brazil
      • 9.3.5.1.1. Market Opportunities and Trends
      • 9.3.5.1.2. Growth Prospects
    • 9.3.5.2. Argentina
      • 9.3.5.2.1. Market Opportunities and Trends
      • 9.3.5.2.2. Growth Prospects
    • 9.3.5.3. Others
      • 9.3.5.3.1. Market Opportunities and Trends
      • 9.3.5.3.2. Growth Prospects
• 9.4. Europe
  • 9.4.1. By Configuration
  • 9.4.2. By Type
  • 9.4.3. By Application
  • 9.4.4. By End User
  • 9.4.5. By Country
    • 9.4.5.1. Germany
      • 9.4.5.1.1. Market Opportunities and Trends
      • 9.4.5.1.2. Growth Prospects
    • 9.4.5.2. France
      • 9.4.5.2.1. Market Opportunities and Trends
      • 9.4.5.2.2. Growth Prospects
    • 9.4.5.3. United Kingdom
      • 9.4.5.3.1. Market Opportunities and Trends
      • 9.4.5.3.2. Growth Prospects
    • 9.4.5.4. Spain
      • 9.4.5.4.1. Market Opportunities and Trends
      • 9.4.5.4.2. Growth Prospects
    • 9.4.5.5. Others
      • 9.4.5.5.1. Market Opportunities and Trends
      • 9.4.5.5.2. Growth Prospects
• 9.5. Middle East and Africa
  • 9.5.1. By Configuration
  • 9.5.2. By Type
  • 9.5.3. By Application
  • 9.5.4. By End User
  • 9.5.5. By Country
    • 9.5.5.1. Saudi Arabia
      • 9.5.5.1.1. Market Opportunities and Trends
      • 9.5.5.1.2. Growth Prospects
    • 9.5.5.2. Israel
      • 9.5.5.2.1. Market Opportunities and Trends
      • 9.5.5.2.2. Growth Prospects
    • 9.5.5.3. Others
      • 9.5.5.3.1. Market Opportunities and Trends
      • 9.5.5.3.2. Growth Prospects
• 9.6. Asia Pacific
  • 9.6.1. By Configuration
  • 9.6.2. By Type
  • 9.6.3. By Application
  • 9.6.4. By End User
  • 9.6.5. By Country
    • 9.6.5.1. China
      • 9.6.5.1.1. Market Opportunities and Trends
      • 9.6.5.1.2. Growth Prospects
    • 9.6.5.2. Japan
      • 9.6.5.2.1. Market Opportunities and Trends
      • 9.6.5.2.2. Growth Prospects
    • 9.6.5.3. South Korea
      • 9.6.5.3.1. Market Opportunities and Trends
      • 9.6.5.3.2. Growth Prospects
    • 9.6.5.4. India
      • 9.6.5.4.1. Market Opportunities and Trends
      • 9.6.5.4.2. Growth Prospects
    • 9.6.5.5. Indonesia
      • 9.6.5.5.1. Market Opportunities and Trends
      • 9.6.5.5.2. Growth Prospects
    • 9.6.5.6. Taiwan
      • 9.6.5.6.1. Market Opportunities and Trends
      • 9.6.5.6.2. Growth Prospects
    • 9.6.5.7. Others
      • 9.6.5.7.1. Market Opportunities and Trends
      • 9.6.5.7.2. Growth Prospects

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 10.1. Major Players and Strategy Analysis
• 10.2. Market Share Analysis
• 10.3. Mergers, Acquisitions, Agreements, and Collaborations
• 10.4. Competitive Dashboard

11. COMPANY PROFILES

• 11.1. Vertiv Group Corporation
• 11.2. SCHOTT AG
• 11.3. AMETEK
• 11.4. Amkor Technology
• 11.5. Texas Instruments
• 11.6. Teledyne Microelectronics
• 11.7. Kyocera Corporation
• 11.8. Materion Corporation
• 11.9. Egide
• 11.10. Micross Components
• 11.11. Legacy Technologies
• 11.12. Hermetic Solutions Group