반도체 패키징 시장 : 예측(2025-2030년)

The semiconductor packaging market is projected to grow at a CAGR of 6.82% over the forecast period, increasing from US$53.119 billion in 2025 to US$73.886 billion by 2030.

Semiconductors are an important component applicable across multiple industries, like automotive, telecommunications, consumer electronics, healthcare, and aerospace, among others. Semiconductors have various properties like integrated circuits, electronic discrete, and transistors. They are a sensitive component, requiring a protective packaging case before being transported to multiple end-users. The semiconductor packaging offers a protective layer, which helps prevent the semiconductors from dust, scratches, or any other physical or environmental damage.

The demand for semiconductor packaging is expected to grow with the increasing demand for semiconductors globally. Semiconductors are an important component in automobiles. They offer multiple features, such as enabling the entertainment system and internet connectivity options in vehicles. The semiconductors are also embedded into various automobile safety systems, such as the ADAS and emergency braking systems.

Market Trends:

• Rising Global Semiconductor Demand Set to Drive Market Expansion: Semiconductors are vital components in electronic devices, facilitating communication and enhancing computing capabilities. Their widespread use spans industries such as healthcare, aerospace, automotive, and consumer electronics, fueling expectations of significant growth in the global semiconductor packaging market. The semiconductor sector has experienced a surge in demand due to its versatility across multiple fields. According to the Semiconductor Industry Association (SIA), global semiconductor demand rose by 15.8% from April 2023 to April 2024, with a projected industry growth of approximately 16% for 2024. Sales figures reflect this upward trend, reaching an estimated US$46.4 billion in April 2024, up from US$40.1 billion in April 2023. Regionally, the Americas led with a remarkable 32.4% growth in 2024, followed by China at 23.4%, while the broader Asia-Pacific region saw an 11.1% increase.
• Global Segmentation of the Semiconductor Packaging Market: The semiconductor packaging market is divided into five regions: North America, South America, Europe, the Middle East and Africa, and Asia-Pacific. China stands out as a global leader in the semiconductor industry, with ambitious goals to advance its integrated circuit (IC) production and bolster domestic chip manufacturing. The country boasts a thriving semiconductor ecosystem, encompassing foundries, packaging equipment, and research institutions. The Chinese government is actively supporting this growth, with initiatives including an estimated US$150 billion investment from 2014 to 2030, as noted by the SIA. These substantial government efforts to enhance semiconductor production are expected to significantly benefit the semiconductor packaging market.

Some of the major players covered in this report include ASE , Amkor Technology, Powertech Technology Inc., Fujitsu Semiconductor Limited, ChipMOS Technologies Inc., Intel Corporation, Samsung Electronics Co., Ltd., Unisem (M) Berhad, among others.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

The Semiconductor Packaging Market is segmented and analyzed as follows:

By Material Type

• Organic Substrate
• Bonding Wire
• Ceramic Package
• Others
• Packaging Type
• Advanced Packaging
• Flip Chip
• Embedded Die
• Fan-Out Level Packaging (FO-WLP)
• Fan-In Level Packaging (FI-WLP)

By Packaging Material

• Organic Substrate
• Leadframe
• Ceramic Packaging
• Bonding-Wire
• Others

By End-User

• Consumer Electronics
• Aerospace and Defence
• Medical Devices
• Communication and Telecom
• Others

By Geography

• North America
• United States
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• United Kingdom
• Germany
• France
• Italy
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• India
• Japan
• South Korea
• Thailand
• Indonesia
• Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study
• 1.4. Market Segmentation
• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base and Forecast Years Timeline
• 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

• 2.1. Research Design
• 2.2. Research Process

3. EXECUTIVE SUMMARY

• 3.1. Key Findings
• 3.2. Analyst View

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Forces Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. The Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR PACKAGING MARKET BY MATERIAL TYPE

• 5.1. Introduction
• 5.2. Organic Substrate
• 5.3. Bonding Wire
• 5.4. Ceramic Package
• 5.5. Others

6. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING TYPE

• 6.1. Introduction
• 6.2. Advanced Packaging
• 6.3. Flip Chip
• 6.4. Embedded Die
• 6.5. Fan-Out Level Packaging (FO-WLP)
• 6.6. Fan-In Level Packaging (FI-WLP)

7. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING MATERIAL

• 7.1. Introduction
• 7.2. Organic Substrate
• 7.3. Leadframe
• 7.4. Ceramic Packaging
• 7.5. Bonding-Wire
• 7.6. Others

8. SEMICONDUCTOR PACKAGING MARKET BY END-USER

• 8.1. Introduction
• 8.2. Consumer Electronics
• 8.3. Aerospace and Defence
• 8.4. Medical Devices
• 8.5. Communication and Telecom
• 8.6. Others

9. SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY

• 9.1. Global Overview
• 9.2. North America
  • 9.2.1. United States
  • 9.2.2. Canada
  • 9.2.3. Mexico
• 9.3. South America
  • 9.3.1. Brazil
  • 9.3.2. Argentina
  • 9.3.3. Others
• 9.4. Europe
  • 9.4.1. United Kingdom
  • 9.4.2. Germany
  • 9.4.3. France
  • 9.4.4. Italy
  • 9.4.5. Others
• 9.5. Middle East and Africa
  • 9.5.1. Saudi Arabia
  • 9.5.2. UAE
  • 9.5.3. Others
• 9.6. Asia-Pacific
  • 9.6.1. China
  • 9.6.2. India
  • 9.6.3. Japan
  • 9.6.4. South Korea
  • 9.6.5. Thailand
  • 9.6.6. Indonesia
  • 9.6.7. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 10.1. Major Players and Strategy Analysis
• 10.2. Market Share Analysis
• 10.3. Mergers, Acquisitions, Agreements, and Collaborations
• 10.4. Competitive Dashboard

11. COMPANY PROFILES

• 11.1. ASE
• 11.2. Amkor Technology
• 11.3. Powertech Technology Inc.
• 11.4. Fujitsu Semiconductor Limited
• 11.5. ChipMOS Technologies Inc.
• 11.6. Intel Corporation
• 11.7. Samsung Electronics Co., Ltd.
• 11.8. Unisem (M) Berhad
• 11.9. ISI - Interconnect Systems
• 11.10. Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)