세계의 반도체 제조 장비 시장 - 예측(2025-2030년)

Semiconductor Manufacturing Equipment Market, with a 10.88% CAGR, is anticipated to reach USD 210.401 billion in 2030 from USD 125.540 billion in 2025.

The semiconductor manufacturing equipment industry is at a pivotal juncture, characterized by intense demand and significant operational constraints. Escalating requirements for advanced semiconductors, driven by the proliferation of Artificial Intelligence (AI), 5G infrastructure, and high-performance computing (HPC), are triggering a global wave of capital expenditure in new fabrication facilities (fabs). This surge places unprecedented demands on suppliers of lithography, etch, deposition, metrology, and test tools, who are simultaneously challenged by supply chain fragility, escalating technological complexity, and increasing geopolitical friction.

Primary Market Growth Drivers

The market is propelled by several interconnected technological shifts. The rising integration of AI is propelling demand for advanced deposition and etching equipment, as chipmakers scale to increasingly minute nodes to handle massive data throughput in neural networks. This necessitates tools capable of depositing ultra-thin films with atomic-level precision. Concurrently, the global expansion of 5G infrastructure is catalyzing acquisitions of lithography tools, as base stations require chips with superior frequency response, driving the need for finer patterning and higher wafer throughput. A third major driver is automotive electrification, which is accelerating the uptake of metrology and testing equipment. Electric vehicles require robust, defect-free semiconductors and power modules, boosting demand for sophisticated back-end inspection and validation tools to ensure reliability and performance.

Critical Challenges and Supply Chain Constraints

The industry's growth is tempered by a complex set of challenges. Geopolitical tensions are manifesting as export controls on advanced tools to certain regions, which constrains market access for major suppliers and can elongate lead times for non-restricted fabs reliant on the global supply chain. Furthermore, a significant talent shortage in precision engineering is impeding the scaling of cleanroom automation, leading to potential delays in equipment validation and deployment. Sustainability mandates are also applying pressure, particularly concerning the intensive consumption of resources like ultrapure water and the management of specialized chemical waste, driving up operational costs and compliance requirements.

The equipment supply chain itself is under considerable stress. It relies on specialized raw materials, including certain alloys and photoresist polymers, which are vulnerable to price volatility and sourcing bottlenecks due to concentrated production and geopolitical factors. These dependencies create vulnerabilities, where a disruption at a single supplier can idle significant global fab capacity. Logistical strains, from port congestion to international trade tariffs, further complicate the timely delivery of these highly complex and sensitive tools.

Government Regulatory Landscape

Government policies worldwide are actively shaping the market. Initiatives like the U.S. CHIPS and Science Act and the European Chips Act are injecting substantial funding to bolster domestic semiconductor manufacturing capacity, directly driving demand for advanced equipment within these regions. Conversely, such policies often include provisions that prioritize local suppliers or impose export controls, creating a fragmented global market. In response, other nations are implementing their own subsidy programs and import restrictions to foster indigenous equipment industries, which simultaneously erodes the market share of established global suppliers while creating new, protected domestic markets.

Market Segment Analysis

Within the equipment landscape, the lithography segment continues to dominate front-end procurement. The industry's transition to Extreme Ultraviolet (EUV) lithography is critical for patterning at the most advanced nodes, driven by the demands of AI processors and other high-performance logic chips. This segment commands a significant portion of total equipment spend and is central to enabling continued node scaling.

Simultaneously, the testing equipment segment is emerging as a critical growth area, particularly in the back-end. The rise of heterogeneous integration and 3D packaging, essential for advanced AI and HPC modules, places a premium on ensuring yield and reliability. This is driving substantial investment in sophisticated testing and metrology tools to validate complex multi-die assemblies and power devices for applications like electric vehicles.

Competitive Environment

The competitive landscape is dominated by a group of specialized global players, each with distinct strengths. ASML Holdings N.V. maintains a unique, dominant position in the critical EUV lithography market. Companies like Applied Materials, Inc. and LAM Research Corporation offer broad portfolios across deposition, etch, and other critical process tools. Other significant players, including Tokyo Electron and Teradyne, Inc., hold strong positions in specific domains such as wafer fabrication systems and back-end test equipment, respectively. The strategic imperative for these firms is to navigate the dual challenges of capturing growth from relentless technological advancement while mitigating risks associated with supply chain disruptions and an increasingly complex geopolitical regulatory environment.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Semiconductor Manufacturing Equipment Market Segmentation:

• BY FRONT END EQUIPMENT:
• Water Surface Conditioning Equipment
• Cleaning Process
• Others
• BY BACK END EQUIPMENT
• Assembling and Packaging
• Bonding Equipment
• Dicing Equipment
• Testing Equipment
• Metrology Equipment
• BY DIMENSION
• 2D
• 3D
• BY FAB FACILITY
• Automation
• Chemical Control Equipment
• Gas Control Equipment
• Others
• BY GEOGRAPHY
• Americas
• United States
• Others
• Europe, the Middle East, and Africa
• Germany
• United Kingdom
• Netherlands
• Others
• Asia Pacific
• China
• Japan
• South Korea
• India
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY FRONT-END EQUIPMENT

• 5.1. Introduction
• 5.2. Water Surface Conditioning Equipment
• 5.3. Cleaning Process
• 5.4. Others

6. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY BACK-END EQUIPMENT

• 6.1. Introduction
• 6.2. Assembling and Packaging
• 6.3. Bonding Equipment
• 6.4. Dicing Equipment
• 6.5. Testing Equipment
• 6.6. Metrology Equipment

7. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY DIMENSION

• 7.1. Introduction
• 7.2. 2D
• 7.3. 3D

8. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY FAB FACILITY

• 8.1. Introduction
• 8.2. Automation
• 8.3. Chemical Control Equipment
• 8.4. Gas Control Equipment
• 8.5. Others

9. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY GEOGRAPHY

• 9.1. Introduction
• 9.2. Americas
  • 9.2.1. United States
  • 9.2.2. Others
• 9.3. Europe, the Middle East, and Africa
  • 9.3.1. Germany
  • 9.3.2. United Kingdom
  • 9.3.3. Netherlands
  • 9.3.4. Others
• 9.4. Asia Pacific
  • 9.4.1. China
  • 9.4.2. Japan
  • 9.4.3. South Korea
  • 9.4.4. India
  • 9.4.5. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 10.1. Major Players and Strategy Analysis
• 10.2. Market Share Analysis
• 10.3. Mergers, Acquisitions, Agreements, and Collaborations
• 10.4. Competitive Dashboard

11. COMPANY PROFILES

• 11.1. Tokyo Seimitsu Co., Ltd.
• 11.2. Kokusai Electric Corporation
• 11.3. Terra Universal
• 11.4. Modutek Corporation
• 11.5. Hitachi High-Technologies Corporation
• 11.6. LAM Research Corporation
• 11.7. Applied Materials, Inc.
• 11.8. ASML Holdings N.V
• 11.9. Tokyo Electron Limited
• 11.10. Teradyne, Inc.

12. APPENDIX

• 12.1. Currency
• 12.2. Assumptions
• 12.3. Base and Forecast Years Timeline
• 12.4. Key Benefits for the Stakeholders
• 12.5. Research Methodology
• 12.6. Abbreviations