파워 모듈 패키징 시장 - 예측(2025-2030년)

The Power Module Packaging Market is projected to expand at a 10.05% CAGR, achieving USD 4.755 billion by 2030 from USD 2.946 billion in 2025.

Power Module Packaging Market Analysis

Power module packaging represents the critical procedure of enclosing power electronic components including transistors, diodes, capacitors, and inductors within protective casings or packages. The packaging provides essential functions including mechanical support, electrical insulation, thermal management, and environmental protection for enclosed electronic components. Power module packaging significantly influences the efficiency, reliability, and durability of power electronic systems, making it a fundamental consideration in system design and performance optimization.

Market growth is being driven by the implementation of effective distributed cooling techniques, waste reduction initiatives, and resulting increases in power density capabilities. These technological advancements enable more compact and efficient power electronic systems while maintaining or improving performance characteristics and reliability standards essential for demanding applications across industrial, automotive, and consumer electronics sectors.

Primary Market Drivers

Electronic Device Demand

The power module packaging market is expected to be propelled by expanding demand for power modules across industrial and consumer electronics sectors. Electronic devices requiring high power and voltage handling capabilities necessitate proper power module packaging to safeguard devices from environmental factors including humidity, temperature variations, and physical damage. Power modules are deployed in systems including lighting systems, power supplies, converters, and motor control applications, creating diverse demand across multiple application categories.

According to the Consumer Electronics and Appliances Manufacturers Association (CEAMA), the consumer electronics and home appliances industry in India is expected to grow at a 10% rate over the 2020-2025 period, demonstrating robust regional market expansion. Annual growth in electronics sales has increased demand for power module packaging solutions supporting this production volume expansion.

Renewable Energy Applications

Power module utilization in renewable energy sources is anticipated to grow substantially, as these components are employed in wind turbine inverters, photovoltaic inverters, and micro-inverters. The U.S. Energy Information Administration (EIA) predicted utility-scale solar capacity in the United States would increase by 2022, indicating strong market momentum. The US Solar Energy Industries Association (SEIA) noted that government legislation including net metering and solar promotion policies has been implemented to advance solar panel technology for power generation applications.

Photovoltaic power modules enable control systems to receive power directly from solar panels while guaranteeing steady operational performance. The increasing adoption of solar energy is driving demand for power module packaging solutions supporting renewable energy infrastructure deployment. This trend aligns with global decarbonization efforts and renewable energy capacity expansion initiatives across developed and developing markets.

Automotive Sector Growth

The automotive industry has experienced rapid growth driven by efforts promoting electric vehicle (EV) adoption, propelling the automotive power module packaging market forward. According to the International Energy Agency (IEA), approximately 1.8 million electric vehicles were registered in the United States in 2020, representing more than triple the 2016 registration volume. This substantial growth trajectory demonstrates accelerating EV market penetration and corresponding demand for power electronics supporting electric propulsion systems.

IEA data indicated Europe experienced the largest increase in EV sales from 2016 to 2020, achieving a compound annual growth rate of 60%, compared to gains of 36% in China and 17% in the United States. These regional growth patterns demonstrate global momentum toward vehicle electrification creating sustained demand for power module packaging solutions. Electric vehicles require sophisticated power electronics for battery management, motor control, and charging systems, all requiring advanced power module packaging to ensure reliable operation under demanding automotive environmental conditions.

Regional Market Dynamics

During the forecast period, the Asia Pacific region is expected to maintain significant market share dominance. Asia Pacific encompasses the fastest-growing economies worldwide and has made substantial investments in power module packaging technology advancement. Key participants in the Asia Pacific power module packaging market including China, Japan, South Korea, and Taiwan are focusing on improving electric vehicle infrastructure, which is expected to propel market growth further.

In 2022 from January to November, the China Electric Vehicle Charging Infrastructure Promotion Alliance (EVCIPA) announced that 2.33 million charging points were added, representing double the previous year's installation volume. This infrastructure expansion will create parallel increases in demand for power module packaging in EV charging applications, supporting the region's electric mobility transition.

The Taiwanese government presented a strategic plan for incorporating 20% renewable energy in the nation's energy mix by 2025, which will increase demand for power module packaging in solar and wind energy applications. This policy commitment demonstrates governmental support for renewable energy development creating favorable conditions for power module packaging market expansion.

These factors collectively contribute to power module packaging market growth throughout the Asia Pacific region, positioning it as the primary driver of global market expansion throughout the forecast period. The combination of manufacturing capabilities, technology development initiatives, and supportive governmental policies establishes Asia Pacific as the critical hub for power module packaging innovation and production.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation:

• POWER MODULE PACKAGING MARKET BY TYPE
• GaN Module
• SiC Module
• IGBT Module
• FET Module
• Thyristor
• POWER MODULE PACKAGING MARKET BY APPLICATION
• Automotive
• Electronics
• Medical
• Others
• POWER MODULE PACKAGING MARKET BY GEOGRAPHY
• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• United Kingdom
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• India
• Japan
• South Korea
• Indonesia
• Thailand
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. POWER MODULE PACKAGING MARKET BY TYPE

• 5.1. Introduction
• 5.2. GaN Module
• 5.3. SiC Module
• 5.4. IGBT Module
• 5.5. FET Module
• 5.6. Thyristor

6. POWER MODULE PACKAGING MARKET BY APPLICATION

• 6.1. Introduction
• 6.2. Automotive
• 6.3. Electronics
• 6.4. Medical
• 6.5. Others

7. POWER MODULE PACKAGING MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. USA
  • 7.2.2. Canada
  • 7.2.3. Mexico
• 7.3. South America
  • 7.3.1. Brazil
  • 7.3.2. Argentina
  • 7.3.3. Others
• 7.4. Europe
  • 7.4.1. Germany
  • 7.4.2. France
  • 7.4.3. United Kingdom
  • 7.4.4. Spain
  • 7.4.5. Others
• 7.5. Middle East and Africa
  • 7.5.1. Saudi Arabia
  • 7.5.2. UAE
  • 7.5.3. Others
• 7.6. Asia Pacific
  • 7.6.1. China
  • 7.6.2. India
  • 7.6.3. Japan
  • 7.6.4. South Korea
  • 7.6.5. Indonesia
  • 7.6.6. Thailand
  • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Market Share Analysis
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Competitive Dashboard

9. COMPANY PROFILES

• 9.1. ABB
• 9.2. DyDac Controls
• 9.3. Fuji Electric Co Ltd
• 9.4. Infineon Technologies AG
• 9.5. IXYS Corporation
• 9.6. Mitsubishi Electric Corporation
• 9.7. Semikron
• 9.8. Texas Instruments Inc

10. APPENDIX

• 10.1. Currency
• 10.2. Assumptions
• 10.3. Base and Forecast Years Timeline
• 10.4. Key Benefits for the Stakeholders
• 10.5. Research Methodology
• 10.6. Abbreviations