임베디드 다이 패키징 시장 : 예측(2025-2030년)

The Embedded Die Packaging Market, with a 20.09% CAGR, is expected to grow to USD 1,690.993 million in 2030 from USD 677.131 million in 2025.

The embedded die packaging market is being propelled by the relentless pursuit of technological advancement in the electronics industry. This packaging technique addresses several critical requirements for modern electronics, including the demand for a reduced chip footprint, enhanced electrical performance, and superior interconnect density. A key advantage of this technology is its contribution to miniaturization; by allowing components to be stacked within multiple layers of the substrate itself, it enables more flexible and complex board layouts. This approach offers significant benefits to manufacturers and designers, including improved package robustness and reliability, as well as the capacity for rapid turnaround times for customized designs.

The expansion of the global embedded die packaging market is primarily driven by two interconnected mega-trends: the rising consumption of sophisticated consumer electronics and the global rollout of 5G network technologies. Modern consumer devices, such as smartphones, laptops, tablets, and wearables, integrate numerous embedded processors to deliver a superior user interface and enhanced overall performance. These processors are critical components within power management circuits (like DC-DC converters), camera modules, and various other subsystems. Concurrently, the integration of 5G connectivity is creating demand for embedded die packaging in applications requiring high-speed data processing and low latency, such as the advanced driver-assistance systems (ADAS) and smart video surveillance in automobiles. The urgent industry-wide need for further circuit miniaturization in microelectronic devices makes embedded die packaging an increasingly attractive solution.

The technology's intrinsic benefits over alternative integrated circuit (IC) packaging methods, such as its ability to occupy significantly less space than System-in-Package (SiP) technology, are central to its value proposition and market growth. However, the market's trajectory is not without constraints. The high initial costs associated with establishing embedded die packaging capabilities present a significant barrier to adoption and may hinder the pace of market expansion. Despite this challenge, a substantial opportunity for future growth lies in the proliferation of Internet of Things (IoT) solutions. The unique demands of IoT devices for compact, reliable, and high-performance electronics are expected to create lucrative prospects for embedded die packaging technology over the forecast period.

Primary Market Drivers

A dominant driver for the embedded die packaging market is the increased global consumption of consumer electronics and the deployment of 5G infrastructure. Consumer electronics represent one of the most ubiquitous product categories worldwide. The household sector's adoption of an increasingly diverse array of electronic devices has led to substantial growth for the industry. In this highly competitive landscape, manufacturers are making significant investments to integrate advanced digital technologies into their products, with a strong emphasis on delivering a high-quality user experience. This focus on performance and innovation, supported by rising research and development expenditures from leading market players, is resulting in a continuous stream of new products with cutting-edge features, all of which rely on advanced packaging solutions like embedded die technology.

Another significant driver is the growing demand for die integration within flexible boards. The field of stretchable electronics is evolving, taking on various forms and finding new applications. This technology often utilizes standard printed circuit boards, with a notable emphasis on flexible substrates. Advanced manufacturing processes, such as liquid injection molding of elastomer-embedded stretchable electronic circuits, are being employed to create durable and reliable products. The application potential for these flexible, embedded solutions is vast. For example, in the military and defense sector, there is development of lightweight, flexible impact sensors that can be embedded directly into uniforms and body armor. Such innovations could provide critical data on injuries sustained in combat, demonstrating the high-value applications that are pushing the boundaries of embedded die packaging into flexible formats.

Geographical Market Outlook

The Asia Pacific region is projected to be the prominent market shareholder in the global embedded die packaging market and is anticipated to maintain this leadership position throughout the forecast period. This dominance is attributed to the strong presence of major electronics manufacturers and semiconductor industry players within the region. Asia Pacific is also expected to register the fastest growth rate. A key contributor to this growth is the significant investment from both leading corporations and government entities in the development of next-generation semiconductor solutions. These initiatives specifically focus on leveraging embedded die packaging technology to achieve enhancements in electrical and thermal performance, mechanical stability, and overall reliability. This concerted push for technological advancement in the semiconductor sector is anticipated to be the primary fuel for the expansion of the embedded die packaging market within the Asia Pacific region.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation:

• EMBEDDED DIE PACKAGING MARKET BY PLATFORM
• IC package substrate
• Rigid Board
• Flexible Board
• EMBEDDED DIE PACKAGING MARKET BY APPLICATION
• Medical
• Consumer Electronics
• Military
• Industrial
• EMBEDDED DIE PACKAGING MARKET BY GEOGRAPHY
• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• United Kingdom
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• India
• Japan
• South Korea
• Indonesia
• Thailand
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. EMBEDDED DIE PACKAGING MARKET BY PLATFORM

• 5.1. Introduction
• 5.2. IC package substrate
• 5.3. Rigid Board
• 5.4. Flexible Board

6. EMBEDDED DIE PACKAGING MARKET BY APPLICATION

• 6.1. Introduction
• 6.2. Medical
• 6.3. Consumer Electronics
• 6.4. Military
• 6.5. Industrial

7. EMBEDDED DIE PACKAGING MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. USA
  • 7.2.2. Canada
  • 7.2.3. Mexico
• 7.3. South America
  • 7.3.1. Brazil
  • 7.3.2. Argentina
  • 7.3.3. Others
• 7.4. Europe
  • 7.4.1. Germany
  • 7.4.2. France
  • 7.4.3. United Kingdom
  • 7.4.4. Spain
  • 7.4.5. Others
• 7.5. Middle East and Africa
  • 7.5.1. Saudi Arabia
  • 7.5.2. UAE
  • 7.5.3. Others
• 7.6. Asia Pacific
  • 7.6.1. China
  • 7.6.2. India
  • 7.6.3. Japan
  • 7.6.4. South Korea
  • 7.6.5. Indonesia
  • 7.6.6. Thailand
  • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Market Share Analysis
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Competitive Dashboard

9. COMPANY PROFILES

• 9.1. ASE Group
• 9.2. Microsemi Corporation
• 9.3. Fujikura Ltd
• 9.4. Infineon Technologies AG
• 9.5. AT&S Company
• 9.6. Schweizer Electronic AG
• 9.7. Intel Corporation
• 9.8. TSMC
• 9.9. Shinko Electric Industries Co Ltd
• 9.10. Amkor Technology

10. APPENDIX

• 10.1. Currency
• 10.2. Assumptions
• 10.3. Base and Forecast Years Timeline
• 10.4. Key Benefits for the Stakeholders
• 10.5. Research Methodology
• 10.6. Abbreviations