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세계의 SOI(Silicon On Insulator) 시장 : 스마트 컷 SOI, 본딩 SOI, 레이어 트랜스퍼 SOI, RF-SOI, 파워 SOI, FD-SOI, RF FEM, MEMS 디바이스, 광통신, 이미지 센싱 디바이스, 자동차, 군사/국방 - 예측(-2029년)

Silicon on Insulator Market by Smart Cut SOI, Bonding SOI, Layer Transfer SOI, RF-SOI, Power -SOI, FD-SOI, RF FEM, MEMS Devices, Optical Communication, Image Sensing Devices, Automotive and Military & Defense - Global Forecast to 2029
발행일: | 리서치사: MarketsandMarkets | 페이지 정보: 영문 218 Pages | 배송안내 : 즉시배송

    
    
    




※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계 SOI(Silicon On Insulator) 시장 규모는 2024년 12억 9,000만 달러로 2029년까지 25억 5,000만 달러에 달할 것으로 예상되며, 예측 기간 동안 연평균 14.7% 성장할 것으로 예상됩니다.

SOI 기술은 더 작은 트랜지스터 제조에 적합하며, 소자의 고밀도화 및 기능 향상을 가능하게 하고, 얇은 웨이퍼의 제조 및 설립에서 실리콘의 낭비를 방지하여 SOI(Silicon On Insulator) 시장의 성장을 촉진하고 있습니다.

조사 범위
조사 대상 연도 2020-2029년
기준 연도 2023년
예측 기간 2024-2029년
단위 10억 달러
부문 웨이퍼 크기별, 웨이퍼 유형별, 기술별, 제품별, 용도별, 지역별
대상 지역 북미, 유럽, 아시아태평양 및 기타 지역

"본딩 부문은 예측 기간 동안 상당한 CAGR로 성장할 것으로 예상됩니다."

이 부문의 성장은 SOI 웨이퍼 제조를 저비용으로 개선한 본딩 기술의 발전으로 인한 것입니다. 이로 인해 SOI 기술 도입 비용이 절감되어 소비자 가전 및 자동차 산업과 같은 다른 분야로의 적용이 확대되고 있습니다. 또한, 웨이퍼 접합 기술의 향상으로 통신, 자동차, 소비자 가전 산업에서 수요가 높은 애플리케이션 개발에 필요한 더 큰 크기의 SOI 웨이퍼를 생산할 수 있게 되었습니다. 웨이퍼의 대형화는 한 장의 실리콘에서 더 많은 칩을 생산할 수 있어 높은 생산성을 실현할 수 있습니다.

"RF-SOI가 2023년에 가장 높은 점유율을 차지할 가능성이 높습니다."

RF-SOI 웨이퍼의 수요 확대는 무선 통신, 자동차 산업, 항공우주 및 방위, 의료기기, 소비자 전자제품의 발전으로 인해 발생합니다. 모든 스마트폰은 RF-SOI 웨이퍼를 사용합니다. 레이더, LiDAR, 무선 연결과 같은 ADAS 기능의 자동차 채택이 증가함에 따라 고성능 RF 부품이 필요하며, RF-SOI 웨이퍼는 이러한 애플리케이션에 필요한 특성을 제공합니다. 또한, 디지털 칩 및 RF 칩과 같은 기타 부품에 대한 수요 증가도 RF-SOI 웨이퍼 시장을 견인하고 있습니다. RF-SOI 웨이퍼는 저전력 소비, 높은 집적도, 우수한 RF 성능 등 고유한 특성을 가지고 있어 다양한 응용 분야에서 활용 가치가 높은 기술입니다.

"유럽이 2023년에 가장 높은 점유율을 차지할 가능성이 높습니다."

이러한 시장 성장은 SOI 기술을 제품에 적용하고 있는 유럽 자동차 시장의 성장에 기인한 것으로 보입니다. 주요 자동차 제조 산업에는 Audi, Mercedes-Benz, BMW Group, Daimler, Fiat Chrysler Automobiles, Opel Group, PSA Group, Renault organization, Volkswagen Group 등이 포함됩니다. 또한 2024년 3월, STMicroelectronics는 STM32 마이크로컨트롤러를 18nm FD-SOI(Fully Depleted Silicon On Insulator) 제조 공정으로 변경했습니다.

세계 SOI(Silicon On Insulator) 시장에 대해 조사 분석했으며, 주요 촉진요인과 억제요인, 경쟁 상황, 향후 동향 등의 정보를 전해드립니다.

목차

제1장 소개

제2장 조사 방법

제3장 주요 요약

제4장 주요 인사이트

  • SOI(Silicon On Insulator) 시장 기업에서 매력적인 기회
  • SOI(Silicon On Insulator) 시장 : 용도별
  • SOI(Silicon On Insulator) 시장 : 웨이퍼 유형별
  • SOI(Silicon On Insulator) 시장 : 기술별
  • SOI(Silicon On Insulator) 시장 : 제품별
  • SOI(Silicon On Insulator) 시장 : 웨이퍼 사이즈별
  • 아시아태평양의 SOI(Silicon On Insulator) 시장 : 용도별, 국가별

제5장 시장 개요

  • 소개
  • 시장 역학
    • 성장 촉진요인
    • 성장 억제요인
    • 기회
    • 과제
  • 밸류체인 분석
  • 생태계 분석
  • 투자와 자금 조달 시나리오
  • 고객 비즈니스에 영향을 미치는 동향/혼란
  • 기술 분석
    • 주요 기술
    • 보완 기술
    • 인접 기술
  • 가격 분석
    • 주요 기업 평균판매가격 동향 : 웨이퍼 사이즈별
    • 평균판매가격 동향 : 웨이퍼 사이즈별
    • SOI(Silicon On Insulator) 평균판매가격 동향 : 지역별
  • Porter's Five Forces 분석
  • 주요 이해관계자와 구입 기준
  • SOI(Silicon On Insulator) 시장에 대한 AI/생성형 AI의 영향
  • 사례 연구
  • 무역 분석
    • 수입 시나리오(HS 코드 : 854690)
    • 수출 시나리오(HS 코드 : 854690)
  • 특허 분석
  • 규제 상황
    • 표준
    • 정부 규제
  • 주요 회의와 이벤트(2024-2025년)

제6장 SOI(Silicon On Insulator) 시장 : 웨이퍼 사이즈별

  • 소개
  • 200mm 미만
  • 300mm

제7장 SOI(Silicon On Insulator) 시장 : 웨이퍼 유형별

  • 소개
  • RF-SOI
  • 파워 SOI
  • FD-SOI
  • PD-SOI
  • 기타 웨이퍼 유형
    • 포토닉스 SOI
    • 이미저 SOI

제8장 SOI(Silicon On Insulator) 시장 : 기술별

  • 소개
  • 스마트 컷 SOI
  • 본딩 SOI
  • 레이어 트랜스퍼 SOI

제9장 SOI(Silicon On Insulator) 시장 : 제품별

  • 소개
  • RF FEM 제품
  • MEMS 디바이스
  • 파워 제품
  • 광통신 디바이스
  • 이미지 센싱 제품

제10장 SOI(Silicon On Insulator) 시장 : 용도별

  • 소개
  • 가전제품
  • 자동차
  • 데이터 통신·통신
  • 산업
  • 군·방위, 항공우주

제11장 SOI(Silicon On Insulator) 시장 : 두께별

  • 박막 SOI 웨이퍼(두께 1μm 이하)
  • 후막 SOI 웨이퍼(두께 1μm-3μm)

제12장 SOI(Silicon On Insulator) 시장 : 지역별

  • 소개
  • 북미
    • 거시경제 전망
    • 미국
    • 캐나다
    • 멕시코
  • 유럽
    • 거시경제 전망
    • 프랑스
    • 영국
    • 독일
    • 이탈리아
    • 기타 유럽
  • 아시아태평양
    • 거시경제 전망
    • 중국
    • 일본
    • 대만
    • 기타 아시아태평양
  • 기타 지역
    • 거시경제 전망
    • 중동 및 아프리카
    • 남미

제13장 경쟁 상황

  • 개요
  • 주요 기업 전략/유력 기업(2020-2024년)
  • 시장 점유율 분석(2023년)
  • 매출 분석(2019-2023년)
  • 기업 평가와 재무 지표
  • 기업 평가 매트릭스 : 주요 기업(2023년)
  • 기업 평가 매트릭스 : 스타트업/중소기업(2023년)
  • 브랜드/제품의 비교
  • 경쟁 시나리오

제14장 기업 개요

  • 주요 기업
    • SOITEC
    • SHIN-ETSU CHEMICAL CO., LTD.
    • GLOBALWAFERS
    • SUMCO CORPORATION
    • SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
    • GLOBALFOUNDRIES
    • STMICROELECTRONICS
    • TOWER SEMICONDUCTOR
    • SILICON VALLEY MICROELECTRONICS, INC.
    • WAFERPRO
  • 기타 기업
    • NANOGRAFI NANO TECHNOLOGY
    • OKMETIC
    • PRECISION MICRO-OPTICS INC.
    • UNITED MICROELECTRONICS CORPORATION
    • ULTRASIL LLC
    • PLUTOSEMI CO., LTD
    • NXP SEMICONDUCTORS
    • MURATA MANUFACTURING CO., LTD.
    • ICEMOS TECHNOLOGY LTD.
    • PROLYX MICROELECTRONICS PRIVATE LIMITED
    • NOVA ELECTRONIC MATERIALS, LLC
    • VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    • ROGUE VALLEY MICRODEVICES
    • SOKA TECHNOLOGY
    • ADVANCED MICRO FOUNDRY PTE LTD

제15장 부록

ksm 24.10.11

The global silicon on insulator market was valued at USD 1.29 billion in 2024 and is projected to reach USD 2.55 billion by 2029; it is expected to register a CAGR of 14.7% during the forecast period. SOI technology is well-suited for the fabrication of smaller transistors, enabling higher device densities and increased functionality and silicon wastage prevention in thin-wafer manufacturing and establishment is driving the growth of the silicon on insulator market, while floating body and self-heating effects in SOI-based devices are restraining it.

Scope of the Report
Years Considered for the Study2020-2029
Base Year2023
Forecast Period2024-2029
Units ConsideredValue (USD Billion)
SegmentsBy wafer size, wafer type, technology, product, application, and region
Regions coveredNorth America, Europe, APAC, RoW

"The bonding segment is expected to grow at a significant CAGR during the forecast period."

The bonding segment is projected to grow at a significant rate while attaining a CAGR during the forecast. The growth of the segment is attributed to the advancements in bonding technologies that improved the manufacturing of SOI wafers at lower costs. This results in reduced cost of implementing SOI technology, hence expanding its further applicability in other fields such as consumer electronics and automotive industries, among others. Moreover, increased material bonding technology allows the manufacturing of larger sized SOI wafers, a requirement for the developing high-demanding applications in telecommunication, automobile, and consumer electronics industries. Bigger wafers enable many chips to be produced from a single piece of silicon, resulting in high productivity.

"RF-SOI is likely to capture the highest share during the 2023"

The market in RF-SOI wafer type is expected to capture the highest share in 2023. The growing demand for RF-SOI wafers is driven by advancements in wireless communication, the automotive industry, aerospace and defense, medical devices, and consumer electronic. All smartphones use RF-SOI wafers. The increasing adoption of ADAS features in vehicles, such as radar, lidar, and wireless connectivity, necessitates high-performance RF components. RF-SOI wafers provide the necessary characteristics for these applications. Also, the increasing demand for other components, such as digital and RF chips, also drives the market for RF-SOI wafers. Their unique properties, such as low power consumption, high integration density, and excellent RF performance, make them a valuable technology for a wide range of applications.

"The Europe is likely to capture the highest share during the 2023."

The market in Europe is expected to capture the highest share in 2023. The market growth can be attributed to the European automotive market that has been using SOI technology in its products. The existence of major auto manufacturing industries includes Audi, Mercedes Benz, BMW Group, Daimler, Fiat Chrysler Automobiles, Opel Group, PSA Group, Renault organization, and Volkswagen Group, among others. Moreover, in March 2024, the manufacturing unit STMicroelectronics changed the STM32 microcontrollers to an 18nm Fully Depleted Silicon On Insulator (FD-SOI) manufacturing process with integrated Phase Change Memory.

Breakdown of primaries

The study contains insights from various industry experts, ranging from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:

  • By Company Type - Tier 1 - 35%, Tier 2 - 45%, Tier 3 - 20%
  • By Designation- C-level Executives - 40%, Directors - 30%, Others - 30%
  • By Region-North America - 40%, Europe - 20%, Asia Pacific - 30%, RoW - 10%

The silicon on insulator market is dominated by a few globally established players such as SOITEC (France), Shin-Etsu Chemical Co., Ltd. (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan), Shanghai Simgui Technology Co., Ltd. (China), GlobalFoundries (US), STMicroelectronics (Switzerland), Tower Semiconductors (Israel), Silicon Valley Microelectronics, Inc (US). The study includes an in-depth competitive analysis of these key players in the silicon on insulator market, with their company profiles, recent developments, and key market strategies.

Research Coverage:

The report segments the silicon on insulator market and forecasts its size by wafer size, wafer type, technology, product, application, and region. The report also discusses the drivers, restraints, opportunities, and challenges of the market. It gives a detailed view of the market across four main regions-North America, Europe, Asia Pacific, and RoW. Supply chain analysis has been included in the report, along with the key players and their competitive analysis in the silicon on insulator ecosystem.

Key Benefits to Buy the Report:

  • Analysis of key drivers (Increased investments in the SOI ecosystem, growth in the use of SOI wafers in consumer electronics, reduced overall cost of semiconductor devices by minimizing silicon wastage while manufacturing thin SOI wafers). Restraint (Floating body and self-heating effects in SOI-based devices, Limited availability of existing intellectual property ecosystems to fabless companies), Opportunity (Growing integrated chip industry and expanding SOI ecosystem in the Asia Pacific, Increasing use of SOI technology in IoT devices and applications), Challenges (Volatility and susceptibility of SOI-based wafers to damage caused by pressure or stress)
  • Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and new product launches in the silicon on insulator market.
  • Market Development: Comprehensive information about lucrative markets - the report analyses the silicon on insulator market across varied regions.
  • Market Diversification: Exhaustive information about new products and services, untapped geographies, recent developments, and investments in the silicon on insulator market.
  • Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players in the silicon on insulator market, such as SOITEC (France), Shin-Etsu Chemical Co., Ltd. (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan), and Shanghai Simgui Technology Co., Ltd. (China).

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
  • 1.3 STUDY SCOPE
    • 1.3.1 MARKET SEGMENTATION
    • 1.3.2 INCLUSIONS & EXCLUSIONS
      • 1.3.2.1 Inclusions & exclusions at company level
      • 1.3.2.2 Inclusions & exclusions at wafer size level
      • 1.3.2.3 Inclusions & exclusions at product level
      • 1.3.2.4 Inclusions & exclusions at technology level
      • 1.3.2.5 Inclusions & exclusions at application level
      • 1.3.2.6 Inclusions & exclusions at wafer type level
      • 1.3.2.7 Inclusions & exclusions at regional level
  • 1.4 YEARS CONSIDERED
  • 1.5 CURRENCY CONSIDERED
  • 1.6 UNITS CONSIDERED
  • 1.7 STUDY LIMITATIONS
  • 1.8 STAKEHOLDERS
  • 1.9 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • 2.1.1 SECONDARY DATA
      • 2.1.1.1 Major secondary sources
      • 2.1.1.2 Key data from secondary sources
    • 2.1.2 PRIMARY DATA
      • 2.1.2.1 List of key primary interview participants
      • 2.1.2.2 Breakdown of primaries
      • 2.1.2.3 Key data from primary sources
    • 2.1.3 SECONDARY AND PRIMARY RESEARCH
      • 2.1.3.1 Key industry insights
  • 2.2 MARKET SIZE ESTIMATION
    • 2.2.1 BOTTOM-UP APPROACH
      • 2.2.1.1 Approach to obtain market share using bottom-up analysis (demand side)
    • 2.2.2 TOP-DOWN APPROACH
      • 2.2.2.1 Approach to obtain market share using top-down analysis (supply side)
  • 2.3 FACTOR ANALYSIS
    • 2.3.1 SUPPLY-SIDE ANALYSIS
    • 2.3.2 GROWTH FORECAST
  • 2.4 MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.5 RESEARCH ASSUMPTIONS
  • 2.6 RISK ASSESSMENT

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SILICON-ON-INSULATOR MARKET
  • 4.2 SILICON-ON-INSULATOR MARKET, BY APPLICATION
  • 4.3 SILICON-ON-INSULATOR MARKET, BY WAFER TYPE
  • 4.4 SILICON-ON-INSULATOR MARKET, BY TECHNOLOGY
  • 4.5 SILICON-ON-INSULATOR MARKET, BY PRODUCT
  • 4.6 SILICON-ON-INSULATOR MARKET, BY WAFER SIZE
  • 4.7 ASIA PACIFIC: SILICON-ON-INSULATOR MARKET, BY APPLICATION AND COUNTRY

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • 5.2.1 DRIVERS
      • 5.2.1.1 Increasing demand for high-performance, energy-efficient devices
      • 5.2.1.2 Adoption of 5G and IoT technologies
      • 5.2.1.3 Need for miniaturization
      • 5.2.1.4 Demand for electric vehicles and smart automotive systems
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 Global shortage of semiconductor chips
      • 5.2.2.2 Availability of alternative semiconductor technologies
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Focus on energy efficiency and sustainability
      • 5.2.3.2 Ongoing technological advancements
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Presence of device limitations
      • 5.2.4.2 Complexity in process control and lack of skilled workforce
  • 5.3 VALUE CHAIN ANALYSIS
  • 5.4 ECOSYSTEM ANALYSIS
  • 5.5 INVESTMENT AND FUNDING SCENARIO
  • 5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
  • 5.7 TECHNOLOGY ANALYSIS
    • 5.7.1 KEY TECHNOLOGIES
      • 5.7.1.1 Wafer bonding
    • 5.7.2 COMPLEMENTARY TECHNOLOGIES
      • 5.7.2.1 SiC (Silicon Carbide)
    • 5.7.3 ADJACENT TECHNOLOGIES
      • 5.7.3.1 POI (Piezoelectric-on-Insulator)
  • 5.8 PRICING ANALYSIS
    • 5.8.1 AVERAGE SELLING PRICE TREND OF KEY PLAYERS, BY WAFER SIZE
    • 5.8.2 AVERAGE SELLING PRICE TREND, BY WAFER SIZE
    • 5.8.3 AVERAGE SELLING PRICE TREND FOR SILICON-ON-INSULATORS, BY REGION
  • 5.9 PORTER'S FIVE FORCES ANALYSIS
    • 5.9.1 THREAT OF NEW ENTRANTS
    • 5.9.2 THREAT OF SUBSTITUTES
    • 5.9.3 BARGAINING POWER OF SUPPLIERS
    • 5.9.4 BARGAINING POWER OF BUYERS
    • 5.9.5 INTENSITY OF COMPETITIVE RIVALRY
  • 5.10 KEY STAKEHOLDERS & BUYING CRITERIA
    • 5.10.1 KEY STAKEHOLDERS IN BUYING PROCESS
    • 5.10.2 BUYING CRITERIA
  • 5.11 IMPACT OF AI/GEN AI ON SILICON-ON-INSULATOR MARKET
  • 5.12 CASE STUDIES
    • 5.12.1 UMC UTILIZED SOITEC'S HIGH-PERFORMANCE SOI WAFER TO ADVANCE ITS TECHNOLOGICAL CAPABILITIES
    • 5.12.2 GLOBALFOUNDRIES ENTERED INTO MULTIPLE LONG-TERM SUPPLY AGREEMENTS WITH SOITEC TO MAINTAIN HIGH PRODUCTION LEVELS
    • 5.12.3 CHINA MOBILE INTEGRATED WITH SOITEC'S ADVANCED SOI TECHNOLOGY TO ACCELERATE 5G DEVELOPMENT EFFORTS
    • 5.12.4 VTT CHOSE OKMETIC'S E-SOI WAFERS TO IMPROVE ITS PHOTONICS TECHNOLOGY
  • 5.13 TRADE ANALYSIS
    • 5.13.1 IMPORT SCENARIO (HS CODE: 854690)
    • 5.13.2 EXPORT SCENARIO (HS CODE: 854690)
  • 5.14 PATENT ANALYSIS
  • 5.15 REGULATORY LANDSCAPE
    • 5.15.1 STANDARDS
    • 5.15.2 GOVERNMENT REGULATIONS
  • 5.16 KEY CONFERENCES & EVENTS, 2024-2025

6 SILICON-ON-INSULATOR MARKET, BY WAFER SIZE

  • 6.1 INTRODUCTION
  • 6.2 LESS THAN OR EQUAL TO 200MM
    • 6.2.1 IMPROVED STABILITY AND LOW SENSITIVITY OFFERED BY LESS THAN OR EQUAL TO 200MM SOI TO DRIVE GROWTH
  • 6.3 300MM
    • 6.3.1 RISING DEMAND FOR TECHNOLOGICALLY ADVANCED SOI WAFERS IN END-USE APPLICATIONS TO FUEL SEGMENT GROWTH

7 SILICON-ON-INSULATOR MARKET, BY WAFER TYPE

  • 7.1 INTRODUCTION
  • 7.2 RF-SOI
    • 7.2.1 NEED FOR WIRELESS DATA TRANSMISSION TO INFLUENCE DEMAND FOR RF-SOI
  • 7.3 POWER-SOI
    • 7.3.1 DEMAND FOR ENHANCED POWER MANAGEMENT SYSTEMS TO BOOST GROWTH
  • 7.4 FD-SOI
    • 7.4.1 NEED FOR DEVICES WITH RELIABILITY AND HIGH PERFORMANCE TO SPUR DEMAND FOR FD-SOI
  • 7.5 PD-SOI
    • 7.5.1 PD-SOI WAFERS OFFER REDUCED JUNCTION CAPACITANCE, SIMPLIFIED TAP STRUCTURE, AND REDUCED SUSCEPTIBILITY TO ERRORS
  • 7.6 OTHER WAFER TYPES
    • 7.6.1 PHOTONICS-SOI
    • 7.6.2 IMAGER-SOI

8 SILICON-ON-INSULATOR MARKET, BY TECHNOLOGY

  • 8.1 INTRODUCTION
  • 8.2 SMART CUT SOI
    • 8.2.1 GROWING USE OF SMART CUT TECHNOLOGY AT WAFER MANUFACTURING SITES FOR HIGH-VOLUME PRODUCTION TO BOOST MARKET
  • 8.3 BONDING SOI
    • 8.3.1 NEED FOR BONDING SOI TECHNOLOGY IN HIGH-TEMPERATURE, HIGH-VOLTAGE APPLICATIONS TO DRIVE MARKET
  • 8.4 LAYER TRANSFER SOI
    • 8.4.1 LAYER TRANSFER SOI TECHNOLOGY IS KNOWN FOR ITS HIGH-ACCURACY, THIN-FILM LAYER TRANSFER PROCESS

9 SILICON-ON-INSULATOR MARKET, BY PRODUCT

  • 9.1 INTRODUCTION
  • 9.2 RF FEM PRODUCTS
    • 9.2.1 WIDE USAGE OF RF FEM IN SMARTPHONES TO PROPEL SEGMENT GROWTH
  • 9.3 MEMS DEVICES
    • 9.3.1 INCREASING USE OF SOI WAFER-BASED MEMS IN TELECOMMUNICATION TO DRIVE MARKET
  • 9.4 POWER PRODUCTS
    • 9.4.1 SUSTAINABILITY OF POWER PRODUCTS IN HARSH ENVIRONMENTS TO BOOST THEIR ADOPTION
  • 9.5 OPTICAL COMMUNICATION DEVICES
    • 9.5.1 RISING NUMBER OF DATA CENTERS TO DRIVE MARKET GROWTH
  • 9.6 IMAGE SENSING PRODUCTS
    • 9.6.1 APPLICATION OF SOI TECHNOLOGY IN THIN CIS CHIP DEVELOPMENT AND FACIAL RECOGNITION TO DRIVE GROWTH

10 SILICON-ON-INSULATOR MARKET, BY APPLICATION

  • 10.1 INTRODUCTION
  • 10.2 CONSUMER ELECTRONICS
    • 10.2.1 RISING TECHNOLOGICAL ADVANCEMENTS AND NEED FOR SOI IN MOBILE AND PORTABLE DEVICES TO DRIVE MARKET
  • 10.3 AUTOMOTIVE
    • 10.3.1 GROWING DEMAND FOR COMFORT, CONVENIENCE, AND SECURITY IN AUTOMOBILES TO BOOST MARKET
  • 10.4 DATACOM & TELECOM
    • 10.4.1 GROWING EMPHASIS ON USING SOI IN FIBER-OPTIC CONNECTIONS TO BOOST GROWTH
  • 10.5 INDUSTRIAL
    • 10.5.1 INNOVATION IN EVOLVING INDUSTRIAL SYSTEMS TO BOLSTER GROWTH OF SOI WAFERS
  • 10.6 MILITARY, DEFENSE, AND AEROSPACE
    • 10.6.1 NEED FOR ENHANCED COMMUNICATION IN MILITARY, DEFENSE, AND AEROSPACE SECTORS TO DRIVE ADOPTION OF SOI-BASED WAFERS

11 SILICON-ON-INSULATOR MARKET, BY THICKNESS

  • 11.1 THIN-FILM SOI WAFERS (THICKNESS UP TO 1μM)
  • 11.2 THICK-FILM SOI WAFERS (THICKNESS BETWEEN 1μM AND 3μM)

12 SILICON-ON-INSULATOR MARKET, BY REGION

  • 12.1 INTRODUCTION
  • 12.2 NORTH AMERICA
    • 12.2.1 MACROECONOMIC OUTLOOK
    • 12.2.2 US
      • 12.2.2.1 Increasing focus on production of SOI technology to fuel growth
    • 12.2.3 CANADA
      • 12.2.3.1 Growing advancements in photonic industry to drive growth
    • 12.2.4 MEXICO
      • 12.2.4.1 Increased demand for RF-SOI devices to spur market growth
  • 12.3 EUROPE
    • 12.3.1 MACROECONOMIC OUTLOOK
    • 12.3.2 FRANCE
      • 12.3.2.1 Rising focus on research and development of SOI technology to fuel market growth
    • 12.3.3 UK
      • 12.3.3.1 Increased demand for IoT and 5G technologies to drive adoption of SOI
    • 12.3.4 GERMANY
      • 12.3.4.1 Adoption of SOI wafers in automotive sector to drive market
    • 12.3.5 ITALY
      • 12.3.5.1 Rapid innovation and technological advancements to propel growth
    • 12.3.6 REST OF EUROPE
  • 12.4 ASIA PACIFIC
    • 12.4.1 MACROECONOMIC OUTLOOK
    • 12.4.2 CHINA
      • 12.4.2.1 Growing demand for consumer electronics to drive adoption of SOI technology
    • 12.4.3 JAPAN
      • 12.4.3.1 Presence of well-established market players to spur demand for SOI technology
    • 12.4.4 TAIWAN
      • 12.4.4.1 Increasing demand for 5G technologies to spur growth
    • 12.4.5 REST OF ASIA PACIFIC
  • 12.5 REST OF THE WORLD (ROW)
    • 12.5.1 MACROECONOMIC OUTLOOK
    • 12.5.2 MIDDLE EAST & AFRICA
      • 12.5.2.1 Growth in initiatives and improved focus on medical technologies to drive growth
      • 12.5.2.2 GCC countries
      • 12.5.2.3 Rest of Middle East & Africa
    • 12.5.3 SOUTH AMERICA
      • 12.5.3.1 Growing emphasis on adoption of solar energy to bolster innovation in SOI technology

13 COMPETITIVE LANDSCAPE

  • 13.1 OVERVIEW
  • 13.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020-2024
  • 13.3 MARKET SHARE ANALYSIS, 2023
  • 13.4 REVENUE ANALYSIS, 2019-2023
  • 13.5 COMPANY VALUATION AND FINANCIAL METRICS
  • 13.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
    • 13.6.1 STARS
    • 13.6.2 EMERGING LEADERS
    • 13.6.3 PERVASIVE PLAYERS
    • 13.6.4 PARTICIPANTS
    • 13.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023
      • 13.6.5.1 Company footprint
      • 13.6.5.2 Region footprint
      • 13.6.5.3 Wafer size footprint
      • 13.6.5.4 Wafer type footprint
      • 13.6.5.5 Technology footprint
      • 13.6.5.6 Product footprint
      • 13.6.5.7 Application footprint
  • 13.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
    • 13.7.1 PROGRESSIVE COMPANIES
    • 13.7.2 RESPONSIVE COMPANIES
    • 13.7.3 DYNAMIC COMPANIES
    • 13.7.4 STARTING BLOCKS
    • 13.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023
      • 13.7.5.1 Detailed list of startups/SMEs
      • 13.7.5.2 Competitive benchmarking of startups/SMEs
  • 13.8 BRAND/PRODUCT COMPARISON
  • 13.9 COMPETITIVE SCENARIO
    • 13.9.1 PRODUCT LAUNCHES
    • 13.9.2 DEALS
    • 13.9.3 EXPANSION
    • 13.9.4 OTHER DEVELOPMENTS

14 COMPANY PROFILES

  • 14.1 KEY PLAYERS
    • 14.1.1 SOITEC
      • 14.1.1.1 Business overview
      • 14.1.1.2 Products/Solutions/Services offered
      • 14.1.1.3 Recent developments
        • 14.1.1.3.1 Deals
        • 14.1.1.3.2 Expansion
      • 14.1.1.4 MnM view
        • 14.1.1.4.1 Key strengths/Right to win
        • 14.1.1.4.2 Strategic choices
        • 14.1.1.4.3 Weaknesses/Competitive threats
    • 14.1.2 SHIN-ETSU CHEMICAL CO., LTD.
      • 14.1.2.1 Business overview
      • 14.1.2.2 Products/Solutions/Services offered
      • 14.1.2.3 Recent developments
        • 14.1.2.3.1 Deals
        • 14.1.2.3.2 Expansion
      • 14.1.2.4 MnM view
        • 14.1.2.4.1 Key strengths/Right to win
        • 14.1.2.4.2 Strategic choices
        • 14.1.2.4.3 Weaknesses/Competitive threats
    • 14.1.3 GLOBALWAFERS
      • 14.1.3.1 Business overview
      • 14.1.3.2 Products/Solutions/Services offered
      • 14.1.3.3 Recent developments
        • 14.1.3.3.1 Deals
        • 14.1.3.3.2 Expansion
        • 14.1.3.3.3 Other developments
      • 14.1.3.4 MnM view
        • 14.1.3.4.1 Key strengths/Right to win
        • 14.1.3.4.2 Strategic choices
        • 14.1.3.4.3 Weaknesses/Competitive threats
    • 14.1.4 SUMCO CORPORATION
      • 14.1.4.1 Business overview
      • 14.1.4.2 Products/Solutions/Services offered
      • 14.1.4.3 MnM view
        • 14.1.4.3.1 Key strengths/Right to win
        • 14.1.4.3.2 Strategic choices
        • 14.1.4.3.3 Weaknesses/Competitive threats
    • 14.1.5 SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
      • 14.1.5.1 Business overview
      • 14.1.5.2 Products/Solutions/Services offered
      • 14.1.5.3 MnM view
        • 14.1.5.3.1 Key strengths/Right to win
        • 14.1.5.3.2 Strategic choices
        • 14.1.5.3.3 Weaknesses/Competitive threats
    • 14.1.6 GLOBALFOUNDRIES
      • 14.1.6.1 Business overview
      • 14.1.6.2 Products/Solutions/Services offered
      • 14.1.6.3 Recent developments
        • 14.1.6.3.1 Products/Service launches
        • 14.1.6.3.2 Deals
    • 14.1.7 STMICROELECTRONICS
      • 14.1.7.1 Business overview
      • 14.1.7.2 Products/Solutions/Services offered
      • 14.1.7.3 Recent developments
        • 14.1.7.3.1 Products/Services launches
        • 14.1.7.3.2 Deals
    • 14.1.8 TOWER SEMICONDUCTOR
      • 14.1.8.1 Business overview
      • 14.1.8.2 Products/Solutions/Services offered
      • 14.1.8.3 Recent developments
        • 14.1.8.3.1 Deals
    • 14.1.9 SILICON VALLEY MICROELECTRONICS, INC.
      • 14.1.9.1 Business overview
      • 14.1.9.2 Products/Solutions/Services offered
    • 14.1.10 WAFERPRO
      • 14.1.10.1 Business overview
      • 14.1.10.2 Products/Solutions/Services offered
  • 14.2 OTHER PLAYERS
    • 14.2.1 NANOGRAFI NANO TECHNOLOGY
    • 14.2.2 OKMETIC
    • 14.2.3 PRECISION MICRO-OPTICS INC.
    • 14.2.4 UNITED MICROELECTRONICS CORPORATION
    • 14.2.5 ULTRASIL LLC
    • 14.2.6 PLUTOSEMI CO., LTD
    • 14.2.7 NXP SEMICONDUCTORS
    • 14.2.8 MURATA MANUFACTURING CO., LTD.
    • 14.2.9 ICEMOS TECHNOLOGY LTD.
    • 14.2.10 PROLYX MICROELECTRONICS PRIVATE LIMITED
    • 14.2.11 NOVA ELECTRONIC MATERIALS, LLC
    • 14.2.12 VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    • 14.2.13 ROGUE VALLEY MICRODEVICES
    • 14.2.14 SOKA TECHNOLOGY
    • 14.2.15 ADVANCED MICRO FOUNDRY PTE LTD

15 APPENDIX

  • 15.1 KEY INSIGHTS BY INDUSTRY EXPERTS
  • 15.2 DISCUSSION GUIDE
  • 15.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 15.4 CUSTOMIZATION OPTIONS
  • 15.5 RELATED REPORTS
  • 15.6 AUTHOR DETAILS
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