3D IC 시장 규모, 점유율, 성장 분석, 기판별, 제품별, 컴포넌트별, 3D 기술별, 용도별, 지역별 - 산업 예측(2024-2031년)

Global 3D IC Market size was valued at USD 10.62 billion in 2022 and is poised to grow from USD 11.49 billion in 2023 to USD 21.60 billion by 2031, growing at a CAGR of 8.21% during the forecast period (2024-2031).

The global 3D Integrated Circuit (IC) market is on a robust growth trajectory, driven by rapid technological developments and an escalating demand for compact, high-performance electronic devices. The adoption of 3D ICs across consumer electronics, particularly smartphones and tablets, reflects the market's aim to enhance operational efficiency and energy consumption by stacking multiple layers of integrated circuits. This innovative architecture not only facilitates energy savings and strengthens signal integrity but also caters to consumers' preferences for lighter, smaller, and more energy-efficient gadgets. Despite facing challenges such as high initial implementation costs, intricate manufacturing processes, and concerns over heat management and interoperability, the 3D IC market presents substantial opportunities. The rise of artificial intelligence (AI) and machine learning (ML), alongside the rollout of 5G technology, underscores the necessity for faster data processing capabilities, making 3D ICs integral to modern electronic innovations. As the industry continues to overcome hurdles related to standardization and collaborative efforts, the market is poised for significant expansion. Manufacturers are urged to leverage advancements in 3D IC technology, as the demand for next-generation electronics is set to soar. Overall, the 3D IC market is propelled by the quest for smaller, efficient, and high-speed electronic solutions, positioning itself as a vital player in the evolving digital landscape.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global 3D Ic market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global 3D Ic Market Segmental Analysis

Global 3D IC Market is segmented by Substrate, Product, Component, 3D Technology, Application, and Region. Based on Substrate, the market is segmented into Silicon on Insulator (SOI), Bulk Silicon. Based on Product, the market is segmented into Sensors, Memories, Logics, Light Emitting Diodes (LED), Micro Electro Mechanical Systems (MEMS). Based on Component, the market is segmented into Through Silicon Vias, Through Glass Vias, Silicon Interposer, Others. Based on 3D Technology, the market is segmented into Wafer Level Packaging, System Integration. Based on Application, the market is segmented into Consumer Electronics, ICT/Telecommunication, Military, Automotive, Biomedical, Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global 3D Ic Market

The global 3D IC market is driven by the increasing consumer demand for compact and high-performance electronic devices. As consumers gravitate towards smaller, lighter, and more powerful gadgets such as smartphones, tablets, and wearables, 3D IC technology provides a crucial solution by enabling the stacking of multiple layers of integrated circuits. This innovative approach enhances processing capabilities while minimizing power consumption and physical dimensions. Consequently, it aligns perfectly with the evolving needs of tech-savvy users seeking advanced functionality in their devices, fueling the expansion of the 3D IC market across various applications in electronics.

Restraints in the Global 3D Ic Market

The high start-up costs associated with 3D integrated circuit (IC) technology represent a significant market restraint, limiting its widespread adoption. The intricate fabrication processes and the requirement for specialized equipment result in elevated production costs, which can be prohibitive for many manufacturers. These initial financial barriers deter potential entrants and established companies from investing in the transition to 3D IC technology, slowing down industrial uptake across various sectors. Consequently, the reluctance to embrace this innovative technology restricts its market potential, hindering the overall growth and evolution of the 3D IC market on a global scale.

Market Trends of the Global 3D Ic Market

The global 3D IC market is witnessing a significant trend driven by the increasing integration of 3D ICs in artificial intelligence (AI) and machine learning (ML) applications. As industries demand enhanced data processing capabilities and superior performance to support the growing complexity of AI algorithms, the adoption of 3D IC technology is surging. This technology enables higher integration density and faster data transfer rates, essential for the efficient functioning of AI and ML systems. Consequently, this trend not only propels the demand for advanced 3D ICs but also signifies a broader technological evolution, positioning the market for substantial growth in the coming years.

Table of Contents

Introduction

• Objectives of the Study
• Definitions
• Market Scope

Research Methodology

• Information Procurement
• Secondary & Primary Data Sources
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Market Overview Outlook
• Supply Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Dynamics
  • Drivers
  • Opportunities
  • Restraints
  • Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of Substitute Products
  • Bargaining Power of Buyers
  • Threat of New Entrants
  • Bargaining Power of Suppliers

Key Market Insights

• Technology Analysis
• Value Chain Analysis
• Ecosystem of the Market
• Patent Analysis
• Pricing Analysis
• Regulatory Landscape
• Innovation Matrix
• PESTEL Analysis
• Top Investment Analysis
• Key Success Factor
• Degree of Competition

3D IC Market by Substrate

• Market Overview
• Silicon on Insulator (SOI)
• Bulk Silicon

3D IC Market by Product

• Market Overview
• Sensors
• Memories
• Logics
• Light Emitting Diodes (LED)
• Micro Electro Mechanical Systems (MEMS)

3D IC Market by Component

• Market Overview
• Through Silicon Vias
• Through Glass Vias
• Silicon Interposer
• Others

3D IC Market by 3D Technology

• Market Overview
• Wafer Level Packaging
• System Integration

3D IC Market by Application

• Market Overview
• Consumer Electronics
• ICT/Telecommunication
• Military
• Automotive
• Biomedical
• Others

3D IC Market Size by Region

• Market Overview
• North America
  • USA
  • Canada
• Europe
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America
  • Brazil
  • Rest of Latin America
• Middle East & Africa (MEA)
  • GCC Countries
  • South Africa
  • Rest of MEA

Competitive Landscape

• Top 5 Player Comparison
• Market Positioning of Key Players, 2023
• Strategies Adopted by Key Market Players
• Recent Activities in the Market
• Key Companies Market Share (%), 2023

Key Company Profiles

• Advanced Semiconductor Engineering
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ST Microelectronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• STATS ChipPAC
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Taiwan Semiconductor Manufacturing
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• IBM
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• AMKOR TECHNOLOGY
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Toshiba Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• United Microelectronics Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Xilinx Inc.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Micron Technology, Inc.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electronics Co. Ltd.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Cadence
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Monolithic 3D Inc.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Intel Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• NXP Semiconductors
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Qualcomm
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Broadcom Inc.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Analog Devices, Inc.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Siemens
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments