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세계의 EUV 노광 시장 예측(-2029년) : 컴포넌트별, 최종사용자별

Extreme Ultraviolet (EUV) Lithography Market by Component (Light Sources, Optics, Masks, EUV Metrology, EUV Sensors, EUV Subassembly) and End User (Integrated Device Manufacturers (IDMs), Foundries) - Global Forecast to 2029
발행일: | 리서치사: MarketsandMarkets | 페이지 정보: 영문 164 Pages | 배송안내 : 즉시배송

    
    
    




※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 EUV 노광 시장 규모는 2024년 121억 8,000만 달러에서 2029년까지 226억 9,000만 달러에 달할 것으로 예측되며, 2024-2029년에 CAGR로 13.2%의 성장이 전망됩니다.

조사 범위
조사 대상년 2020-2029년
기준년 2023년
예측 기간 2024-2029년
단위 10억 달러
부문 컴포넌트, 최종사용자, 지역
대상 지역 북미, 유럽, 아시아태평양, 기타 지역

CE(Consumer Electronics)의 지속적인 발전으로 EUV 노광 시장 수요가 증가하고 있습니다. 더 얇고, 더 고성능이며, 더 에너지 효율적인 디바이스가 증가함에 따라 EUV 노광의 사용도 증가하고 있습니다. 최근 스마트폰, 스마트워치, 노트북, 스마트홈 기기 전반에 걸쳐 더 작은 반도체 칩을 사용하여 고성능의 첨단 기능을 구현하고 있으며, EUVL은 나노미터 단위의 매우 복잡한 패턴을 에칭할 수 있으며, 차세대 칩 제조에 필수적인 요소입니다. 차세대 칩 제조에 필수적인 요소입니다.

5G, AI, AR/VR과 같은 기술이 발전함에 따라 고성능 프로세서, 메모리 칩 및 기타 반도체 부품에 대한 수요가 증가함에 따라 EUV 시스템의 필요성이 증가하고 있습니다. 배터리 수명 연장, 빠른 처리 속도, 정교한 디자인에 대한 소비자의 기대는 EUV 노광이 촉진하는 소형화 추세에 힘을 실어주고 있습니다. 또한 주요 CE(Consumer Electronics) 브랜드들이 기술적 우위를 확보하기 위해 첨단 반도체 제조 공정에 투자하면서 EUV 노광 시장의 성장을 촉진하고 있습니다. 이러한 CE(Consumer Electronics)과 반도체 제조 기술 혁신의 상호 작용에서 EUV 노광은 미래 기술의 핵심으로 부각되고 있습니다.

"한국이 2024-2029년의 예측 기간 중 가장 높은 CAGR로 성장할 것으로 예상됩니다."

한국은 반도체 제조의 리더십과 첨단 노광 기술에 대한 적극적인 투자로 인해 예측 기간 중 EUV 노광 시장에서 가장 높은 CAGR을 나타낼 것으로 예상되고 있습니다. 한국은 삼성과 SK하이닉스를 비롯한 세계 최대 반도체 제조업체의 본거지이며, 5nm 이하의 첨단 노드에서 고성능 칩을 생산하기 위해 EUV를 채택하는 주요 국가이기도 합니다.

한국 정부는 수입을 줄이고 전 세계 시장에서 보다 확고한 입지를 구축하기 위해 정책적 인센티브와 상당한 재정적 지원과 함께 견고한 반도체 생태계를 구축하는 것을 고려하고 있습니다. 또한 국내 제조업체들은 AI, 5G, IoT, 자동차 용도에 대한 국내외 시장 수요 증가로 인해 큰 압박을 받고 있습니다.

ASML과 같은 EUV 장비 공급업체와의 지속적인 협력 관계는 한국 공장에 최첨단 노광 툴을 제공할 것이며, EUV 노광을 확대하려는 한국의 전략적 움직임은 반도체 산업이 더 작고 에너지 효율적이며 강력한 칩을 지향하는 것과 더불어 이 지역 시장 이 지역 시장 CAGR을 건강하게 만들고 있습니다.

EUV 노광 시장에서 주요 진출 기업의 개요는 다음과 같습니다.

세계의 EUV 노광 시장에 대해 조사분석했으며, 주요 촉진요인과 억제요인, 경쟁 구도, 향후 동향 등의 정보를 제공하고 있습니다.

목차

제1장 서론

제2장 조사 방법

제3장 개요

제4장 주요 인사이트

  • EUV 노광 시장의 기업에게 매력적인 기회
  • EUV 노광 시장 : 최종사용자별
  • EUV 노광 시장 : 컴포넌트별
  • EUV 노광 시장 : 지역별

제5장 시장 개요

  • 서론
  • 시장 역학
    • 촉진요인
    • 억제요인
    • 기회
    • 과제
  • 밸류체인 분석
    • 연구개발 엔지니어
    • 컴포넌트 제조업체
    • 시스템 통합사업자
    • 마케팅·판매 서비스 프로바이더
    • 최종사용자
  • 고객 비즈니스에 영향을 미치는 동향/혼란
  • 에코시스템 분석
  • 기술 분석
    • 주요 기술
    • 보완 기술
    • 인접 기술
  • 투자와 자금조달 시나리오
  • 가격 분석
    • EUV 노광 시스템의 평균 판매 가격
    • 평균 판매 가격 동향 : 지역별(2020-2023년)
  • 사례 연구 분석
  • 특허 분석
  • 무역 분석
    • 수입 시나리오(HS 코드 8442)
    • 수출 시나리오(HS 코드 8442)
  • Porter's Five Forces 분석
  • 주요 이해관계자와 구입 기준
  • 관세와 규제 상황
    • 관세 분석
    • 규제기관, 정부기관, 기타 조직
    • 규제
  • 주요 컨퍼런스와 이벤트(2024-2025년)
  • EUV 노광 시장에 대한 생성형 AI/AI의 영향

제6장 EUV 노광 시장 : 컴포넌트별

  • 서론
  • 광원
  • 광학
  • 마스크
  • 기타

제7장 EUV 노광 시장 : 최종사용자별

  • 서론
  • 통합 디바이스 제조업체
  • 파운드리

제8장 EUV 노광 시장 : 지역별

  • 서론
  • 아메리카
  • 유럽
  • 아시아태평양
    • 아시아태평양의 거시경제 전망
    • 중국
    • 일본
    • 한국
    • 대만
    • 기타 아시아태평양

제9장 경쟁 구도

  • 개요
  • 주요 참여 기업의 전략/강점(2023-2024년)
  • 매출 분석(2021-2023년)
  • 시장 점유율 분석(2023년)
  • 기업 평가와 재무 지표
  • 기업 평가 매트릭스 : 주요 기업(2023년)
  • 기업 평가 매트릭스 : 스타트업/중소기업(2023년)
  • 경쟁 시나리오

제10장 기업 개요

  • 서론
  • 주요 기업
    • ASML
  • 주요 컴포넌트 제조업체
    • CARL ZEISS AG
    • NTT ADVANCED TECHNOLOGY CORPORATION
    • KLA CORPORATION
    • ADVANTEST CORPORATION
    • USHIO INC.
    • SUSS MICROTEC SE
    • AGC INC.
    • LASERTEC CORPORATION
    • TOPPAN INC.
  • 기타 기업
    • ENERGETIQ TECHNOLOGY, INC.
    • NUFLARE TECHNOLOGY INC.
    • PHOTRONICS, INC.
    • HOYA CORPORATION
    • TRUMPF
    • RIGAKU HOLDINGS CORPORATION
    • EDMUND OPTICS INC.
    • IMAGINE OPTIC
    • APPLIED MATERIALS, INC.
    • PARK SYSTEMS
    • EUV TECH
    • MLOPTIC CROP.
    • MKS INSTRUMENTS
    • BROOKS AUTOMATION
    • PFEIFFER VACUUM GMBH

제11장 부록

KSA 25.01.16

The EUV lithography market is expected to reach USD 22.69 billion by 2029 from USD 12.18 billion in 2024, at a CAGR of 13.2% during the 2024-2029 period.

Scope of the Report
Years Considered for the Study2020-2029
Base Year2023
Forecast Period2024-2029
Units ConsideredValue (USD Billion)
SegmentsBy Component, End User and Region
Regions coveredNorth America, Europe, APAC, RoW

Continuing advances in consumer electronics increase demand for extreme ultraviolet lithography markets. With an increase in thinner, more powerful, energy-efficient devices, the usage of extreme ultraviolet lithography also increases. Advanced functionality with high performance is achieved using a smaller semiconductor chip in modern smartphones, smartwatch, laptops, and also a whole smart home device. EUVL has the ability to etch extremely intricate patterns down at nanometer scales, making it absolutely necessary to produce next-generation chips.

The increasing deployment of technologies such as 5G, artificial intelligence (AI), and augmented reality/virtual reality rises the demand for high-performance processors, memory chips, and other semiconductor components, which in turn increases the need for EUV systems. Consumer expectations for longer battery life, faster processing speeds, and sleek designs also reinforce the trend towards miniaturization, which EUV lithography facilitates. Also, in the quest for technological superiority among leading consumer electronics brands, investments in advanced semiconductor manufacturing processes fuel the growth of the EUV lithography market. In this interaction between innovation in consumer electronics and semiconductor fabrication, the EUV lithography stands out as a key to future technologies.

"South Korea is projected to grow at the highest CAGR during the forecast period from 2024-2029"

The South Korean region is expected to have the highest compound annual growth rate (CAGR) for the EUV lithography market over the forecast period due to the country's leadership in semiconductor manufacturing and aggressive investments in advanced lithography technologies. South Korea is also the home of some of the world's largest makers of semiconductors, notably Samsung and SK Hynix, key adopters of EUV for producing high-performance chips at such advanced nodes as 5nm and lower.

The government of South Korea considers the development of a robust ecosystem of semiconductors with considerable support in terms of finance and with policy incentives to reduce imports and thus establish a stronger position in markets around the world. Moreover, South Korean manufacturers are under rising pressure from the increasing demands of AI, 5G, IoT, and automotive applications in both home and international markets.

Continuous collaborations with EUV equipment vendors, such as ASML, will provide South Korean fabs with the most advanced lithography tools. The strategic move of South Korea to scale up EUV lithography, in addition to the semiconductor industry's push toward smaller, more energy-efficient, and powerful chips, drives the market to the robust CAGR in the region.

In-depth interviews have been conducted with chief executive officers (CEOs), Directors, and other executives from various key organizations operating in the EUV lithography market.

The break-up of the profile of primary participants in the EUV lithography market-

  • By Company Type: Tier 1 - 30%, Tier 2 - 50%, Tier 3 - 20%
  • By Designation Type: C Level Executive - 25%, Directors - 35%, Others - 40%
  • By Region Type: Americas - 25%, Europe -35 %, Asia Pacific- 40%

The major players in the EUV lithography market are ASML (Netherlands), Carl Zeiss AG (Germany), NTT Advanced Technology Corporation (Japan), KLA Corporation (US), ADVANTEST CORPORATION (Japan), Ushio Inc. (Japan), SUSS MicroTec SE (Germany), AGC Inc. (Japan), Lasertec Corporation (Japan), TOPPAN Inc. (Japan), Energetiq Technology, Inc. (Japan), NuFlare Technology Inc. (US), Photronics, Inc. (Japan), HOYA Corporation (Japan), TRUMPF (Germany), Rigaku Holdings Corporation (Japan), Edmund Optics Inc. (US), Imagine Optic (France), Applied Materials, Inc. (US), Park Systems (South Koria), EUV Tech (US), Mloptic Crop. (China), MKS Instruments (US), Brooks Automation (US), and Pfeiffer Vacuum GmbH (Germany).

Research Coverage

The report segments the EUV lithography market and forecasts its size by region. It also comprehensively reviews drivers, restraints, opportunities, and challenges influencing market growth. The report covers qualitative aspects in addition to quantitative aspects of the market.

This report has categorized the EUV lithography market by component (light sources, optics, masks, others), end user (integrated device manufacturers, foundries), and region (Americas, Europe, and Asia Pacific)

Reasons to buy the report:

The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall EUV lithography market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the objectives of the market and provides information on key market drivers, restraints, opportunities, and challenges.

The report provides insights on the following pointers:

  • Analysis of key drivers (adoption of EUV lithography for advanced semiconductor nodes), restraint (significant upfront capital investment in EUV lithography), opportunity (rising investments in advanced EUV lithography and semiconductor devices), and challenges (competition from alternative lithography techniques)
  • Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the EUV lithography market
  • Market Development: Comprehensive information about lucrative markets - the report analyses the EUV lithography market across varied regions.
  • Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the EUV lithography market
  • Competitive Assessment: In-depth assessment of market shares, growth strategies, and product offerings of leading players like KLA Corporation (US), Carl Zeiss AG (Germany), TRUMPF (Germany), TOPPAN Inc. (Japan), and AGC Inc. (Japan).

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
  • 1.3 STUDY SCOPE
    • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
    • 1.3.2 INCLUSIONS AND EXCLUSIONS
    • 1.3.3 YEARS CONSIDERED
  • 1.4 CURRENCY CONSIDERED
  • 1.5 UNIT CONSIDERED
  • 1.6 LIMITATIONS
  • 1.7 STAKEHOLDERS
  • 1.8 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • 2.1.1 SECONDARY DATA
      • 2.1.1.1 Key data from secondary sources
      • 2.1.1.2 Key secondary sources
    • 2.1.2 PRIMARY DATA
      • 2.1.2.1 Key data from primary sources
      • 2.1.2.2 Key participants in primary interviews
      • 2.1.2.3 Breakdown of primary interviews
      • 2.1.2.4 Key industry insights
    • 2.1.3 SECONDARY AND PRIMARY RESEARCH
  • 2.2 MARKET SIZE ESTIMATION
    • 2.2.1 BOTTOM-UP APPROACH
      • 2.2.1.1 Approach to arrive at market size using bottom-up analysis (Demand side)
    • 2.2.2 TOP-DOWN APPROACH
      • 2.2.2.1 Approach to arrive at market size using top-down analysis (Supply side)
  • 2.3 DATA TRIANGULATION
  • 2.4 RISK ASSESSMENT
  • 2.5 RESEARCH ASSUMPTIONS AND LIMITATIONS
    • 2.5.1 RESEARCH ASSUMPTIONS
    • 2.5.2 RESEARCH LIMITATIONS

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN EUV LITHOGRAPHY MARKET
  • 4.2 EUV LITHOGRAPHY MARKET, BY END USER
  • 4.3 EUV LITHOGRAPHY MARKET, BY COMPONENT
  • 4.4 EUV LITHOGRAPHY MARKET, BY REGION

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • 5.2.1 DRIVERS
      • 5.2.1.1 Adoption of EUV lithography for advanced semiconductor nodes
      • 5.2.1.2 Rising demand for high-performance computing
      • 5.2.1.3 Increasing complexity of integrated circuits
      • 5.2.1.4 Advancements in consumer electronics
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 Need for significant upfront capital investment
      • 5.2.2.2 Requirement for advanced infrastructure and skilled workforce
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Increasing investments in advanced EUV lithography and semiconductor devices
      • 5.2.3.2 Expanding deployment of EUV lithography in emerging applications
      • 5.2.3.3 Advancement in memory module and chip development for next-generation devices
      • 5.2.3.4 Commercialization of advanced displays for enhanced visual experiences
      • 5.2.3.5 Application of advanced patterning technologies in photonics and optics production
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Competition from alternative lithography techniques
      • 5.2.4.2 Difficulty in sustaining high source power and productivity
      • 5.2.4.3 Detecting and addressing mask defects and yield challenges
  • 5.3 VALUE CHAIN ANALYSIS
    • 5.3.1 R&D ENGINEERS
    • 5.3.2 COMPONENT MANUFACTURERS
    • 5.3.3 SYSTEM INTEGRATORS
    • 5.3.4 MARKETING & SALES SERVICES PROVIDERS
    • 5.3.5 END USERS
  • 5.4 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
  • 5.5 ECOSYSTEM ANALYSIS
  • 5.6 TECHNOLOGY ANALYSIS
    • 5.6.1 KEY TECHNOLOGIES
      • 5.6.1.1 Light source
      • 5.6.1.2 EUV masks
    • 5.6.2 COMPLEMENTARY TECHNOLOGIES
      • 5.6.2.1 Mask pellicles
      • 5.6.2.2 Plasma generation
    • 5.6.3 ADJACENT TECHNOLOGIES
      • 5.6.3.1 Extreme ultraviolet reflectometry (EUVR)
      • 5.6.3.2 Atomic layer deposition (ALD)
  • 5.7 INVESTMENT AND FUNDING SCENARIO
  • 5.8 PRICING ANALYSIS
    • 5.8.1 AVERAGE SELLING PRICE OF EUV LITHOGRAPHY SYSTEM
    • 5.8.2 AVERAGE SELLING PRICE TREND, BY REGION, 2020-2023
  • 5.9 CASE STUDY ANALYSIS
    • 5.9.1 INTEL SECURES EXCLUSIVE HIGH-NA EUV MACHINES
    • 5.9.2 LAM COLLABORATED WITH ASML TO DEVELOP DRY RESIST TECHNOLOGY THAT ADVANCES EUV LITHOGRAPHY
    • 5.9.3 TSMC ACQUIRED EUV SYSTEMS TO BOOST PRODUCTION CAPACITY
  • 5.10 PATENT ANALYSIS
  • 5.11 TRADE ANALYSIS
    • 5.11.1 IMPORT SCENARIO (HS CODE 8442)
    • 5.11.2 EXPORT SCENARIO (HS CODE 8442)
  • 5.12 PORTER'S FIVE FORCES ANALYSIS
    • 5.12.1 INTENSITY OF COMPETITIVE RIVALRY
    • 5.12.2 THREAT OF NEW ENTRANTS
    • 5.12.3 THREAT OF SUBSTITUTES
    • 5.12.4 BARGAINING POWER OF BUYERS
    • 5.12.5 BARGAINING POWER OF SUPPLIERS
  • 5.13 KEY STAKEHOLDERS AND BUYING CRITERIA
    • 5.13.1 KEY STAKEHOLDERS IN BUYING PROCESS
    • 5.13.2 BUYING CRITERIA
  • 5.14 TARIFF AND REGULATORY LANDSCAPE
    • 5.14.1 TARIFF ANALYSIS
    • 5.14.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • 5.14.3 REGULATIONS
  • 5.15 KEY CONFERENCES AND EVENTS, 2024-2025
  • 5.16 IMPACT OF GEN AI/AI ON EUV LITHOGRAPHY MARKET
    • 5.16.1 INTRODUCTION

6 EUV LITHOGRAPHY MARKET, BY COMPONENT

  • 6.1 INTRODUCTION
  • 6.2 LIGHT SOURCES
    • 6.2.1 GROWING ADOPTION OF LPP EUV LIGHT SOURCES IN COMMERCIAL SYSTEMS TO PROPEL MARKET
  • 6.3 OPTICS
    • 6.3.1 HIGH PRECISION AND ACCURACY OF EUV OPTICS TO DRIVE ADOPTION
  • 6.4 MASKS
    • 6.4.1 GROWING EMPHASIS ON DEVELOPING NEXT-GENERATION SEMICONDUCTOR DEVICES TO PROPEL MARKET
  • 6.5 OTHERS

7 EUV LITHOGRAPHY MARKET, BY END USER

  • 7.1 INTRODUCTION
  • 7.2 INTEGRATED DEVICE MANUFACTURERS
    • 7.2.1 EMPHASIS ON DEVELOPING ADVANCED, ENERGY-EFFICIENT MICROCHIPS AND ICS TO DRIVE GROWTH
  • 7.3 FOUNDRIES
    • 7.3.1 INNOVATIONS IN SEMICONDUCTOR NODES TO ACCELERATE ADOPTION OF EUV LITHOGRAPHY BY FOUNDRIES

8 EUV LITHOGRAPHY MARKET, BY REGION

  • 8.1 INTRODUCTION
  • 8.2 AMERICAS
    • 8.2.1 PRESENCE OF STRONG SEMICONDUCTOR ECOSYSTEM TO PROPEL MARKET GROWTH
    • 8.2.2 MACROECONOMIC OUTLOOK FOR AMERICAS
  • 8.3 EUROPE
    • 8.3.1 STRATEGIC INVESTMENTS IN R&D BY GERMANY, NETHERLANDS, AND FRANCE TO STRENGTHEN MARKET GROWTH
    • 8.3.2 MACROECONOMIC OUTLOOK FOR EUROPE
  • 8.4 ASIA PACIFIC
    • 8.4.1 MACROECONOMIC OUTLOOK FOR ASIA PACIFIC
    • 8.4.2 CHINA
      • 8.4.2.1 Advanced semiconductor production capabilities fueling market growth
    • 8.4.3 JAPAN
      • 8.4.3.1 Strong semiconductor ecosystem driving market growth
    • 8.4.4 SOUTH KOREA
      • 8.4.4.1 Advancement in EUV lithography fueling semiconductor innovation
    • 8.4.5 TAIWAN
      • 8.4.5.1 Significant investments in eco-friendly EUV system components to drive growth
    • 8.4.6 REST OF ASIA PACIFIC

9 COMPETITIVE LANDSCAPE

  • 9.1 OVERVIEW
  • 9.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2023-2024
  • 9.3 REVENUE ANALYSIS, 2021-2023
  • 9.4 MARKET SHARE ANALYSIS, 2023
  • 9.5 COMPANY VALUATION AND FINANCIAL METRICS
  • 9.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
    • 9.6.1 STARS
    • 9.6.2 EMERGING LEADERS
    • 9.6.3 PERVASIVE PLAYERS
    • 9.6.4 PARTICIPANTS
    • 9.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023
      • 9.6.5.1 Company footprint
      • 9.6.5.2 Region footprint
      • 9.6.5.3 Component footprint
      • 9.6.5.4 End user footprint
  • 9.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
    • 9.7.1 PROGRESSIVE COMPANIES
    • 9.7.2 RESPONSIVE COMPANIES
    • 9.7.3 DYNAMIC COMPANIES
    • 9.7.4 STARTING BLOCKS
    • 9.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023
      • 9.7.5.1 Detailed list of startups/SMEs
      • 9.7.5.2 Competitive benchmarking of startups/SMEs
  • 9.8 COMPETITIVE SCENARIO
    • 9.8.1 PRODUCT LAUNCHES
    • 9.8.2 DEALS

10 COMPANY PROFILES

  • 10.1 INTRODUCTION
  • 10.2 KEY PLAYERS
    • 10.2.1 ASML
      • 10.2.1.1 Business overview
      • 10.2.1.2 Products/Solutions/Services offered
      • 10.2.1.3 Recent developments
        • 10.2.1.3.1 Deals
      • 10.2.1.4 MnM view
        • 10.2.1.4.1 Key strengths
        • 10.2.1.4.2 Strategic choices
        • 10.2.1.4.3 Weaknesses and competitive threats
  • 10.3 KEY COMPONENT MANUFACTURERS
    • 10.3.1 CARL ZEISS AG
      • 10.3.1.1 Carl Zeiss AG: Business overview
      • 10.3.1.2 Products/Solutions/Services offered
      • 10.3.1.3 Recent developments
        • 10.3.1.3.1 Product launches
      • 10.3.1.4 MnM view
        • 10.3.1.4.1 Key strengths
        • 10.3.1.4.2 Strategic choices
        • 10.3.1.4.3 Weaknesses and competitive threats
    • 10.3.2 NTT ADVANCED TECHNOLOGY CORPORATION
      • 10.3.2.1 Business overview
      • 10.3.2.2 Products/Solutions/Services offered
      • 10.3.2.3 MnM view
        • 10.3.2.3.1 Key strengths
        • 10.3.2.3.2 Strategic choices
        • 10.3.2.3.3 Weaknesses and competitive threats
    • 10.3.3 KLA CORPORATION
      • 10.3.3.1 Business overview
      • 10.3.3.2 Products/Solutions/Services offered
      • 10.3.3.3 MnM view
        • 10.3.3.3.1 Key strengths
        • 10.3.3.3.2 Strategic choices
        • 10.3.3.3.3 Weaknesses and competitive threats
    • 10.3.4 ADVANTEST CORPORATION
      • 10.3.4.1 Business overview
      • 10.3.4.2 Products/Solutions/Services offered
      • 10.3.4.3 MnM view
        • 10.3.4.3.1 Key strengths
        • 10.3.4.3.2 Strategic choices
        • 10.3.4.3.3 Weaknesses and competitive threats
    • 10.3.5 USHIO INC.
      • 10.3.5.1 Business overview
      • 10.3.5.2 Products/Solutions/Services offered
    • 10.3.6 SUSS MICROTEC SE
      • 10.3.6.1 Business overview
      • 10.3.6.2 Products/Solutions/Services offered
    • 10.3.7 AGC INC.
      • 10.3.7.1 Business overview
      • 10.3.7.2 Products/Solutions/Services offered
    • 10.3.8 LASERTEC CORPORATION
      • 10.3.8.1 Business overview
      • 10.3.8.2 Products/Solutions/Services offered
    • 10.3.9 TOPPAN INC.
      • 10.3.9.1 Business overview
      • 10.3.9.2 Products/Solutions/Services offered
  • 10.4 OTHER PLAYERS
    • 10.4.1 ENERGETIQ TECHNOLOGY, INC.
    • 10.4.2 NUFLARE TECHNOLOGY INC.
    • 10.4.3 PHOTRONICS, INC.
    • 10.4.4 HOYA CORPORATION
    • 10.4.5 TRUMPF
    • 10.4.6 RIGAKU HOLDINGS CORPORATION
    • 10.4.7 EDMUND OPTICS INC.
    • 10.4.8 IMAGINE OPTIC
    • 10.4.9 APPLIED MATERIALS, INC.
    • 10.4.10 PARK SYSTEMS
    • 10.4.11 EUV TECH
    • 10.4.12 MLOPTIC CROP.
    • 10.4.13 MKS INSTRUMENTS
    • 10.4.14 BROOKS AUTOMATION
    • 10.4.15 PFEIFFER VACUUM GMBH

11 APPENDIX

  • 11.1 INSIGHTS FROM INDUSTRY EXPERTS
  • 11.2 DISCUSSION GUIDE
  • 11.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 11.4 CUSTOMIZATION OPTIONS
  • 11.5 RELATED REPORTS
  • 11.6 AUTHOR DETAILS
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