세계의 전기자동차용 반도체 시장 : 기술별, 추진 방식별, 용도별, 구성 요소별, 지역별 예측(-2032년)

The EV semiconductors market is projected to reach USD 57.48 billion in 2032, growing from USD 24.09 billion in 2025, at a CAGR of 9.1%. The market's growth is driven by increasing semiconductor content per passenger car and the shift to fully electric platforms. EVs use more sensors and computing for safety and automation features, so ADAS requires high-performance MCUs, radar, and vision chips at higher penetration than ICE vehicles. Battery electronics are becoming more advanced because fast charging, longer cycle life, and precise cell monitoring need high-accuracy analog front ends, power devices, and functional safety processors.

Wide-bandgap technologies, including SiC and GaN, hybrid SiC GaN inverters, and advanced packaging, improve efficiency, lower heat, and enable compact high-power designs. Government initiatives, such as the US CHIPS Act and the EU Chips Act, drive local fab expansion by Texas Instruments, Infineon, and STMicroelectronics. Software-defined vehicle platforms increase the demand for memory and processing, and tighter OEM supplier collaboration accelerates innovation. 800V architectures in premium BEVs are pushing the adoption of advanced power semiconductors for faster charging and a longer range. 48V systems in models like Audi A6 and Mercedes-Benz C Class sustain demand for efficient power devices to support high electrical load without moving to full high voltage EV designs.

"Battery management system applications are expected to witness notable demand in the EV semiconductors market during the forecast period."

Battery management system applications are set to witness substantial growth in the EV semiconductors market. Modern BMS hardware must deliver precise measurement, fast data processing, and efficient thermal control inside large battery packs. Advanced microcontrollers, power management ICs, sensors, and communication modules are required to achieve cell voltage, temperature, charge state, and health accuracy.

In April 2025, STMicroelectronics announced its Stellar with xMemory MCUs that support software-driven battery control and flexible cell balancing architectures. Similarly, in March 2025, Renesas launched the RBMS F platform, which combines fuel gauge ICs, microcontrollers, and analog front ends in one design that improves safety through faster fault detection and optimizes charging and discharging. Likewise, in June 2025, NXP Semiconductors completed its acquisition of TTTech Auto to enhance real-time functional safety computing for high-energy battery systems. Packaging improvements and shifting toward high-power-density batteries also increase the use of SiC and GaN-based components inside BMS modules because they reduce heat and improve efficiency. These developments make BMS one of North America and China's strongest semiconductor demand drivers across EV production hubs.

"By component type, the power ICs & modules segment is projected to register strong growth in the EV semiconductors market during the forecast period."

Power ICs & modules, including MOSFETs, IGBTs, and wide-bandgap devices such as SiC and GaN, are critical for inverters, onboard chargers, and DC-DC converters and directly impact vehicle efficiency, range, and thermal performance. Porsche Taycan and Ford Mustang Mach-E employ SiC-based inverters to enhance energy efficiency and enable faster charging. Reflecting the industry's focus on scaling these next-generation power devices, Infineon and ROHM's March 2025 memorandum of understanding to collaborate on SiC power packages highlights industry efforts to scale next-generation power devices. Similarly, STMicroelectronics' investment in September 2025 in panel-level packaging further improves the efficiency and reliability of power semiconductors for automotive applications.

The accelerated adoption of 800V platforms in high-performance BEVs and ongoing global EV production are increasing the demand for high-efficiency power devices. Investments in hybrid SiC-GaN solutions and advanced thermal management packaging are helping OEMs achieve high power density, low losses, and improved overall system reliability, positioning the power semiconductor segment as a significant growth driver in the EV semiconductors market.

"Europe is projected to witness significant growth in the EV semiconductors market during the forecast period."

Europe is projected to experience significant growth in the EV semiconductors market, driven by the increasing passenger car electrification and strong regional automotive manufacturing. Leading OEMs such as Volkswagen, BMW, and Stellantis are expanding BEV lineups and investing in software-defined vehicle platforms, increasing demand for high-performance MCUs, power electronics, and radar/ADAS chips. At the same time, key Chinese OEMs are establishing European manufacturing presence. For instance, in March 2025, BYD announced plans for a new plant in Hungary to serve the European market. The EU Chips Act is a primary catalyst, aiming to double Europe's global semiconductor market share to 20% by 2030 through over USD 46.5 billion in public and private investment, fostering self-sufficiency and supply chain resilience for critical components like automotive chips.

Key investments in the region include Infineon's investment of USD 4.9 billion for expansion in Dresden, STMicroelectronics' SiC fab project worth USD 5.5 billion in Catania, and joint ventures (USD 8.2 billion FD-SOI fab by ST and GlobalFoundries near Grenoble, France). European suppliers, including Infineon Technologies AG and STMicroelectronics, are scaling SiC and GaN production to meet demand for high-efficiency inverters and onboard chargers. Combined with government support for electrification, EV mandates, and incentives for energy-efficient vehicle electronics, these developments position Europe as a key growth region for the EV semiconductors market.

In-depth interviews were conducted with CEOs, marketing directors, other innovation and technology directors, and executives from various key organizations operating in this market.

• By Company Type: Tier I - 41%, Tier II - 36%, and Tier III - 23%
• By Designation: Directors - 32%, Managers - 47%, and Others - 21%
• By Region: Asia Pacific - 27%, North America - 42%, and Europe - 31%

The EV semiconductors market is dominated by major players, including Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), NXP Semiconductors (Netherlands), Texas Instruments Incorporated (US), Renesas Electronics Corporation (Japan), and more. These companies are expanding their portfolios to strengthen their market position.

Research Coverage:

The report covers the EV semiconductors market in terms of Technology (Silicon-based Semiconductor, Wide-Bandgap Semiconductor), Propulsion [Battery Electric Vehicle (BEV) and Plug-In Hybrid Electric Vehicle (PHEV)], Application (Battery Management System, Powertrain System, ADAS, Body & Chassis, and Infotainment & Connectivity), Component Type (Power ICs & Modules, Microcontrollers & Processors, Discretes, Communication & Interface ICs, Sensor ICs, Gate Driver ICs, Memory & Storage ICs, Other Semiconductors), and Region. It covers the competitive landscape and company profiles of significant players in the EV semiconductors market. The study includes an in-depth competitive analysis of the key market players, their company profiles, key observations related to product and business offerings, recent developments, and key market strategies.

Key Benefits of Buying the Report:

• The report will help market leaders/new entrants with information on the closest approximations of revenue numbers for the EV semiconductors market and its subsegments.
• This report will help stakeholders understand the competitive landscape and gain more insights to position their businesses better and plan suitable go-to-market strategies.
• The report will also help stakeholders understand the market pulse and provides information on key market drivers, restraints, challenges, and opportunities.
• The report will also help stakeholders understand the EV semiconductors market's current and future pricing trends.
• The report will also help market leaders/new entrants with information on various market trends based on technology, propulsion, application, component type, and Region.

The report provides insight into the following pointers:

• Analysis of key drivers (Rising EV adoption, high semiconductor content per EV, technological advancements in chip design and integration), restraints (Long qualification cycles and strict automotive reliability standards; high cost of advanced materials; and geopolitical, trade, and export control risks; fragmented standards and interoperability challenges), opportunities (Growth in wide-bandgap materials, expansion in emerging markets, tier-1 and OEM partnerships/co-development), and challenges (Intense competition and margin pressure; cybersecurity, safety, and liability concerns).
• Product Development/Innovation: Detailed insights into upcoming technologies, research & development activities, and product launches in the EV semiconductors market
• Market Development: Comprehensive information about lucrative markets across varied regions
• Market Diversification: Exhaustive information about new products and services, untapped geographies, recent developments, and investments in the EV semiconductors market
• Competitive Assessment: In-depth assessment of market share, growth strategies, and service offerings of leading players like Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), NXP Semiconductors (Netherlands), Texas Instruments Incorporated (US), and Renesas Electronics Corporation (Japan), among others, in the EV semiconductors market

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 INCLUSIONS AND EXCLUSIONS
  • 1.3.3 YEARS CONSIDERED
• 1.4 CURRENCY CONSIDERED
• 1.5 STAKEHOLDERS

2 EXECUTIVE SUMMARY

• 2.1 KEY INSIGHTS AND MARKET HIGHLIGHTS
• 2.2 KEY MARKET PARTICIPANTS: SHARE INSIGHTS AND STRATEGIC DEVELOPMENTS
• 2.3 DISRUPTIVE TRENDS SHAPING MARKET
• 2.4 HIGH-GROWTH SEGMENTS AND EMERGING FRONTIERS
• 2.5 SNAPSHOT: GLOBAL MARKET SIZE, GROWTH RATE, AND FORECAST

3 PREMIUM INSIGHTS

• 3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN EV SEMICONDUCTORS MARKET
• 3.2 EV SEMICONDUCTORS MARKET, BY TECHNOLOGY
• 3.3 EV SEMICONDUCTORS MARKET, BY PROPULSION
• 3.4 EV SEMICONDUCTORS MARKET, BY APPLICATION
• 3.5 EV SEMICONDUCTORS MARKET, BY COMPONENT
• 3.6 EV SEMICONDUCTORS MARKET, BY REGION

4 MARKET OVERVIEW

• 4.1 INTRODUCTION
• 4.2 MARKET DYNAMICS
  • 4.2.1 DRIVERS
    • 4.2.1.1 Increased semiconductor content in EVs
    • 4.2.1.2 Innovations in chip design and integration
    • 4.2.1.3 Heightened EV adoption
    • 4.2.1.4 Rapid evolution of EV architectures
  • 4.2.2 RESTRAINTS
    • 4.2.2.1 Long qualification cycles and strict automotive reliability standards
    • 4.2.2.2 High cost of advanced materials
    • 4.2.2.3 Fragmented standards and limited interoperability
  • 4.2.3 OPPORTUNITIES
    • 4.2.3.1 Extensive use of wide-bandgap materials
    • 4.2.3.2 Expansion into emerging markets
    • 4.2.3.3 Collaborations between Tier 1s and OEMs
    • 4.2.3.4 Emerging applications of EV semiconductors
  • 4.2.4 CHALLENGES
    • 4.2.4.1 Stiff competition and margin pressure
    • 4.2.4.2 Cybersecurity, safety, and liability concerns
    • 4.2.4.3 Geopolitical, trade, and export control risks
• 4.3 UNMET NEEDS AND WHITE SPACES
  • 4.3.1 POWER ELECTRONICS FOR 800V SYSTEMS
  • 4.3.2 EV ARCHITECTURE AND COMPUTING
• 4.4 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES
• 4.5 STRATEGIC MOVES BY TIER-1/2/3 PLAYERS

5 INDUSTRY TRENDS

• 5.1 MACROECONOMIC INDICATORS
  • 5.1.1 INTRODUCTION
  • 5.1.2 GDP TRENDS AND FORECAST
  • 5.1.3 TRENDS IN GLOBAL EV INDUSTRY
  • 5.1.4 TRENDS IN GLOBAL AUTOMOTIVE AND TRANSPORTATION INDUSTRY
• 5.2 ECOSYSTEM ANALYSIS
  • 5.2.1 RAW MATERIAL SUPPLIERS
  • 5.2.2 CHIP DESIGN COMPANIES
  • 5.2.3 FOUNDRIES
  • 5.2.4 OSAT PROVIDERS
  • 5.2.5 COMPONENT MANUFACTURERS
  • 5.2.6 TIER-1 SUPPLIERS
  • 5.2.7 OEMS
• 5.3 SUPPLY CHAIN ANALYSIS
• 5.4 PRICING ANALYSIS
  • 5.4.1 AVERAGE SELLING PRICE OF EV SEMICONDUCTORS OFFERED BY KEY PLAYERS
  • 5.4.2 AVERAGE SELLING PRICE TREND, BY TECHNOLOGY
  • 5.4.3 AVERAGE SELLING PRICE TREND, BY REGION
• 5.5 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 5.6 INVESTMENT AND FUNDING SCENARIO
• 5.7 FUNDING, BY USE CASE
• 5.8 KEY CONFERENCES AND EVENTS
• 5.9 TRADE ANALYSIS
  • 5.9.1 IMPORT SCENARIO (HS CODE 8541)
  • 5.9.2 EXPORT SCENARIO (HS CODE 8541)
  • 5.9.3 TRADE RESTRICTIONS
  • 5.9.4 US-CHINA EXPORT BANS
  • 5.9.5 EU SUBSIDY RACE
  • 5.9.6 IMPACT OF LOCALIZATION POLICIES ON SOURCING
  • 5.9.7 CXO PRIORITIES
• 5.10 CASE STUDY ANALYSIS
  • 5.10.1 ELECTROTHERMAL SIMULATION FOR AEC COMPLIANCE IN AUTOMOTIVE SMART FET DRIVERS
  • 5.10.2 SMART DATA CONTROL ROOM INTEGRATION FOR SEMICONDUCTOR MANUFACTURING OPTIMIZATION
  • 5.10.3 LEGACY SEMICONDUCTOR FAB MODERNIZATION THROUGH ADVANCED AUTOMATION PLATFORM
  • 5.10.4 RAPID EV MOTOR CONTROL UNIT DEVELOPMENT THROUGH SEMICONDUCTOR SENSOR INTEGRATION
  • 5.10.5 POWER ELECTRONICS AND COMPOUND SEMICONDUCTORS ACCELERATE EV INNOVATION
  • 5.10.6 BYD ADVANCES EV SEMICONDUCTOR INNOVATION WITH 1500V SIC CHIPS FOR 1000V SUPER E-PLATFORM
  • 5.10.7 WIDE-BANDGAP SEMICONDUCTORS ENABLING 800V POWERTRAIN
• 5.11 2025 US TARIFF
  • 5.11.1 INTRODUCTION
  • 5.11.2 KEY TARIFF RATES
  • 5.11.3 PRICE IMPACT ANALYSIS
  • 5.11.4 IMPACT ON COUNTRIES/REGIONS
  • 5.11.5 IMPACT ON AUTOMOTIVE INDUSTRY

6 TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACT, PATENTS, INNOVATIONS, AND FUTURE APPLICATIONS

• 6.1 KEY TECHNOLOGIES
  • 6.1.1 SIC MOSFETS AND JFETS
  • 6.1.2 800V TRACTION INVERTERS
  • 6.1.3 GAN HEMTS
  • 6.1.4 COMPACT ONBOARD CHARGERS AND DC-DC CONVERTERS
  • 6.1.5 HYBRID SIC-GAN MODULES
• 6.2 COMPLEMENTARY TECHNOLOGIES
  • 6.2.1 ADVANCED PACKAGING AND INTEGRATION
  • 6.2.2 NEXT-GENERATION SENSOR SEMICONDUCTORS
  • 6.2.3 POWER AND CONTROL ICS
  • 6.2.4 HIGH-VOLTAGE INTERCONNECTS
• 6.3 ADJACENT TECHNOLOGIES
  • 6.3.1 AI AND EDGE PROCESSING CHIPS
  • 6.3.2 V2X AND CONNECTIVITY SEMICONDUCTORS
• 6.4 TECHNOLOGY ROADMAP
• 6.5 PATENT ANALYSIS
• 6.6 FUTURE APPLICATIONS
• 6.7 IMPACT OF AI/GEN AI
  • 6.7.1 TOP USE CASES AND MARKET POTENTIAL
  • 6.7.2 BEST PRACTICES
  • 6.7.3 CASE STUDIES
  • 6.7.4 ADJACENT ECOSYSTEM AND IMPACT ON MARKET PLAYERS
  • 6.7.5 CLIENTS' READINESS TO ADOPT AI/GEN AI
• 6.8 SUCCESS STORIES AND REAL-WORLD APPLICATIONS
  • 6.8.1 INFINEON TECHNOLOGIES AG: AI-ENHANCED POWER MODULE OPTIMIZATION
  • 6.8.2 TEXAS INSTRUMENTS INCORPORATED: PREDICTIVE SEMICONDUCTOR MANUFACTURING
  • 6.8.3 STMICROELECTRONICS: AI-ASSISTED DESIGN AND VERIFICATION
  • 6.8.4 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: AI-DRIVEN YIELD AND SUPPLY CHAIN RESILIENCE
• 6.9 REGIONAL SEMICONDUCTOR HOTSPOTS AND LOCALIZATION DYNAMICS
• 6.10 SUPPLY CHAIN RISKS IN SIC AND GAN WAFER CONCENTRATION
• 6.11 POLICY DRIVES SHAPING SEMICONDUCTOR SOURCING
• 6.12 COST TRAJECTORIES FOR NEXT-GENERATION SEMICONDUCTORS
• 6.13 SEMICONDUCTOR SHARE OF EV BILL OF MATERIALS
• 6.14 SOURCING MODELS: MULTI-SUPPLIER VS. CAPTIVE DESIGN
• 6.15 FUTURE EV MODEL LAUNCH PIPELINE AND SEMICONDUCTOR DEMAND

7 SUSTAINABILITY AND REGULATORY LANDSCAPE

• 7.1 REGIONAL REGULATIONS AND COMPLIANCE
  • 7.1.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • 7.1.2 INDUSTRY STANDARDS
• 7.2 SUSTAINABILITY INITIATIVES
• 7.3 SUSTAINABILITY IMPACT AND REGULATORY POLICY INITIATIVES
• 7.4 CERTIFICATIONS, LABELING, AND ECO-STANDARDS

8 CUSTOMER LANDSCAPE AND BUYER BEHAVIOR

• 8.1 DECISION-MAKING PROCESS
• 8.2 BUYER STAKEHOLDERS AND BUYING EVALUATION CRITERIA
  • 8.2.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 8.2.2 BUYING CRITERIA
• 8.3 ADOPTION BARRIERS AND INTERNAL CHALLENGES
• 8.4 UNMET NEEDS FROM VARIOUS END-USE INDUSTRIES
• 8.5 MARKET PROFITABILITY
  • 8.5.1 REVENUE POTENTIAL
  • 8.5.2 COST DYNAMICS

9 EV SEMICONDUCTORS MARKET, BY TECHNOLOGY

• 9.1 INTRODUCTION
• 9.2 SILICON-BASED SEMICONDUCTOR
  • 9.2.1 STRONG ECOSYSTEM FOR MCUS, SENSORS, AND POWER ICS TO DRIVE MARKET
• 9.3 WIDE-BANDGAP SEMICONDUCTOR
  • 9.3.1 SOFTWARE-BASED ARCHITECTURE, ADAS ADVANCEMENTS, AND SHIFT TO 800V EV ARCHITECTURE TO DRIVE MARKET
• 9.4 PRIMARY INSIGHTS

10 EV SEMICONDUCTORS MARKET, BY PROPULSION

• 10.1 INTRODUCTION
• 10.2 BEV
  • 10.2.1 ADOPTION OF SIC/GAN POWER DEVICES FOR TRACTION INVERTERS TO DRIVE MARKET
• 10.3 PHEV
  • 10.3.1 DEMAND FOR DUAL-MODE BMS ICS AND POWER MODULES FOR MULTI-VOLTAGE SYSTEMS TO DRIVE MARKET
• 10.4 PRIMARY INSIGHTS

11 EV SEMICONDUCTORS MARKET, BY COMPONENT

• 11.1 INTRODUCTION
• 11.2 POWER IC & MODULE
  • 11.2.1 TRANSITION TO HIGH-VOLTAG EV ARCHITECTURE AND WBG MATERIALS TO DRIVE MARKET
• 11.3 MICROCONTROLLER & PROCESSOR
  • 11.3.1 GROWTH OF ZONAL/DOMAIN CONTROLLERS AND REAL-TIME SENSOR FUSION FOR ADAS TO DRIVE MARKET
• 11.4 DISCRETE
  • 11.4.1 INCREASE IN 48V SUBSYSTEMS FOR BODY AND COMFORT ELECTRONICS TO DRIVE MARKET
• 11.5 COMMUNICATION & INTERFACE IC
  • 11.5.1 DEPLOYMENT OF MULTI-PROTOCOL 10 GBPS ETHERNET & V2X AND TELEMATICS GATEWAYS TO DRIVE MARKET
• 11.6 SENSOR IC
  • 11.6.1 RAPID SENSOR PROLIFERATION FOR LIDAR, IMAGING RADAR, AND BMS TO DRIVE MARKET
• 11.7 GATE DRIVER IC
  • 11.7.1 PRECISION CONTROL OF HIGH-SPEED SIC/GAN MOSFETS TO DRIVE MARKET
• 11.8 MEMORY & STORAGE IC
  • 11.8.1 HIGH-BANDWIDTH DRAM FOR INFOTAINMENT AND RESILIENT NAND STORAGE FOR OTA/DIAGNOSTICS TO DRIVE MARKET
• 11.9 OTHER SEMICONDUCTORS
• 11.10 PRIMARY INSIGHTS

12 EV SEMICONDUCTORS MARKET, BY APPLICATION

• 12.1 INTRODUCTION
• 12.2 BMS
  • 12.2.1 FOCUS ON CELL-LEVEL MONITORING AND COMPLEX THERMAL MANAGEMENT TO DRIVE MARKET
• 12.3 POWERTRAIN SYSTEM
  • 12.3.1 SIC MOSFET TRANSITION AND INTEGRATED GATE DRIVERS TO DRIVE MARKET
• 12.4 ADAS
  • 12.4.1 HIGHER LEVEL OF AUTONOMY AND HIGH-SPEED IN-VEHICLE NETWORKS TO DRIVE MARKET
• 12.5 BODY & CHASSIS
  • 12.5.1 ELECTRIFICATION OF MECHANICAL SYSTEMS AND SHIFT TO ZONAL CONTROLLERS TO DRIVE MARKET
• 12.6 INFOTAINMENT & CONNECTIVITY
  • 12.6.1 INNOVATION IN SDV ARCHITECTURE, OTA UPDATES, AND HIGH-SPEED CONNECTIVITY MODULES TO DRIVE MARKET
• 12.7 PRIMARY INSIGHTS

13 EV SEMICONDUCTORS MARKET, BY REGION

• 13.1 INTRODUCTION
• 13.2 ASIA PACIFIC
  • 13.2.1 CHINA
    • 13.2.1.1 Local semiconductor production scale and localization efforts for SiC/GaN semiconductors to drive market
  • 13.2.2 INDIA
    • 13.2.2.1 Government incentives for local manufacturing and substantial investments by OEMs to drive market
  • 13.2.3 JAPAN
    • 13.2.3.1 Power semiconductor leadership and high ADAS integration to drive market
  • 13.2.4 SOUTH KOREA
    • 13.2.4.1 Strong local EV battery supply chains and high export focus to drive market
• 13.3 EUROPE
  • 13.3.1 GERMANY
    • 13.3.1.1 Premium EV platforms with high semiconductor content to drive market
  • 13.3.2 FRANCE
    • 13.3.2.1 Growing ADAS integration in passenger EVs to drive market
  • 13.3.3 ITALY
    • 13.3.3.1 SiC FAB scale-ups and robust supplier ecosystem to drive market
  • 13.3.4 SPAIN
    • 13.3.4.1 EU funding alignment and strong local manufacturing hub to drive market
  • 13.3.5 UK
    • 13.3.5.1 Increased SiC production and government-supported industrialization and development centers to drive market
• 13.4 NORTH AMERICA
  • 13.4.1 US
    • 13.4.1.1 Rigorous onshoring policies and supporting government funding to drive market
  • 13.4.2 CANADA
    • 13.4.2.1 Strong automotive semiconductor R&D and growing IC design hubs to drive market
  • 13.4.3 MEXICO
    • 13.4.3.1 Export-focused assembly hubs and integration into North American supply chains to drive market

14 COMPETITIVE LANDSCAPE

• 14.1 INTRODUCTION
• 14.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2022-2025
• 14.3 MARKET SHARE ANALYSIS, 2024
• 14.4 REVENUE ANALYSIS, 2020-2024
• 14.5 COMPANY VALUATION AND FINANCIAL METRICS
• 14.6 BRAND/PRODUCT COMPARISON
• 14.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024
  • 14.7.1 STARS
  • 14.7.2 EMERGING LEADERS
  • 14.7.3 PERVASIVE PLAYERS
  • 14.7.4 PARTICIPANTS
  • 14.7.5 COMPANY FOOTPRINT
    • 14.7.5.1 Company footprint
    • 14.7.5.2 Region footprint
    • 14.7.5.3 Technology footprint
    • 14.7.5.4 Application footprint
    • 14.7.5.5 Propulsion footprint
• 14.8 COMPANY EVALUATION MATRIX: START-UPS/SMES, 2024
  • 14.8.1 PROGRESSIVE COMPANIES
  • 14.8.2 RESPONSIVE COMPANIES
  • 14.8.3 DYNAMIC COMPANIES
  • 14.8.4 STARTING BLOCKS
  • 14.8.5 COMPETITIVE BENCHMARKING
    • 14.8.5.1 List of start-ups/SMEs
    • 14.8.5.2 Competitive benchmarking of start-ups/SMEs
• 14.9 COMPETITIVE SCENARIO
  • 14.9.1 PRODUCT LAUNCHES
  • 14.9.2 DEALS
  • 14.9.3 EXPANSIONS
  • 14.9.4 OTHER DEVELOPMENTS

15 COMPANY PROFILES

• 15.1 KEY PLAYERS
  • 15.1.1 INFINEON TECHNOLOGIES AG
    • 15.1.1.1 Business overview
    • 15.1.1.2 Products/Solutions offered
    • 15.1.1.3 Recent developments
      • 15.1.1.3.1 Product launches/developments
      • 15.1.1.3.2 Deals
      • 15.1.1.3.3 Expansions
      • 15.1.1.3.4 Other developments
    • 15.1.1.4 MnM view
      • 15.1.1.4.1 Right to win
      • 15.1.1.4.2 Strategic choices
      • 15.1.1.4.3 Weaknesses and competitive threats
  • 15.1.2 STMICROELECTRONICS
    • 15.1.2.1 Business overview
    • 15.1.2.2 Products/Solutions offered
    • 15.1.2.3 Recent developments
      • 15.1.2.3.1 Product launches/developments
      • 15.1.2.3.2 Deals
      • 15.1.2.3.3 Expansions
      • 15.1.2.3.4 Other developments
    • 15.1.2.4 MnM view
      • 15.1.2.4.1 Right to win
      • 15.1.2.4.2 Strategic choices
      • 15.1.2.4.3 Weaknesses and competitive threats
  • 15.1.3 NXP SEMICONDUCTORS
    • 15.1.3.1 Business overview
    • 15.1.3.2 Products/Solutions offered
    • 15.1.3.3 Recent developments
      • 15.1.3.3.1 Product launches/developments
      • 15.1.3.3.2 Deals
      • 15.1.3.3.3 Expansions
      • 15.1.3.3.4 Other developments
    • 15.1.3.4 MnM view
      • 15.1.3.4.1 Right to win
      • 15.1.3.4.2 Strategic choices
      • 15.1.3.4.3 Weaknesses and competitive threats
  • 15.1.4 TEXAS INSTRUMENTS INCORPORATED
    • 15.1.4.1 Business overview
    • 15.1.4.2 Products/Solutions offered
    • 15.1.4.3 Recent developments
      • 15.1.4.3.1 Product launches/developments
      • 15.1.4.3.2 Deals
      • 15.1.4.3.3 Expansions
      • 15.1.4.3.4 Other developments
    • 15.1.4.4 MnM view
      • 15.1.4.4.1 Right to win
      • 15.1.4.4.2 Strategic choices
      • 15.1.4.4.3 Weaknesses and competitive threats
  • 15.1.5 RENESAS ELECTRONICS CORPORATION
    • 15.1.5.1 Business overview
    • 15.1.5.2 Products/Solutions offered
    • 15.1.5.3 Recent developments
      • 15.1.5.3.1 Product launches/developments
      • 15.1.5.3.2 Deals
      • 15.1.5.3.3 Expansions
      • 15.1.5.3.4 Other developments
    • 15.1.5.4 MnM view
      • 15.1.5.4.1 Right to win
      • 15.1.5.4.2 Strategic choices
      • 15.1.5.4.3 Weaknesses and competitive threats
  • 15.1.6 QUALCOMM TECHNOLOGIES, INC.
    • 15.1.6.1 Business overview
    • 15.1.6.2 Products/Solutions offered
    • 15.1.6.3 Recent developments
      • 15.1.6.3.1 Product launches/developments
      • 15.1.6.3.2 Expansions
  • 15.1.7 NVIDIA CORPORATION
    • 15.1.7.1 Business overview
    • 15.1.7.2 Products/Solutions offered
    • 15.1.7.3 Recent developments
      • 15.1.7.3.1 Product launches/developments
      • 15.1.7.3.2 Deals
  • 15.1.8 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • 15.1.8.1 Business overview
    • 15.1.8.2 Products/Solutions offered
    • 15.1.8.3 Recent developments
      • 15.1.8.3.1 Product launches/developments
      • 15.1.8.3.2 Deals
      • 15.1.8.3.3 Expansions
  • 15.1.9 ANALOG DEVICES, INC.
    • 15.1.9.1 Business overview
    • 15.1.9.2 Products/Solutions offered
    • 15.1.9.3 Recent developments
      • 15.1.9.3.1 Deals
      • 15.1.9.3.2 Expansions
  • 15.1.10 ROBERT BOSCH GMBH
    • 15.1.10.1 Business overview
    • 15.1.10.2 Products/Solutions offered
    • 15.1.10.3 Recent developments
      • 15.1.10.3.1 Product launches/developments
      • 15.1.10.3.2 Deals
      • 15.1.10.3.3 Expansions
  • 15.1.11 MICRON TECHNOLOGY, INC.
    • 15.1.11.1 Business overview
    • 15.1.11.2 Products/Solutions offered
    • 15.1.11.3 Recent developments
      • 15.1.11.3.1 Expansions
      • 15.1.11.3.2 Other developments
  • 15.1.12 MICROCHIP TECHNOLOGY INC.
    • 15.1.12.1 Business overview
    • 15.1.12.2 Products/Solutions offered
    • 15.1.12.3 Recent developments
      • 15.1.12.3.1 Product launches/developments
      • 15.1.12.3.2 Deals
      • 15.1.12.3.3 Expansions
• 15.2 OTHER PLAYERS
  • 15.2.1 TOSHIBA CORPORATION
  • 15.2.2 POLAR SEMICONDUCTOR, LLC
  • 15.2.3 ROHM CO., LTD.
  • 15.2.4 MARVELL
  • 15.2.5 BROADCOM
  • 15.2.6 MITSUBISHI ELECTRIC CORPORATION
  • 15.2.7 STARPOWER SEMICONDUCTOR LTD.
  • 15.2.8 SEMIKRON DANFOSS
  • 15.2.9 CAMBRIDGE GAN DEVICES
  • 15.2.10 HUAWEI TECHNOLOGIES CO., LTD.
  • 15.2.11 BOS SEMICONDUCTORS
  • 15.2.12 ENSILICA
  • 15.2.13 INDIE

16 RESEARCH METHODOLOGY

• 16.1 RESEARCH DATA
  • 16.1.1 SECONDARY DATA
    • 16.1.1.1 Secondary sources
    • 16.1.1.2 Key data from secondary sources
  • 16.1.2 PRIMARY DATA
    • 16.1.2.1 Primary interviews: demand and supply sides
    • 16.1.2.2 Breakdown of primary interviews
    • 16.1.2.3 Primary participants
• 16.2 MARKET SIZE ESTIMATION
  • 16.2.1 BOTTOM-UP APPROACH
  • 16.2.2 TOP-DOWN APPROACH
• 16.3 DATA TRIANGULATION
• 16.4 FACTOR ANALYSIS
• 16.5 RESEARCH ASSUMPTIONS
• 16.6 RESEARCH LIMITATIONS
• 16.7 RISK ASSESSMENT

17 APPENDIX

• 17.1 INSIGHTS FROM INDUSTRY EXPERTS
• 17.2 DISCUSSION GUIDE
• 17.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 17.4 CUSTOMIZATION OPTIONS
  • 17.4.1 EV SEMICONDUCTORS MARKET FOR HYBRID ELECTRIC VEHICLES AT REGIONAL LEVEL (FOR COUNTRIES COVERED IN REPORT)
  • 17.4.2 EV SEMICONDUCTORS MARKET, BY TECHNOLOGY, FOR ADDITIONAL COUNTRIES (FOR COUNTRIES NOT COVERED IN REPORT)
  • 17.4.3 COMPANY INFORMATION (PROFILING OF UP TO FIVE ADDITIONAL MARKET PLAYERS)
• 17.5 RELATED REPORTS
• 17.6 AUTHOR DETAILS