Fab 자동화 시장 : 제공 제품별, 자동화층별, 웨이퍼 사이즈별, 전개 유형별, Fab 타입별, 최종사용자별, 지역별 - 예측(-2032년)

The fab automation market is projected to reach USD 25.24 billion in 2025 and USD 41.44 billion by 2032, registering a CAGR of 7.3% between 2025 and 2032. The market is projected to witness substantial growth during the forecast period, driven by the increasing complexity of semiconductor manufacturing and the global push toward higher yields, faster cycle times, and greater operational consistency.

Expanding 300 mm capacity, advanced-node production, and heterogeneous integration are accelerating the adoption of automated material handling systems (AMHS), robotics, manufacturing execution systems (MES), advanced process control (APC), yield management software (YMS), and AI-enabled analytics. These solutions enable fabs to achieve precision handling, real-time process optimization, and predictive maintenance, ensuring compliance with ultra-clean manufacturing standards. Growth is further supported by large-scale investments in new greenfield fabs, government semiconductor incentives, and the rising demand for chips powering AI, 5G, automotive electronics, and high-performance computing. However, high implementation costs, integration complexity, and the need for skilled technical resources may present operational challenges. Strengthening interoperability, modular deployments, and partnerships across the automation ecosystem will be essential to sustaining long-term market expansion.

"By end user, the outsourced semiconductor assembly & test (OSAT) providers segment is expected to register the highest CAGR between 2025 and 2032."

The outsourced semiconductor assembly and test (OSAT) providers segment is expected to register the highest CAGR in the fab automation market between 2025 and 2032, driven by the rapid growth of advanced packaging, heterogeneous integration, and chiplet-based architectures. OSAT facilities are experiencing rising demand for high-precision, contamination-free, and high-throughput automation solutions to support complex processes such as wafer-level packaging (WLP), fan-out technologies, 2.5D/3D stacking, and advanced test operations. To manage increasing device complexity and shrinking tolerances, OSATs are deploying Automated Material Handling Systems (AMHS), robotics, smart inspection systems, Manufacturing Execution Systems (MES), Advanced Process Control (APC), and AI-enabled analytics to enhance yield, reduce operational variability, and maintain traceability across packaging and test workflows. The expansion of AI, HPC, automotive electronics, and 5G applications is further driving OSAT customers to demand faster cycle times, scalable production, and higher reliability. As packaging becomes a critical differentiator in semiconductor performance, OSATs are accelerating investments in digital transformation, automation upgrades, and cleanroom optimization. The combination of rising outsourcing trends, advanced packaging demand, and the need for cost-efficient, high-volume production positions OSAT providers as a pivotal and fast-growing end-user segment in the global fab automation market.

"Based on offering, the hardware segment is projected to account for the largest market share in 2032."

The hardware segment is projected to account for the largest share of the fab automation market by 2032, driven by the rapid expansion of semiconductor manufacturing capacity and the increasing demand for high-throughput, contamination-controlled production environments. As fabs scale advanced-node and 300mm lines, demand for robust hardware, including automated material handling systems (AMHS), robotics, wafer-handling equipment, environmental control systems, power and utility automation systems, and communication and networking hardware, continues to rise. These systems form the physical backbone of automated fabs, enabling precise wafer transport, maintaining stable cleanroom conditions, ensuring uninterrupted utility management, and ensuring reliable equipment connectivity. The surge in logic, memory, and advanced packaging production driven by AI, HPC, automotive electronics, and 5G applications is further accelerating investments in automation hardware. Greenfield fabs in the Asia Pacific, the US, and Europe are increasingly prioritizing end-to-end automated infrastructure to ensure yield consistency, reduce cycle time, and enhance operational resilience. Additionally, the modernization of brownfield facilities is boosting the adoption of next-generation robotics, AMHS upgrades, and advanced contamination control systems. As semiconductor processes become more complex and throughput requirements rise, hardware will remain the foundational and most heavily invested offering within the global fab automation landscape.

"The Americas region is projected to exhibit the highest CAGR from 2025 to 2032."

The Americas region is projected to exhibit the highest CAGR in the fab automation market from 2025 to 2032, driven by substantial investments in advanced semiconductor manufacturing, modernization of existing fabs, and renewed government focus on strengthening domestic chip production. The region, comprising the US and the Rest of the Americas, is advancing multiple greenfield and brownfield projects aimed at supporting leading-edge logic, memory, and heterogeneous integration technologies. As new fabs emphasize high-throughput, contamination-free, and energy-efficient operations, demand is rising for automated material handling systems (AMHS), robotics, environmental control systems, advanced metrology hardware, and factory communication infrastructure. The US leads regional growth, fueled by substantial capital expenditure from IDMs, foundries, and OSATs, alongside incentives under national semiconductor policies that prioritize automation, digital transformation, and workforce optimization. Increasing adoption of sub-10 nm and EUV-enabled processes is further accelerating the need for precision handling equipment and intelligent automation platforms. Meanwhile, countries in the Rest of the Americas are expanding backend assembly, test, and packaging capabilities, creating additional demand for scalable, cost-efficient automation solutions. Collectively, strong policy support, rising semiconductor consumption, and large-scale capacity expansion position the Americas as a high-growth hub for next-generation fab automation.

The break-up of the profile of primary participants in the fab automation market-

• By Company Type: Tier 1 - 35%, Tier 2 - 45%, Tier 3 - 20%
• By Designation: C-level Executives - 40%, Directors - 30%, Others - 30%
• By Region: Americas - 40%, EMEA - 25%, Asia Pacific - 35%

Note: Other designations include sales, marketing, and product managers.

The three tiers of the companies are based on their total revenues as of 2024: Tier 1: >USD 1 billion, Tier 2: USD 500 million-1 billion, and Tier 3: USD 500 million.

The major players in the fab automation market with a significant global presence include Daifuku (Japan), Murata Machinery (Japan), Atlas Copco (Sweden), Rorze Automation (Japan), and Ebara (Japan).

Research Coverage

The report segments the fab automation market and forecasts its size by offering, deployment type, wafer size, end user, and region. It also comprehensively reviews the drivers, restraints, opportunities, and challenges that influence market growth. The report encompasses both qualitative and quantitative aspects of the market.

Reasons to Buy the Report:

The report will help the market leaders/new entrants with information on the closest approximate revenues for the overall fab automation market and related segments. This report will help stakeholders understand the competitive landscape and gain valuable insights to strengthen their market position and develop effective go-to-market strategies. The report also helps stakeholders understand the pulse of the market, providing them with information on key market drivers, restraints, opportunities, and challenges.

The report provides insights into the following pointers:

• Analysis of key drivers (expansion of advanced-node and EUV-enabled manufacturing requiring high-throughput automation; rapid growth in 300 mm fab capacity; rising process complexity across logic, memory, and advanced packaging; increasing adoption of AI/ML-driven predictive analytics and digital-twin platforms; government incentives accelerating greenfield fab construction), restraints (high capital expenditure for automation hardware and integration; limited interoperability between legacy and next-generation systems; shortages of skilled automation and software specialists; extended equipment lead times due to vendor concentration), opportunities (deployment of advanced automation for 2.5D/3D packaging and heterogeneous integration; emergence of autonomous, AI-enabled fabs; large-scale automation demand from new fabs in the US, Asia, and Europe; adoption of modular AMHS and collaborative robotics; sustainability-focused automation solutions for energy and cleanroom efficiency), and challenges (stringent ultra-clean manufacturing requirements increasing contamination and reliability risks; integration complexity across multi-vendor MES, APC, YMS, and AMHS ecosystems; maintaining automation performance at high wafer volumes and EUV process sensitivities; geopolitical disruptions affecting semiconductor equipment supply chains; high complexity and cost of modernizing brownfield fabs without production impact)
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and strategies such as new product launches, expansions, contracts, partnerships, and acquisitions in the fab automation market
• Market Development: Comprehensive information about lucrative markets-the report analyses the fab automation market across varied regions
• Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the fab automation market
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and product offerings of leading players, including Daifuku (Japan), Murata Machinery (Japan), Atlas Copco (Sweden), Rorze Automation (Japan), Ebara (Japan), FANUC (Japan), Kawasaki Heavy Industries (Japan), Hirata Corporation (Japan), Yaskawa (Japan), and KUKA AG (Germany).

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 YEARS CONSIDERED
  • 1.3.3 INCLUSIONS AND EXCLUSIONS
• 1.4 CURRENCY CONSIDERED
• 1.5 UNITS CONSIDERED
• 1.6 STAKEHOLDERS

2 EXECUTIVE SUMMARY

• 2.1 MARKET HIGHLIGHTS AND KEY INSIGHTS
• 2.2 KEY MARKET PARTICIPANTS: MAPPING OF STRATEGIC DEVELOPMENTS
• 2.3 DISRUPTIVE TRENDS IN FAB AUTOMATION MARKET
• 2.4 HIGH-GROWTH SEGMENTS
• 2.5 REGIONAL SNAPSHOT: MARKET SIZE, GROWTH RATE, AND FORECAST

3 PREMIUM INSIGHTS

• 3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN FAB AUTOMATION MARKET
• 3.2 FAB AUTOMATION MARKET, BY OFFERING
• 3.3 FAB AUTOMATION MARKET, BY WAFER SIZE
• 3.4 FAB AUTOMATION MARKET, BY DEPLOYMENT TYPE
• 3.5 FAB AUTOMATION MARKET, BY END USER
• 3.6 FAB AUTOMATION MARKET, BY REGION
• 3.7 FAB AUTOMATION MARKET, BY COUNTRY

4 MARKET OVERVIEW

• 4.1 INTRODUCTION
• 4.2 MARKET DYNAMICS
  • 4.2.1 DRIVERS
    • 4.2.1.1 Rising demand for high-throughput, high-yield semiconductor manufacturing across AI, HPC, automotive, and 5G applications
    • 4.2.1.2 Expansion of advanced-node fabs requiring deep automation to sustain process stability
    • 4.2.1.3 Increasing adoption of AMHS, robotics, and contamination-free transport to reduce human intervention
    • 4.2.1.4 Increasing integration of MES, APC, YMS, and ECS platforms to enhance real-time process control and production efficiency
    • 4.2.1.5 Government-backed investments and incentive programs accelerating greenfield fabs and capacity expansion
  • 4.2.2 RESTRAINTS
    • 4.2.2.1 High capital investment requirements for full fab automation deployment, particularly in brownfield facilities
    • 4.2.2.2 Interoperability challenges between legacy tools and modern automation systems
    • 4.2.2.3 Limited availability of skilled automation engineers for system integration and fab-level optimization
    • 4.2.2.4 Supply chain constraints for automation components and cleanroom systems, resulting in extended deployment timelines
  • 4.2.3 OPPORTUNITIES
    • 4.2.3.1 AI/ML-driven automation enabling predictive maintenance, intelligent scheduling, and yield enhancement
    • 4.2.3.2 Rising automation demand in OSAT facilities driven by advanced packaging and throughput requirements
    • 4.2.3.3 Expansion of 300 mm fabs and modernization of 200 mm facilities, driving long-term automation upgrade cycles
    • 4.2.3.4 Growing adoption of digital twins and simulation platforms to optimize fab workflows and equipment layouts
  • 4.2.4 CHALLENGES
    • 4.2.4.1 Complex coordination and orchestration across multi-layer automation architectures in large semiconductor fabs
    • 4.2.4.2 Ensuring real-time, low-latency communication across distributed automation networks under heavy data loads
    • 4.2.4.3 Ensuring ultra-clean automated handling as device geometries shrink and contamination sensitivity intensifies
    • 4.2.4.4 Long deployment and integration timelines create operational risks in upgrading automation within running fabs
• 4.3 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES
  • 4.3.1 INTERCONNECTED MARKETS
  • 4.3.2 CROSS-SECTOR OPPORTUNITIES
• 4.4 STRATEGIC MOVES BY TIER 1/2/3 PLAYERS
  • 4.4.1 MARKET DYNAMICS

5 INDUSTRY TRENDS

• 5.1 INTRODUCTION
• 5.2 PORTER'S FIVE FORCES ANALYSIS
  • 5.2.1 THREAT OF NEW ENTRANTS
  • 5.2.2 THREAT OF SUBSTITUTES
  • 5.2.3 BARGAINING POWER OF SUPPLIERS
  • 5.2.4 BARGAINING POWER OF BUYERS
  • 5.2.5 INTENSITY OF COMPETITIVE RIVALRY
• 5.3 MACROECONOMIC INDICATORS
  • 5.3.1 INTRODUCTION
  • 5.3.2 GDP TRENDS AND FORECAST
  • 5.3.3 TRENDS IN MANUFACTURING & INDUSTRIAL AUTOMATION INDUSTRY
  • 5.3.4 TRENDS IN SEMICONDUCTOR MANUFACTURING INDUSTRY
• 5.4 VALUE CHAIN ANALYSIS
• 5.5 ECOSYSTEM ANALYSIS
• 5.6 PRICING ANALYSIS
  • 5.6.1 AVERAGE SELLING PRICE OF KEY PLAYERS, BY OFFERING, 2024
  • 5.6.2 AVERAGE SELLING PRICE, BY REGION, 2021-2024
• 5.7 TRADE ANALYSIS
  • 5.7.1 IMPORT SCENARIO (HS CODE 8479)
  • 5.7.2 EXPORT SCENARIO (HS CODE 8479)
• 5.8 KEY CONFERENCES AND EVENTS, 2026-2027
• 5.9 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESSES
• 5.10 INVESTMENT AND FUNDING SCENARIO, 2021-2025
• 5.11 CASE STUDY ANALYSIS
  • 5.11.1 TSMC'S CLEANROOM THROUGHPUT IMPROVEMENT WITH DAIFUKU'S NEO-AMHS PLATFORM
  • 5.11.2 SAMSUNG ELECTRONICS' AUTOMATION UPGRADE USING MURATA MACHINERY'S WAFER-HANDLING ROBOTICS
  • 5.11.3 GLOBALFOUNDRIES' APC/YMS TRANSFORMATION WITH APPLIED MATERIALS AUTOMATION SOFTWARE SOLUTIONS
• 5.12 IMPACT OF 2025 US TARIFF - FAB AUTOMATION MARKET
  • 5.12.1 KEY TARIFF RATES
  • 5.12.2 PRICE IMPACT ANALYSIS
  • 5.12.3 IMPACT ON COUNTRIES/REGIONS
    • 5.12.3.1 US
    • 5.12.3.2 Europe
    • 5.12.3.3 Asia Pacific
  • 5.12.4 IMPACT ON END USERS

6 TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACT, PATENTS, INNOVATIONS, AND FUTURE APPLICATIONS

• 6.1 KEY EMERGING TECHNOLOGIES
  • 6.1.1 AI-DRIVEN ADVANCED PROCESS CONTROL (APC) & PREDICTIVE AUTOMATION
  • 6.1.2 MODULAR & COLLABORATIVE AMHS PLATFORMS
  • 6.1.3 DIGITAL TWIN & VIRTUAL FAB SIMULATION PLATFORMS
• 6.2 COMPLEMENTARY TECHNOLOGIES
  • 6.2.1 EDGE COMPUTING & REAL-TIME DATA INFRASTRUCTURE
  • 6.2.2 HIGH-PRECISION CLEANROOM ENVIRONMENTAL CONTROL & MONITORING SYSTEMS
  • 6.2.3 SECURE FAB COMMUNICATION NETWORKS & INDUSTRIAL IOT CONNECTIVITY
• 6.3 ADJACENT TECHNOLOGIES
  • 6.3.1 ADVANCED PACKAGING & HETEROGENEOUS INTEGRATION AUTOMATION
  • 6.3.2 SEMICONDUCTOR MATERIALS DELIVERY & CHEMICAL MANAGEMENT SYSTEMS
• 6.4 TECHNOLOGY/PRODUCT ROADMAP
  • 6.4.1 SHORT-TERM (2025-2027): AUTOMATION MODERNIZATION & AI-AUGMENTED OPERATIONS
  • 6.4.2 MID-TERM (2027-2030): HYPER-AUTOMATION & ADVANCED PACKAGING INTEGRATION
  • 6.4.3 LONG-TERM (2030-2035+): AUTONOMOUS FABS & SYSTEM-LEVEL CONVERGENCE
• 6.5 PATENT ANALYSIS
• 6.6 IMPACT OF AI ON FAB AUTOMATION MARKET
  • 6.6.1 TOP USE CASES AND MARKET POTENTIAL
  • 6.6.2 BEST PRACTICES IN FAB AUTOMATION MARKET
  • 6.6.3 CASE STUDIES OF AI IMPLEMENTATION IN FAB AUTOMATION MARKET
  • 6.6.4 INTERCONNECTED ADJACENT ECOSYSTEM AND IMPACT ON MARKET PLAYERS
  • 6.6.5 CLIENTS' READINESS TO ADOPT GENERATIVE AI IN FAB AUTOMATION MARKET

7 REGULATORY LANDSCAPE

• 7.1 INTRODUCTION
  • 7.1.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
• 7.2 INDUSTRY STANDARDS
  • 7.2.1 SEMI STANDARDS (GEM, GEM300, E84, E87, EDA/INTERFACE A)
  • 7.2.2 ISO CLEANROOM & ENVIRONMENTAL CONTROL STANDARDS (ISO 14644 SERIES)
  • 7.2.3 ISO 10218 & IEC 61508 - ROBOTICS SAFETY & FUNCTIONAL SAFETY STANDARDS
  • 7.2.4 OPC UA FOR FAB EQUIPMENT COMMUNICATION
  • 7.2.5 ANSI/ISA-95 - MANUFACTURING INTEGRATION STANDARD
  • 7.2.6 SEMI S2 - ENVIRONMENTAL, HEALTH & SAFETY (EHS) STANDARD

8 CUSTOMER LANDSCAPE AND BUYER BEHAVIOR

• 8.1 DECISION-MAKING PROCESS
• 8.2 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 8.2.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 8.2.2 BUYING CRITERIA
• 8.3 ADOPTION BARRIERS AND INTERNAL CHALLENGES
• 8.4 UNMET NEEDS FROM VARIOUS END USERS

9 FAB AUTOMATION MARKET, BY OFFERING

• 9.1 INTRODUCTION
• 9.2 HARDWARE
  • 9.2.1 AUTOMATED MATERIAL HANDLING SYSTEMS
    • 9.2.1.1 AI-orchestrated throughput growth to fuel AMHS demand in fab automation
  • 9.2.2 ROBOTICS & HANDLING EQUIPMENT
    • 9.2.2.1 AI-enabled precision and vision integration to drive demand
  • 9.2.3 ENVIRONMENTAL CONTROL SYSTEMS
    • 9.2.3.1 Humidity and AMC control to increase demand for advanced environmental control systems
  • 9.2.4 POWER & UTILITY AUTOMATION SYSTEMS
    • 9.2.4.1 Power quality and energy-efficiency mandates to accelerate adoption of utility & power automation systems in fabs
  • 9.2.5 COMMUNICATION & NETWORKING HARDWARE
    • 9.2.5.1 Low-latency, deterministic connectivity requirements to drive market
• 9.3 SOFTWARE
  • 9.3.1 MANUFACTURING EXECUTION SYSTEMS
    • 9.3.1.1 Model-driven traceability and real-time dispatch to accelerate adoption
  • 9.3.2 EQUIPMENT CONTROL SOFTWARE
    • 9.3.2.1 Real-time tool-state coordination and recipe enforcement to drive adoption
  • 9.3.3 ADVANCED PROCESS CONTROL
    • 9.3.3.1 Shrinking process windows and high-mix production to drive APC integration
  • 9.3.4 YIELD MANAGEMENT SOFTWARE
    • 9.3.4.1 Defect density reduction and multi-source data fusion to increase adoption
  • 9.3.5 AI/ML & PREDICTIVE ANALYTICS PLATFORMS
    • 9.3.5.1 Predictive maintenance and lot-flow optimization to accelerate AI/ML deployment
  • 9.3.6 SIMULATION & DIGITAL TWIN SOFTWARE
    • 9.3.6.1 Capacity planning and virtual process optimization to expand digital twin usage
  • 9.3.7 MIDDLEWARE & COMMUNICATION PROTOCOL SOFTWARE
    • 9.3.7.1 Interoperability requirements and multi-vendor tool integration to fuel middleware adoption
• 9.4 SERVICES
  • 9.4.1 PROFESSIONAL SERVICES
    • 9.4.1.1 System integration complexity and node migration timelines to increase demand
  • 9.4.2 MANAGED SERVICES
    • 9.4.2.1 Predictive maintenance and 24/7 operational assurance to accelerate managed services adoption

10 FAB AUTOMATION MARKET, BY AUTOMATION LAYER

• 10.1 INTRODUCTION
• 10.2 MATERIAL HANDLING AUTOMATION
• 10.3 EQUIPMENT AUTOMATION
• 10.4 PROCESS AUTOMATION
• 10.5 FACTORY AUTOMATION SOFTWARE
• 10.6 AI/ANALYTICS AUTOMATION

11 FAB AUTOMATION MARKET, BY WAFER SIZE

• 11.1 INTRODUCTION
• 11.2 <150 MM
  • 11.2.1 INCREASED SPECIALTY-DEVICE PRODUCTION TO DRIVE ADOPTION
• 11.3 200 MM
  • 11.3.1 GROWTH IN POWER AND ANALOG DEVICES TO INCREASE DEMAND
• 11.4 300 MM
  • 11.4.1 ADVANCED PACKAGING DEMAND AND HIGH-VOLUME TEST REQUIREMENTS TO DRIVE MARKET

12 FAB AUTOMATION MARKET, BY DEPLOYMENT TYPE

• 12.1 INTRODUCTION
• 12.2 GREENFIELD FABS
  • 12.2.1 ADVANCED NODE CAPACITY EXPANSION AND HIGH-THROUGHPUT MANUFACTURING REQUIREMENTS TO DRIVE MARKET
• 12.3 BROWNFIELD FABS
  • 12.3.1 RETROFIT INVESTMENTS AND LEGACY-ASSET UTILIZATION TO SUPPORT MARKET GROWTH

13 FAB AUTOMATION MARKET, BY FAB TYPE

• 13.1 INTRODUCTION
• 13.2 ADVANCED NODE FABS (<=7 NM)
• 13.3 MAINSTREAM NODE FABS (10-28 NM)
• 13.4 MATURE NODE FABS (28-90 NM)
• 13.5 LEGACY NODE FABS (>90 NM)

14 FAB AUTOMATION MARKET, BY AUTOMATION LEVEL

• 14.1 INTRODUCTION
• 14.2 FULLY AUTOMATED
• 14.3 SEMI-AUTOMATED

15 FAB AUTOMATION MARKET, BY END USER

• 15.1 INTRODUCTION
• 15.2 INTEGRATED DEVICE MANUFACTURERS
  • 15.2.1 COMPLEX PRODUCT PORTFOLIOS AND MULTI-FAB MANUFACTURING COORDINATION TO DRIVE MARKET
• 15.3 FOUNDRIES
  • 15.3.1 HIGH-MIX PRODUCTION LOADS AND ADVANCED-NODE CAPACITY REQUIREMENTS TO PROPEL MARKET
• 15.4 OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST PROVIDERS
  • 15.4.1 ADVANCED PACKAGING DEMAND AND HIGH-VOLUME TEST REQUIREMENTS TO DRIVE MARKET
• 15.5 RESEARCH FABS
  • 15.5.1 HIGH-ACCURACY EXPERIMENTATION AND ACCELERATED PROTOTYPING DEMAND TO DRIVE MARKET

16 FAB AUTOMATION MARKET, BY REGION

• 16.1 INTRODUCTION
• 16.2 AMERICAS
  • 16.2.1 US
    • 16.2.1.1 Federal incentives and advanced-node capacity expansion to drive adoption
  • 16.2.2 REST OF AMERICAS
• 16.3 ASIA PACIFIC
  • 16.3.1 CHINA
    • 16.3.1.1 China's 300 mm expansion and localized automation ecosystem to drive market
  • 16.3.2 JAPAN
    • 16.3.2.1 Government subsidies and new 300 mm fab investments to accelerate demand
  • 16.3.3 SOUTH KOREA
    • 16.3.3.1 Memory-led capacity expansion and mega-cluster investments to accelerate demand
  • 16.3.4 TAIWAN
    • 16.3.4.1 Advanced-node expansion and foundry-led manufacturing growth to drive automation
  • 16.3.5 INDIA
    • 16.3.5.1 Government-backed fab expansion and growing domestic demand to drive adoption
  • 16.3.6 REST OF ASIA PACIFIC
• 16.4 EMEA
  • 16.4.1 EUROPE
    • 16.4.1.1 Advanced-node investments and power-semiconductor expansion to drive market
  • 16.4.2 MIDDLE EAST & AFRICA
    • 16.4.2.1 Government-led technology initiatives and emerging electronics manufacturing to support market growth

17 COMPETITIVE LANDSCAPE

• 17.1 OVERVIEW
• 17.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, JANUARY 2021-OCTOBER 2025
• 17.3 MARKET SHARE ANALYSIS, 2024
• 17.4 REVENUE ANALYSIS, 2021-2024
• 17.5 COMPANY VALUATION AND FINANCIAL METRICS
• 17.6 BRAND/PRODUCT COMPARISON
• 17.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024
  • 17.7.1 STARS
  • 17.7.2 EMERGING LEADERS
  • 17.7.3 PERVASIVE PLAYERS
  • 17.7.4 PARTICIPANTS
  • 17.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024
    • 17.7.5.1 Company footprint
    • 17.7.5.2 Region footprint
    • 17.7.5.3 Offering footprint
    • 17.7.5.4 Wafer size footprint
    • 17.7.5.5 Deployment type footprint
    • 17.7.5.6 End user footprint
• 17.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024
  • 17.8.1 PROGRESSIVE COMPANIES
  • 17.8.2 RESPONSIVE COMPANIES
  • 17.8.3 DYNAMIC COMPANIES
  • 17.8.4 STARTING BLOCKS
  • 17.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2024
    • 17.8.5.1 Detailed list of key startups/SMEs
    • 17.8.5.2 Competitive benchmarking of key startups/SMEs
• 17.9 COMPETITIVE SCENARIO
  • 17.9.1 PRODUCT LAUNCHES
  • 17.9.2 EXPANSIONS

18 COMPANY PROFILES

• 18.1 INTRODUCTION
• 18.2 KEY PLAYERS
  • 18.2.1 DAIFUKU CO., LTD.
    • 18.2.1.1 Business overview
    • 18.2.1.2 Products/Solutions/Services offered
    • 18.2.1.3 Recent developments
      • 18.2.1.3.1 Expansions
    • 18.2.1.4 MnM view
      • 18.2.1.4.1 Key strengths
      • 18.2.1.4.2 Strategic choices
      • 18.2.1.4.3 Weaknesses and competitive threats
  • 18.2.2 MURATA MACHINERY
    • 18.2.2.1 Business overview
    • 18.2.2.2 Products/Solutions/Services offered
    • 18.2.2.3 MnM view
      • 18.2.2.3.1 Key strengths
      • 18.2.2.3.2 Strategic choices
      • 18.2.2.3.3 Weaknesses and competitive threats
  • 18.2.3 EBARA CORPORATION
    • 18.2.3.1 Business overview
    • 18.2.3.2 Products/Solutions/Services offered
    • 18.2.3.3 MnM view
      • 18.2.3.3.1 Key strengths
      • 18.2.3.3.2 Strategic choices
      • 18.2.3.3.3 Weaknesses and competitive threats
  • 18.2.4 RORZE CORPORATION
    • 18.2.4.1 Business overview
    • 18.2.4.2 Products/Solutions/Services offered
    • 18.2.4.3 MnM view
      • 18.2.4.3.1 Key strengths
      • 18.2.4.3.2 Strategic choices
      • 18.2.4.3.3 Weaknesses and competitive threats
  • 18.2.5 FANUC
    • 18.2.5.1 Business overview
    • 18.2.5.2 Products/Solutions/Services offered
    • 18.2.5.3 MnM view
      • 18.2.5.3.1 Key strengths
      • 18.2.5.3.2 Strategic choices
      • 18.2.5.3.3 Weaknesses and competitive threats
  • 18.2.6 HIRATA CORPORATION
    • 18.2.6.1 Business overview
    • 18.2.6.2 Products/Solutions/Services offered
  • 18.2.7 KUKA AG
    • 18.2.7.1 Business overview
    • 18.2.7.2 Products/Solutions/Services offered
  • 18.2.8 YASKAWA ELECTRIC CORPORATION
    • 18.2.8.1 Business overview
    • 18.2.8.2 Products/Solutions/Services offered
  • 18.2.9 KAWASAKI HEAVY INDUSTRIES
    • 18.2.9.1 Business overview
    • 18.2.9.2 Products/Solutions/Services offered
• 18.3 OTHER PLAYERS
  • 18.3.1 ATLAS COPCO
  • 18.3.2 THIRA-UTECH
  • 18.3.3 DAIHEN CORPORATION
  • 18.3.4 BROOKS AUTOMATION
  • 18.3.5 MIRLE AUTOMATION
  • 18.3.6 SYNUS TECH
  • 18.3.7 SHINKO ELECTRIC INDUSTRIES
  • 18.3.8 MEETFUTURE
  • 18.3.9 FABMATICS
  • 18.3.10 TAIYO INC.
  • 18.3.11 SINEVA
  • 18.3.12 CASTEC INTERNATIONAL
  • 18.3.13 SYSTEMA GMBH
  • 18.3.14 KYOWA ELECTRIC & INSTRUMENT
  • 18.3.15 AMHS TECHNOLOGIES
  • 18.3.16 ATS AUTOMATION
  • 18.3.17 NIDEC CORPORATION
  • 18.3.18 GENMARK AUTOMATION
  • 18.3.19 JEL CORPORATION
  • 18.3.20 KENSINGTON LABS
  • 18.3.21 SIEMENS
  • 18.3.22 ROCKWELL AUTOMATION
• 18.4 END USERS
  • 18.4.1 FOUNDRIES
    • 18.4.1.1 Taiwan Semiconductor Manufacturing Company Limited
    • 18.4.1.2 Samsung
    • 18.4.1.3 GlobalFoundries
    • 18.4.1.4 SMIC
    • 18.4.1.5 United Microelectronics Corporation
  • 18.4.2 IDM FIRMS
    • 18.4.2.1 Intel Corporation
    • 18.4.2.2 Texas Instruments Incorporated
    • 18.4.2.3 Infineon Technologies AG
  • 18.4.3 OSAT COMPANIES
    • 18.4.3.1 ASE Technology Holding Co., Ltd.
    • 18.4.3.2 Amkor Technology

19 RESEARCH METHODOLOGY

• 19.1 RESEARCH DATA
  • 19.1.1 SECONDARY AND PRIMARY RESEARCH
  • 19.1.2 SECONDARY DATA
    • 19.1.2.1 List of key secondary sources
    • 19.1.2.2 Key data from secondary sources
  • 19.1.3 PRIMARY DATA
    • 19.1.3.1 List of primary interview participants
    • 19.1.3.2 Breakdown of primaries
    • 19.1.3.3 Key data from primary sources
    • 19.1.3.4 Key industry insights
• 19.2 MARKET SIZE ESTIMATION
  • 19.2.1 BOTTOM-UP APPROACH
  • 19.2.2 TOP-DOWN APPROACH
• 19.3 DATA TRIANGULATION
• 19.4 RESEARCH ASSUMPTIONS
• 19.5 RESEARCH LIMITATIONS AND RISK ASSESSMENT

20 APPENDIX

• 20.1 INSIGHTS FROM INDUSTRY EXPERTS
• 20.2 DISCUSSION GUIDE
• 20.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 20.4 CUSTOMIZATION OPTIONS
• 20.5 RELATED REPORTS
• 20.6 AUTHOR DETAILS