옵토일렉트로닉스 : 시장 점유율 분석, 산업 동향, 통계, 성장 예측(2025-2030년)

The optoelectronics market size reached USD 45.79 billion in 2025 and is forecast to climb to USD 59.12 billion by 2030 as it advances at a 5.24% CAGR.

Demand is broad-based, spanning next-generation 3D sensing in consumer devices, higher-speed optical links for AI-heavy data centers, and advanced lighting and imaging systems in electric vehicles. Device innovation benefits from wide-bandgap materials that operate efficiently at elevated frequencies and temperatures, while policy incentives in Asia and North America encourage regional fabrication to bolster supply-chain resilience. Companies able to integrate metasurface optics or multi-junction VCSEL architectures are positioned to capture premium opportunities, especially where power efficiency and compact form factors are decisive. Across all end uses, buyers increasingly evaluate suppliers on the ability to certify both traceable sourcing of critical inputs and compliance with emerging export-control rules, factors that now influence design-win decisions as much as raw performance.

Global Optoelectronics Market Trends and Insights

Proliferation of VCSEL-based 3D sensing in Asian smartphones

Rising demand for secure facial authentication, spatial video capture, and indoor navigation is reinforcing the role of vertical-cavity surface-emitting lasers in flagship handsets. Major brands integrate multi-junction VCSEL arrays that raise optical power while cutting battery drain, ultimately improving user experience.Patent filings by Chinese vendors illustrate a push to localize the full VCSEL stack and reduce dependence on imported epi-wafers, a move aligned with broader semiconductor self-reliance goals. Component suppliers positioned with high-yield epi-growth and advanced testing capacity are securing multi-year supply agreements ahead of under-display 3D sensing roll-outs. As optical-AI co-processors mature, the optoelectronics market anticipates wider adoption of VCSEL-enabled gesture and environment mapping across mid-tier phones as well.

Stringent automotive LED-lighting mandates in Europe

European Union safety standards now favor adaptive LED headlights that minimize glare and improve night driving comfort, pushing carmakers to adopt sophisticated light-domain controllers.Tier-1 suppliers respond with RGB matrices that enable dynamic beam shaping, brand-signature animations, and energy savings that extend electric-vehicle range. Design cycles increasingly require close collaboration between lighting and thermal teams to meet lumen output and regulation targets without adding cooling mass. The legislation indirectly boosts the optoelectronics market because micro-optics, drivers, and sensors embedded in the modules add value beyond the LED die itself. Global automakers homologating models for Europe tend to propagate the same advanced lighting packages into other regions, broadening unit demand.

Chronic GaN-substrate supply constraints

Production of free-standing GaN wafers remains concentrated in a handful of specialized facilities, creating bottlenecks for high-power devices. Makeshift workarounds such as growing GaN on silicon help lower costs but introduce dislocation densities that limit voltage ratings. Governments now treat wide-bandgap substrates as critical assets, offering tax credits for domestic crystal-growth plants to ease strategic risk. Pioneering approaches like Qromis Substrate Technology adapt hetero-epitaxial stacks to 200 mm formats, promising higher throughput and better compatibility with mainstream fabs. While these measures will add capacity over the medium term, short-term shortages continue to prompt allocation prioritization in favor of electric-vehicle and defense programs.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid roll-out of 400 G fiber modules in North-American data centers
2. Government incentives for GaN LEDs in Southeast-Asian smart-city projects
3. High thermal-management cost of consumer VCSEL arrays

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

LEDs retained the largest position in the 2024 optoelectronics market, accounting for 34% revenue as horticulture lighting, automotive exterior modules, and commercial displays rebounded. The segment benefited from mature manufacturing lines and incremental chip-level improvements that squeezed more lumens per watt without major capital upgrades. In parallel, laser diodes-especially vertical-cavity and edge-emitting structures-advanced at a 6.8% CAGR outlook due to expanding 3D sensing, short-reach optical interconnect, and automotive LiDAR adoption. Multi-junction architectures now squeeze additional optical power from the same die area, a feature critical for under-display projectors where footprint is limited. Suppliers that combine wafer-scale testing with integrated driver ICs continue to gain design wins as handset makers favor turnkey emitter packages.

Rising interest in metasurface integration amplifies the value of precise beam shaping at the chip face, which in turn raises switching costs for device original equipment manufacturers. As metasurface libraries mature, laser-diode designers embed custom patterning in the final epitaxy step, delivering pattern and phase control unattainable with conventional lenses. The ability to tailor divergence profiles opens enterprise demand for AR displays and short-throw projectors, widening the total addressable optoelectronics market. LEDs will remain indispensable for large-area illumination, yet laser diodes are carving out premium niches where coherent light or tight beam steering is essential.

Gallium nitride maintained dominance in 2024 with a 41% optoelectronics market share, sustained by its superior electron mobility and thermal conductivity that allow efficient operation at high switching speeds. Wafer scaling to 200 mm supports cost reductions, while alloy engineering delivers ultraviolet-to-visible emission tuning for sensing and sterilization. However, silicon carbide exhibits the fastest growth trajectory at a 7.4% CAGR as its threefold higher thermal conductivity enables power devices for fast-charging electric vehicles and solar inverters. Government-backed pilot lines in the United States and Europe now qualify 8-inch SiC substrates, signaling a ramp toward mass production.

Indium phosphide garners renewed attention for data-center optics beyond 400 G because its direct bandgap accommodates high-modulation speeds with low drive voltage. Gallium arsenide remains the workhorse for infrared emitters in remote-control and time-of-flight sensors. Meanwhile, silicon photonics positions itself as a cost-effective solution for dense transceivers, leveraging CMOS fabs and hybrid laser attach to sidestep III-V wafer shortages. Collectively, these trends underscore material pluralism wherein application-specific requirements dictate substrate selection, enriching the broader optoelectronics market.

The Optoelectronics Market Report is Segmented by Device Type (LED, Laser Diode, Image Sensors, and More), Device Material (Gallium Nitride (GaN), Gallium Arsenide (GaAs), Silicon Carbide (SiC), and More), Application (Lighting and Display, Sensing and Imaging, and More), End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Geography Analysis

Asia Pacific dominates the optoelectronics market with 52% of 2024 revenue, a lead built on deep supply-chain integration, experienced labor, and long-standing policy support. China's foundry capacity continues to grow as provincial governments subsidize 200 mm and 300 mm fabs that focus on compound semiconductors, an expansion that mitigates some substrate shortages yet also raises concerns about overcapacity. Japan leverages its medical-imaging expertise to pioneer CMOS-sensor-based diagnostic platforms, boosting domestic demand while exporting subsystems to Europe and North America. South Korea's display vendors push micro-LED process nodes that shrink epi-defect density, creating new high-brightness panels for augmented reality. Taiwan remains indispensable in the advanced-packaging stack despite geopolitical risk, prompting multinational OEMs to diversify second-source assembly in Southeast Asia.

The Middle East and Africa region posts a 7.9% CAGR outlook through 2030, fueled by national defense procurements and smart-city megaprojects that integrate LED lighting, fiber backbones, and security imaging. United Arab Emirates and Saudi Arabia channel oil-export surpluses into sovereign technology clusters, inviting global optoelectronic players to establish regional design centers. African coastal economies invest in submarine fiber landing stations that anchor shorter terrestrial links, stimulating passive-optics demand and downstream maintenance services. Although base volumes remain modest compared with Asia, high growth accelerates adoption of niche devices such as cooled mid-wave IR detectors for perimeter systems.

North America sustains substantial optoelectronics market influence thanks to robust venture funding, strong university research, and the U.S. CHIPS incentive that earmarks USD 50 billion for semiconductor manufacturing and R&D. The National Semiconductor Technology Center provides shared prototyping lines that lower barrier-to-entry for photonics start-ups, while export-control updates tighten oversight of dual-use ICs. Canada nurtures quantum-photonics ventures that explore entanglement-based communication, adding a frontier segment to the regional opportunity set.

Europe contends with a gradual erosion of global semiconductor share yet retains leadership in metrology optics, automotive lighting, and lithography equipment. The Chips Act allocates EUR 43 billion to amplify local production, though the European Court of Auditors projects only 11.7% global share by 2030 absent further interventions. Germany and France coordinate pilot lines for wide-bandgap power devices, while Nordic nations expand compound-semiconductor epitaxy dedicated to space and defense customers. The region's stringent environmental rules stimulate demand for energy-efficient optoelectronic components, particularly in building automation.

South America remains a smaller but rising geography for the optoelectronics market, driven by broadband expansion, LED street-lighting programs, and agricultural imaging in Brazil and Argentina. International suppliers use joint-ventures to sidestep import duties and meet local-content requirements, seeding ecosystem capability that could scale in the next decade.

1. Sony Corporation
2. Samsung Electronics Co., Ltd.
3. ams-OSRAM AG
4. SK Hynix Inc.
5. Broadcom Inc.
6. Panasonic Holdings Corp.
7. Signify N.V.
8. Nichia Corporation
9. Texas Instruments Inc.
10. STMicroelectronics N.V.
11. Infineon Technologies AG
12. ON Semiconductor Corp.
13. Vishay Intertechnology Inc.
14. Renesas Electronics Corp.
15. Rohm Co., Ltd.
16. Omnivision Technologies Inc.
17. Cree LED (Wolfspeed, Inc.)
18. LITE-ON Technology Corp.
19. Sharp Corporation
20. Mitsubishi Electric Corp.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Proliferation of VCSEL-based 3-D Sensing in Asian Smartphones
  • 4.2.2 Stringent Automotive LED-Lighting Mandates in Europe
  • 4.2.3 Rapid Roll-out of 400 G Fiber Modules in North-American Data Centers
  • 4.2.4 Government Incentives for GaN LEDs in SE-Asian Smart-City Projects
  • 4.2.5 Digital Medical Imaging Boom Driving CMOS Sensors in Japan
  • 4.2.6 Middle-East Defense Modernization Fueling Infra-red Detector Demand
• 4.3 Market Restraints
  • 4.3.1 Chronic GaN-substrate Supply Constraints
  • 4.3.2 High Thermal-management Cost of Consumer VCSEL Arrays
  • 4.3.3 Export-control Barriers on Advanced Image-Sensor Supply Chains
  • 4.3.4 LED Price-Erosion Compressing Tier-2 Chinese Margins
• 4.4 Industry Ecosystem Analysis
• 4.5 Technological Outlook
• 4.6 Porter's Five Forces Analysis
  • 4.6.1 Bargaining Power of Suppliers
  • 4.6.2 Bargaining Power of Buyers
  • 4.6.3 Threat of New Entrants
  • 4.6.4 Threat of Substitutes
  • 4.6.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUES)

• 5.1 By Device Type
  • 5.1.1 LED
  • 5.1.2 Laser Diode
  • 5.1.3 Image Sensors
  • 5.1.4 Optocouplers
  • 5.1.5 Photovoltaic Cells
  • 5.1.6 Others
• 5.2 By Device Material
  • 5.2.1 Gallium Nitride (GaN)
  • 5.2.2 Gallium Arsenide (GaAs)
  • 5.2.3 Silicon Carbide (SiC)
  • 5.2.4 Indium Phosphide (InP)
  • 5.2.5 Silicon and Others
• 5.3 By Application
  • 5.3.1 Lighting and Display
  • 5.3.2 Optical Communication and Li-Fi
  • 5.3.3 Sensing and Imaging
  • 5.3.4 Power Conversion and Photovoltaics
  • 5.3.5 Defense and Security
• 5.4 By End-user Industry
  • 5.4.1 Consumer Electronics
  • 5.4.2 Automotive
  • 5.4.3 Information Technology and Telecom
  • 5.4.4 Healthcare and Life-Sciences
  • 5.4.5 Aerospace and Defense
  • 5.4.6 Industrial Automation
  • 5.4.7 Residential and Commercial
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Italy
    • 5.5.2.5 Spain
    • 5.5.2.6 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 South Korea
    • 5.5.3.4 India
    • 5.5.3.5 South East Asia
    • 5.5.3.6 Australia
    • 5.5.3.7 Rest of Asia-Pacific
  • 5.5.4 South America
    • 5.5.4.1 Brazil
    • 5.5.4.2 Rest of South America
  • 5.5.5 Middle East and Africa
    • 5.5.5.1 Middle East
    • 5.5.5.1.1 United Arab Emirates
    • 5.5.5.1.2 Saudi Arabia
    • 5.5.5.1.3 Rest of Middle East
    • 5.5.5.2 Africa
    • 5.5.5.2.1 South Africa
    • 5.5.5.2.2 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles {(includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)}
  • 6.4.1 Sony Corporation
  • 6.4.2 Samsung Electronics Co., Ltd.
  • 6.4.3 ams-OSRAM AG
  • 6.4.4 SK Hynix Inc.
  • 6.4.5 Broadcom Inc.
  • 6.4.6 Panasonic Holdings Corp.
  • 6.4.7 Signify N.V.
  • 6.4.8 Nichia Corporation
  • 6.4.9 Texas Instruments Inc.
  • 6.4.10 STMicroelectronics N.V.
  • 6.4.11 Infineon Technologies AG
  • 6.4.12 ON Semiconductor Corp.
  • 6.4.13 Vishay Intertechnology Inc.
  • 6.4.14 Renesas Electronics Corp.
  • 6.4.15 Rohm Co., Ltd.
  • 6.4.16 Omnivision Technologies Inc.
  • 6.4.17 Cree LED (Wolfspeed, Inc.)
  • 6.4.18 LITE-ON Technology Corp.
  • 6.4.19 Sharp Corporation
  • 6.4.20 Mitsubishi Electric Corp.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment