반도체 장비 : 시장 점유율 분석, 산업 동향, 통계, 성장 예측(2025-2030년)

The semiconductor equipment market size was valued at USD 124.00 billion in 2025 and is forecast to reach USD 177.97 billion by 2030, at a 7.49% CAGR.

Robust fab construction, record equipment backlogs, and a wave of government incentives underpin this trajectory. Foundries are accelerating capacity at 2 nm and below, while Outsourced Semiconductor Assembly and Test (OSAT) players scale advanced-package lines to serve artificial-intelligence (AI) demand. Geopolitical efforts to achieve technological sovereignty are shaping capital-spending patterns, forcing tool vendors to juggle export controls in China with subsidy-fuelled opportunities in North America, Europe, and the Middle East. Equipment makers that bundle process breadth, software analytics, and service coverage are securing multi-year purchase commitments from the sector's largest investors.

Global Semiconductor Equipment Market Trends and Insights

Surging demand for advanced consumer electronics and smartphones

Smartphones, wearables, and mixed-reality devices keep adding logic, memory, and analog content that must be built at ever-smaller nodes, pushing foundries to accelerate capacity on 28 nm-7 nm lines. Advanced packaging that miniaturizes high-bandwidth functions without raising power budgets drove a sizable share of early-2025 revenue, triggering an upgrade wave in bumping, test, and lithography equipment. Heterogeneous-integration lines stacking chiplets vertically are expanding at double-digit rates, lifting shipments of flip-chip bonders and wafer-level inspection tools. Tool makers offering modular deposition chambers with rapid recipe switching are winning orders as consumer-product cycles tighten. Strong handset refresh rates across India and Southeast Asia keep mature-node tools running near full utilization, proving that resilient billings are achievable even during premium-device launches.

Rapid AI-, IoT- and edge-device node investments

Data-center operators seek chips that offer higher TOPS-per-watt, boosting procurement of extreme ultraviolet (EUV) scanners and atomic-layer deposition modules used at 3 nm and below. AI accelerator start-ups in the United States and Europe are signing capacity reservation agreements that tie multi-year HBM purchases to guaranteed access to leading-edge lithography, shifting demand risk from chip designers to equipment makers. Edge AI devices for factory automation and smart-city deployments accelerate 16 nm-12 nm demand, spurring fresh orders for 300 mm etch systems tailored to embedded non-volatile memory. Tool suppliers deploy AI in situ process-monitoring algorithms, shortening recipe-development cycles and improving chamber uptime. The self-reinforcing loop between AI workload growth and smarter tools bolsters the semiconductor equipment market well past 2030.

Extremely high CAPEX and long pay-back cycles

A single advanced-logic fab now costs well above USD 20 billion, making the customer base for leading-edge tools increasingly concentrated. Lengthy depreciation periods stretch procurement scrutiny, compelling toolmakers to demonstrate multi-node extendibility before purchase orders are released. Vendors respond with upgrade-ready platforms, modular vacuum geometries, and subscription-based process-control software that spreads cost over a tool's life span. Some IDMs delay capacity expansions, which defers installations and shifts revenue recognition to late project phases. Nevertheless, the relentless need for performance-per-watt keeps road maps intact, limiting the overall drag on the semiconductor equipment market.

Other drivers and restraints analyzed in the detailed report include:

1. Government subsidy waves are boosting the tool CAPEX
2. Transition to GAA and High-NA EUV necessitates new toolsets
3. Specialty-material supply bottlenecks are delaying tool shipments

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Front-end wafer-processing instruments captured 83.7% of the semiconductor equipment market share in 2024, underscoring the central role of lithography, etch, and deposition in yield improvement. Within this segment, High-NA EUV scanners post a 21.1% CAGR to 2030 because they are indispensable for patterning 2 nm logic and 3-D DRAM structures; multi-system orders from fabs in Taiwan and New York already total several billion USD.

Backend complexity fuels innovations such as thermo-compression bonders with sub-2 µm alignment accuracy and fan-out wafer-level packaging that leverages front-end lithographic precision. Vendors that combine lithography optics, placement robotics, and high-frequency test modules into unified platforms are capturing a growing share of advanced-package budgets, extending lithography-grade investments further down the supply chain.

Foundries accounted for 52.2% of semiconductor equipment market revenue in 2024 as fabless chip firms concentrate orders on TSMC, Samsung Foundry, and GlobalFoundries. Mega-projects in Arizona, Dresden, and Kaohsiung each feature clusters of EUV scanners, multi-chamber etch stacks, and atomic-layer deposition tools configured for rapid recipe swaps, reflecting the foundry model's need to host diverse customer process flows. Strict uptime commitments drive bundled service contracts that now equal 25-30% of tool acquisition value, creating annuity streams for equipment suppliers.

OSAT houses emerge as the fastest-growing customer category at a 12.2% CAGR, propelled by 2.5-D and 3-D package architectures required for AI accelerators and automotive domain controllers. New capex lines include laser-drilling for through-silicon vias, high-density flip-chip bonders, and molded-underfill dispense systems. Integrated device manufacturers (IDMs) retain a sizeable but declining share as they pursue fab-lite strategies that outsource leading-edge logic while investing selectively in power, analog, and sensor lines.

Semiconductor Equipment Market is Segmented by Equipment Type (Front-End Equipment, and Back-End Equipment), Supply Chain Participant (IDM, Foundry, and OSAT), Wafer Size (300 Mm, 200 Mm, and <=150 Mm), Fab Technology Node (>=28 Nm, 16/14 Nm, and More), End-User Industry (Computing and Data-Center, Communications (5G, RF), and More), and Geography (North America, South America, Europe, Asia-Pacific, and Middle East and Africa).

Geography Analysis

Asia-Pacific retained 72.2% semiconductor equipment market share in 2024, powered by dense ecosystems in Taiwan, South Korea, and mainland China; Taiwan's foundry cluster alone ran above 90% utilization, sustaining EUV and metrology orders. South Korea intensified spending on 1-beta DRAM and gate-all-around logic, while China's drive for self-reliance lifted domestic etcher and deposition installations even under export-control pressure.

North America's renaissance stems from CHIPS Act grants; Albany NanoTech took delivery of the world's first High-NA EUV tool, creating a cornerstone for a domestic lithography ecosystem. Simultaneous investments by TSMC and Intel in Arizona form a corridor stretching from equipment assembly in Oregon to materials supply in Texas, re-balancing regional demand.

Europe sharpened its specialty-technology focus-automotive power devices, RF front-ends, and advanced sensors-using the European Chips Act to target a doubling of regional capacity by 2030; Saxony's dual 300 mm lines already combine logic, analog, and power processing.

The Middle East and Africa logged the fastest growth at 9.9% CAGR, fuelled by Saudi Arabia's USD 9 billion fab plan and UAE feasibility studies, which require turnkey tool-support contracts spanning training, refurbishment, and logistics. South America remains niche; Brazil is investing selectively in automotive and industrial chips that rely on mature-node 200 mm tools.

1. Applied Materials Inc.
2. ASML Holding NV
3. Tokyo Electron Ltd.
4. Lam Research Corp.
5. KLA Corp.
6. Screen Holdings Co. Ltd.
7. Teradyne Inc.
8. Hitachi High-Tech Corp.
9. Veeco Instruments Inc.
10. ASM International NV
11. Canon Inc.
12. Nikon Corp.
13. Onto Innovation Inc.
14. Nova Ltd.
15. Advantest Corp.
16. Hanmi Semiconductor Co. Ltd.
17. Disco Corp.
18. BESI (BE Semiconductor Industries)
19. Kulicke & Soffa Industries Inc.
20. FormFactor Inc.
21. Plasma-Therm LLC
22. SUSS MicroTec SE
23. Kokusai Electric Corp.
24. AMEC (Advanced Micro-Fabrication Equipment Inc.)
25. Naura Technology Group Co. Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Surging demand for advanced consumer electronics and smartphones
  • 4.2.2 Rapid AI-, IoT- and edge-device node investments
  • 4.2.3 Government subsidy waves (CHIPS, EU Chips Act, etc.) boosting tool CAPEX
  • 4.2.4 Transition to GAA and High-NA EUV necessitating new toolsets
  • 4.2.5 Sustainability mandates driving "green fab" retrofit tools
  • 4.2.6 3D heterogeneous-integration packaging demand spike
• 4.3 Market Restraints
  • 4.3.1 Extremely high CAPEX and long pay-back cycles
  • 4.3.2 Specialty-material supply bottlenecks delaying tool shipments
  • 4.3.3 Export-control restrictions on China-bound tools
  • 4.3.4 Acute shortage of skilled field-service engineers
• 4.4 Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Threat of New Entrants
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry
• 4.8 Impact of Macroeconomic Factors

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Equipment Type
  • 5.1.1 Front-end Equipment
    • 5.1.1.1 Lithography Equipment
    • 5.1.1.2 Etch Equipment
    • 5.1.1.3 Deposition Equipment
    • 5.1.1.4 Metrology / Inspection Equipment
    • 5.1.1.5 Cleaning Equipment
    • 5.1.1.6 Photoresist Processing Equipment
    • 5.1.1.7 Other Front-end Types
  • 5.1.2 Back-end Equipment
    • 5.1.2.1 Test Equipment
    • 5.1.2.2 Assembly and Packaging Equipment
• 5.2 By Supply-Chain Participant
  • 5.2.1 IDM
  • 5.2.2 Foundry
  • 5.2.3 OSAT
• 5.3 By Wafer Size
  • 5.3.1 300 mm
  • 5.3.2 200 mm
  • 5.3.3 <=150 mm
• 5.4 By Fab Technology Node
  • 5.4.1 >=28 nm
  • 5.4.2 16/14 nm
  • 5.4.3 10/7 nm
  • 5.4.4 5 nm and below
• 5.5 By End-user Industry
  • 5.5.1 Computing and Data-Center
  • 5.5.2 Communications (5G, RF)
  • 5.5.3 Automotive and Mobility
  • 5.5.4 Consumer Electronics
  • 5.5.5 Industrial and Others
• 5.6 By Geography
  • 5.6.1 North America
    • 5.6.1.1 United States
    • 5.6.1.2 Canada
    • 5.6.1.3 Mexico
  • 5.6.2 South America
    • 5.6.2.1 Brazil
    • 5.6.2.2 Argentina
    • 5.6.2.3 Rest of South America
  • 5.6.3 Europe
    • 5.6.3.1 Germany
    • 5.6.3.2 United Kingdom
    • 5.6.3.3 France
    • 5.6.3.4 Italy
    • 5.6.3.5 Spain
    • 5.6.3.6 Rest of Europe
  • 5.6.4 Asia-Pacific
    • 5.6.4.1 China
    • 5.6.4.2 Japan
    • 5.6.4.3 South Korea
    • 5.6.4.4 India
    • 5.6.4.5 Rest of Asia-Pacific
  • 5.6.5 Middle East and Africa
    • 5.6.5.1 Middle East
    • 5.6.5.1.1 Saudi Arabia
    • 5.6.5.1.2 United Arab Emirates
    • 5.6.5.1.3 Turkey
    • 5.6.5.1.4 Rest of Middle East
    • 5.6.5.2 Africa
    • 5.6.5.2.1 South Africa
    • 5.6.5.2.2 Nigeria
    • 5.6.5.2.3 Egypt
    • 5.6.5.2.4 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global-level Overview, Market-level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Applied Materials Inc.
  • 6.4.2 ASML Holding NV
  • 6.4.3 Tokyo Electron Ltd.
  • 6.4.4 Lam Research Corp.
  • 6.4.5 KLA Corp.
  • 6.4.6 Screen Holdings Co. Ltd.
  • 6.4.7 Teradyne Inc.
  • 6.4.8 Hitachi High-Tech Corp.
  • 6.4.9 Veeco Instruments Inc.
  • 6.4.10 ASM International NV
  • 6.4.11 Canon Inc.
  • 6.4.12 Nikon Corp.
  • 6.4.13 Onto Innovation Inc.
  • 6.4.14 Nova Ltd.
  • 6.4.15 Advantest Corp.
  • 6.4.16 Hanmi Semiconductor Co. Ltd.
  • 6.4.17 Disco Corp.
  • 6.4.18 BESI (BE Semiconductor Industries)
  • 6.4.19 Kulicke & Soffa Industries Inc.
  • 6.4.20 FormFactor Inc.
  • 6.4.21 Plasma-Therm LLC
  • 6.4.22 SUSS MicroTec SE
  • 6.4.23 Kokusai Electric Corp.
  • 6.4.24 AMEC (Advanced Micro-Fabrication Equipment Inc.)
  • 6.4.25 Naura Technology Group Co. Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment