차량내 네트워킹 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the in-vehicle networking market size was valued at USD 2.87 billion in 2025 and estimated to grow from USD 3.09 billion in 2026 to reach USD 4.51 billion by 2031, at a CAGR of 7.86% during the forecast period (2026-2031).

This report is Segmented by Protocol/Technology (Local Interconnect Network, Flexray, and More), Vehicle Type (Passenger Cars, Light Commercial Vehicles, and More), Application (Powertrain and Chassis Control, Safety and ADAS, Infotainment and Telematics, and More), Component (Transceivers, Controllers and Gateways, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global In-Vehicle Networking Market Trends and Insights

Vehicle Electrification and Escalating ADAS Bandwidth Needs

Battery-electric and plug-in hybrid platforms embed up to 40% more sensors than internal-combustion counterparts, producing several terabytes of raw data every hour. Legacy five-megabit-per-second CAN-FD links cannot move this volume efficiently, prompting widespread deployment of 100BASE-T1 and 1000BASE-T1 Ethernet for sensor fusion backhaul. Microcontroller vendors now integrate 10BASE-T1S low-speed Ethernet into edge nodes so inexpensive temperature and pressure sensors can feed zonal gateways, which then uplink aggregated traffic to gigabit trunks. Centralized architectures also slash wiring length, driving range gains for energy-dense battery packs. Over-the-air updates for perception software can exceed ten gigabytes per vehicle, a load that only gigabit Ethernet paired with 5G or satellite offload can manage. China's GB/T 32960 real-time telematics rule further boosts uplink demand, reinforcing Ethernet adoption.

OEM Migration from Domain to Zonal E and E Architecture

Traditional domain layouts required kilometers of harnesses and up to 100 controllers. Zonal topologies reposition compute into three to five regional gateways located near the physical loads, trimming cable weight by as much as 30% and reducing latency by eliminating inter-domain hops. Early production proof came from Volkswagen's China Electronic Architecture, which cut its controller count by 30% and halved software release cycles. Zonal gateways must bridge LIN, CAN-FD, FlexRay, and Ethernet while satisfying ISO 21434 cybersecurity and AUTOSAR Adaptive compatibility. Silicon that unifies 16 or more CAN channels with integrated TSN switches and hardware security modules is therefore in high demand.

Harness Weight and Cost Inflation Versus BOM Targets

Wiring looms weigh up to 80 kilograms in battery-electric models, adding drag on driving range. Early-2026 copper averaged USD 10,700 per tonne, and silver rose to USD 99 per ounce, inflating cable bills by nearly one-fifth. Moving from 400-volt to 800-volt architectures halves the conductor cross-section but requires higher-rated connectors that claw back some savings. Zonal integration cuts cable length by roughly one-quarter, yet it demands additional gateway silicon that pushes controller costs up more than one-third. Indian suppliers localizing under production-linked incentives face especially tight bill-of-materials limits.

Other drivers and restraints analyzed in the detailed report include:

1. Adoption of Time-Sensitive Networking in Automotive Ethernet
2. Infotainment and Telematics Feature Proliferation
3. Cyber-Security Certification Complexity for Multi-Protocol Stacks

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

CAN and CAN-FD maintained 36.89% of the in-vehicle networking market share in 2025 thanks to their low cost and entrenched use in powertrain and body-control loops. FlexRay, though a niche, is positioned for a 7.93% CAGR because steer-by-wire and brake-by-wire platforms need its deterministic dual-channel redundancy. Automotive Ethernet now scales from 10 megabits to 10 gigabits per second, so infotainment, ADAS, and centralized compute can coexist on one backbone, a shift formalized by IEEE 802.1DG-2025. LIN remains the sub-20-kilobit workhorse for seat, mirror, and lighting functions. MOST continues to decline as its 150-megabit ceiling cannot keep pace with 4K streaming demands.

Multi-protocol microcontrollers that integrate CAN-FD, LIN, and FlexRay reduce board count and shorten validation time as zonal gateways absorb body functions. Emerging CAN-XL raises single-frame payloads to 2,048 bytes, positioning itself as the bridge between legacy control loops and Ethernet tunnels. Secure 1000BASE-T1 PHYs with built-in MACsec and 1588 timestamping now reduce board area by up to 15% compared with discrete implementations. The in-vehicle networking market size attached to Ethernet PHYs will therefore outgrow node counts as the average price per port climbs.

In 2025, passenger cars accounted for 55.34% of total revenue, translating to an annual output of approximately 70 million units. While construction, agriculture, and mining machinery saw lower volumes, they are projected to experience a CAGR of 8.23%. This growth is driven by fleet owners increasingly seeking predictive maintenance and remote diagnostics, both of which necessitate Ethernet gateways. The rising adoption of advanced telematics systems and IoT integration in these machinery segments further supports this trend.

Light commercial vehicles benefit from passenger-car component commonality, allowing them to inherit gigabit backbones at minimal incremental cost. Heavy trucks must meet new automated steering regulations that make deterministic Ethernet mandatory. Off-highway designers adopt IP69K-rated CAN-to-Ethernet bridges so equipment can survive dust, vibration, and water jets. These trends keep the in-vehicle networking market size in the specialty-vehicle segment on a steeper slope than the overall base.

Geography Analysis

Asia-Pacific retained 43.78% of 2025 revenue, anchored by China's 27 million-unit passenger-car output and India's newly announced 300,000-unit plant that targets 75% NEV content localization. Platform rules under GB/T 32960 push every Chinese OEM toward Ethernet gateways with integrated 5G uplink, accelerating silicon volume. India's production-linked incentives are drawing network-component suppliers into local clusters, lowering tariff exposure and bolstering the regional in-vehicle networking market. Japan and South Korea concentrate on premium ADAS features, creating early demand for TSN hardware.

North America held roughly one-quarter of 2025 spending, supported by 11 million light-truck and SUV builds in the United States and export-oriented assembly in Mexico. Regulatory momentum for automated lane keeping and over-the-air cyber-secure updates sustains Ethernet penetration. Silicon Valley start-ups provide SDV middleware that reduces integration time for Detroit-area OEMs, supporting healthy investment in gateways and centralized compute. The United States Inflation Reduction Act spurs domestic battery and electronics supply, giving subsidies that indirectly boost the in-vehicle networking market.

Europe achieved a 20-22% share on the back of luxury and performance brands that lead in zonal topologies, centralized ADAS, and ISO 21434 certification. UN ECE rulemaking synchronizes safety and cybersecurity deadlines across member states, stimulating predictable rollout schedules for Ethernet and FlexRay upgrades. Eastern European plants leverage lower wage costs to assemble wiring harnesses and optical-fiber links, ensuring regional cost competitiveness. Middle East and Africa, although only a mid-single-digit base today, is tracking toward an 8.94% CAGR through 2031 as smart-city megaprojects mandate vehicle-to-infrastructure connectivity. South America benefits from Mercosur rules that reduce import duties on localized CAN-FD and Ethernet components, but macro volatility tempers absolute market size growth.

1. NXP Semiconductors N.V.
2. Robert Bosch GmbH
3. Texas Instruments Incorporated
4. Microchip Technology Inc.
5. STMicroelectronics N.V.
6. Broadcom Inc.
7. Marvell Technology, Inc.
8. Infineon Technologies AG
9. ON Semiconductor Corporation
10. Renesas Electronics Corporation
11. Analog Devices, Inc.
12. Realtek Semiconductor Corp.
13. Rohm Co., Ltd.
14. Melexis N.V.
15. ON Semiconductor Corporation
16. Molex LLC
17. TE Connectivity Ltd.
18. Aptiv PLC
19. Continental AG
20. Marvell Technology, Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Vehicle Electrification and Escalating ADAS Bandwidth Needs
  • 4.2.2 Infotainment/Telematics Feature Proliferation
  • 4.2.3 Regulatory Mandates for Advanced Safety Networks
  • 4.2.4 OEM Migration from Domain to Zonal E/E Architecture
  • 4.2.5 China's NEV Platform Standardisation Pressure
  • 4.2.6 Adoption of Time-Sensitive Networking (TSN) in Automotive Ethernet
• 4.3 Market Restraints
  • 4.3.1 Harness Weight and Cost Inflation Versus BOM Targets
  • 4.3.2 Cyber-Security Certification Complexity for Multi-Protocol Stacks
  • 4.3.3 Thermal/EMC Integrity Limits at >=1 Gbps
  • 4.3.4 OEM-Specific Proprietary Network Stacks Hindering Interoperability
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Threat of New Entrants
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry
• 4.8 Assessment of Macroeconomic Trends on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Protocol / Technology
  • 5.1.1 Local Interconnect Network (LIN)
  • 5.1.2 Controller Area Network (CAN and CAN-FD)
  • 5.1.3 FlexRay
  • 5.1.4 Automotive Ethernet (10 Mbps - 10 Gbps)
  • 5.1.5 Media Oriented Systems Transport (MOST)
• 5.2 By Vehicle Type
  • 5.2.1 Passenger Cars
  • 5.2.2 Light Commercial Vehicles
  • 5.2.3 Heavy Commercial Vehicles
  • 5.2.4 Off-Highway and Specialized Vehicles
• 5.3 By Application
  • 5.3.1 Powertrain and Chassis Control
  • 5.3.2 Safety and ADAS
  • 5.3.3 Infotainment and Telematics
  • 5.3.4 Body Control and Comfort
  • 5.3.5 Autonomous Driving Compute Domains
• 5.4 By Component
  • 5.4.1 Transceivers
  • 5.4.2 Controllers and Gateways
  • 5.4.3 Switches and Routers
  • 5.4.4 Cabling and Connectors
  • 5.4.5 Network ICs and PHYs
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Spain
    • 5.5.3.6 Rest of Europe
  • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 ASEAN
    • 5.5.4.6 Rest of Asia-Pacific
  • 5.5.5 Middle East and Africa
    • 5.5.5.1 Middle East
      • 5.5.5.1.1 Saudi Arabia
      • 5.5.5.1.2 United Arab Emirates
      • 5.5.5.1.3 Turkey
      • 5.5.5.1.4 Rest of the Middle East
    • 5.5.5.2 Africa
      • 5.5.5.2.1 South Africa
      • 5.5.5.2.2 Nigeria
      • 5.5.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 6.4.1 NXP Semiconductors N.V.
  • 6.4.2 Robert Bosch GmbH
  • 6.4.3 Texas Instruments Incorporated
  • 6.4.4 Microchip Technology Inc.
  • 6.4.5 STMicroelectronics N.V.
  • 6.4.6 Broadcom Inc.
  • 6.4.7 Marvell Technology, Inc.
  • 6.4.8 Infineon Technologies AG
  • 6.4.9 ON Semiconductor Corporation
  • 6.4.10 Renesas Electronics Corporation
  • 6.4.11 Analog Devices, Inc.
  • 6.4.12 Realtek Semiconductor Corp.
  • 6.4.13 Rohm Co., Ltd.
  • 6.4.14 Melexis N.V.
  • 6.4.15 ON Semiconductor Corporation
  • 6.4.16 Molex LLC
  • 6.4.17 TE Connectivity Ltd.
  • 6.4.18 Aptiv PLC
  • 6.4.19 Continental AG
  • 6.4.20 Marvell Technology, Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment