GPU 콜드 플레이트 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the gPU cold plate market size is expected to increase from USD 4.1 billion in 2025 to USD 4.8 billion in 2026 and reach USD 12.85 billion by 2031, growing at a CAGR of 21.78% over 2026-2031.

This report is Segmented by Cooling Type (Single-Phase, and Two-Phase), Design Type (Microchannel, Jet Impingement, and Hybrid/Advanced), Deployment Environment (Hyperscale/Cloud, Enterprise, Government and Research HPC, and Edge AI), GPU Power Density (Below 300W, 300W-700W, and Above 700W), and Geography (North America, Asia Pacific, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global GPU Cold Plate Market Trends and Insights

Accelerating Adoption of Liquid Cooling in Hyperscale Data Centers

Hyperscale providers added more than 200 megawatts of liquid-cooled GPU capacity during 2025, a fivefold jump from 2023 deployments, as air cooling became economically untenable once rack loads exceeded 80 kilowatts. Microsoft's Fairwater campus validated a 40% energy-savings metric, turning capital expenditure into immediate operating profit. Meta's mandate that every forthcoming AI cluster ship with liquid cooling set a de facto industry baseline that pushed suppliers to scale production. Higher GPU utilization reinforces the business case because liquid-cooled accelerators sustain boost clocks for longer duty cycles, directly raising training throughput. These factors combine to accelerate order volumes that, in turn, compress per-unit costs for cold plates.

Rising GPU Power Densities Surpassing Air Cooling Limits

NVIDIA H200 and AMD MI300A chips hit 760 watts in 2025, surpassing air cooling's practical ceiling without resorting to deafening fan speeds. Air's poor thermal conductivity caps heat-flux removal near 0.5 W cm-2, while water-based plates deliver 5 W cm-2 or higher, eliminating performance throttling even in 25 °C ambient conditions. Field data show that air-cooled clusters throttled during 18% of training epochs when temperatures rose past 27 °C. Cold plates remove that variability, ensuring operators extract the full value from capital-intensive accelerators, especially in tropical data center hubs such as Singapore.

High Upfront Cost of Liquid Cooling Deployment

A 10-rack GPU cluster retrofitted with single-phase cold plates requires roughly USD 400,000 in capital, triple the outlay for a comparable air-cooled install. Two-phase systems cost even more because they add refrigerant pumps, heat exchangers, and certified piping. Colocation environments add customer isolation and metering hardware, which inflates rack costs by an additional USD 15,000-25,000. Payback drops below three years only where electricity rates top USD 0.10 kWh-1, leaving many low-tariff regions unmoved. Staff training, often absent in enterprise IT budgets, further inflates life-cycle expense through mandatory vendor service contracts.

Other drivers and restraints analyzed in the detailed report include:

1. Government Incentives for Energy-Efficient Infrastructure
2. Increasing AI Model Complexity Requiring Higher Thermal Performance
3. Compatibility Challenges with Existing Rack Infrastructures

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Single-phase systems accounted for 74.69% of 2025 revenue, driven by their plug-and-play fit with chilled-water loops and the modest operational skills required. In the core 300-watt-to-700-watt band, single-phase plates satisfy thermal loads at 2-4 L min-1 flow while keeping pump power manageable. Two-phase systems, although at only 25.31% share, are scaling at 21.98% because they dissipate over 200 W cm-2, unlocking next-generation GPU envelopes above 1,000 watts. Hyperscale operators piloting these designs report 60% reductions in cooling energy use and the ability to dump heat directly into dry coolers, eliminating chiller plants and freeing real estate for revenue-generating racks.

Hybrid architectures that blend single-phase primary loops with two-phase hotspot modules are emerging as a pragmatic bridge. Products such as Parker-Hannifin's HyperCool pair water-glycol circuits for bulk removal with embedded heat pipes that vaporize refrigerant at localized peaks, delivering 150 W cm-2 without site-wide refrigerant handling. As two-phase expertise diffuses and low-GWP fluids mature, the GPU cold plate market is likely to witness gradual share transfer toward full two-phase plates, especially for racks exceeding 100 kilowatts, where traditional water loops hit flow-rate ceilings.

Microchannel plates retained 63.56% share in 2025 because CNC machining is mature, cost-effective, and backed by a decade of server OEM validation. However, physics impose a fourth-power rise in pressure drop as channel width narrows, capping scalability for 800-watt GPUs. Jet impingement designs circumvent this by firing high-velocity coolant jets perpendicularly onto the die, achieving above 300 W cm-2 while using 30% less pumping power than equivalent microchannel solutions.

Manufacturing constraints kept jet impingement costly, yet automated laser drilling and 3D-printed nozzle arrays are closing the gap. As vendors reach cost parity by 2028, Boyu Liquid Cooling targets jet impingement to dominate the above-700-watt niche. Meanwhile, hybrid plates combining microchannel base layers with vapor chambers or nozzle inserts address workloads where cost sensitivity and hotspot intensity coexist, such as financial trading clusters demanding both reliability and extreme transient performance.

Geography Analysis

Asia-Pacific led the GPU cold plate market with 68.53% revenue in 2025 and is forecast to grow at 22.78% through 2031. China's Ministry of Industry and Information Technology earmarked CNY 50 billion (USD 7 billion) for liquid-ready AI infrastructure, driving massive orders such as Alibaba Cloud's 100,000-GPU Ulanqab campus. Singapore enforces a 1.3 PUE ceiling that virtually mandates liquid cooling; Digital Realty's USD 1.26 billion Jurong campus showcased seawater heat rejection to sidestep chiller loads. India is fast-tracking hyperscale builds, and local manufacturers like Schneider Electric's Bangalore plant will produce 50,000 plates annually by year-end 2026, cutting import dependence.

North America contributed roughly 18% of 2025 revenue, anchored by hyperscale campuses in Wisconsin, Oregon, and Virginia. U.S. federal and state incentives shorten enterprise payback periods, and in cold-climate regions, liquid cooling is still adopted for GPU racks because ambient free cooling alone cannot handle 700-watt chips during summer peaks. Canada's operators find that liquid cooling lets them consolidate servers, offsetting months of free-air advantage with higher annual compute density.

Europe clocked about 10% of revenue, with the Energy Efficiency Directive placing a regulatory gun to operators' heads. Germany's Hetzner achieved 1.25 PUE in Falkenstein and secured accelerated depreciation, while the United Kingdom earmarked GBP 200 million (USD 255 million) for university clusters that default to liquid cooling. South America and the Middle East and Africa together contributed under 4% yet display strategic importance. Brazil's Sao Paulo campus leverages hydroelectric grids for low-carbon marketing, and the Emirates' AI71 project builds two-phase immersion rigs to cope with 45 °C summers, aiming to claim a 5% global share by 2031 if water-scarcity challenges are mitigated

1. CoolIT Systems Inc.
2. Asetek A/S
3. BOYD Corporation
4. JetCool Technologies Inc.
5. Laird Thermal Systems Inc.
6. Nidec Corp.
7. Danfoss A/S
8. Schneider Electric SE
9. Rittal GmbH and Co. KG
10. LiquidStack Inc.
11. Alfa Laval AB
12. Fujikura Ltd.
13. Advanced Cooling Technologies Inc.
14. Lytron LLC
15. TE Connectivity Ltd.
16. Parker-Hannifin Corporation
17. AMAX Information Technologies Inc.
18. Cool-IT Science Ltd.
19. Midas Cooling Solutions LLC

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Accelerating Adoption of Liquid Cooling in Hyperscale Data Centers
  • 4.2.2 Rising GPU Power Densities Surpassing Air Cooling Limits
  • 4.2.3 Government Incentives for Energy-Efficient Data Center Infrastructure
  • 4.2.4 Increasing AI Model Complexity Demanding Higher Thermal Management Performance
  • 4.2.5 Emergence of Open-Hardware Cold Plate Standards Reducing Vendor Lock-In
  • 4.2.6 Advancements in Low-Fluorinated Dielectric Fluids Enabling Two-Phase Cold Plates
• 4.3 Market Restraints
  • 4.3.1 High Upfront Cost of Liquid Cooling Deployment
  • 4.3.2 Compatibility Challenges with Existing Rack Infrastructures
  • 4.3.3 Limited Field Expertise for Operational Maintenance of Two-Phase Systems
  • 4.3.4 Supply Chain Constraints for High-Precision Microchannel Machining
• 4.4 Impact of Macroeconomic Factors on the Market
• 4.5 Industry Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Cooling Type
  • 5.1.1 Single-Phase Cold Plates
  • 5.1.2 Two-Phase Cold Plates
• 5.2 By Design Type
  • 5.2.1 Microchannel Cold Plates
  • 5.2.2 Jet Impingement Cold Plates
  • 5.2.3 Hybrid / Advanced Designs
• 5.3 By Deployment Environment
  • 5.3.1 Hyperscale / Cloud
  • 5.3.2 Enterprise
  • 5.3.3 Government and Research (HPC)
  • 5.3.4 Edge AI
• 5.4 By GPU Power Density
  • 5.4.1 Below 300W
  • 5.4.2 300W-700W
  • 5.4.3 Above 700W
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 United Kingdom
    • 5.5.2.2 Germany
    • 5.5.2.3 France
    • 5.5.2.4 Italy
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 India
    • 5.5.3.4 South Korea
    • 5.5.3.5 Southeast Asia
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
    • 5.5.4.1 Brazil
    • 5.5.4.2 Rest of South America
  • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 CoolIT Systems Inc.
  • 6.4.2 Asetek A/S
  • 6.4.3 BOYD Corporation
  • 6.4.4 JetCool Technologies Inc.
  • 6.4.5 Laird Thermal Systems Inc.
  • 6.4.6 Nidec Corp.
  • 6.4.7 Danfoss A/S
  • 6.4.8 Schneider Electric SE
  • 6.4.9 Rittal GmbH and Co. KG
  • 6.4.10 LiquidStack Inc.
  • 6.4.11 Alfa Laval AB
  • 6.4.12 Fujikura Ltd.
  • 6.4.13 Advanced Cooling Technologies Inc.
  • 6.4.14 Lytron LLC
  • 6.4.15 TE Connectivity Ltd.
  • 6.4.16 Parker-Hannifin Corporation
  • 6.4.17 AMAX Information Technologies Inc.
  • 6.4.18 Cool-IT Science Ltd.
  • 6.4.19 Midas Cooling Solutions LLC

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment