기판형 PCB : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the substrate-Like printed circuit board market size in 2026 is estimated at USD 4.24 billion, growing from 2025 value of USD 3.93 billion with projections showing USD 6.05 billion, growing at 7.37% CAGR over 2026-2031.

This report is Segmented by Substrate Material (Glass Epoxy FR-4, High-Speed/Low-Loss, Polyimide, and More), End-User Industry (Consumer Electronics, Computing and Data Centers, Telecommunications and 5G, Automotive and EV, Healthcare / Medical, Aerospace and Defense, and More), and Geography (North America, Europe, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global Substrate-Like Printed Circuit Board Market Trends and Insights

Surging Smartphone OEM Demand for High-Density Interconnects

Smartphone brands have consolidated application processors, RF front ends, and power-management ICs onto single Substrate-Like PCB market boards, cutting occupied area by 30% relative to conventional multilayer designs. Taiwanese fabricators disclosed that mobile use accounted for over 35% of SLP revenue in 2025, underscoring the volume pull for sub-20 µm lines with via diameters below 50 µm. Yield has become the decisive differentiator as more plants master the geometry, pushing suppliers to couple high-accuracy laser direct imaging with predictive analytics that spot pattern-transfer deviations early.

Rising Demand for 5G Communication Modules

Standalone 5G networks operating at millimeter-wave frequencies impose insertion-loss ceilings of 0.5 dB-in. at 30 GHz that FR-4 can meet only at impractical thicknesses. Base-station OEMs therefore specify high-speed PTFE or liquid-crystal polymer stacks, lifting layer counts beyond eight and driving Substrate-Like PCB market capital spending on automated optical inspection to hold defect escape below 50 PPM. Handset makers mirror the trend; dual-band phones integrate multiple power amplifiers and antenna tuners on densified SLP modules, boosting material revenue per device.

High CAPEX for SLP Production Lines

Greenfield plants capable of 25 µm lines demand USD 150-300 million for laser direct-imaging, sequential lamination and inline X-ray inspection clusters. Payback stretches beyond five years unless utilizations exceed 80%, which deters newcomers and consolidates the Substrate-Like PCB market around incumbents that amortize assets across telecom, consumer and automotive contracts.

Other drivers and restraints analyzed in the detailed report include:

1. Automotive ADAS and EV Electronics Escalating Complexity
2. Flip-Chip on SLP Enabling Heterogeneous Integration
3. Supply Risk of ABF Resin Due to Limited Vendors

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

High-speed and low-loss laminates captured 40.94% of substrate-like printed circuit board market share in 2025, expanding at a 7.64% CAGR through 2031 as PTFE, liquid-crystal polymer, and hydrocarbon-ceramic systems replace glass-epoxy in 5G radio heads and 400-GbE switch fabrics. Insertion loss stays under 0.5 dB-in. at 10 GHz, even as routing lengths shrink, enabling spectral efficiency gains that directly convert into carrier capacity. Glass-epoxy FR-4 still prevails in mid-range smartphones and industrial controls because its raw sheet cost is one-third that of PTFE composites. However, its Substrate-Like PCB market size has begun to taper as handset OEMs chase tighter tolerances for stacked camera arrays.

High-speed materials also spread to data-center accelerator boards, where 112 Gbps PAM4 signaling raises eye-diagram closure sensitivity. Suppliers have started blending hydrocarbon ceramics into ABF resin to lift the glass-transition temperature without sacrificing the dielectric constant. Polyimide retains a niche for flex-rigid builds in automotive and avionics, but share stays below 10% because laser-drilling time and chemistry handling raise process cost. Metal-core and ceramic-filled builds win socket-level power electronics when heat flux exceeds 10 W cm-2, a micro-segment that offers high margins but modest volume.

Geography Analysis

Asia-Pacific accounted for 83.64% of the Substrate-Like Printed Circuit Board market revenue in 2025, led by Taiwan, China, South Korea, and Japan. Taiwan recorded USD 20.5 billion PCB output in Q3-2024, reflecting an ecosystem of build-up laminate suppliers, laser-equipment firms, and design houses that can prototype within days. Mainland China advances domestic capacity to escape geopolitically fraught imports, with Shennan Circuits expanding ABF lines under state subsidies SCC. South Korea's conglomerates leverage auto-qualified verticals to enter the EV module market, while Japan maintains process leadership in ultra-thin glass cores. Overall regional growth is projected at 8.77% through 2031, fueled by 5G densification, cloud data-center builds, and EV battery-pack localization

North America and Europe together hold under 15% of the market, constrained by higher labor costs and a thinner material supply chain. The 2022 CHIPS and Science Act earmarked USD 39 billion for semiconductors but excluded substrate facilities from investment tax credits, muting near-term reshoring momentum. A few greenfield pilots, including one in New York and another in Austria, remain in site-selection stages as of early 2026. Rest-of-world demand arises mainly from consumer-electronics final assembly in Southeast Asia and automotive cable-harness plants in Mexico, yet local substrate capacity is negligible, so imports from Taiwan and South Korea dominate.

Geopolitical risk is steering multinational OEMs toward dual-sourcing. Unimicron's plant in Thailand entered mass production in 2025, offering duty-free access to Association of Southeast Asian Nations markets while dampening cross-strait exposure. European automakers, wary of Taiwanese earthquake disruptions, have entered multi-year sourcing pacts with Korean and Japanese suppliers to secure Substrate-Like Printed Circuit Board market continuity for 800-V battery packs.

1. Kinsus Interconnect Technology Corp
2. Ibiden Co., Ltd.
3. Compeq Manufacturing Co., Ltd.
4. Daeduck Electronics Co., Ltd.
5. Unimicron Technology Corp.
6. Zhen Ding Technology Holding
7. TTM Technologies
8. Meiko Electronics Co., Ltd.
9. AT&S AG
10. Korea Circuit Co., Ltd.
11. LG Innotek Co., Ltd.
12. Samsung Electro-Mechanics
13. Shennan Circuits Co., Ltd.
14. Tripod Technology
15. Fujitsu Interconnect
16. Wus Printed Circuit
17. HannStar Board Corp.
18. Nippon Mektron Ltd.
19. NCAB Group AB

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Ultra-Thin Glass Core Adoption for Optical Integration
  • 4.2.2 On-Device Generative AI Raising SLP Layer Counts
  • 4.2.3 In-Package RF Front-End Convergence (SiP + SLP)
  • 4.2.4 Battery-Free Wearables Using Energy-Harvest SLP Boards
  • 4.2.5 Government Chiplets Grants for Advanced Substrates
  • 4.2.6 Rapid Build-Up Film Capacity Expansion in Vietnam
• 4.3 Market Restraints
  • 4.3.1 ABF Resin Oligopoly Driving Price Volatility
  • 4.3.2 Yield Losses from mSAP Copper Over-Etch Below 20 µm
  • 4.3.3 Scarcity of Skilled mSAP Process Engineers
  • 4.3.4 Carbon-Footprint Regulations on High-Energy Plasma Desmear
• 4.4 Impact of Macroeconomic Factors on the Market
• 4.5 Industry Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Substrate Material
  • 5.1.1 Glass Epoxy (FR-4)
  • 5.1.2 High-Speed / Low-Loss
  • 5.1.3 Polyimide (PI)
  • 5.1.4 Other Substrate Materials
• 5.2 By End-user Industry
  • 5.2.1 Consumer Electronics
  • 5.2.2 Computing and Data Centers
  • 5.2.3 Telecommunications and 5G
  • 5.2.4 Automotive and EV
  • 5.2.5 Healthcare / Medical
  • 5.2.6 Aerospace and Defense
  • 5.2.7 Other End-user Industries
• 5.3 By Geography
  • 5.3.1 North America
    • 5.3.1.1 United States
    • 5.3.1.2 Rest of North America
  • 5.3.2 Europe
    • 5.3.2.1 Germany
    • 5.3.2.2 United Kingdom
    • 5.3.2.3 Netherlands
    • 5.3.2.4 Rest of Europe
  • 5.3.3 Asia-Pacific
    • 5.3.3.1 China
    • 5.3.3.2 Taiwan
    • 5.3.3.3 Japan
    • 5.3.3.4 India
    • 5.3.3.5 South Korea
    • 5.3.3.6 Southeast Asia
    • 5.3.3.7 Rest of Asia-Pacific
  • 5.3.4 Rest of World

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products & Services, and Recent Developments)
  • 6.4.1 Kinsus Interconnect Technology Corp
  • 6.4.2 Ibiden Co., Ltd.
  • 6.4.3 Compeq Manufacturing Co., Ltd.
  • 6.4.4 Daeduck Electronics Co., Ltd.
  • 6.4.5 Unimicron Technology Corp.
  • 6.4.6 Zhen Ding Technology Holding
  • 6.4.7 TTM Technologies
  • 6.4.8 Meiko Electronics Co., Ltd.
  • 6.4.9 AT&S AG
  • 6.4.10 Korea Circuit Co., Ltd.
  • 6.4.11 LG Innotek Co., Ltd.
  • 6.4.12 Samsung Electro-Mechanics
  • 6.4.13 Shennan Circuits Co., Ltd.
  • 6.4.14 Tripod Technology
  • 6.4.15 Fujitsu Interconnect
  • 6.4.16 Wus Printed Circuit
  • 6.4.17 HannStar Board Corp.
  • 6.4.18 Nippon Mektron Ltd.
  • 6.4.19 NCAB Group AB

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment