납땜 재료 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the solder materials market size was valued at USD 5.04 billion in 2025 and estimated to grow from USD 5.25 billion in 2026 to reach USD 6.72 billion by 2031, at a CAGR of 5.06% during the forecast period (2026-2031).

This report is Segmented by Type (Lead-Based Solder Materials and Lead-Free Solder Materials), Product Type (Paste, Wire, and More), Process Type (Wave Soldering, Reflow Soldering, and More), End-Use Industry (Consumer Electronics, Automotive, and More), and Geography (Asia-Pacific, North America, Europe, South America, and Middle-East and Africa). The Market Forecasts Provided are in Terms of Value (USD).

Global Solder Materials Market Trends and Insights

Expansion of Electronics Manufacturing and PCB Assembly

Electronics manufacturing growth supports recurring consumption of solder paste, wire, bar, and flux in the solder materials market. Assembly activity for cloud hardware, AI infrastructure, and electric-vehicle electronics increases the number of boards that require these materials. India approved the Electronics Component Manufacturing Scheme on April 8, 2025, with an outlay of INR 22,919 crore (approximately USD 2.7 billion) to strengthen domestic electronics component manufacturing. The program supported the development of Printed Circuit Board (PCB) fabrication capacity and expanded the domestic assembly base. New production hubs in India, Vietnam, Thailand, and Mexico require local material availability, controlled storage, process support, and responsive supply arrangements. This favors formulators that can manage approvals, distribution, process trials, and consistent technical support across several regions.

Automotive Electrification and Rising Semiconductor Content Per Vehicle

Automotive electrification is increasing solder requirements in power modules, battery management systems, gate drivers, and high-voltage control equipment. These applications require interconnects that can tolerate wide temperature changes, repeated thermal cycles, vibration, and sustained electrical loading. This requirement favors reinforced formulations over standard SAC305 in demanding automotive programs. KOKI introduced SB6NX58-G850 in June 2025 for automotive and industrial assemblies exposed to harsh operating conditions. The product reflects demand for lower-void, high-reliability solder joints in these applications. The solder materials market benefits when automotive customers qualify more specialized alloy systems for safety-critical electronics and use them across longer production programs.

Tin, Silver, Copper, and Lead Price Volatility

Metal prices remain a direct risk for the solder materials market because SAC305 contains 96.5% tin by weight. Price changes affect margins for assemblers and formulators, especially in standard wire and bar products where material costs form a large share of selling prices. There is no mass-scale substitute for the core metal roles within commonly used solder alloys. The International Energy Agency reported sharply rising tin and base-metal prices between January 2025 and April 2026 while supply conditions remained tight. Cost pressure is most acute where supply agreements offer limited flexibility and customers require qualified alloys without changes to production settings. Low-silver alternatives such as AIM Solder's REL61 can improve the cost position of suppliers serving high-volume electronics manufacturing.

Other drivers and restraints analyzed in the detailed report include:

1. Lead-Free Conversion Driven by RoHS and Related Substance Restrictions
2. Miniaturization, Fine-Pitch Assembly, and Advanced Semiconductor Packaging
3. Higher Processing Windows and Qualification Costs for Lead-Free Alloys

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Lead-free solder materials held 68.14% of overall revenue in 2025 and are projected to grow at a 5.14% CAGR through 2031. Their role is supported by compliance needs in electronics, automotive, and industrial equipment. SAC305, with tin, silver, and copper, remains a standard alloy for RoHS-compliant SMT assembly. Bismuth, antimony, and indium additives can improve thermal-fatigue performance for automotive control units and power modules. The November 2025 EU restructuring of RoHS Exemption 7(a) introduced a defined compliance timetable for affected high-melting-temperature lead solder uses. This narrows the addressable base for lead-based materials in applications without a continuing exemption.

Lead-based solder materials still serve certain military electronics and aerospace die-attach applications. Their use depends on valid exemptions and qualified application requirements. Low-temperature bismuth-tin alloys are gaining use in heat-sensitive flexible substrates, wearables, and camera modules. These alloys can reflow near 160 °C, compared with 240 °C for SAC305. The lower thermal exposure is useful where component or substrate sensitivity limits process temperatures. The solder materials industry is therefore seeing lead-free growth across both high-reliability and temperature-sensitive applications. The solder materials market retains a smaller, specialized role for lead-based products where performance and exemption conditions allow their use.

Paste held 34.82% of overall revenue in 2025 and is forecast to grow at a 5.92% CAGR through 2031. Its position reflects surface-mount technology use in new electronics designs. Paste also supports advanced packaging applications that require Type 5 through Type 7 powder grades. Indium Corporation received a Circuits Assembly New Product Introduction (NPI) Award in March 2026 for Indium12.9HF, a Type 5 halogen-free paste for low-silver SAC105 and SAC0307 alloys. The product was designed for 01005 fine-feature printing. These product requirements support the value contribution of paste within the solder materials market.

Wire solder supplies selective and robotic soldering applications for through-hole parts and connectors. Bar solder is used in wave-soldering baths, particularly for consumer and industrial electronic assemblies. Flux is consumed across process types, with ongoing movement toward halogen-free and no-clean chemistries. Powder and preforms occupy smaller but higher-value product positions. Preforms are used in power-device die attach, where accurate alloy volume affects heat transfer and long-term joint reliability. The solder materials industry uses each format for a distinct assembly need. Product selection depends on board design, production method, precision requirements, and the expected service environment.

Complete Report Scope:

• By Type
  • Lead-Based Solder Materials
  • Lead-Free Solder Materials
• By Product Type
  • Paste
  • Wire
  • Bar
  • Flux
  • Powder
  • Preforms
  • Other Products
• By Process Type
  • Wave Soldering
  • Reflow Soldering
  • Selective Soldering
  • Robotic Soldering
  • Laser Soldering
• By End-Use Industry
  • Consumer Electronics
  • Automotive
  • Industrial Equipment
  • Building and Electrical Infrastructure
  • Telecommunications
  • Aerospace and Defense
  • Medical Electronics
  • Other End-Use Industries
• By Geography
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Russia
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Middle-East and Africa
    • Saudi Arabia
    • South Africa
    • Rest of Middle-East and Africa

Geography Analysis

Asia-Pacific held 52.69% of overall revenue in 2025 and is forecast to grow at a 5.78% CAGR through 2031. China remains a major regional consumption center because of its broad PCB and electronics assembly base. South Korea supports fine-feature paste and performance demand through its semiconductor packaging and memory manufacturing operations. Japan remains important in precision and high-reliability materials, including automotive-grade and advanced packaging alloys. Senju Metal Industry and KOKI are among the suppliers serving these specialized requirements. Southeast Asia is becoming more important as electronics manufacturing services (EMS) capacity expands in Vietnam, Thailand, and Malaysia.

India is also expanding its electronics production base. New PCB fabrication facilities can create local demand for paste and wire from domestic and international suppliers. The solder materials market in North America is weighted toward defense, aerospace, medical devices, and advanced packaging. These uses require technical qualifications and customer-specific alloy certifications. Europe has demand from automotive electronics and industrial machinery production, especially in Germany and Italy. EU RoHS changes are increasing near-term qualification work for certain high-melting-temperature lead applications.

South America and Middle-East and Africa represent demand areas with different manufacturing profiles. Brazil has domestic electronics assembly for consumer goods and industrial equipment under the Zona Franca de Manaus framework. Argentina retains electronics manufacturing for domestic appliance applications. Saudi Arabia and the United Arab Emirates provide developing electronics assembly demand through industrial investment and free-trade-zone activity. South Africa supports mining and energy electronics maintenance needs. These regions represent developing areas for the solder materials market, supported by local-content policies and industrialization programs over the longer term.

1. AIM Solder
2. Balver Zinn GmbH
3. DUKSAN Holdings
4. Fusion Inc.
5. Henkel AG & Co. KGaA
6. Indium Corporation
7. Kester
8. KOKI Company Ltd.
9. MacDermid Alpha Electronics Solutions
10. Nihon Superior Co., Ltd.
11. Qualitek International, Inc.
12. Senju Metal Industry Co., Ltd.
13. Stannol GmbH & Co. KG
14. Tamura Corporation

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 Introduction

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 Research Methodology

3 Executive Summary

4 Market Landscape

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Expansion of Electronics Manufacturing and PCB Assembly
  • 4.2.2 Automotive Electrification and Rising Semiconductor Content per Vehicle
  • 4.2.3 Lead-Free Conversion Driven by RoHS and Related Substance Restrictions
  • 4.2.4 Miniaturization, Fine-Pitch Assembly, and Advanced Semiconductor Packaging
  • 4.2.5 Qualification Demand for High-Reliability Electronics in Harsh Environments
• 4.3 Market Restraints
  • 4.3.1 Tin, Silver, Copper, and Lead Price Volatility
  • 4.3.2 Higher Processing Windows and Qualification Costs for Lead-Free Alloys
  • 4.3.3 Reliability and Thermal-Fatigue Risk in High-Density Assemblies
• 4.4 Value Chain Analysis
• 4.5 Porter's Five Forces Analysis
  • 4.5.1 Threat of New Entrants
  • 4.5.2 Bargaining Power of Suppliers
  • 4.5.3 Bargaining Power of Buyers
  • 4.5.4 Threat of Substitutes
  • 4.5.5 Competitive Rivalry

5 Market Size and Growth Forecasts (Value)

• 5.1 By Type
  • 5.1.1 Lead-Based Solder Materials
  • 5.1.2 Lead-Free Solder Materials
• 5.2 By Product Type
  • 5.2.1 Paste
  • 5.2.2 Wire
  • 5.2.3 Bar
  • 5.2.4 Flux
  • 5.2.5 Powder
  • 5.2.6 Preforms
  • 5.2.7 Other Products
• 5.3 By Process Type
  • 5.3.1 Wave Soldering
  • 5.3.2 Reflow Soldering
  • 5.3.3 Selective Soldering
  • 5.3.4 Robotic Soldering
  • 5.3.5 Laser Soldering
• 5.4 By End-Use Industry
  • 5.4.1 Consumer Electronics
  • 5.4.2 Automotive
  • 5.4.3 Industrial Equipment
  • 5.4.4 Building and Electrical Infrastructure
  • 5.4.5 Telecommunications
  • 5.4.6 Aerospace and Defense
  • 5.4.7 Medical Electronics
  • 5.4.8 Other End-Use Industries
• 5.5 By Geography
  • 5.5.1 Asia-Pacific
    • 5.5.1.1 China
    • 5.5.1.2 India
    • 5.5.1.3 Japan
    • 5.5.1.4 South Korea
    • 5.5.1.5 Rest of Asia-Pacific
  • 5.5.2 North America
    • 5.5.2.1 United States
    • 5.5.2.2 Canada
    • 5.5.2.3 Mexico
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Russia
    • 5.5.3.6 Rest of Europe
  • 5.5.4 South America
    • 5.5.4.1 Brazil
    • 5.5.4.2 Argentina
    • 5.5.4.3 Rest of South America
  • 5.5.5 Middle-East and Africa
    • 5.5.5.1 Saudi Arabia
    • 5.5.5.2 South Africa
    • 5.5.5.3 Rest of Middle-East and Africa

6 Competitive Landscape

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share (%)/Ranking Analysis
• 6.4 Company Profiles (includes Global Overview, Market Overview, Core Segments, Financials as available, Strategic Information, Products and Services, and Recent Developments)
  • 6.4.1 AIM Solder
  • 6.4.2 Balver Zinn GmbH
  • 6.4.3 DUKSAN Holdings
  • 6.4.4 Fusion Inc.
  • 6.4.5 Henkel AG & Co. KGaA
  • 6.4.6 Indium Corporation
  • 6.4.7 Kester
  • 6.4.8 KOKI Company Ltd.
  • 6.4.9 MacDermid Alpha Electronics Solutions
  • 6.4.10 Nihon Superior Co., Ltd.
  • 6.4.11 Qualitek International, Inc.
  • 6.4.12 Senju Metal Industry Co., Ltd.
  • 6.4.13 Stannol GmbH & Co. KG
  • 6.4.14 Tamura Corporation

7 Market Opportunities and Future Outlook

• 7.1 White-Space and Unmet-Need Assessment