시장보고서
상품코드
1866670

세계의 납땜 재료 시장 : 시장 점유율과 순위, 전체 판매 및 수요 예측(2025-2031년)

Solder Materials - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

발행일: | 리서치사: QYResearch | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

    
    
    




■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

세계의 납땜 재료 시장 규모는 2024년에 92억 2,200만 달러로 추정되며, 2025년부터 2031년까지 예측 기간 동안 CAGR 4.3%로 성장하여 2031년까지 129억 5,800만 달러로 확대될 것으로 예측됩니다.

본 보고서는 납땜 재료의 국경 간 산업 발자국, 자본 배분 패턴, 지역 경제의 상호 의존성, 공급망 재구축, 최근 관세 조정 및 국제 전략적 대응 조치에 대한 종합적인 평가를 제공합니다.

납땜은 고온의 금속 충전재를 사용하여 금속 표면을 접합하는 공정입니다. 전자기기 분야에서는 개별 부품을 기판에 고정하는 데 사용됩니다. 납땜 재료는 모든 형태의 전자기기 제조에서 납땜이 이루어지는 모든 상황에서 중요한 요소입니다. 회로가 조립된 후, 부품을 제자리에 고정하는 데 필수적인 기계적 및 전기적 접합부를 형성합니다. 기계적 강도도 중요하지만, 납땜된 접합부가 연결이 필요한 두 연결점 사이에 양호한 전기적 연결을 보장하는 것도 필요합니다. 이는 매체, 즉 두 도체를 접합하는 솔더가 양호한 전도성을 가지고 있을 때만 충분히 달성할 수 있습니다. 2024년, 세계 납땜 재료 생산량은 약 247

킬로톤에 이르렀고, 세계 평균 시장 가격은 톤당 약 3만 7,334달러를 기록했습니다.

납땜 재료는 두 개의 금속 표면을 접합하여 신뢰할 수 있는 전기적, 기계적 결합을 형성하는 데 사용되는 금속 합금입니다. 일반적으로 주석, 납, 은, 구리, 비스무트, 인듐 등 비교적 낮은 온도에서 유동 및 응고하는 능력이 있고 접합 부품을 손상시키지 않는 저융점 금속의 조합으로 구성됩니다. 용도에 따라 솔더는 연질 솔더(낮은 융점 범위와 우수한 전기 전도성으로 전자기기 조립에 많이 사용)와 경질 솔더(또는 브레이징 합금 : 융점이 높고 배관, 기계 조립, 보석 제조에 사용)로 나뉩니다. 현대의 응용 분야에서는 환경 및 건강 규제로 인해 무연 솔더가 주류를 이루고 있으며, 성능을 유지하기 위해 은, 구리 및 기타 금속을 소량 첨가한 주석 기반 합금이 사용되고 있습니다.

납땜 재료 시장은 주로 세계 전자 산업이 주도하고 있으며, 반도체 패키징, 인쇄회로기판(PCB) 조립, 부품 간 연결에 필수적입니다. 자동차 전장, 통신 장비, 재생에너지 시스템에서도 추가적인 수요가 발생하고 있으며, 모두 신뢰할 수 있는 고성능 연결이 요구되고 있습니다. 전자기기의 소형화 및 작동 온도 상승 추세는 열 안정성과 기계적 강도를 향상시킨 첨단 솔더 조성물의 개발을 촉진하고 있습니다. 유해물질 규제가 강화되는 가운데, 제조업체들은 무연 배합에 대한 투자를 늘리고 비용, 성능, 신뢰성의 균형을 고려한 새로운 합금 개발을 모색하고 있으며, 납땜 재료가 산업 전반의 기술 발전의 중요한 기반이 될 것임을 보장하고 있습니다.

이 보고서는 납땜 재료 세계 시장에 대한 종합적인 분석을 제공하는 것을 목표로 합니다. 총 판매량, 매출액, 가격, 주요 기업의 기업 점유율과 순위에 초점을 맞추고, 지역별, 국가별, 종류별, 용도별 납땜 재료의 분석을 포함하고 있습니다.

납땜 재료의 시장 규모, 추정 및 예측은 판매량(천 톤)과 매출액(백만 달러)으로 제시되며, 2024년을 기준 연도로, 2020년에서 2031년까지의 과거 데이터와 예측 데이터를 포함합니다. 정량적, 정성적 분석을 통해 독자들이 솔더 소재 관련 사업 전략 및 성장 전략 수립, 시장 경쟁 평가, 현재 시장에서의 자사 포지셔닝 분석, 정보에 입각한 사업 판단을 할 수 있도록 지원합니다.

시장 세분화

기업별

  • Alpha Assembly Solutions
  • Senju Metal Industry
  • AIM Metals & Alloys
  • Qualitek International
  • KOKI
  • Indium Corporation
  • Balver Zinn
  • Heraeus
  • Nihon Superior
  • Nihon Handa
  • Nihon Almit
  • Harima
  • DKL Metals
  • Koki Products
  • Tamura Corp
  • PT TIMAH(Persero) Tbk
  • Hybrid Metals
  • Persang Alloy Industries
  • Yunnan Tin
  • Yik Shing Tat Industrial
  • Shenmao Technology
  • Anson Solder
  • Shengdao Tin
  • Hangzhou Youbang
  • Shaoxing Tianlong Tin Materials
  • Zhejiang Asia-welding
  • QLG
  • Tongfang Tech
  • Shenzhen Fitech
  • Inventec
  • ISHIKAWA-Metal
  • KAWADA

유형별 부문

  • 납땜 와이어
  • 납땜 봉
  • 납땜 페이스트
  • 프리폼 납땜
  • 플럭스
  • 기타

용도별 부문

  • 가전제품
  • 자동차
  • 산업
  • 의료
  • 기타

지역별

  • 북미
    • 미국
    • 캐나다
  • 아시아태평양
    • 중국
    • 일본
    • 한국
    • 동남아시아
    • 인도
    • 호주
    • 기타 아시아태평양
  • 유럽
    • 독일
    • 프랑스
    • 영국
    • 이탈리아
    • 네덜란드
    • 북유럽 국가
    • 기타 유럽
  • 라틴아메리카
    • 멕시코
    • 브라질
    • 기타 라틴아메리카
  • 중동 및 아프리카
    • 튀르키예
    • 사우디아라비아
    • 아랍에미리트
    • 기타 중동 및 아프리카
KSM 25.11.26

자주 묻는 질문

  • 세계 납땜 재료 시장 규모는 어떻게 예측되나요?
  • 2024년 세계 납땜 재료 생산량은 얼마인가요?
  • 납땜 재료의 주요 용도는 무엇인가요?
  • 납땜 재료 시장의 주요 기업은 어디인가요?
  • 납땜 재료의 유형은 어떤 것들이 있나요?
  • 납땜 재료 시장의 지역별 분포는 어떻게 되나요?

The global market for Solder Materials was estimated to be worth US$ 9222 million in 2024 and is forecast to a readjusted size of US$ 12958 million by 2031 with a CAGR of 4.3% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Solder Materials cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Soldering is the process of joining metallic surfaces together using a hot metal filler. In electronics, it is used to secure individual components to circuit boards. Solder material is a key element in any form of electronics construction where soldering is undertaken. It provides a mechanical and electrical joint that is essential to keep components in place once a circuit has been assembled. While the mechanical strength is important, it is also necessary to ensure that the soldered joint provides a good electrical connection is made between the two connections that require joining. This can only be achieved satisfactorily if the medium, i.e. the solder joining the two conducts electricity well.In 2024, global Solder Materials production reached approximately 247

K MT, with an average global market price of around US$ 37334 per MT.

Solder materials are metallic alloys used to join two or more metal surfaces together, creating a reliable electrical and mechanical bond. They typically consist of a combination of metals with low melting points, such as tin, lead, silver, copper, bismuth, or indium, chosen for their ability to flow and solidify at relatively low temperatures without damaging the components being joined. Depending on the application, solder can be categorized into soft solder, often used in electronics assembly due to its lower melting range and fine electrical conductivity, and hard solder (or brazing alloys), which have higher melting points and are applied in plumbing, mechanical assemblies, and jewelry making. In modern applications, lead-free solders have gained prominence due to environmental and health regulations, relying on tin-based alloys with small additions of silver, copper, or other metals to maintain performance.

The solder materials market is driven primarily by the global electronics industry, where they are indispensable for semiconductor packaging, printed circuit board (PCB) assembly, and component interconnection. Additional demand comes from automotive electronics, telecommunications, and renewable energy systems, all of which require reliable, high-performance interconnects. The shift toward miniaturization and higher operating temperatures in electronics has also spurred innovation in advanced solder compositions with improved thermal stability and mechanical strength. As regulations continue to restrict hazardous substances, manufacturers are investing in lead-free formulations and exploring new alloys to balance cost, performance, and reliability, ensuring solder materials remain critical enablers of technological progress across industries.

This report aims to provide a comprehensive presentation of the global market for Solder Materials, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Solder Materials by region & country, by Type, and by Application.

The Solder Materials market size, estimations, and forecasts are provided in terms of sales volume (K MT) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Materials.

Market Segmentation

By Company

  • Alpha Assembly Solutions
  • Senju Metal Industry
  • AIM Metals & Alloys
  • Qualitek International
  • KOKI
  • Indium Corporation
  • Balver Zinn
  • Heraeus
  • Nihon Superior
  • Nihon Handa
  • Nihon Almit
  • Harima
  • DKL Metals
  • Koki Products
  • Tamura Corp
  • PT TIMAH (Persero) Tbk
  • Hybrid Metals
  • Persang Alloy Industries
  • Yunnan Tin
  • Yik Shing Tat Industrial
  • Shenmao Technology
  • Anson Solder
  • Shengdao Tin
  • Hangzhou Youbang
  • Shaoxing Tianlong Tin Materials
  • Zhejiang Asia-welding
  • QLG
  • Tongfang Tech
  • Shenzhen Fitech
  • Inventec
  • ISHIKAWA-Metal
  • KAWADA

Segment by Type

  • Solder Wires
  • Solder Bars
  • Solder Paste
  • Preformed Solder
  • Flux
  • Others

Segment by Application

  • Consumer Electronics
  • Automotive
  • Industrial
  • Medical
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Solder Materials manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Solder Materials in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Solder Materials in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Solder Materials Product Introduction
  • 1.2 Global Solder Materials Market Size Forecast
    • 1.2.1 Global Solder Materials Sales Value (2020-2031)
    • 1.2.2 Global Solder Materials Sales Volume (2020-2031)
    • 1.2.3 Global Solder Materials Sales Price (2020-2031)
  • 1.3 Solder Materials Market Trends & Drivers
    • 1.3.1 Solder Materials Industry Trends
    • 1.3.2 Solder Materials Market Drivers & Opportunity
    • 1.3.3 Solder Materials Market Challenges
    • 1.3.4 Solder Materials Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Solder Materials Players Revenue Ranking (2024)
  • 2.2 Global Solder Materials Revenue by Company (2020-2025)
  • 2.3 Global Solder Materials Players Sales Volume Ranking (2024)
  • 2.4 Global Solder Materials Sales Volume by Company Players (2020-2025)
  • 2.5 Global Solder Materials Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers Solder Materials Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers Solder Materials Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of Solder Materials
  • 2.9 Solder Materials Market Competitive Analysis
    • 2.9.1 Solder Materials Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by Solder Materials Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Solder Materials as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 Solder Wires
    • 3.1.2 Solder Bars
    • 3.1.3 Solder Paste
    • 3.1.4 Preformed Solder
    • 3.1.5 Flux
    • 3.1.6 Others
  • 3.2 Global Solder Materials Sales Value by Type
    • 3.2.1 Global Solder Materials Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Solder Materials Sales Value, by Type (2020-2031)
    • 3.2.3 Global Solder Materials Sales Value, by Type (%) (2020-2031)
  • 3.3 Global Solder Materials Sales Volume by Type
    • 3.3.1 Global Solder Materials Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global Solder Materials Sales Volume, by Type (2020-2031)
    • 3.3.3 Global Solder Materials Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global Solder Materials Average Price by Type (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 Consumer Electronics
    • 4.1.2 Automotive
    • 4.1.3 Industrial
    • 4.1.4 Medical
    • 4.1.5 Others
  • 4.2 Global Solder Materials Sales Value by Application
    • 4.2.1 Global Solder Materials Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Solder Materials Sales Value, by Application (2020-2031)
    • 4.2.3 Global Solder Materials Sales Value, by Application (%) (2020-2031)
  • 4.3 Global Solder Materials Sales Volume by Application
    • 4.3.1 Global Solder Materials Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global Solder Materials Sales Volume, by Application (2020-2031)
    • 4.3.3 Global Solder Materials Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global Solder Materials Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global Solder Materials Sales Value by Region
    • 5.1.1 Global Solder Materials Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Solder Materials Sales Value by Region (2020-2025)
    • 5.1.3 Global Solder Materials Sales Value by Region (2026-2031)
    • 5.1.4 Global Solder Materials Sales Value by Region (%), (2020-2031)
  • 5.2 Global Solder Materials Sales Volume by Region
    • 5.2.1 Global Solder Materials Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global Solder Materials Sales Volume by Region (2020-2025)
    • 5.2.3 Global Solder Materials Sales Volume by Region (2026-2031)
    • 5.2.4 Global Solder Materials Sales Volume by Region (%), (2020-2031)
  • 5.3 Global Solder Materials Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America Solder Materials Sales Value, 2020-2031
    • 5.4.2 North America Solder Materials Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe Solder Materials Sales Value, 2020-2031
    • 5.5.2 Europe Solder Materials Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific Solder Materials Sales Value, 2020-2031
    • 5.6.2 Asia Pacific Solder Materials Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America Solder Materials Sales Value, 2020-2031
    • 5.7.2 South America Solder Materials Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa Solder Materials Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa Solder Materials Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Solder Materials Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Solder Materials Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions Solder Materials Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions Solder Materials Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Solder Materials Sales Value, 2020-2031
    • 6.3.2 United States Solder Materials Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Solder Materials Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Solder Materials Sales Value, 2020-2031
    • 6.4.2 Europe Solder Materials Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Solder Materials Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Solder Materials Sales Value, 2020-2031
    • 6.5.2 China Solder Materials Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Solder Materials Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Solder Materials Sales Value, 2020-2031
    • 6.6.2 Japan Solder Materials Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Solder Materials Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Solder Materials Sales Value, 2020-2031
    • 6.7.2 South Korea Solder Materials Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Solder Materials Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Solder Materials Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Solder Materials Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Solder Materials Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Solder Materials Sales Value, 2020-2031
    • 6.9.2 India Solder Materials Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Solder Materials Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 Alpha Assembly Solutions
    • 7.1.1 Alpha Assembly Solutions Company Information
    • 7.1.2 Alpha Assembly Solutions Introduction and Business Overview
    • 7.1.3 Alpha Assembly Solutions Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 Alpha Assembly Solutions Solder Materials Product Offerings
    • 7.1.5 Alpha Assembly Solutions Recent Development
  • 7.2 Senju Metal Industry
    • 7.2.1 Senju Metal Industry Company Information
    • 7.2.2 Senju Metal Industry Introduction and Business Overview
    • 7.2.3 Senju Metal Industry Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 Senju Metal Industry Solder Materials Product Offerings
    • 7.2.5 Senju Metal Industry Recent Development
  • 7.3 AIM Metals & Alloys
    • 7.3.1 AIM Metals & Alloys Company Information
    • 7.3.2 AIM Metals & Alloys Introduction and Business Overview
    • 7.3.3 AIM Metals & Alloys Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 AIM Metals & Alloys Solder Materials Product Offerings
    • 7.3.5 AIM Metals & Alloys Recent Development
  • 7.4 Qualitek International
    • 7.4.1 Qualitek International Company Information
    • 7.4.2 Qualitek International Introduction and Business Overview
    • 7.4.3 Qualitek International Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.4.4 Qualitek International Solder Materials Product Offerings
    • 7.4.5 Qualitek International Recent Development
  • 7.5 KOKI
    • 7.5.1 KOKI Company Information
    • 7.5.2 KOKI Introduction and Business Overview
    • 7.5.3 KOKI Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.5.4 KOKI Solder Materials Product Offerings
    • 7.5.5 KOKI Recent Development
  • 7.6 Indium Corporation
    • 7.6.1 Indium Corporation Company Information
    • 7.6.2 Indium Corporation Introduction and Business Overview
    • 7.6.3 Indium Corporation Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.6.4 Indium Corporation Solder Materials Product Offerings
    • 7.6.5 Indium Corporation Recent Development
  • 7.7 Balver Zinn
    • 7.7.1 Balver Zinn Company Information
    • 7.7.2 Balver Zinn Introduction and Business Overview
    • 7.7.3 Balver Zinn Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.7.4 Balver Zinn Solder Materials Product Offerings
    • 7.7.5 Balver Zinn Recent Development
  • 7.8 Heraeus
    • 7.8.1 Heraeus Company Information
    • 7.8.2 Heraeus Introduction and Business Overview
    • 7.8.3 Heraeus Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.8.4 Heraeus Solder Materials Product Offerings
    • 7.8.5 Heraeus Recent Development
  • 7.9 Nihon Superior
    • 7.9.1 Nihon Superior Company Information
    • 7.9.2 Nihon Superior Introduction and Business Overview
    • 7.9.3 Nihon Superior Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.9.4 Nihon Superior Solder Materials Product Offerings
    • 7.9.5 Nihon Superior Recent Development
  • 7.10 Nihon Handa
    • 7.10.1 Nihon Handa Company Information
    • 7.10.2 Nihon Handa Introduction and Business Overview
    • 7.10.3 Nihon Handa Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.10.4 Nihon Handa Solder Materials Product Offerings
    • 7.10.5 Nihon Handa Recent Development
  • 7.11 Nihon Almit
    • 7.11.1 Nihon Almit Company Information
    • 7.11.2 Nihon Almit Introduction and Business Overview
    • 7.11.3 Nihon Almit Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.11.4 Nihon Almit Solder Materials Product Offerings
    • 7.11.5 Nihon Almit Recent Development
  • 7.12 Harima
    • 7.12.1 Harima Company Information
    • 7.12.2 Harima Introduction and Business Overview
    • 7.12.3 Harima Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.12.4 Harima Solder Materials Product Offerings
    • 7.12.5 Harima Recent Development
  • 7.13 DKL Metals
    • 7.13.1 DKL Metals Company Information
    • 7.13.2 DKL Metals Introduction and Business Overview
    • 7.13.3 DKL Metals Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.13.4 DKL Metals Solder Materials Product Offerings
    • 7.13.5 DKL Metals Recent Development
  • 7.14 Koki Products
    • 7.14.1 Koki Products Company Information
    • 7.14.2 Koki Products Introduction and Business Overview
    • 7.14.3 Koki Products Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.14.4 Koki Products Solder Materials Product Offerings
    • 7.14.5 Koki Products Recent Development
  • 7.15 Tamura Corp
    • 7.15.1 Tamura Corp Company Information
    • 7.15.2 Tamura Corp Introduction and Business Overview
    • 7.15.3 Tamura Corp Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.15.4 Tamura Corp Solder Materials Product Offerings
    • 7.15.5 Tamura Corp Recent Development
  • 7.16 PT TIMAH (Persero) Tbk
    • 7.16.1 PT TIMAH (Persero) Tbk Company Information
    • 7.16.2 PT TIMAH (Persero) Tbk Introduction and Business Overview
    • 7.16.3 PT TIMAH (Persero) Tbk Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.16.4 PT TIMAH (Persero) Tbk Solder Materials Product Offerings
    • 7.16.5 PT TIMAH (Persero) Tbk Recent Development
  • 7.17 Hybrid Metals
    • 7.17.1 Hybrid Metals Company Information
    • 7.17.2 Hybrid Metals Introduction and Business Overview
    • 7.17.3 Hybrid Metals Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.17.4 Hybrid Metals Solder Materials Product Offerings
    • 7.17.5 Hybrid Metals Recent Development
  • 7.18 Persang Alloy Industries
    • 7.18.1 Persang Alloy Industries Company Information
    • 7.18.2 Persang Alloy Industries Introduction and Business Overview
    • 7.18.3 Persang Alloy Industries Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.18.4 Persang Alloy Industries Solder Materials Product Offerings
    • 7.18.5 Persang Alloy Industries Recent Development
  • 7.19 Yunnan Tin
    • 7.19.1 Yunnan Tin Company Information
    • 7.19.2 Yunnan Tin Introduction and Business Overview
    • 7.19.3 Yunnan Tin Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.19.4 Yunnan Tin Solder Materials Product Offerings
    • 7.19.5 Yunnan Tin Recent Development
  • 7.20 Yik Shing Tat Industrial
    • 7.20.1 Yik Shing Tat Industrial Company Information
    • 7.20.2 Yik Shing Tat Industrial Introduction and Business Overview
    • 7.20.3 Yik Shing Tat Industrial Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.20.4 Yik Shing Tat Industrial Solder Materials Product Offerings
    • 7.20.5 Yik Shing Tat Industrial Recent Development
  • 7.21 Shenmao Technology
    • 7.21.1 Shenmao Technology Company Information
    • 7.21.2 Shenmao Technology Introduction and Business Overview
    • 7.21.3 Shenmao Technology Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.21.4 Shenmao Technology Solder Materials Product Offerings
    • 7.21.5 Shenmao Technology Recent Development
  • 7.22 Anson Solder
    • 7.22.1 Anson Solder Company Information
    • 7.22.2 Anson Solder Introduction and Business Overview
    • 7.22.3 Anson Solder Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.22.4 Anson Solder Solder Materials Product Offerings
    • 7.22.5 Anson Solder Recent Development
  • 7.23 Shengdao Tin
    • 7.23.1 Shengdao Tin Company Information
    • 7.23.2 Shengdao Tin Introduction and Business Overview
    • 7.23.3 Shengdao Tin Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.23.4 Shengdao Tin Solder Materials Product Offerings
    • 7.23.5 Shengdao Tin Recent Development
  • 7.24 Hangzhou Youbang
    • 7.24.1 Hangzhou Youbang Company Information
    • 7.24.2 Hangzhou Youbang Introduction and Business Overview
    • 7.24.3 Hangzhou Youbang Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.24.4 Hangzhou Youbang Solder Materials Product Offerings
    • 7.24.5 Hangzhou Youbang Recent Development
  • 7.25 Shaoxing Tianlong Tin Materials
    • 7.25.1 Shaoxing Tianlong Tin Materials Company Information
    • 7.25.2 Shaoxing Tianlong Tin Materials Introduction and Business Overview
    • 7.25.3 Shaoxing Tianlong Tin Materials Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.25.4 Shaoxing Tianlong Tin Materials Solder Materials Product Offerings
    • 7.25.5 Shaoxing Tianlong Tin Materials Recent Development
  • 7.26 Zhejiang Asia-welding
    • 7.26.1 Zhejiang Asia-welding Company Information
    • 7.26.2 Zhejiang Asia-welding Introduction and Business Overview
    • 7.26.3 Zhejiang Asia-welding Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.26.4 Zhejiang Asia-welding Solder Materials Product Offerings
    • 7.26.5 Zhejiang Asia-welding Recent Development
  • 7.27 QLG
    • 7.27.1 QLG Company Information
    • 7.27.2 QLG Introduction and Business Overview
    • 7.27.3 QLG Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.27.4 QLG Solder Materials Product Offerings
    • 7.27.5 QLG Recent Development
  • 7.28 Tongfang Tech
    • 7.28.1 Tongfang Tech Company Information
    • 7.28.2 Tongfang Tech Introduction and Business Overview
    • 7.28.3 Tongfang Tech Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.28.4 Tongfang Tech Solder Materials Product Offerings
    • 7.28.5 Tongfang Tech Recent Development
  • 7.29 Shenzhen Fitech
    • 7.29.1 Shenzhen Fitech Company Information
    • 7.29.2 Shenzhen Fitech Introduction and Business Overview
    • 7.29.3 Shenzhen Fitech Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.29.4 Shenzhen Fitech Solder Materials Product Offerings
    • 7.29.5 Shenzhen Fitech Recent Development
  • 7.30 Inventec
    • 7.30.1 Inventec Company Information
    • 7.30.2 Inventec Introduction and Business Overview
    • 7.30.3 Inventec Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.30.4 Inventec Solder Materials Product Offerings
    • 7.30.5 Inventec Recent Development
  • 7.31 ISHIKAWA-Metal
    • 7.31.1 ISHIKAWA-Metal Company Information
    • 7.31.2 ISHIKAWA-Metal Introduction and Business Overview
    • 7.31.3 ISHIKAWA-Metal Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.31.4 ISHIKAWA-Metal Solder Materials Product Offerings
    • 7.31.5 ISHIKAWA-Metal Recent Development
  • 7.32 KAWADA
    • 7.32.1 KAWADA Company Information
    • 7.32.2 KAWADA Introduction and Business Overview
    • 7.32.3 KAWADA Solder Materials Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.32.4 KAWADA Solder Materials Product Offerings
    • 7.32.5 KAWADA Recent Development

8 Industry Chain Analysis

  • 8.1 Solder Materials Industrial Chain
  • 8.2 Solder Materials Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Solder Materials Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Solder Materials Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer
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