반도체 첨단 패키징 재료 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the semiconductor advanced packaging materials market size is estimated at USD 18.56 billion in 2025 and is estimated to grow from USD 20.11 billion in 2026 to USD 31.03 billion by 2031, at a CAGR of 9.06% during the forecast period (2026-2031).

This report is Segmented by Material Type (Substrates and More), Packaging Technology (Flip-Chip Packaging and More), Application (Logic and AI Processors and More), and Geography (Asia-Pacific, North America, Europe, South America, and Middle-East and Africa). The Market Forecasts are Provided in Terms of Value (USD).

Global Semiconductor Advanced Packaging Materials Market Trends and Insights

AI and HBM Package Complexity Driving Materials Bill-of-Materials Expansion

Each HBM generation increases the material content required in an AI package. HBM4 entered production in 2026 and requires molded underfill formulations with higher thermal conductivity near the die-to-die physical interface. SK hynix introduced its iHBM thermal solution on May 26, 2026, integrating silicon-based cooling elements into the HBM package. The company stated that the solution reduces thermal resistance by 30% while maintaining compatibility with its Advanced Mass Reflow Molded Underfill (MR-MUF) process. Samsung's hybrid copper bonding route and SK hynix's MR-MUF approach create separate qualification paths for underfill materials. Suppliers that align early with a customer's selected bonding route can secure qualified status, while suppliers serving multiple routes face additional development requirements.

Heterogeneous Integration and Chiplet Adoption Multiplying Interface Layers

Chiplet architectures add die-to-die and die-to-interposer interfaces that require underfill, adhesive, and dielectric treatment. This increases the material requirement for each package rather than simply increasing unit shipments. Intel's 2025 patent filings described chiplet metallization directly bonded to host integrated circuit (IC) back-end-of-line layers, which could reduce the role of silicon interposers and increase the role of organic redistribution-layer dielectric materials. Therefore, the semiconductor advanced packaging materials market is affected when package designs use more interfaces and more material types. Heterogeneous integration and hybrid bonding remain central technology paths for chiplet development. Foundry-approved material lists can become a practical requirement for participation in specialized packaging programs.

High Material Qualification Costs Constraining New Material Adoption Velocity

New materials often require an 18- to 24-month customer qualification cycle. Testing typically covers thermal cycling, moisture sensitivity, mechanical reliability, and, in many cases, wafer-level process integration. A completed qualification for one packaging node may not apply to the next generation if package geometry, layer count, or bonding architecture changes. This requirement strengthens the position of existing approved suppliers in the semiconductor advanced packaging materials market. Long-term supply agreements and capacity reservations for approved materials further support this position. Suppliers outside approved vendor lists for 2.5D and 3D packaging may have limited opportunities to enter the market before the next package generation.

Other drivers and restraints analyzed in the detailed report include:

1. ABF and Low-Loss Material Qualification Creating Structural Supply Constraints
2. TIM1.5 and Package-Level Thermal Innovation Emerging as a Distinct Market Segment
3. PFAS Substitution and Chemical Traceability: Introducing Multi-Year Compliance Costs

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Substrates accounted for 41.12% of the semiconductor advanced packaging materials market share in 2025. Their position reflected the structural and electrical routing role they play across advanced package types. ABF build-up film, copper-clad laminates, and solder resist form the core substrate material set. Larger AI server packages require more substrate area per unit, while higher layer counts increase build-up film consumption. The IEEE Electronics Packaging Society states that leading redistribution-layer implementations now use 2 µm linewidths, while target dielectric constants are moving toward 2.0 or below. These requirements support the use of low-loss dielectric materials as demand for package signals increases.

Die attach materials are expected to register a 9.53% CAGR from 2026 to 2031, the highest growth rate within this material grouping. Sintered silver die attach films are gaining use in power electronics and dense flip-chip applications, where conventional polymer pastes cannot meet thermal and reliability requirements. Underfill demand is rising with the deeper adoption of flip-chip technology in AI and high-performance computing packages. Large-body flip-chip BGA configurations also require materials that can manage low-gap-height die connections. Encapsulation materials support high-volume mobile and IoT assembly, while thermal interface materials, solder materials, and build-up films are becoming more important. The semiconductor advanced packaging materials industry relies on all these categories to balance heat removal, mechanical reliability, and electrical performance.

Complete Report Scope:

• By Material Type
  • Substrates
  • Die Attach Materials
  • Underfill Materials
  • Encapsulation Materials
  • Others (Thermal Interface Materials, Solder Materials, Bonding Materials, Build-Up Films and Other Packaging Materials)
• By Packaging Technology
  • Flip-Chip Packaging
  • Fan-Out Packaging (FOWLP/FOPLP)
  • 2.5D and 3D IC Packaging
  • Others (Wafer-Level CSP, System-in-Package, Embedded-Die, Silicon Bridge and Hybrid Bonding)
• By Application
  • Logic and AI Processors
  • Memory Devices
  • RF, Analog and Power Devices
  • Others (MEMS and Sensors, Photonics and Optoelectronics)
• By Geography
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Middle-East and Africa
    • Saudi Arabia
    • South Africa
    • Rest of Middle-East and Africa

Geography Analysis

Asia-Pacific held 39.18% of the semiconductor advanced packaging materials market share in 2025 and is forecast to grow at a CAGR of 9.88% through 2031. The region has a high concentration of advanced packaging capacity and semiconductor materials production. Taiwan remains a key hub for IC substrate production. Japan supplies Ajinomoto Build-up Film (ABF), encapsulants, and advanced dielectric polymers to global supply chains. South Korea maintains strong activity in package substrates, supported by demand for AI accelerators and server CPUs. India is emerging as a secondary location for materials applications and innovation centers that support national assembly and packaging plans.

North America has the largest concentration of AI chip design activity, but its production assets remain limited relative to design demand. This gap keeps the region dependent on imported advanced packaging materials. Europe is led by Austria's AT&S, which opened Europe's first IC substrate production facility in Leoben in June 2025. The project included an investment exceeding EUR 500 million, which the source reported as USD 550 million. Germany has substantial materials supplier activity through Henkel's portfolio of underfills, encapsulants, and thermal management materials. These capabilities position Europe in substrate manufacturing and specialty materials development.

South America, the Middle-East, and Africa remained minor contributors to the advanced packaging materials market for semiconductors in 2025. Mexico is attracting electronics manufacturing investment, which could create local demand for encapsulants and adhesives, particularly in automotive and consumer electronics assembly. Middle-Eastern countries are investing in semiconductor supply chain infrastructure through national technology programs, although advanced packaging materials capacity in the region remains limited. South Africa and other African locations remain focused on downstream electronics assembly rather than semiconductor packaging. Their future contribution depends on the broader regionalization of the semiconductor supply chain through the late 2020s.

1. Ajinomoto Fine-Techno Co.,Inc.
2. AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
3. Dow
4. DuPont
5. Henkel AG & Co. KGaA
6. IBIDEN
7. KYOCERA Corporation
8. LG Chem
9. NAMICS CORPORATION
10. Nan Ya PCB Co., Ltd.
11. Resonac Holdings Corporation
12. SAMSUNG ELECTRO-MECHANICS
13. Shin-Etsu Chemical Co., Ltd.
14. SHINKO ELECTRIC INDUSTRIES
15. Sumitomo Bakelite Co., Ltd.
16. Unimicron

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 Introduction

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 Research Methodology

3 Executive Summary

4 Market Landscape

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 AI and HBM Package Complexity Increasing Materials Content
  • 4.2.2 Heterogeneous Integration and Chiplet Adoption
  • 4.2.3 Miniaturization, Higher I/O Density, and Faster Signal Transmission
  • 4.2.4 Automotive Electrification and ADAS Reliability Requirements
  • 4.2.5 ABF and Low-Loss Material Qualification for Large AI Packages
  • 4.2.6 TIM1.5 and Package-Level Thermal Innovation
• 4.3 Market Restraints
  • 4.3.1 High Material Qualification Costs and Long Customer Approval Cycles
  • 4.3.2 Capital Intensity and Yield Sensitivity in Advanced Packaging
  • 4.3.3 Warpage and Coefficient-of-Thermal-Expansion Mismatch in Large Packages
  • 4.3.4 PFAS Substitution and Chemical Traceability Risk
• 4.4 Value Chain Analysis
• 4.5 Porter's Five Forces Analysis
  • 4.5.1 Bargaining Power of Suppliers
  • 4.5.2 Bargaining Power of Buyers
  • 4.5.3 Threat of New Entrants
  • 4.5.4 Threat of Substitutes
  • 4.5.5 Competitive Rivalry

5 Market Size and Growth Forecasts (Value)

• 5.1 By Material Type
  • 5.1.1 Substrates
  • 5.1.2 Die Attach Materials
  • 5.1.3 Underfill Materials
  • 5.1.4 Encapsulation Materials
  • 5.1.5 Others (Thermal Interface Materials, Solder Materials, Bonding Materials, Build-Up Films and Other Packaging Materials)
• 5.2 By Packaging Technology
  • 5.2.1 Flip-Chip Packaging
  • 5.2.2 Fan-Out Packaging (FOWLP/FOPLP)
  • 5.2.3 2.5D and 3D IC Packaging
  • 5.2.4 Others (Wafer-Level CSP, System-in-Package, Embedded-Die, Silicon Bridge and Hybrid Bonding)
• 5.3 By Application
  • 5.3.1 Logic and AI Processors
  • 5.3.2 Memory Devices
  • 5.3.3 RF, Analog and Power Devices
  • 5.3.4 Others (MEMS and Sensors, Photonics and Optoelectronics)
• 5.4 By Geography
  • 5.4.1 Asia-Pacific
    • 5.4.1.1 China
    • 5.4.1.2 India
    • 5.4.1.3 Japan
    • 5.4.1.4 South Korea
    • 5.4.1.5 Rest of Asia-Pacific
  • 5.4.2 North America
    • 5.4.2.1 United States
    • 5.4.2.2 Canada
    • 5.4.2.3 Mexico
  • 5.4.3 Europe
    • 5.4.3.1 Germany
    • 5.4.3.2 United Kingdom
    • 5.4.3.3 France
    • 5.4.3.4 Italy
    • 5.4.3.5 Rest of Europe
  • 5.4.4 South America
    • 5.4.4.1 Brazil
    • 5.4.4.2 Argentina
    • 5.4.4.3 Rest of South America
  • 5.4.5 Middle-East and Africa
    • 5.4.5.1 Saudi Arabia
    • 5.4.5.2 South Africa
    • 5.4.5.3 Rest of Middle-East and Africa

6 Competitive Landscape

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share (%)/Ranking Analysis
• 6.4 Company Profiles (includes Global Overview, Market Overview, Core Segments, Financials as available, Strategic Information, Products and Services, and Recent Developments)
  • 6.4.1 Ajinomoto Fine-Techno Co.,Inc.
  • 6.4.2 AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
  • 6.4.3 Dow
  • 6.4.4 DuPont
  • 6.4.5 Henkel AG & Co. KGaA
  • 6.4.6 IBIDEN
  • 6.4.7 KYOCERA Corporation
  • 6.4.8 LG Chem
  • 6.4.9 NAMICS CORPORATION
  • 6.4.10 Nan Ya PCB Co., Ltd.
  • 6.4.11 Resonac Holdings Corporation
  • 6.4.12 SAMSUNG ELECTRO-MECHANICS
  • 6.4.13 Shin-Etsu Chemical Co., Ltd.
  • 6.4.14 SHINKO ELECTRIC INDUSTRIES
  • 6.4.15 Sumitomo Bakelite Co., Ltd.
  • 6.4.16 Unimicron

7 Market Opportunities and Future Outlook

• 7.1 White-Space and Unmet-Need Assessment