유럽의 이미지 센서 : 시장 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the Europe image sensors market size is projected to be USD 3.75 billion in 2025, USD 4.1 billion in 2026, and reach USD 6.21 billion by 2031, growing at a CAGR of 8.66% from 2026 to 2031.

This report is Segmented by Type (CMOS, and CCD), Resolution (<= 8 MP, 9-24 MP, 25-64 MP, 65-200 MP, and More), Spectrum (Visible RGB, Near-Infrared NIR, Short-Wave Infrared SWIR, and More), Shutter Technology (Rolling-Shutter CMOS, and Global-Shutter CMOS), End-User Industry (Consumer Electronics, Healthcare, Industrial, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Europe Image Sensors Market Trends and Insights

Euro NCAP Front-Camera Mandate (AEB)

Euro NCAP's 2025 and 2026 protocols award up to 25 points for driver-monitoring and pedestrian-detection performance, effectively forcing every automaker that seeks a five-star rating to adopt near-infrared forward and in-cabin imagers. Integrators compressed sourcing timetables by 18-24 months to meet July 2024 EU General Safety Regulation deadlines, which amplified demand for Europe image sensors market supply. onsemi disclosed that 450 million of its automotive cameras were already on the road by third-quarter 2025, with 68% of design wins linked to Euro-compliant platforms. The regulatory premium is also steering time-of-flight (ToF) modules into cockpits, as occupant-classification rules tighten air-bag deployment criteria. Germany's Bosch, Continental, and ZF are fusing side and rear views with the mandated front-camera feed, generating sticky software interfaces that protect incumbent sensor suppliers. The mandate therefore raises unit count per vehicle and entrenches established vendors, contributing materially to the growth trajectory of the Europe image sensors market.

Multi-Camera Smartphone Race Beyond 200 MP

Pixel pitch in flagship phones fell below 0.6 µm during 2025 as Sony and OmniVision each unveiled 200-megapixel parts, lifting average selling prices above USD 30 per sensor. Samsung is scaling 0.5 µm nodes in Hwaseong to regain premium-tier ground, while European module assemblers in Germany and France gain volume because sub-micron pixels demand tighter optical tolerances. Wafer-level camera modules integrate the lens directly on the die, shaving 1.2 mm from z-height and enabling periscope telephoto designs. Although Asian chipmakers dominate supply, the Europe image sensors market benefits indirectly through higher equipment-automation intensity and through a larger pull for photonics packaging materials sourced from European specialty-glass vendors. With premium Android shipments stabilizing, the value-uplift rather than raw volume expansion supports incremental revenue.

High EU Energy and Clean-Room Utility Costs

Electricity prices in continental Europe remain two to three times higher than those in East Asia, raising fabrication costs just as the Europe image sensors market migrates from 200 mm to energy-hungry 300 mm lines. Clean-room heating, ventilation, and air-conditioning systems consume up to 40 % of total fab energy, obliging STMicroelectronics to invest EUR 120 million (USD 128 million) in on-site solar and cogeneration to hedge price swings. KPMG's 2025 semiconductor survey found that 66 % of regional respondents deferred capital expenditure because of energy uncertainty, well above the 51 % global average. ams-OSRAM's EUR 567 million (USD 602 million) Premstaetten project focuses on high-mix, low-volume automotive and medical sensors with average selling prices above USD 5, avoiding cost competition with sub-USD 1 smartphone parts. Even so, nightshift scheduling to capture off-peak tariffs trims overall utilization by several percentage points, modestly dragging the aggregate growth of the Europe image sensors market.

Other drivers and restraints analyzed in the detailed report include:

1. Wafer-Level Optics and Stacked-CIS Migration
2. AI-Enabled Industrial Machine-Vision Grants
3. Limited 300 mm CIS-Grade Capacity

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

CMOS devices captured 96.19% of 2025 revenue, reflecting stacked architectures that triple pixel-readout bandwidth and backside illumination that lifts quantum efficiency by up to 40%. Sony's 24.55-megapixel IMX925 global-shutter part runs 394 frames per second using copper-to-copper hybrid bonding, while STMicroelectronics' 5-megapixel BrightSense reaches 4 000-electron full-well capacity for 120 decibel scenes. CCD imagers, with 3.81% share, linger in astronomy and spectroscopy because they maintain charge-transfer efficiency above 99.999%, although electron-multiplying CMOS and SPAD arrays are eroding that moat. A gradual shift toward energy-efficient mobile applications and Euro NCAP-compliant automotive cameras is expanding the CMOS slice of the Europe image sensors market.

CMOS is forecast to advance at a 9.21% CAGR, comfortably above the overall 8.66% trajectory, while CCD declines in low single digits. Much of the incremental Europe image sensors market size upside stems from stacked die that embed AI accelerators and on-chip data compression, shrinking off-sensor bandwidth needs. The feature set raises subsystem-level performance, justifying premium pricing that outweighs the higher wafer cost of through-silicon vias. Niche CCD opportunities in scientific instrumentation persist yet remain immaterial to aggregate revenue.

The 25-64-megapixel class held 42.31% of 2025 shipments, preferred for automotive surround-view fusion and printed-circuit inspection where balanced frame rate and resolution matter. Units exceeding 200 megapixels grew from a negligible base to 200 million smartphone sockets in 2025, driven by lossless digital zoom and multi-frame super-resolution algorithms that ride hyperspectral data. That cohort is scaling at a 9.06% CAGR, outpacing all other brackets and contributing a disproportionate chunk of incremental Europe image sensors market size.

Lower bands below 8 megapixels retain relevance in reverse-camera and video-conference modules, especially as enterprise laptops upgrade webcams to 1080p. The 9-24-megapixel slot is steady at roughly one-fifth of shipments, spanning 12-megapixel selfie cameras and 20-megapixel medical endoscopes. Mid-tier momentum will persist because industrial and automotive systems cannot compromise on frame rate, yet high-resolution sensor average selling prices ensure that revenue mix skews upward, supporting the premium layer of the Europe image sensors market.

Complete Report Scope:

• By Type
  • CMOS
  • CCD
• By Resolution
  • Less Than Equal to 8 MP
  • 9 - 24 MP
  • 25 - 64 MP
  • 65 - 200 MP
  • More than 200 MP
• By Spectrum
  • Visible (RGB)
  • Near-Infrared (NIR)
  • Short-Wave Infrared (SWIR)
  • Ultraviolet (UV)
  • Thermal / Long-Wave Infrared (LWIR)
• By Shutter Technology
  • Rolling-Shutter CMOS
  • Global-Shutter CMOS
• By End-User Industry
  • Consumer Electronics
  • Healthcare
  • Industrial
  • Security and Surveillance
  • Automotive and Transportation
  • Aerospace and Defense
  • Other End-User Industries
• By Country
  • United Kingdom
  • Germany
  • France
  • Italy
  • Rest of Europe

List of Companies Covered in this Report:

1. STMicroelectronics N.V.
2. Sony Group Corporation
3. Samsung Electronics Co., Ltd.
4. ON Semiconductor Corporation.
5. OmniVision Technologies Inc.
6. BAE Systems plc
7. Toshiba Electronic Devices and Storage Corporation
8. Nikon Corporation
9. Panasonic Holdings Corporation
10. SK hynix Inc.
11. Canon Inc.
12. ams-OSRAM AG
13. Teledyne FLIR LLC
14. Hamamatsu Photonics K.K.
15. PixArt Imaging Inc.
16. Tower Semiconductor Ltd.
17. Gpixel NV
18. Himax Technologies Inc.
19. GalaxyCore Inc.
20. Teledyne e2v Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Multi-Camera Smartphone Race Beyond 200 MP
  • 4.2.2 Euro NCAP Front-Camera Mandate (AEB)
  • 4.2.3 Wafer-Level Optics and Stacked CIS Migration
  • 4.2.4 AI-Enabled Industrial Machine-Vision Grants
  • 4.2.5 Disposable Chip-On-Tip Medical Endoscopy
  • 4.2.6 Photon-Counting SPAD Sensors for Automotive LiDAR Pilots
• 4.3 Market Restraints
  • 4.3.1 High EU Energy and Clean-Room Utility Costs
  • 4.3.2 Limited 300 mm CIS-Grade Capacity
  • 4.3.3 Strict EU Data-Privacy Rules Limiting Facial-Recognition Roll-Out
  • 4.3.4 Talent Shortage in Advanced Pixel-Design Engineering
• 4.4 Industry Value-Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Type
  • 5.1.1 CMOS
  • 5.1.2 CCD
• 5.2 By Resolution
  • 5.2.1 Less Than Equal to 8 MP
  • 5.2.2 9 - 24 MP
  • 5.2.3 25 - 64 MP
  • 5.2.4 65 - 200 MP
  • 5.2.5 More than 200 MP
• 5.3 By Spectrum
  • 5.3.1 Visible (RGB)
  • 5.3.2 Near-Infrared (NIR)
  • 5.3.3 Short-Wave Infrared (SWIR)
  • 5.3.4 Ultraviolet (UV)
  • 5.3.5 Thermal / Long-Wave Infrared (LWIR)
• 5.4 By Shutter Technology
  • 5.4.1 Rolling-Shutter CMOS
  • 5.4.2 Global-Shutter CMOS
• 5.5 By End-User Industry
  • 5.5.1 Consumer Electronics
  • 5.5.2 Healthcare
  • 5.5.3 Industrial
  • 5.5.4 Security and Surveillance
  • 5.5.5 Automotive and Transportation
  • 5.5.6 Aerospace and Defense
  • 5.5.7 Other End-User Industries
• 5.6 By Country
  • 5.6.1 United Kingdom
  • 5.6.2 Germany
  • 5.6.3 France
  • 5.6.4 Italy
  • 5.6.5 Rest of Europe

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 STMicroelectronics N.V.
  • 6.4.2 Sony Group Corporation
  • 6.4.3 Samsung Electronics Co., Ltd.
  • 6.4.4 ON Semiconductor Corporation.
  • 6.4.5 OmniVision Technologies Inc.
  • 6.4.6 BAE Systems plc
  • 6.4.7 Toshiba Electronic Devices and Storage Corporation
  • 6.4.8 Nikon Corporation
  • 6.4.9 Panasonic Holdings Corporation
  • 6.4.10 SK hynix Inc.
  • 6.4.11 Canon Inc.
  • 6.4.12 ams-OSRAM AG
  • 6.4.13 Teledyne FLIR LLC
  • 6.4.14 Hamamatsu Photonics K.K.
  • 6.4.15 PixArt Imaging Inc.
  • 6.4.16 Tower Semiconductor Ltd.
  • 6.4.17 Gpixel NV
  • 6.4.18 Himax Technologies Inc.
  • 6.4.19 GalaxyCore Inc.
  • 6.4.20 Teledyne e2v Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment