첨단 IC 기판 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the advanced IC substrates market size is expected to grow from USD 10.66 billion in 2025 to USD 11.37 billion in 2026 and is forecast to reach USD 15.67 billion by 2031 at a 6.63% CAGR over 2026-2031.

This report is Segmented by Substrate Type (Flip-Chip Ball Grid Array, Flip-Chip Chip Scale Package, and More), Core Material (Glass, Ceramic, and More), Packaging Technology (2D Flip-Chip, SiP/Module, and More), Device Node (Above 28nm, 7-5nm, and More), End-Use Industry (Mobile and Consumer, Data-Centre/AI and HPC, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Advanced IC Substrates Market Trends and Insights

Surge in ABF-Substrate Demand for AI and HPC Accelerators

Hyperscale operators installed more than 1.2 million AI accelerator units in 2025, each integrating four to six flip-chip BGA substrates that must withstand power draw above 700 watts. Average selling prices climbed from USD 65 in 2024 to USD 82 in 2025 as coating-line additions lagged demand, widening suppliers' margins as they locked in Ajinomoto film allocations. Fabless chipmakers are now co-investing in substrate plants, illustrated by AMD's USD 400 million venture with Siliconware Precision Industries that secures 30% of a new Taiwanese facility's output. These forward-buy agreements squeeze mid-tier vendors that lack guaranteed slots, reinforcing a capacity oligopoly. As long as accelerator shipments double every 2 years, the advanced IC substrates market will continue to absorb incremental ABF panels at premium pricing.

Miniaturisation and Heterogeneous Integration Trend

Chiplet architectures slice monolithic dies into smaller compute, I/O, and memory tiles, cutting die area by up to 40% and enabling node-mixing strategies. Such layouts demand microvias below 50 micrometers and redistribution layers at 2 micrometer pitch, pushing both ABF and emerging glass cores to their physical limits. To stay design-win-relevant, Ibiden and AT&S embedded engineers at TSMC's packaging center 18 months ahead of tape-out, capturing 40% of the 2.5D interposer substrate pool by 2025. The collaboration model shifts substrate manufacturing from commodity production toward quasi-design services, accelerating learning curves and deepening vendor lock-in. Over the next decade, suppliers unable to align roadmaps with foundries risk relegation to legacy nodes, curtailing addressable revenue in the advanced IC substrates market.

ABF-Substrate Capacity Shortage and Lead-Time Spikes

Lead times for 14-layer ABF substrates stretched to 28 weeks in early 2025 as AI demand outran supply by 18 percentage points. Mid-tier fabless designers either paid spot premiums of 15-20% or postponed tape-outs by up to three quarters. Equipment chokepoints persist: LPKF Laser and Mitsubishi Electric hold roughly 70% of laser-drill capacity and face an 18-month delivery backlog. Large suppliers, therefore, over-book Ajinomoto film, amplifying scarcity for smaller rivals. Unless new coating lines come online before 2027, the advanced IC substrates market will remain capacity-constrained, trimming potential CAGR by an estimated 1.2 percentage points.

Other drivers and restraints analyzed in the detailed report include:

1. 5G Roll-Out Boosting High-Frequency RF Packaging
2. Co-Packaged Optics Adoption Requiring Ultra-Low-Loss Substrates
3. High Capital Intensity and Process Complexity

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Flip-chip BGA commanded 43.89% of the advanced IC substrates market share in 2025, reflecting its entrenched position in mobile application processors and server CPUs. Rigid-flex and flexible CSP formats are advancing at a 7.71% CAGR through 2031, driven by smartwatches, augmented-reality headsets, and medical patches that benefit from bendable polyimide cores. Flip-chip CSP held 22% of 2025 shipment volume for ultra-thin smartphones, while organic BGA and LGA accounted for a steady 18% of volume in cost-focused automotive controllers. Other formats, including embedded-die and coreless substrates, accounted for the remaining 16%, driven by 5G millimeter-wave front-end modules that require improved thermal paths.

Chiplet-ready flip-chip BGA variants command 25-35% ASP premiums because multi-cavity layouts and fine redistribution layers raise manufacturing complexity. Suppliers with laser-direct-imaging and modified semi-additive processes secured roughly 70% of this high-margin pool, reshaping competitive balance. By contrast, panel-level processing helped rigid-flex yields, but the resulting 5% ASP erosion in 2025 pressured specialists to consolidate. The technology mix, therefore, tilts profitability toward advanced flip-chip formats even as unit growth skews toward flexible substrates, keeping product strategy nuanced across the advanced IC substrates market.

Ajinomoto build-up film captured 52.78% of 2025 revenue, reinforcing its status as the incumbent core for smartphones, PCs, and servers. Glass substrates are set for a 7.47% CAGR through 2031 as sub-4-nanometer logic and co-packaged optics demand ultra-low warpage and optical routing. Bismaleimide-triazine accounted for 15% of the volume in high-temperature automotive modules, while ceramic remained at 9% for RF power and LED packages. Hybrid glass-organic laminates under development could combine cost efficiency with glass-level flatness, challenging pure ABF beyond 2027.

Hyperscaler funding for Corning and AGC pilot lines may lift glass to 15-20% of premium server sockets by 2031, injecting fresh revenue into the advanced IC substrates market size. Automotive price-down pressure of 2-3% a year forces BT and ceramic vendors to automate inspection and test to protect margins. As a result, the long-term material strategy hinges on balancing ABF volume, glass performance, and BT cost discipline across diversified end uses.

Complete Report Scope:

• By Substrate Type
  • Flip-Chip Ball Grid Array
  • Flip-Chip Chip Scale Package
  • Organic Ball Grid Array / Land Grid Array
  • Rigid-Flex and Flexible Chip Scale Package
  • Other Substrate Types
• By Core Material
  • Ajinomoto Build-up Film
  • Bismaleimide-Triazine Resin
  • Glass
  • Ceramic
• By Packaging Technology
  • 2D Flip-Chip
  • 2.5D Interposer
  • 3D-IC / SoIC
  • Fan-Out WLP
  • SiP / Module
• By Device Node
  • Above 28 nm
  • 16/14-10 nm
  • 7-5 nm
  • 4 nm and below
• By End-Use Industry
  • Mobile and Consumer
  • Automotive and Transportation
  • IT and Telecom Infrastructure
  • Data-Centre / AI and HPC
  • Other End-Use Industries
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia Pacific
  • Middle East and Africa
    • Middle East
      • United Arab Emirates
      • Saudi Arabia
      • Rest of Middle East
    • Africa
      • South Africa
      • Egypt
      • Rest of Africa

Geography Analysis

Asia-Pacific accounted for 78.36% of the advanced IC substrates market size in 2025, anchored by Taiwan's 420 million flip-chip BGA shipments and Japan's specialization in 14-layer and 16-layer server substrates. South Korean vendors raised rigid-flex output to 85 million units and achieved cost parity with strip formats by switching to panel processing. Chinese suppliers increased legacy-node capacity and priced 10-15% below Taiwanese averages, boosting their share of automotive and industrial demand to 18%. India remained a nascent player, as pilot lines at Tata Electronics and Kaynes Technology shipped fewer than 5 million substrates due to yield challenges.

North America is projected to expand at a 7.69% CAGR through 2031, propelled by USD 2.8 billion in CHIPS Act incentives tied to domestic substrate and packaging plants. Ibiden's USD 1.2 billion Arizona fab and AT&S's USD 800 million Texas facility will together add 50,000 panels per month after 2027, giving U.S. fabless firms a second sourcing hub. Mexican near-shoring added 22 million units in 2025 as Tripod Technology and Zhen Ding Technology enlarged Guadalajara operations to serve automotive and industrial customers. Dual-sourcing clauses in U.S. contracts are already fragmenting order volumes, pressuring Asian incumbents to establish North American subsidiaries to defend their share.

Europe accounted for 6% of 2025 revenue, concentrated in Austria and Germany, where AT&S and Schweizer Electronic cater to automotive and industrial clients. AT&S's Leoben expansion, backed by EUR 500 million in EU Chips funds, will bring 20,000 additional FC-BGA panels per month starting in 2027. South America, the Middle East, and Africa together accounted for less than 2%, reflecting limited semiconductor assembly capacity and long payback periods for greenfield fabs. Unless subsidy frameworks emerge to offset high capital costs, these regions will remain fringe participants in the advanced IC substrates market.

1. Unimicron Technology Corp.
2. Ibiden Co., Ltd.
3. Nan Ya Printed Circuit Board Corp.
4. Shinko Electric Industries Co., Ltd.
5. AT&S Austria Technologie & Systemtechnik AG
6. Kinsus Interconnect Technology Corp.
7. Samsung Electro-Mechanics Co., Ltd.
8. Kyocera Corporation
9. ASE Technology Holding Co., Ltd.
10. LG Innotek Co., Ltd.
11. Simmtech Co., Ltd.
12. TTM Technologies, Inc.
13. Fujitsu Interconnect Technologies Ltd.
14. JCET Group Co., Ltd.
15. Panasonic Holdings Corporation
16. Zhen Ding Technology Holding Ltd.
17. Shennan Circuits Co., Ltd.
18. Daeduck Electronics Co., Ltd.
19. WUS Printed Circuit Co., Ltd.
20. Zhejiang Kingdom Sci-Tech Co., Ltd.
21. SKC Absolics Inc.
22. Tripod Technology Corp.
23. Toppan Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Surge in ABF-Substrate Demand for AI and HPC Accelerators
  • 4.2.2 Miniaturisation and Heterogeneous Integration Trend
  • 4.2.3 5G Roll-Out Boosting High-Frequency RF Packaging
  • 4.2.4 Co-Packaged Optics Adoption Requiring Ultra-Low-Loss Substrates
  • 4.2.5 CHIPS-Style Localisation Subsidies Tied to Substrate Fabs
  • 4.2.6 Large-Panel Organic Substrate Lines Lowering Cost Per Die
• 4.3 Market Restraints
  • 4.3.1 ABF-Substrate Capacity Shortage and Lead-Time Spikes
  • 4.3.2 High Capital Intensity and Process Complexity
  • 4.3.3 Single-Source Dependency on ABF Build-Up Films
  • 4.3.4 Stricter Fluorinated-Solvent Emission Regulations
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
    • 4.7.1.1 Bargaining Power of Consumers
    • 4.7.1.2 Threat of New Entrants
    • 4.7.1.3 Threat of Substitutes
    • 4.7.1.4 Intensity of Competitive Rivalry
• 4.8 Pricing Analysis
• 4.9 Impact of Macroeconomic Factors

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Substrate Type
  • 5.1.1 Flip-Chip Ball Grid Array
  • 5.1.2 Flip-Chip Chip Scale Package
  • 5.1.3 Organic Ball Grid Array / Land Grid Array
  • 5.1.4 Rigid-Flex and Flexible Chip Scale Package
  • 5.1.5 Other Substrate Types
• 5.2 By Core Material
  • 5.2.1 Ajinomoto Build-up Film
  • 5.2.2 Bismaleimide-Triazine Resin
  • 5.2.3 Glass
  • 5.2.4 Ceramic
• 5.3 By Packaging Technology
  • 5.3.1 2D Flip-Chip
  • 5.3.2 2.5D Interposer
  • 5.3.3 3D-IC / SoIC
  • 5.3.4 Fan-Out WLP
  • 5.3.5 SiP / Module
• 5.4 By Device Node
  • 5.4.1 Above 28 nm
  • 5.4.2 16/14-10 nm
  • 5.4.3 7-5 nm
  • 5.4.4 4 nm and below
• 5.5 By End-Use Industry
  • 5.5.1 Mobile and Consumer
  • 5.5.2 Automotive and Transportation
  • 5.5.3 IT and Telecom Infrastructure
  • 5.5.4 Data-Centre / AI and HPC
  • 5.5.5 Other End-Use Industries
• 5.6 By Geography
  • 5.6.1 North America
    • 5.6.1.1 United States
    • 5.6.1.2 Canada
    • 5.6.1.3 Mexico
  • 5.6.2 South America
    • 5.6.2.1 Brazil
    • 5.6.2.2 Argentina
    • 5.6.2.3 Rest of South America
  • 5.6.3 Europe
    • 5.6.3.1 United Kingdom
    • 5.6.3.2 Germany
    • 5.6.3.3 France
    • 5.6.3.4 Italy
    • 5.6.3.5 Rest of Europe
  • 5.6.4 Asia Pacific
    • 5.6.4.1 China
    • 5.6.4.2 Japan
    • 5.6.4.3 India
    • 5.6.4.4 South Korea
    • 5.6.4.5 Rest of Asia Pacific
  • 5.6.5 Middle East and Africa
    • 5.6.5.1 Middle East
      • 5.6.5.1.1 United Arab Emirates
      • 5.6.5.1.2 Saudi Arabia
      • 5.6.5.1.3 Rest of Middle East
    • 5.6.5.2 Africa
      • 5.6.5.2.1 South Africa
      • 5.6.5.2.2 Egypt
      • 5.6.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Unimicron Technology Corp.
  • 6.4.2 Ibiden Co., Ltd.
  • 6.4.3 Nan Ya Printed Circuit Board Corp.
  • 6.4.4 Shinko Electric Industries Co., Ltd.
  • 6.4.5 AT&S Austria Technologie & Systemtechnik AG
  • 6.4.6 Kinsus Interconnect Technology Corp.
  • 6.4.7 Samsung Electro-Mechanics Co., Ltd.
  • 6.4.8 Kyocera Corporation
  • 6.4.9 ASE Technology Holding Co., Ltd.
  • 6.4.10 LG Innotek Co., Ltd.
  • 6.4.11 Simmtech Co., Ltd.
  • 6.4.12 TTM Technologies, Inc.
  • 6.4.13 Fujitsu Interconnect Technologies Ltd.
  • 6.4.14 JCET Group Co., Ltd.
  • 6.4.15 Panasonic Holdings Corporation
  • 6.4.16 Zhen Ding Technology Holding Ltd.
  • 6.4.17 Shennan Circuits Co., Ltd.
  • 6.4.18 Daeduck Electronics Co., Ltd.
  • 6.4.19 WUS Printed Circuit Co., Ltd.
  • 6.4.20 Zhejiang Kingdom Sci-Tech Co., Ltd.
  • 6.4.21 SKC Absolics Inc.
  • 6.4.22 Tripod Technology Corp.
  • 6.4.23 Toppan Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment