3D 센싱 및 이미징 시장 : 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the 3D sensing and imaging market size is expected to grow from USD 13.16 billion in 2025 to USD 14.98 billion in 2026 and is forecast to reach USD 28.65 billion by 2031 at 13.84% CAGR over 2026-2031.

This report is Segmented by Component (Hardware, Software, and Services), Technology (Ultrasound, Structured Light, and More), Sensor Type (Position Sensors, Image Sensors, and More), Connectivity (Wired Network Connectivity and Wireless Network Connectivity), End-User Industry (Consumer Electronics, Automotive, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global 3D Sensing And Imaging Market Trends and Insights

Widespread Smartphone Integration of Structured-Light 3D Cameras

Structured-light depth modules once reserved for premium flagships are now commonplace in mid-range handsets, lowering entry costs and normalizing user expectations for spatial photography, AR gaming, and secure face authentication. Apple's iPhone 15 Pro LiDAR module validated consumer appetite for spatial computing, while Android OEMs rapidly released cost-reduced structured-light solutions. OmniVision's April 2025 unveiling of a 1.5-megapixel global-shutter sensor for driver monitoring illustrates technology spillover from phones to vehicles, deepening economies of scale. Volume ramp-ups push component pricing toward the sub-USD 1 threshold, unlocking adoption in industrial scanners and handheld medical devices.

Automotive ADAS Demand for Solid-State LiDAR Depth Maps

Vehicle makers are phasing out rotating LiDAR heads in favor of solid-state frequency-modulated continuous-wave (FMCW) units that offer vibration tolerance, velocity measurement, and lower cost. Daimler Truck's 2024 selection of Aeva FMCW LiDAR underscored industry confidence in chip-scale depth sensors for Level 4 trucking fleets. Although automotive homologation extends timelines, Tier-1 suppliers with zero-defect manufacturing credentials stand to gain recurring design wins as ADAS moves down the vehicle price curve.

Supply-Chain Scarcity of High-Power GaAs Epi-Wafers

Gallium arsenide substrate output remains concentrated among a handful of Asia-Pacific growers, creating price spikes and 20-week lead times for high-power VCSELs used in long-range time-of-flight modules. Sensor makers redesign optics for lower peak current draw and pursue silicon nitride photonics as a hedge, but near-term unit allocations still constrain automotive LiDAR rollout schedules.

Other drivers and restraints analyzed in the detailed report include:

1. Industry 4.0 Adoption of 3D Machine-Vision Inspection Systems
2. Healthcare Shift Toward Minimally Invasive, Real-Time 3D Imaging
3. Calibration Complexity Across Multi-Sensor Camera Modules

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Hardware retained 72.15% of the 3D sensing and imaging market in 2025, yet services are growing 14.88% CAGR to 2031 as buyers seek turnkey deployments and outcome-based pricing. Faro Technologies now derives 20.9% of quarterly revenue from software and recurring cloud analytics, illustrating how calibration, maintenance, and AI model updates create annuity streams. Vendors package installation and lifetime support to secure multi-year deals, gradually tilting revenue mix toward services.

Demand for edge AI tool-chains that compress depth maps into actionable events further propels software attach rates. This erosion of pure-play hardware margins pressures component suppliers to form alliances with cloud and middleware providers, ensuring ecosystem stickiness and data-driven upsell potential.

Time-of-flight kept a 43.25% share in 2025 because its silicon photodiodes and VCSEL drivers align with smartphone cost envelopes, securing billions of annual units. The 3D sensing and imaging market size for ultrasound-based systems, however, is projected to expand 15.62% annually as acoustic transducers excel in bright-sunlight and translucent-material scenarios. Industrial robotics adopts hybrid optical-ultrasound stacks for defect detection on glossy metals, while hospitals favor ultrasound depth probes for radiation-free fetal and cardiac imaging. Sensor designers leverage 3D-stacked CMOS to co-locate ultrasound receive circuits and optical imagers, yielding sensing clusters that toggle modality based on the environment.

Complete Report Scope:

• By Component
  • Hardware
  • Software
  • Services
• By Technology
  • Ultrasound
  • Structured Light
  • Time-of-Flight
  • Stereoscopic Vision
  • Other Technologies
• By Sensor Type
  • Position Sensors
  • Image Sensors
  • Temperature Sensors
  • Accelerometer Sensors
  • Proximity Sensors
  • Other Sensor Types
• By Connectivity
  • Wired Network Connectivity
  • Wireless Network Connectivity
• By End-user Industry
  • Consumer Electronics
  • Automotive
  • Healthcare
  • Aerospace and Defense
  • Security and Surveillance
  • Media and Entertainment
  • Other End-user Industries
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Chile
    • Rest of South America
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Spain
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Singapore
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa
    • Middle East
      • Saudi Arabia
      • United Arab Emirates
      • Turkey
      • Rest of Middle East
    • Africa
      • South Africa
      • Nigeria
      • Egypt
      • Rest of Africa

Geography Analysis

North America led with 37.85% revenue in 2025, owing to entrenched automotive and medical-device manufacturers, yet Asia-Pacific is climbing 15.74% CAGR. Chinese handset and contract-manufacturing giants compress bill-of-materials to democratize depth cameras, while Japanese precision-machinery firms elevate quality inspection standards that require micron-level 3D capture. Korean display producers deploy in-line 3D profilometers to validate next-gen OLED stacks. India pilots satellite-based 3D soil-moisture mapping to optimize crop yields, signaling broader smart-agriculture uptake. Europe remains steady, driven by Euro NCAP mandates and industrial automation subsidies that reward machine vision investments.

1. Infineon Technologies AG
2. Microchip Technology Inc.
3. OmniVision Technologies Inc.
4. Qualcomm Inc.
5. Sick AG
6. Keyence Corporation
7. Texas Instruments Incorporated
8. GE Healthcare Technologies Inc.
9. STMicroelectronics N.V.
10. Alphabet Inc. (Google LLC)
11. Adobe Inc.
12. Autodesk Inc.
13. Panasonic Holdings Corporation
14. Trimble Inc.
15. FARO Technologies Inc.
16. Lockheed Martin Corporation
17. Dassault Systemes SE
18. Sony Group Corporation
19. Lumentum Holdings Inc.
20. ams-OSRAM AG

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Widespread smartphone integration of structured-light 3D cameras
  • 4.2.2 Automotive ADAS demand for solid-state LiDAR depth maps
  • 4.2.3 Industry 4.0 adoption of 3D machine-vision inspection systems
  • 4.2.4 Healthcare shift toward minimally-invasive, real-time 3D imaging
  • 4.2.5 Emergence of VCSEL-on-CMOS chiplets for sub-USD 1 depth sensors
  • 4.2.6 Satellite-based 3D Earth-observation constellations for climate analytics
• 4.3 Market Restraints
  • 4.3.1 Supply-chain scarcity of high-power GaAs epi-wafers
  • 4.3.2 Calibration complexity across multi-sensor camera modules
  • 4.3.3 Cyber-security risks from depth-map spoofing in authentication
  • 4.3.4 Regulatory uncertainty on public-space 3D biometric data capture
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Consumers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUES)

• 5.1 By Component
  • 5.1.1 Hardware
  • 5.1.2 Software
  • 5.1.3 Services
• 5.2 By Technology
  • 5.2.1 Ultrasound
  • 5.2.2 Structured Light
  • 5.2.3 Time-of-Flight
  • 5.2.4 Stereoscopic Vision
  • 5.2.5 Other Technologies
• 5.3 By Sensor Type
  • 5.3.1 Position Sensors
  • 5.3.2 Image Sensors
  • 5.3.3 Temperature Sensors
  • 5.3.4 Accelerometer Sensors
  • 5.3.5 Proximity Sensors
  • 5.3.6 Other Sensor Types
• 5.4 By Connectivity
  • 5.4.1 Wired Network Connectivity
  • 5.4.2 Wireless Network Connectivity
• 5.5 By End-user Industry
  • 5.5.1 Consumer Electronics
  • 5.5.2 Automotive
  • 5.5.3 Healthcare
  • 5.5.4 Aerospace and Defense
  • 5.5.5 Security and Surveillance
  • 5.5.6 Media and Entertainment
  • 5.5.7 Other End-user Industries
• 5.6 By Geography
  • 5.6.1 North America
    • 5.6.1.1 United States
    • 5.6.1.2 Canada
    • 5.6.1.3 Mexico
  • 5.6.2 South America
    • 5.6.2.1 Brazil
    • 5.6.2.2 Argentina
    • 5.6.2.3 Chile
    • 5.6.2.4 Rest of South America
  • 5.6.3 Europe
    • 5.6.3.1 Germany
    • 5.6.3.2 United Kingdom
    • 5.6.3.3 France
    • 5.6.3.4 Italy
    • 5.6.3.5 Spain
    • 5.6.3.6 Rest of Europe
  • 5.6.4 Asia-Pacific
    • 5.6.4.1 China
    • 5.6.4.2 Japan
    • 5.6.4.3 South Korea
    • 5.6.4.4 India
    • 5.6.4.5 Singapore
    • 5.6.4.6 Australia
    • 5.6.4.7 Rest of Asia-Pacific
  • 5.6.5 Middle East and Africa
    • 5.6.5.1 Middle East
      • 5.6.5.1.1 Saudi Arabia
      • 5.6.5.1.2 United Arab Emirates
      • 5.6.5.1.3 Turkey
      • 5.6.5.1.4 Rest of Middle East
    • 5.6.5.2 Africa
      • 5.6.5.2.1 South Africa
      • 5.6.5.2.2 Nigeria
      • 5.6.5.2.3 Egypt
      • 5.6.5.2.4 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 6.4.1 Infineon Technologies AG
  • 6.4.2 Microchip Technology Inc.
  • 6.4.3 OmniVision Technologies Inc.
  • 6.4.4 Qualcomm Inc.
  • 6.4.5 Sick AG
  • 6.4.6 Keyence Corporation
  • 6.4.7 Texas Instruments Incorporated
  • 6.4.8 GE Healthcare Technologies Inc.
  • 6.4.9 STMicroelectronics N.V.
  • 6.4.10 Alphabet Inc. (Google LLC)
  • 6.4.11 Adobe Inc.
  • 6.4.12 Autodesk Inc.
  • 6.4.13 Panasonic Holdings Corporation
  • 6.4.14 Trimble Inc.
  • 6.4.15 FARO Technologies Inc.
  • 6.4.16 Lockheed Martin Corporation
  • 6.4.17 Dassault Systemes SE
  • 6.4.18 Sony Group Corporation
  • 6.4.19 Lumentum Holdings Inc.
  • 6.4.20 ams-OSRAM AG

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-need Assessment