마이크로프로세서 : 시장 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the microprocessor market size was valued at USD 109.12 billion in 2025 and estimated to grow from USD 115.85 billion in 2026 to reach USD 156.25 billion by 2031, at a CAGR of 6.17% during the forecast period (2026-2031).

This report is Segmented by Processor Type (CPU, GPU, APU, FPGA, DSP, and ASIC), Instruction-Set Architecture (x86, Arm, RISC-V, Power, MIPS, and More), Fabrication Node (>=28nm, 22-16nm, 14-10nm, 7-6nm, 5-4nm, and More), Application (Consumer Electronics, Datacentre and Enterprise Servers, Aerospace and Defence, and More), and Geography (North America, South America, Europe, Asia-Pacific, and Middle East and Africa).

Global Microprocessor Market Trends and Insights

Growing Demand for High-Performance and Energy-Efficient Processors

Demand for processors that simultaneously deliver high throughput and low power consumption shaped vendor roadmaps throughout 2024 and 2025. Data-centre operators prioritized total cost of ownership, prompting designers to optimize performance per watt and integrate on-package memory to reduce latency. Consumer device makers followed suit, seeking battery-savvy chips that enable on-device AI inference without thermal throttling. The move toward smaller geometries such as 3 nm and below pushed leakage-current challenges to the forefront, intensifying cooperation between electronic-design-automation providers and foundries to balance speed and efficiency. Suppliers that delivered energy-efficient designs captured design wins in smartphones, notebooks, and industrial IoT endpoints, reinforcing this driver's medium-term influence on the microprocessor market.

Proliferation of AI Accelerators and Edge Computing Use-Cases

Edge devices, from smart cameras to industrial robots, increasingly require embedded neural engines that eliminate dependence on cloud back-ends for inference. AMD's Instinct MI350 accelerator family, scheduled for broad availability in late 2025, illustrated the push toward specialized AI silicon with a four-fold uplift in compute density. Device makers embedded similar engines inside general-purpose processors to address user privacy and latency expectations. As a result, demand broadened beyond data-centre GPUs to encompass low-power inference cores inside wearables and automotive control units. The short-term lift to the microprocessor market emerged as customers accelerated refresh cycles to gain AI capability.

Structural Decline in Traditional PC Shipments

Notebook and desktop volumes softened as enterprises extended refresh cycles and consumers turned to mobile form factors. Manufacturers confronted channel inventory corrections that depressed run-rate demand for mainstream CPUs. Vendors mitigated the impact by positioning AI-enabled PCs as a replacement catalyst, yet volume recovery remained partial through 2025. The short-term drag shaved 0.5 percentage points from the overall CAGR, yet also prompted repurposing of existing fabs toward emerging categories.

Other drivers and restraints analyzed in the detailed report include:

1. Expansion of Hyperscale Data-Centres and Cloud Workloads
2. Electrification and ADAS Adoption in Automotive Electronics
3. Ongoing Supply-Chain Capacity Constraints for Advanced Nodes

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

The microprocessor market size for processor types showed CPUs retaining a 51.85% revenue share in 2025 as they remained indispensable for serial workloads. GPUs, however, posted a 9.95% CAGR outlook through 2031, underlining the shift toward massively parallel workloads in AI, graphics, and scientific simulation. The discrete-GPU pipeline expanded as data-centre operators added accelerator cards while consumer devices integrated low-power variants for on-device inference. APUs that fuse CPU and GPU cores on one die circled niche segments where board space and battery life mattered.

Discrete GPUs benefited from high-bandwidth-memory advances that multiplied training throughput, with hyperscalers locking in multiyear supply agreements to secure capacity. FPGAs preserved relevance in telecom infrastructure, where 5G and emerging 6G standards required programmable logic. DSPs continued to address audio and baseband processing, although some market share shifted toward general-purpose cores with embedded vector extensions. Application-specific integrated circuits claimed design wins in high-volume AI inference appliances, demonstrating that bespoke silicon can outpace programmable counterparts once volumes justify non-recurring engineering expense.

The microprocessor market registered x86 chips with a 45.95% share in 2025 on the strength of decades-old software compatibility. RISC-V, buoyed by its 13.20% CAGR forecast, gained traction among cost-sensitive embedded applications and academic research initiatives that valued open standards. Arm-based designs deepened penetration in data-centre and automotive sectors, leveraging a reputation for power efficiency and a growing server-class software stack.

Vendor roadmaps illustrated divergence rather than convergence. Intel and AMD advanced x86 to sub-3 nm nodes, aiming to sustain single-thread performance leadership. RISC-V specialists emphasized domain-specific extensions, such as vector and cryptography instructions, to differentiate in IoT and AI accelerators. Arm licensees broadened custom core designs, targeting cloud workloads with chiplet-enabled multi-die packages. The proliferation of instruction sets fostered innovation in compiler technologies and toolchains, ultimately expanding developer choice and supporting a more diverse microprocessor market.

Complete Report Scope:

• By Processor Type
  • Central Processing Unit (CPU)
  • Graphics Processing Unit (GPU)
  • Accelerated Processing Unit (APU)
  • Field-Programmable Gate Array (FPGA)
  • Digital Signal Processor (DSP)
  • Application-Specific Integrated Circuit (ASIC)
• By Instruction-Set Architecture
  • x86
  • Arm
  • RISC-V
  • Power
  • MIPS
  • SPARC and Others
• By Fabrication Node
  • >=28 nm
  • 22-16 nm
  • 14-10 nm
  • 7-6 nm
  • 5-4 nm
  • 3 nm and Below
• By Application
  • Consumer Electronics
  • Datacentre and Enterprise Servers
  • Automotive and Transportation
  • Industrial Automation and Robotics
  • Aerospace and Defence
  • Healthcare and Medical Devices
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Rest of South America
  • Europe
    • Germany
    • France
    • United Kingdom
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • Middle East and Africa
    • Middle East
      • Saudi Arabia
      • United Arab Emirates
      • Turkey
      • Rest of Middle East
    • Africa
      • South Africa
      • Rest of Africa

Geography Analysis

Asia-Pacific held a 41.95% share of the microprocessor market in 2025 and posted an 8.21% CAGR outlook, sustained by China's electronics assembly scale and government-backed foundry expansion. Japan's sensor and automotive ecosystems ensured steady demand for mixed-signal and safety-critical processors, while South Korea's champions pressed ahead with below-3 nm node investments supported by fiscal incentives. India rolled out chip-manufacturing subsidies that encouraged multinational fabs and local design-service firms to co-locate, adding complementary demand for mid-tier nodes.

North America remained the second-largest region, buoyed by hyperscale cloud build-outs, automotive electrification, and the CHIPS Act incentives that offset capital-expenditure risk for new fabs. TSMC's USD 165 billion commitment to three United States plants underlined how fiscal support can redirect capacity allocation to domestic soil. Canada and Mexico supported regional momentum through automotive electronics and cross-border logistics integration that shortened lead times for Tier-1 suppliers.

Europe delivered moderate expansion on the back of stringent vehicle-emissions rules and Industry 4.0 modernization. Germany's automakers locked in strategic silicon supply agreements to safeguard ADAS roadmaps, while France and the United Kingdom tapped local research institutes to co-develop secure processors for defense and aerospace missions. The European Chips Act channeled funds into pilot lines and advanced packaging clusters that aimed to reduce dependency on overseas foundries. The Middle East and Africa trailed in absolute volumes yet registered design-win activity tied to data center projects in the Gulf states and telecom infrastructure upgrades across Africa, setting the stage for long-term participation in the wider microprocessor market.

1. Intel Corporation
2. Advanced Micro Devices, Inc.
3. NVIDIA Corporation
4. Qualcomm Technologies, Inc.
5. Taiwan Semiconductor Manufacturing Company Limited
6. Samsung Electronics Co., Ltd.
7. Apple Inc.
8. Broadcom Inc.
9. MediaTek Inc.
10. HiSilicon Technologies Co., Ltd.
11. NXP Semiconductors N.V.
12. STMicroelectronics N.V.
13. Texas Instruments Incorporated
14. Marvell Technology, Inc.
15. Microchip Technology Incorporated
16. Analog Devices, Inc.
17. Renesas Electronics Corporation
18. Infineon Technologies AG
19. SiFive, Inc.
20. Alibaba Group Holding Ltd. (T-Head)
21. Raspberry Pi Ltd.
22. Rockchip Electronics Co., Ltd.
23. GigaDevice Semiconductor (Beijing) Inc.
24. Espressif Systems (Shanghai) Co., Ltd.
25. VIA Technologies, Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Growing demand for high-performance and energy-efficient processors
  • 4.2.2 Proliferation of AI accelerators and edge computing use-cases
  • 4.2.3 Expansion of hyperscale data-centres and cloud workloads
  • 4.2.4 Electrification and ADAS adoption in automotive electronics
  • 4.2.5 Chiplet-based heterogeneous integration gaining traction
  • 4.2.6 Government semiconductor incentive programmes (CHIPS-style)
• 4.3 Market Restraints
  • 4.3.1 Structural decline in traditional PC shipments
  • 4.3.2 Ongoing supply-chain capacity constraints for advanced nodes
  • 4.3.3 Export-control/geopolitical limits on leading-edge equipment
  • 4.3.4 Escalating R&D costs below the 3 nm technology node
• 4.4 Impact of Macroeconomic Factors
• 4.5 Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Bargaining Power of Suppliers
  • 4.8.4 Threat of Substitute Products
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Processor Type
  • 5.1.1 Central Processing Unit (CPU)
  • 5.1.2 Graphics Processing Unit (GPU)
  • 5.1.3 Accelerated Processing Unit (APU)
  • 5.1.4 Field-Programmable Gate Array (FPGA)
  • 5.1.5 Digital Signal Processor (DSP)
  • 5.1.6 Application-Specific Integrated Circuit (ASIC)
• 5.2 By Instruction-Set Architecture
  • 5.2.1 x86
  • 5.2.2 Arm
  • 5.2.3 RISC-V
  • 5.2.4 Power
  • 5.2.5 MIPS
  • 5.2.6 SPARC and Others
• 5.3 By Fabrication Node
  • 5.3.1 >=28 nm
  • 5.3.2 22-16 nm
  • 5.3.3 14-10 nm
  • 5.3.4 7-6 nm
  • 5.3.5 5-4 nm
  • 5.3.6 3 nm and Below
• 5.4 By Application
  • 5.4.1 Consumer Electronics
  • 5.4.2 Datacentre and Enterprise Servers
  • 5.4.3 Automotive and Transportation
  • 5.4.4 Industrial Automation and Robotics
  • 5.4.5 Aerospace and Defence
  • 5.4.6 Healthcare and Medical Devices
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 France
    • 5.5.3.3 United Kingdom
    • 5.5.3.4 Rest of Europe
  • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 Rest of Asia-Pacific
  • 5.5.5 Middle East and Africa
    • 5.5.5.1 Middle East
      • 5.5.5.1.1 Saudi Arabia
      • 5.5.5.1.2 United Arab Emirates
      • 5.5.5.1.3 Turkey
      • 5.5.5.1.4 Rest of Middle East
    • 5.5.5.2 Africa
      • 5.5.5.2.1 South Africa
      • 5.5.5.2.2 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 6.4.1 Intel Corporation
  • 6.4.2 Advanced Micro Devices, Inc.
  • 6.4.3 NVIDIA Corporation
  • 6.4.4 Qualcomm Technologies, Inc.
  • 6.4.5 Taiwan Semiconductor Manufacturing Company Limited
  • 6.4.6 Samsung Electronics Co., Ltd.
  • 6.4.7 Apple Inc.
  • 6.4.8 Broadcom Inc.
  • 6.4.9 MediaTek Inc.
  • 6.4.10 HiSilicon Technologies Co., Ltd.
  • 6.4.11 NXP Semiconductors N.V.
  • 6.4.12 STMicroelectronics N.V.
  • 6.4.13 Texas Instruments Incorporated
  • 6.4.14 Marvell Technology, Inc.
  • 6.4.15 Microchip Technology Incorporated
  • 6.4.16 Analog Devices, Inc.
  • 6.4.17 Renesas Electronics Corporation
  • 6.4.18 Infineon Technologies AG
  • 6.4.19 SiFive, Inc.
  • 6.4.20 Alibaba Group Holding Ltd. (T-Head)
  • 6.4.21 Raspberry Pi Ltd.
  • 6.4.22 Rockchip Electronics Co., Ltd.
  • 6.4.23 GigaDevice Semiconductor (Beijing) Inc.
  • 6.4.24 Espressif Systems (Shanghai) Co., Ltd.
  • 6.4.25 VIA Technologies, Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment