북미의 eSIM 하드웨어 : 시장 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the North America esim hardware market size in terms of shipment volume is expected to grow from 234 million units in 2025 to 283 million units in 2026 and is forecast to reach 682 million units by 2031 at 19.21% CAGR over 2026-2031.

North America Esim Hardware Market Trends and Insights

IPhone-Led Migration to eSIM-Only Flagships

Apple made the iPhone 17 series eSIM-only across the United States, Canada, and Mexico in September 2025. The iPhone 17 Air also became the first iPhone sold globally without a physical SIM tray exception. This decision moved all 3 North American markets to a common device design requirement. The North America eSIM hardware market benefits because carriers need compatible remote provisioning systems for premium device users. The policy also raises the technical standard for smartphone components and profile management. It creates a faster path for Samsung and other premium OEMs to expand eSIM support in North American models. Budget Android brands still have limited eSIM hardware availability at volume, so adoption remains uneven between premium and lower-priced devices. Apple's device direction makes provisioning capability a basic carrier requirement rather than a feature reserved for early adopters. Carriers must support GSMA-certified SM-DP+ and SM-DS infrastructure to serve eSIM-only handsets. This requirement can place greater investment pressure on mobile virtual network operators. The North America eSIM hardware market therefore gains from hardware demand and from wider carrier readiness. The resulting divide is between premium eUICC procurement today and later adoption in lower-priced devices. That lag can preserve physical-SIM compatibility needs in parts of the handset base. No flagship smartphone OEM in the region retained a physical-SIM-only option across the United States, Canada, and Mexico in 2026.

5G Fixed-Wireless Access and Private Network Expansion

Private 5G networks create an eSIM hardware demand base outside traditional consumer carrier channels. Enterprise installations require connected controllers, sensors, gateways, and related endpoints. These devices commonly use MFF2 or integrated iUICC designs because the components are soldered into equipment. The North America eSIM hardware market gains where enterprises procure hardware for factory, campus, and logistics operations. Private network buyers also manage subscriber systems that differ from standard consumer activation processes. This can bring eSIM operating-system vendors directly into enterprise integration projects. Verizon extended Ericsson Private 5G to international enterprise campuses in June 2026. The enterprise model shifts part of the procurement decision from carriers to equipment makers and private-network operators. It favors components that can support remote lifecycle management and multiple credentials. It also gives manufacturers a reason to package connectivity features during the original device design stage. Industrial hardware cycles are longer than smartphone replacement cycles. This can make demand less exposed to annual handset launches. The North America eSIM hardware market is consequently linked to private network investment decisions across several end uses. These deployments also increase the relevance of tested provisioning and security capabilities.

Legacy and Next-Generation IoT Specification Fragmentation

SGP.02, SGP.22, and SGP.32 remain in use for M2M, consumer, and IoT applications. This creates separate procurement and integration paths for connected-device programs. Large enterprises have installed SGP.02 devices in fleets, smart meters, and industrial sensor networks. Those devices cannot move directly to SGP.32 without replacing hardware. Refresh cycles of 5 years or more can delay that transition. The North America eSIM hardware market must therefore serve both new SGP.32 programs and legacy-compatible replacement demand. STMicroelectronics and COMPRION introduced an SGP.32 interoperability reference environment in September 2026. Their work shows that component-level protocol qualification remains an active requirement. Enterprises may maintain parallel purchases while they validate newer provisioning methods. This approach increases project complexity and can delay larger hardware commitments. It also makes demand forecasting less direct for vendors and device makers. The constraint does not eliminate demand, but it slows the consolidation that a complete SGP.32 transition could provide. The North America eSIM hardware market remains exposed to the pace at which installed equipment is replaced.

Other drivers and restraints analyzed in the detailed report include:

1. Automotive Embedded Connectivity for Software Updates
2. GSMA SGP.32 for Headless IoT Deployments
3. Carrier Resistance to Losing SIM-Lock Economics

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

5G held 45.86% of the North America eSIM hardware market share in 2025 and is projected to expand at a 19.87% CAGR through 2031. Its lead reflects established 5G smartphone adoption and wider use in industrial and automotive programs. The North America eSIM hardware market size for 5G also benefits from private networks that require managed device credentials. ATandT activated a nationwide dedicated 5G Standalone core for FirstNet in July 2026. The service supports more than 27,500 public-safety agencies and 5.5 million connections. The program includes a USD 2 billion incremental investment. It supports a shift from 4G and LTE SIM modules toward 5G eSIM hardware in public-safety procurement.

4G and LTE eSIM hardware remains important for enterprise IoT in places with coverage constraints. These modules serve established devices that do not need the performance or cost profile of 5G. NB-IoT and LTE-M support low-power tracking and smart-meter uses. Their lower power requirements are useful when devices must operate for long periods without frequent maintenance. 5G slicing can require devices to manage separate service-level credentials. This favors eSIM operating systems with multiple active profile capabilities. Infineon's OPTIGA Connect Consumer OC1230 is a 28 nm eSIM solution compliant with GSMA SGP.22 v3. It supports Multiple Enabled Profile functionality for simultaneous carrier credentials.

MFF2 held 33.53% of form-factor volume in 2025, while System-in-Package and Integrated iUICC are projected to expand at a 20.17% CAGR through 2031. MFF2 is widely used where a permanently bonded component is required. Industrial and automotive equipment can be exposed to vibration, humidity, and temperature changes. A soldered interface can reduce a common physical failure point. The North America eSIM hardware market, therefore, retains MFF2 demand in equipment designed for difficult operating conditions. MFF2 also suits manufacturers that prioritize long-term device reliability over removable card flexibility.

Integrated designs are gaining attention in wearables, hearables, and compact IoT devices. These categories must balance silicon area, weight, battery capacity, and connectivity features. Wafer-Level CSP supports smaller consumer devices, while Plug-In eSIM remains relevant in replacement and mobile virtual network operator settings. STMicroelectronics introduced the ST54M in June 2026. The single-die device combines NFC, a secure element, eSIM, and a post-quantum cryptography accelerator. Valid received GSMA eSA certification for an SGP.32 IoT eUICC based on Infineon's TEGRION SLx22 in August 2026.

Complete Report Scope:

• By Network Type
  • 4G/LTE
  • 5G
  • NB-IoT/LTE-M
• By Form Factor
  • MFF2
  • Wafer-Level CSP
  • Plug-In eSIM
  • System-in-Package and Integrated iUICC
• By Device Type
  • Smartphones and Feature Phones
  • Tablets and Laptops
  • Wearables
  • M2M and IoT Modules
• By Application
  • Consumer Electronics
  • Automotive and Transportation
  • Industrial and Manufacturing
  • Logistics and Asset Tracking
  • Other Applications (Energy and Utilities and Healthcare and Medical Devices)
• By Geography
  • United States
  • Canada
  • Mexico

List of Companies Covered in this Report:

1. Thales S.A.
2. Giesecke+Devrient GmbH
3. IDEMIA France SAS
4. Infineon Technologies AG
5. STMicroelectronics N.V.
6. NXP Semiconductors N.V.
7. Qualcomm Technologies, Inc.
8. Kigen Limited
9. Valid Solucoes S.A.
10. Sierra Wireless, Inc.
11. Semtech Corporation
12. Telit Cinterion Deutschland GmbH
13. KORE Group Holdings, Inc.
14. Workz Group Limited
15. Soracom, Inc.
16. Apple Inc.
17. Samsung Electronics Co., Ltd.
18. AT&T Inc.
19. Verizon Communications Inc.
20. T-Mobile US, Inc.
21. Rogers Communications Inc.
22. BCE Inc.
23. America Movil, S.A.B. de C.V.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Impact of Macroeconomic Factors on the Market
• 4.3 Market Drivers
  • 4.3.1 iPhone-Led Migration to eSIM-Only Flagships
  • 4.3.2 Expansion of 5G Fixed-Wireless Access and Private Networks
  • 4.3.3 Automotive Embedded Connectivity for Over-the-Air Updates
  • 4.3.4 GSMA SGP.32 Enabling Mass-Scale Headless IoT Deployments
  • 4.3.5 Carrier-Grade eSIM Provisioning for Public-Safety Networks
  • 4.3.6 Insurance-Linked Asset Tracking Adoption
• 4.4 Market Restraints
  • 4.4.1 Fragmented Legacy and Next-Generation IoT Specifications
  • 4.4.2 Carrier Reluctance to Surrender SIM-Lock Economics
  • 4.4.3 Remote Profile-Swap Cybersecurity Exposure
  • 4.4.4 Ultra-Thin Wearable Space and Power Constraints
• 4.5 Industry Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Semiconductor Suppliers
  • 4.8.2 Bargaining Power of Device OEMs and Module Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VOLUME)

• 5.1 By Network Type
  • 5.1.1 4G/LTE
  • 5.1.2 5G
  • 5.1.3 NB-IoT/LTE-M
• 5.2 By Form Factor
  • 5.2.1 MFF2
  • 5.2.2 Wafer-Level CSP
  • 5.2.3 Plug-In eSIM
  • 5.2.4 System-in-Package and Integrated iUICC
• 5.3 By Device Type
  • 5.3.1 Smartphones and Feature Phones
  • 5.3.2 Tablets and Laptops
  • 5.3.3 Wearables
  • 5.3.4 M2M and IoT Modules
• 5.4 By Application
  • 5.4.1 Consumer Electronics
  • 5.4.2 Automotive and Transportation
  • 5.4.3 Industrial and Manufacturing
  • 5.4.4 Logistics and Asset Tracking
  • 5.4.5 Other Applications (Energy and Utilities and Healthcare and Medical Devices)
• 5.5 By Geography
  • 5.5.1 United States
  • 5.5.2 Canada
  • 5.5.3 Mexico

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Thales S.A.
  • 6.4.2 Giesecke+Devrient GmbH
  • 6.4.3 IDEMIA France SAS
  • 6.4.4 Infineon Technologies AG
  • 6.4.5 STMicroelectronics N.V.
  • 6.4.6 NXP Semiconductors N.V.
  • 6.4.7 Qualcomm Technologies, Inc.
  • 6.4.8 Kigen Limited
  • 6.4.9 Valid Solucoes S.A.
  • 6.4.10 Sierra Wireless, Inc.
  • 6.4.11 Semtech Corporation
  • 6.4.12 Telit Cinterion Deutschland GmbH
  • 6.4.13 KORE Group Holdings, Inc.
  • 6.4.14 Workz Group Limited
  • 6.4.15 Soracom, Inc.
  • 6.4.16 Apple Inc.
  • 6.4.17 Samsung Electronics Co., Ltd.
  • 6.4.18 AT&T Inc.
  • 6.4.19 Verizon Communications Inc.
  • 6.4.20 T-Mobile US, Inc.
  • 6.4.21 Rogers Communications Inc.
  • 6.4.22 BCE Inc.
  • 6.4.23 America Movil, S.A.B. de C.V.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment