세계의 마이크로일렉트로닉스 포장 시장(2024-2031년)

Global Microelectronics Packaging Market Size, Share & Trends Analysis Report by Packaging Type (Ball Grid Array (BGA), Chip-on-Board (COB), Surface Mount Technology (SMT), Through-Hole Technology (THT), Package-on-Package (PoP), Flip-Chip, and System-in-Package (SiP)), by Technology (Wafer-Level Packaging (WLP), Tape Carrier Package (TCP), Die-Level Packaging, and Others (3D Packaging, And System-In-Package (SiP)), by Material Type (Organic Substrates, Ceramic Substrates, Silicon Substrates, and Metal Substrates), and by Application (Consumer Electronics, Automotive, Healthcare, Industrial, Telecommunications, Aerospace & Defense, and Energy) Forecast Period (2024-2031)

The Microelectronics packaging market is anticipated to grow at a CAGR of 7.6% during the forecast period (2024-2031). Microelectronics packaging involves encasing and protecting microelectronic components such as Integrated Circuits (ICs) and semiconductors from external damage to ensure their smooth functionality and durability in various applications. It encompasses a range of packaging technologies, including Chip-On-Board (COB), Ball Grid Array (BGA), and flip-chip, which are essential for devices such as smartphones, computers, and automotive electronics. Further, the market is expected to experience significant growth in the future, attributed to the growing miniaturization of electronic components, expanding application of microelectronics packaging in the automotive industry, increasing demand for packaging solutions in the consumer electronics industry, and rising adoption of the Internet of Things (IoT) and wearable technology.

Market Dynamics

Miniaturization of Electronics Components

The demand for microelectronic packaging is being driven by the trend towards developing smaller and lighter electronic devices without sacrificing performance or functionality. Microelectronics packaging plays a crucial role in integrating multiple functionalities into smaller form factors, improving thermal management, and increasing component density. These abilities of the technology to address miniaturization complexities foster technological progress and contribute to growth in the packaging sector to meet the changing needs of consumer electronics, automotive systems, and industrial applications, driving market growth. For instance, in May 2021, IBM introduced the world's first 2 nanometer (nm) chip using nanosheet technology, representing a significant advancement in semiconductor design. This technology is expected to offer 45.0% higher performance, or 75.0% lower energy consumption compared to 7 nm node chips, meeting the rising demand for enhanced performance and energy efficiency in various applications.

Expansion of Automotive Electronics Industry

The automotive industry is increasingly integrating advanced electronics to improve navigation, safety, and infotainment systems in vehicles. This growing demand for sophisticated electronic features has increased the need for reliable and durable microelectronics packaging solutions. Electronic systems such as Advanced Driver Assistance Systems (ADAS), collision avoidance sensors, and high-definition infotainment displays require advanced packaging technologies that ensure high performance, robust thermal management, and long-term reliability under challenging automotive conditions. This increasing need for integrating advanced electronics drives the demand for microelectronic packaging in the automotive sector and is expected to expand the scope for microelectronics packaging beyond the consumer electronics market. For instance, in December 2023, Alpha and Omega Semiconductor Limited (AOS) introduced a new automotive TO-Leadless (TOLL) package for its automotive-grade 80V and 100V MOSFETs. The TOLL package is designed to enhance the company's power semiconductors as essential components in the advancement of e-mobility for 2- and 3-wheel and other light vehicles. This new package helps meet the growing trend of electrifying vehicles with the latest battery technology to achieve clean energy zero-emission goals. AOS's 80V and 100V MOSFETs are well-suited for automotive BLDC motor and battery management applications for e-mobility.

Segmental Outlook

• Based on packaging type, the market is segmented into Ball Grid Array (BGA), Chip-On-Board (COB), Surface Mount Technology (SMT), Through-Hole Technology (THT), Package-on-Package (PoP), flip-chip, and System-in-Package (SiP).
• Based on technology, the market is segmented into Wafer-Level Packaging (WLP), Tape Carrier Package (TCP), die-level packaging, and others (3D packaging, and System-in-Package (SiP))
• Based on material type, the market is segmented into organic substrates, ceramic substrates, silicon substrates, and metal substrates.
• Based on application, the market is segmented into consumer electronics, automotive, healthcare, industrial, telecommunications, aerospace & defense, and energy.

Ball Grid Array (BGA) is the Preferred Packaging Type

Ball Grid Array (BGA) is the preferred packaging type in the microelectronics packaging market owing to its superior performance in high-density applications and reliable electrical and thermal performance. The segmental growth can be attributed to its ability to support high-speed data transfer and large pin counts, making it ideal for advanced computing and consumer electronics. Additionally, its robust mechanical strength and efficient heat dissipation contribute to its widespread adoption in smartphones, tablets, and high-performance computing systems.

Consumer Electronics is the Biggest Application

Consumer electronics is the biggest application of microelectronics packaging owing to the expanding scope of the consumer electronics market, such as the inclusion of wearable devices, the growing miniaturization of consumer electronics products such as smart rings, the higher requirement for advanced packaging solutions to integrate numerous functions within a limited space while ensuring reliability and efficiency, and the growing adoption of consumer electronics products.

Regional Outlook

The global microelectronics packaging market is further segmented based on geography including North America (the US, and Canada), Europe (the UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia-Pacific), and the Rest of the World (the Middle East & Africa, and Latin America).

North America is Projected to Dominate the Global Microelectronics Packaging Market

North America is projected to deliver the highest growth rate in the future, attributed to the ongoing expansion of advanced electronics markets such as 3D packaging, increasing investments in microelectronics and related product markets, a strong electronics manufacturing and R&D base, growing demand for electronics in the automotive sector, a supportive market ecosystem in the region, and the presence of major microelectronics packaging companies such as Intel, Texas Instruments, and Materion, among others. For instance, in July 2024, as part of President Biden's investing in America agenda, the US Department of Commerce announced its intention to open a competition for new R&D activities aimed at establishing and accelerating domestic capacity for semiconductor advanced packaging. The CHIPS for America program is expected to provide up to $1.6 billion in funding for innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP). The CHIPS for America program would offer several awards of approximately $150.0 million in federal funding for each research area, through potential cooperative agreements. These awards are intended to leverage private sector investments from industry and academia.

Asia-Pacific is the Fastest Growing in Microelectronics Packaging Market

• Several Asia-Pacific countries, including India, Vietnam, and China, are investing in the semiconductor and electronics industries through government initiatives and incentives, boosting the development and adoption of advanced packaging technologies.
• Countries such as Taiwan, South Korea, and China are major players in semiconductor manufacturing, fostering a strong demand and market expansion for microelectronics packaging.

The major companies serving the global microelectronics packaging market include ASE Technology Holding Co, Ltd., Intel Corp., and Materion Corp., among others. The market players are focusing on capitalizing on growth by adopting strategies such as collaboration, partnerships, and market expansion among others.

Recent Development

• In February 2024, Raytheon, an RTX business, secured a $20.0 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium. The contract is aimed at developing a next-generation multi-chip package suitable for ground, maritime, and airborne sensors. Raytheon will collaborate with industry partners such as AMD to package state-of-the-art commercial devices, creating a compact microelectronics package. This package will have the ability to convert radio frequency energy to digital information with increased bandwidth and higher data rates. The integration of these devices will result in new system capabilities designed for higher performance, lower power consumption, and reduced weight.

Table of Contents

1. Report Summary

• Current Industry Analysis and Growth Potential Outlook
• 1.1. Research Methods and Tools
• 1.2. Market Breakdown
  • 1.2.1. By Segments
  • 1.2.2. By Region

2. Market Overview and Insights

• 2.1. Scope of the Report
• 2.2. Analyst Insight & Current Market Trends
  • 2.2.1. Key Industry Trends
  • 2.2.2. Recommendations
  • 2.2.3. Conclusion

3. Competitive Landscape

• 3.1. Key Company Analysis
• 3.2. ASE Technology Holding Co, Ltd.
  • 3.2.1. Overview
  • 3.2.2. Financial Analysis
  • 3.2.3. SWOT Analysis
  • 3.2.4. Recent Developments
• 3.3. Intel Corp.
  • 3.3.1. Overview
  • 3.3.2. Financial Analysis
  • 3.3.3. SWOT Analysis
  • 3.3.4. Recent Developments
• 3.4. Materion Corp.
  • 3.4.1. Overview
  • 3.4.2. Financial Analysis
  • 3.4.3. SWOT Analysis
  • 3.4.4. Recent Developments
• 3.5. Key Strategy Analysis

4. Market Segmentation

• 4.1. Global Microelectronics Packaging Market by Packaging Type
  • 4.1.1. Ball Grid Array (BGA)
  • 4.1.2. Chip-on-Board (COB)
  • 4.1.3. Surface Mount Technology (SMT)
  • 4.1.4. Through-Hole Technology (THT
  • 4.1.5. Package-on-Package (PoP)
  • 4.1.6. Flip-Chip
  • 4.1.7. System-in-Package (SiP)
• 4.2. Global Microelectronics Packaging Market by Technology
  • 4.2.1. Wafer-Level Packaging (WLP)
  • 4.2.2. Tape Carrier Package (TCP)
  • 4.2.3. Die-Level Packaging
  • 4.2.4. Others ((3D Packaging, Fan-Out Wafer-Level Packaging (Fowlp), And System-In-Package (SiP))
• 4.3. Global Microelectronics Packaging Market by Material Type
  • 4.3.1. Organic Substrates
  • 4.3.2. Ceramic Substrates
  • 4.3.3. Silicon Substrates
  • 4.3.4. Metal Substrates
• 4.4. Global Microelectronics Packaging Market by Application
  • 4.4.1. Consumer Electronics
  • 4.4.2. Automotive
  • 4.4.3. Healthcare
  • 4.4.4. Industrial
  • 4.4.5. Telecommunications
  • 4.4.6. Aerospace & Defense
  • 4.4.7. Energy

5. Regional Analysis

• 5.1. North America
  • 5.1.1. United States
  • 5.1.2. Canada
• 5.2. Europe
  • 5.2.1. UK
  • 5.2.2. Germany
  • 5.2.3. Italy
  • 5.2.4. Spain
  • 5.2.5. France
  • 5.2.6. Rest of Europe
• 5.3. Asia-Pacific
  • 5.3.1. China
  • 5.3.2. India
  • 5.3.3. Japan
  • 5.3.4. South Korea
  • 5.3.5. Rest of Asia-Pacific
• 5.4. Rest of the World
  • 5.4.1. Latin America
  • 5.4.2. Middle East and Africa

6. Company Profiles

• 6.1. Amkor Technology
• 6.2. ChipMOS Technologies Inc.
• 6.3. Deca Technologies Inc.
• 6.4. Fujitsu Ltd.
• 6.5. iangsu Changdian Technology Co., Ltd.
• 6.6. KLA Corp.
• 6.7. Micron Technology, Inc.
• 6.8. NXP Semiconductors
• 6.9. SCHOTT
• 6.10. Shinko Electric Industries Co., Ltd.
• 6.11. Silicon Connection Pte Ltd.
• 6.12. Siliconware Precision Industries Co., Ltd.
• 6.13. STI Electronics, Inc.
• 6.14. Taiwan Semiconductor Manufacturing Co. Ltd.
• 6.15. Texas Instruments Inc.
• 6.16. Tongfu Microelectronics Co., Ltd.
• 6.17. Xilinx, Inc. (AMD)