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¼¼°è¿Í Áß±¹ÀÇ FC BGA ½ÃÀå : ¿¹Ãø(2024-2030³â)

Global and China FC BGA Market Report & Forecast 2024-2030

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: QYResearch | ÆäÀÌÁö Á¤º¸: ¿µ¹® | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

PCB´Â ´Ù¾çÇÑ ÀüÀÚ Á¦Ç°ÀÇ ÁÖ¿ä ÄÄÆ÷³ÍÆ®ÀÔ´Ï´Ù.

ÄÄÇ»ÅÍ, Åë½Å, ´Ù¾çÇÑ CE(Consumer Electronics) Á¦Ç°¿¡ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. ÃÖ±Ù¿¡´Â ÀÚµ¿Â÷, »ê¾÷, ÀÇ·á, ±º, Ç×°ø¿ìÁÖ »ê¾÷¿¡¼­µµ ³Î¸® »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. µû¶ó¼­ ÀÌ »ê¾÷ÀÇ ¹ßÀüÀº Çö´ë °úÇбâ¼úÀÇ Áøº¸¿¡ ÀÇÇØ ÃßÁøµÇ¸ç, ´Ù¾çÇÑ ÃÖÁ¾ Á¦Ç°ÀÇ ¼ö¿ä¿Í ¹ÐÁ¢ÇÏ°Ô °ü·ÃµÇ¾î ÀÖ½À´Ï´Ù.

¼¼°èÀÇ ABF(FCBGA) ±âÆÇ ½ÃÀå ±Ô¸ð´Â 2023³â¿¡ 51¾ï 6,000¸¸ ´Þ·¯À̸ç, 2030³â±îÁö 102¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, 2024-2030³âÀÇ ¿¹Ãø ±â°£¿¡ CAGR·Î 9.86%ÀÇ ¼ºÀåÀÌ Àü¸ÁµË´Ï´Ù.

ÇöÀç, ABF(FCBGA) ±âÆÇÀº ÁÖ·Î ÀϺ», Áß±¹ ´ë¸¸, Çѱ¹, µ¿³²¾Æ½Ã¾Æ, Áß±¹ º»Åä µî¿¡¼­ »ý»êµÇ°í ÀÖ½À´Ï´Ù.

ÀϺ» ½ÃÀå ±Ô¸ð´Â 2023³â¿¡ 16¾ï 8,400¸¸ ´Þ·¯À̸ç, 2030³â±îÁö 27¾ï 4,600¸¸ ´Þ·¯¿¡ ´ÞÇÒ Àü¸ÁÀ̸ç, ¿¹Ãø ±â°£ÀÇ CAGRÀº 7.21%ÀÔ´Ï´Ù.

Áß±¹ ´ë¸¸ ½ÃÀå ±Ô¸ð´Â 2023³â¿¡ 20¾ï 1,100¸¸ ´Þ·¯À̸ç, 2030³â±îÁö 30¾ï 7,900¸¸ ´Þ·¯¿¡ ´ÞÇÒ Àü¸ÁÀ̸ç, ¿¹Ãø ±â°£ÀÇ CAGRÀº 6.03%ÀÔ´Ï´Ù.

Çѱ¹ ½ÃÀå ±Ô¸ð´Â 2023³â¿¡ 6¾ï 1,400¸¸ ´Þ·¯À̸ç, 2030³â±îÁö 16¾ï 7,700¸¸ ´Þ·¯¿¡ ´ÞÇÒ Àü¸ÁÀ̸ç, ¿¹Ãø ±â°£ÀÇ CAGRÀº 12.97%ÀÔ´Ï´Ù.

Áß±¹ º»Åä ½ÃÀå ±Ô¸ð´Â 2023³â¿¡ 6¾ï 5,400¸¸ ´Þ·¯À̸ç, 2030³â±îÁö 22¾ï 8,400¸¸ ´Þ·¯¿¡ ´ÞÇÒ Àü¸ÁÀ̸ç, ¿¹Ãø ±â°£ÀÇ CAGRÀº 18.92%ÀÔ´Ï´Ù.

¼¼°è ABF(FCBGA) ±âÆÇÀÇ ÁÖ¿ä Á¦Á¶¾÷ü´Â Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, TOPPAN µîÀÔ´Ï´Ù. 2023³â, ¼¼°è »óÀ§ 5»çÀÇ ¸ÅÃâ Á¡À¯À²Àº ¾à 73%¿´½À´Ï´Ù.

¾Æ½Ã¾ÆÅÂÆò¾çÀº ÃÖ´ë ½ÃÀåÀ̸ç, ¾à 78%ÀÇ Á¡À¯À²À» Â÷ÁöÇϰí ÀÖ½À´Ï´Ù. ¾Æ½Ã¾ÆÀÇ ÁÖ¿ä ¼ÒºñÀÚ´Â Áß±¹ ´ë¸¸, Çѱ¹, ÀϺ», Áß±¹ º»Åä, µ¿³²¾Æ½Ã¾ÆÀÔ´Ï´Ù.

Á¦Ç°º°·Î´Â 4-8Ãþ ABF ±âÆÇÀÌ °¡Àå ¸¹ÀÌ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. ÇâÈÄ ¼ö³â°£Àº AI, HPC Ĩ, ÇÏÀÌ¿£µå ¼­¹ö, 5GÀÇ ¼ö¿ä¿¡ ÀÇÇØ 10Ãþ Ãʰú ABF ±âÆÇÀÌ ³Î¸® »ç¿ëµÉ Àü¸ÁÀÔ´Ï´Ù.

ÁÖ¿ä ÃÖÁ¾»ç¿ëÀÚ´Â Intel, AMD, Nvidia, Apple, Samsung µîÀÔ´Ï´Ù. 2023³â, ÁÖ¿ä ÃÖÁ¾»ç¿ëÀÚ´Â Àû¾îµµ 2025³â±îÁö ÀÚ»çÀÇ HPC ĨÀ» ó¸®Çϱâ À§ÇØ ÇÊ¿äÇÑ ABF ±âÆÇ °ø±Þ¾÷ü·ÎºÎÅÍ º¸´Ù ¸¹ÀÌ »ý»ê´É·Â Áö¿øÀ» ȹµæÇϱâ À§ÇØ °æÀïÀ» °ÝÈ­½Ã۰í ÀÖ½À´Ï´Ù. °ÅÀÇ ¸ðµç ABF ±âÆÇ Á¦Á¶¾÷ü°¡ ÇâÈÄ ¼ö³â°£ »ý»ê´É·ÂÀ» È®´ëÇÒ °èȹÀ» °¡Áö°í ÀÖÀ¸¸ç, Anhui Splendid Technology, Aoxin Semiconductor Technology(Taicang), Keruisi Semiconductor Technology(Dongyang) µî ABF ±âÆÇ »ý»êÀ¸·ÎÀÇ Âü¿©¸¦ °èȹÇϰí ÀÖ´Â ±â¾÷µµ ÀÖ½À´Ï´Ù. ¼¼°èÀÇ °æÀï ±¸µµ´Â 2³â ÈÄ, 5³â ÈÄ¿¡´Â ¿ÏÀüÈ÷ ´Þ¶óÁú Àü¸ÁÀ̸ç, ºÒÈ®½Ç¼ºÀ¸·Î °¡µæ Â÷ ÀÖ½À´Ï´Ù.

¼¼°è ¹× Áß±¹ÀÇ FC BGA ½ÃÀå¿¡ ´ëÇØ Á¶»çºÐ¼®ÇßÀ¸¸ç, °¢ Áö¿ªÀÇ ½ÃÀå ±Ô¸ð¿Í ¿¹Ãø, ±â¾÷ °³¿ä, ½ÃÀå ¿ªÇÐ µîÀ» Á¦°øÇϰí ÀÖ½À´Ï´Ù.

¸ñÂ÷

Á¦1Àå Á¶»ç ¹üÀ§

  • FC BGA Á¦Ç° ¼­·Ð
  • ¼¼°èÀÇ FC BGA Àü¸Á(2019³â¡¤2023³â¡¤2030³â)
    • ¼¼°èÀÇ FC BGA ÆÇ¸Å(2019-2030³â)
    • ¼¼°èÀÇ FC BGA ÆÇ¸Å ¼ö·®(2019-2030³â)
  • Áß±¹ÀÇ FC BGA Àü¸Á(2019³â¡¤2023³â¡¤2030³â)
    • Áß±¹ÀÇ FC BGA ÆÇ¸Å(2019-2030³â)
    • Áß±¹ÀÇ FC BGA ÆÇ¸Å ¼ö·®(2019-2030³â)
  • ¼¼°è ¹× Áß±¹ÀÇ FC BGA ½ÃÀå ±Ô¸ð(2019³â¡¤2023³â¡¤2030³â)
    • ¼¼°è Áß±¹ÀÇ FC BGA ½ÃÀå Á¡À¯À²(2019³â¡¤2023³â¡¤2030³â)
    • ¼¼°è ¹× Áß±¹ÀÇ FC BGA ½ÃÀå ±Ô¸ðÀÇ ¼ºÀå·ü(2019³â¡¤2023³â¡¤2030³â)
  • FC-BGA ½ÃÀå ¿ªÇÐ
    • FC-BGA »ê¾÷ µ¿Çâ
    • FC-BGA ½ÃÀå ÃËÁø¿äÀÎ
    • FC-BGA ½ÃÀåÀÌ ÇØ°áÇØ¾ß ÇÒ °úÁ¦
    • FC-BGA ½ÃÀå ¾ïÁ¦¿äÀÎ
  • ÀüÁ¦Á¶°Ç°ú Á¦ÇÑ
  • Á¶»ç ¸ñÀû
  • °í·ÁµÇ´Â ¿¬¼ö

Á¦2Àå FC BGA : Á¦Ç°º°

  • FC BGA ½ÃÀå : Á¦Ç°º°
    • 4-8Ãþ FC BGA ±âÆÇ
    • 8-16Ãþ FC BGA ±âÆÇ
    • ±âŸ
  • FC BGA ½ÃÀå ±Ô¸ð : Á¦Ç°º°
    • ¼¼°èÀÇ FC BGA ÆÇ¸Å ±Ý¾× : Á¦Ç°º°(2019³â¡¤2023³â¡¤2030³â)
    • ¼¼°èÀÇ FC BGA ÆÇ¸Å ¼ö·® : Á¦Ç°º°(2019³â¡¤2023³â¡¤2030³â)
    • ¼¼°èÀÇ FC BGA Æò±Õ ÆÇ¸Å °¡°Ý : Á¦Ç°º°(ASP)(2019³â¡¤2023³â¡¤2030³â)
  • Áß±¹ÀÇ FC BGA ½ÃÀå ±Ô¸ð : Á¦Ç°º°
    • Áß±¹ÀÇ FC BGA ÆÇ¸Å ±Ý¾× : Á¦Ç°º°(2019³â¡¤2023³â¡¤2030³â)
    • Áß±¹ÀÇ FC BGA ÆÇ¸Å ¼ö·® : Á¦Ç°º°(2019³â¡¤2023³â¡¤2030³â)
    • Áß±¹ÀÇ FC BGA Æò±Õ ÆÇ¸Å °¡°Ý : Á¦Ç°º°(ASP)(2019³â¡¤2023³â¡¤2030³â)

Á¦3Àå FC BGA : ¿ëµµº°

  • FC BGA ½ÃÀå : ¿ëµµº°
    • PC
    • ¼­¹ö¡¤µ¥ÀÌÅͼ¾ÅÍ
    • HPC/AI Ĩ
    • Åë½Å
    • ±âŸ
  • ¼¼°èÀÇ FC BGA ½ÃÀå ±Ô¸ð : ¿ëµµº°
    • ¼¼°èÀÇ FC BGA ÆÇ¸Å ±Ý¾× : ¿ëµµº°(2019³â¡¤2023³â¡¤2030³â)
    • ¼¼°èÀÇ FC BGA ÆÇ¸Å ¼ö·® : ¿ëµµº°(2019³â¡¤2023³â¡¤2030³â)
    • ¼¼°èÀÇ FC BGA Æò±Õ ÆÇ¸Å °¡°Ý : ¿ëµµº°(ASP)(2019³â¡¤2023³â¡¤2030³â)
  • Áß±¹ÀÇ FC BGA ½ÃÀå ±Ô¸ð : ¿ëµµº°
    • Áß±¹ÀÇ FC BGA ÆÇ¸Å ±Ý¾× : ¿ëµµº°(2019³â¡¤2023³â¡¤2030³â)
    • Áß±¹ÀÇ FC BGA ÆÇ¸Å ¼ö·® : ¿ëµµº°(2019³â¡¤2023³â¡¤2030³â)
    • Áß±¹ÀÇ FC BGA Æò±Õ ÆÇ¸Å °¡°Ý : ¿ëµµº°(ASP)(2019³â¡¤2023³â¡¤2030³â)

Á¦4Àå ¼¼°èÀÇ FC BGA °æÀï ±¸µµ : ±â¾÷º°

  • ¼¼°èÀÇ FC BGA ½ÃÀå ±Ô¸ð : ±â¾÷º°
    • ¼¼°èÀÇ FC BGAÀÇ ÁÖ¿ä Á¦Á¶¾÷ü, ¸ÅÃâ ¼øÀ§(2023³â)
    • ¼¼°èÀÇ FC BGA ¸ÅÃâ : Á¦Á¶¾÷üº°(2019-2024³â)
    • ¼¼°èÀÇ FC BGA ÆÇ¸Å : Á¦Á¶¾÷üº°(2019-2024³â)
    • ¼¼°èÀÇ FC BGA °¡°Ý : Á¦Á¶¾÷üº°(2019-2024³â)
  • ¼¼°èÀÇ FC BGA ÁýÁßÀ²(CR)
    • FC BGA ½ÃÀå ÁýÁßµµ(CR)(2019-2024³â)
    • ¼¼°èÀÇ 5´ë¡¤10´ëFC BGA Á¦Á¶¾÷ü(2023³â)
    • ¼¼°èÀÇ FC BGA ½ÃÀå Á¡À¯À² : ±â¾÷ À¯Çüº°(Tier 1¡¤Tier 2¡¤Tier 3)
  • ¼¼°èÀÇ FC BGAÀÇ ÁÖ¿ä Á¦Á¶¾÷ü, Á¦Á¶ ±â¹Ý ºÐÆ÷, º»»ç
  • ¼¼°èÀÇ FC BGAÀÇ ÁÖ¿ä Á¦Á¶¾÷ü, ¾÷°è Âü¿© ÀÏ
  • Á¦Á¶¾÷ü ÇÕº´°ú Àμö, È®Àå °èȹ
  • Áß±¹ÀÇ FC BGA ½ÃÀå ±Ô¸ð : Áß±¹ ÇöÁö ±â¾÷º°
    • Áß±¹ÀÇ FC BGA ¸ÅÃâ : Áß±¹ ÇöÁö ±â¾÷º°(2019-2024³â)
    • Áß±¹ÀÇ FC BGA ÆÇ¸Å : Áß±¹ ÇöÁö ±â¾÷º°(2019-2024³â)

Á¦5Àå ¼¼°èÀÇ FC BGA ½ÃÀå ±Ô¸ð : Áö¿ªº°

  • ¼¼°èÀÇ FC BGA ½ÃÀå ±Ô¸ð : Áö¿ªº°(2019³â¡¤2023³â¡¤2030³â)
  • ¼¼°èÀÇ FC BGA ½ÃÀå ±Ô¸ð : Áö¿ªº°(2019-2030³â)
  • ¼¼°èÀÇ FC BGA ½ÃÀå ±Ô¸ð : Áö¿ªº°(2019-2030³â)

Á¦6Àå ºÏ¹Ì

  • ºÏ¹ÌÀÇ FC BGA ½ÃÀå ±Ô¸ð Àü³â´ëºñ ¼ºÀå(2019-2030³â)
  • ºÏ¹ÌÀÇ FC BGA ÆÇ¸Å ¼ö·® : Á¦Ç°º°(2019³â¡¤2023³â¡¤2030³â)
  • ºÏ¹ÌÀÇ FC BGA ÆÇ¸Å ¼ö·® : ¿ëµµº°(2019³â¡¤2023³â¡¤2030³â)
  • ºÏ¹ÌÀÇ FC BGA ½ÃÀåÀÇ »ç½Ç°ú ¼öÄ¡ : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)
    • ºÏ¹ÌÀÇ FC BGA ÆÇ¸Å ±Ý¾× : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)
    • ºÏ¹ÌÀÇ FC BGA ÆÇ¸Å ¼ö·® : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)
    • ¹Ì±¹
    • ij³ª´Ù
    • ¸ß½ÃÄÚ

Á¦7Àå À¯·´

  • À¯·´ÀÇ FC BGA ½ÃÀå ±Ô¸ð Àü³â´ëºñ ¼ºÀå(2019-2030³â)
  • À¯·´ÀÇ FC BGA ÆÇ¸Å ¼ö·® : Á¦Ç°º°(2019³â¡¤2023³â¡¤2030³â)
  • À¯·´ÀÇ FC BGA ÆÇ¸Å ¼ö·® : ¿ëµµº°(2019³â¡¤2023³â¡¤2030³â)
  • À¯·´ÀÇ FC BGA ½ÃÀåÀÇ »ç½Ç°ú ¼öÄ¡ : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)
    • À¯·´ÀÇ FC BGA ÆÇ¸Å ±Ý¾× : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)
    • À¯·´ÀÇ FC BGA ÆÇ¸Å ¼ö·® : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)
    • µ¶ÀÏ
    • ¿µ±¹
    • ÇÁ¶û½º
    • ºÏÀ¯·´ ±¹°¡
    • ÀÌÅ»¸®¾Æ

Á¦8Àå ¾Æ½Ã¾ÆÅÂÆò¾ç

  • ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ FC BGA ½ÃÀå ±Ô¸ð Àü³â´ëºñ ¼ºÀå(2019-2030³â)
  • ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ FC BGA ÆÇ¸Å ¼ö·® : Á¦Ç°º°(2019³â¡¤2023³â¡¤2030³â)
  • ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ FC BGA ÆÇ¸Å ¼ö·® : ¿ëµµº°(2019³â¡¤2023³â¡¤2030³â)
  • ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ FC BGA ½ÃÀåÀÇ »ç½Ç°ú ¼öÄ¡ : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)
    • ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ FC BGA ÆÇ¸Å ±Ý¾× : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)
    • ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ FC BGA ÆÇ¸Å ¼ö·® : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)
    • Áß±¹
    • ÀϺ»
    • Çѱ¹
    • Áß±¹ ´ë¸¸
    • µ¿³²¾Æ½Ã¾Æ
    • Àεµ

Á¦9Àå Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ FC BGA ½ÃÀå ±Ô¸ð Àü³â´ëºñ ¼ºÀå(2019-2030³â)
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ FC BGA ÆÇ¸Å ¼ö·® : Á¦Ç°º°(2019³â¡¤2023³â¡¤2030³â)
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ FC BGA ÆÇ¸Å ¼ö·® : ¿ëµµº°(2019³â¡¤2023³â¡¤2030³â)
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ FC BGA ½ÃÀåÀÇ »ç½Ç°ú ¼öÄ¡ : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)

Á¦10Àå ³²¹Ì

  • ³²¹ÌÀÇ FC BGA ½ÃÀå ±Ô¸ð Àü³â´ëºñ ¼ºÀå(2019-2030³â)
  • ³²¹ÌÀÇ FC BGA ÆÇ¸Å ¼ö·® : Á¦Ç°º°(2019³â¡¤2023³â¡¤2030³â)
  • ³²¹ÌÀÇ FC BGA ÆÇ¸Å ¼ö·® : ¿ëµµº°(2019³â¡¤2023³â¡¤2030³â)
  • ³²¹ÌÀÇ FC BGA ½ÃÀåÀÇ »ç½Ç°ú ¼öÄ¡ : ±¹°¡º°(2019³â¡¤2023³â¡¤2030³â)

Á¦11Àå ±â¾÷ °³¿ä

  • Unimicron
  • Ibiden
  • Nan Ya PCB
  • Shinko Electric Industries
  • Kinsus Interconnect Technology
  • AT&S
  • Semco
  • Kyocera
  • TOPPAN
  • Zhen Ding Technology
  • Daeduck Electronics
  • Zhuhai Access Semiconductor Co., Ltd.
  • LG InnoTek
  • Shennan Circuit
  • Shenzhen Fastprint Circuit Tech

Á¦12Àå »ê¾÷ üÀΰú ÆÇ¸Åä³Î ºÐ¼®

  • FC BGA »ê¾÷ üÀÎ ºÐ¼®
  • FC BGA ÁÖ¿ä ¿øÀç·á
    • ÁÖ¿ä ¿øÀç·á
    • ¿øÀç·áÀÇ ÁÖ¿ä °ø±Þ¾÷ü
  • FC BGA »ý»ê ¹æ½Ä°ú ÇÁ·Î¼¼½º
  • FC BGAÀÇ ÆÇ¸Å¿Í ¸¶ÄÉÆÃ
    • FC BGAÀÇ ÆÇ¸Å ä³Î
  • FC BGA °í°´

Á¦13Àå Á¶»ç °á°ú¿Í °á·Ð

Á¦14Àå ºÎ·Ï

KSA 24.08.06

PCBs are key component of various electronic products. They are used in computers, communications, and various consumer electronic products and equipment. In recent years, they have been widely used in the automotive, industrial, medical, military and aerospace industries. Therefore, the development of this industry is driven by the advancement of modern science and technology, and is closely related to the demand of various end products.

The global market for ABF (FCBGA) Substrate was valued at US$ 5.16 billion in the year 2023, is projected to reach a revised size of US$ 10.2 billion by 2030, growing at a CAGR of 9.86% during the forecast period 2024-2030.

Currently the ABF (FCBGA) Substrates are mainly produced in Japan, China Taiwan, South Korea, Southeast Asia and China Mainland, etc.

The Japan market for ABF (FCBGA) substrates was valued at US$ 1,684 million in 2023 and will reach US$ 2,746 million by 2030, at a CAGR of 7.21% during the forecast period of 2024 through 2030.

The China Taiwan market for ABF (FCBGA) substrates was valued at US$ 2,011 million in 2023 and will reach US$ 3,079 million by 2030, at a CAGR of 6.03% during the forecast period of 2024 through 2030.

The South Korea market for ABF (FCBGA) substrates was valued at US$ 614 million in 2023 and will reach US$ 1,677 million by 2030, at a CAGR of 12.97% during the forecast period of 2024 through 2030.

The China Mainland market for ABF (FCBGA) substrates was valued at US$ 654 million in 2023 and will reach US$ 2,284 million by 2030, at a CAGR of 18.92% during the forecast period of 2024 through 2030.

The global key manufacturers of ABF (FCBGA) substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2023, the global top five players had a share approximately 73% in terms of revenue.

Asia Pacific is the largest market, holds a share about 78%, key consumers in Asia are Chinese Taiwan, South Korea, Japan, China mainland, and Southeast Asia.

In terms of products, 4-8 Layers ABF substrates are the most common used products, due to the strong demand from PC. In next few years, the segment over 10 layers ABF substrate will be widely used, driven by the demand of AI, HPC chips, high end servers and 5G.

Key end users are Intel, AMD, Nvidia, Apple, and Samsung, etc. In 2023, the key end users are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025. Almost all of ABF substrates manufacturers have plans to expand production capacity in next few years, and there also several companies have planned to enter to produce ABF substrates, such as Anhui Splendid Technology, Aoxin Semiconductor Technology (Taicang), and Keruisi Semiconductor Technology (Dongyang) etc. The global competitive situation will be totally different after two or five years, filled with uncertainty.

FC BGA market is segmented in regional and country level, by players, by Product, and by Application. Companies, stakeholders, and other participants in the global FC BGA market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by Product and by Application for the period 2019-2030.

For China market, this report focuses on the FC BGA market size by players, by Product, and by Application, for the period 2019-2030. The key players include the global and local players which play important roles in China.

Market Segmentation

By Company

  • Unimicron
  • Ibiden
  • Nan Ya PCB
  • Shinko Electric Industries
  • Kinsus Interconnect
  • AT&S
  • Semco
  • Kyocera
  • TOPPAN
  • Zhen Ding Technology
  • Daeduck Electronics
  • ACCESS
  • LG InnoTek
  • Shennan Circuit
  • Shenzhen Fastprint Circuit Tech

Segment by Product

  • 4-8 Layers FC BGA Substrate
  • 8-16 Layers FC BGA Substrate
  • Others

Segment by Application

  • PCs
  • Server & Data Center
  • HPC/AI Chips
  • Communication
  • Others

By Region

  • North America
  • United States
  • Canada
  • Mexico
  • Brazil
  • Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Nordic Countries
  • Netherlands
  • Rest of Europe
  • APAC
  • China
  • Japan
  • South Korea
  • China Taiwan
  • ASEAN
  • India
  • Latin America, Middle East & Africa
  • Mexico
  • Brazil
  • Israel

Chapter Outline

Chapter 1: Introduces FC BGA definition, global sales (volume and revenue), China market size, China percentage in global market. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Provides the analysis of various market segments by Product, covering the volume, price, revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 3: Provides the analysis of various market segments by Application, covering the revenue, price, volume, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 4: Detailed analysis of FC BGA companies' competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.

Chapter 5: Revenue and volume of FC BGA in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and capacity of each country in the world.

Chapter 6: Americas by Product, by Application and by country, sales, and revenue for each segment.

Chapter 7: EMEA by Product, by Application and by region, sales, and revenue for each segment.

Chapter 8: China by Product, and by Application, sales, and revenue for each segment.

Chapter 9: APAC (excluding China) by Product, by Application and by region, sales, and revenue for each segment.

Chapter 10: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, FC BGA sales, revenue, gross margin, and recent development, etc.

Chapter 11: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.

Chapter 12: research findings and conclusion

Table of Contents

1 Study Coverage

  • 1.1 FC BGA Product Introduction
  • 1.2 Global FC BGA Outlook 2019 VS 2023 VS 2030
    • 1.2.1 Global FC BGA Sales in US$ Million for the Year 2019-2030
    • 1.2.2 Global FC BGA Sales in Volume for the Year 2019-2030
  • 1.3 China FC BGA Outlook 2019 VS 2023 VS 2030
    • 1.3.1 China FC BGA Sales in US$ Million for the Year 2019-2030
    • 1.3.2 China FC BGA Sales in Volume for the Year 2019-2030
  • 1.4 FC BGA Market Size, China VS Global, 2019 VS 2023 VS 2030
    • 1.4.1 The Market Share of China FC BGA in Global, 2019 VS 2023 VS 2030
    • 1.4.2 The Growth Rate of FC BGA Market Size, China VS Global, 2019 VS 2023 VS 2030
  • 1.5 FC-BGA Market Dynamics
    • 1.5.1 FC-BGA Industry Trends
    • 1.5.2 FC-BGA Market Drivers
    • 1.5.3 FC-BGA Market Challenges
    • 1.5.4 FC-BGA Market Restraints
  • 1.6 Assumptions and Limitations
  • 1.7 Study Objectives
  • 1.8 Years Considered

2 FC BGA by Product

  • 2.1 FC BGA Market by Product
    • 2.1.1 4-8 Layers FC BGA Substrate
    • 2.1.2 8-16 Layers FC BGA Substrate
    • 2.1.3 Others
  • 2.2 Global FC BGA Market Size by Product
    • 2.2.1 Global FC BGA Sales in Value, by Product (2019, 2023 & 2030)
    • 2.2.2 Global FC BGA Sales in Volume, by Product (2019, 2023 & 2030)
    • 2.2.3 Global FC BGA Average Selling Price (ASP) by Product (2019, 2023 & 2030)
  • 2.3 China FC BGA Market Size by Product
    • 2.3.1 China FC BGA Sales in Value, by Product (2019, 2023 & 2030)
    • 2.3.2 China FC BGA Sales in Volume, by Product (2019, 2023 & 2030)
    • 2.3.3 China FC BGA Average Selling Price (ASP) by Product (2019, 2023 & 2030)

3 FC BGA by Application

  • 3.1 FC BGA Market by Application
    • 3.1.1 PCs
    • 3.1.2 Server & Data Center
    • 3.1.3 HPC/AI Chips
    • 3.1.4 Communication
    • 3.1.5 Others
  • 3.2 Global FC BGA Market Size by Application
    • 3.2.1 Global FC BGA Sales in Value, by Application (2019, 2023 & 2030)
    • 3.2.2 Global FC BGA Sales in Volume, by Application (2019, 2023 & 2030)
    • 3.2.3 Global FC BGA Average Selling Price (ASP) by Application (2019, 2023 & 2030)
  • 3.3 China FC BGA Market Size by Application
    • 3.3.1 China FC BGA Sales in Value, by Application (2019, 2023 & 2030)
    • 3.3.2 China FC BGA Sales in Volume, by Application (2019, 2023 & 2030)
    • 3.3.3 China FC BGA Average Selling Price (ASP) by Application (2019, 2023 & 2030)

4 Global FC BGA Competitor Landscape by Company

  • 4.1 Global FC BGA Market Size by Company
    • 4.1.1 Global Key Manufacturers of FC BGA, Ranked by Revenue (2023)
    • 4.1.2 Global FC BGA Revenue by Manufacturer (2019-2024)
    • 4.1.3 Global FC BGA Sales by Manufacturer (2019-2024)
    • 4.1.4 Global FC BGA Price by Manufacturer (2019-2024)
  • 4.2 Global FC BGA Concentration Ratio (CR)
    • 4.2.1 FC BGA Market Concentration Ratio (CR) (2019-2024)
    • 4.2.2 Global Top 5 and Top 10 Largest Manufacturers of FC BGA in 2023
    • 4.2.3 Global FC BGA Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
  • 4.3 Global Key Manufacturers of FC BGA, Manufacturing Base Distribution and Headquarters
  • 4.4 Global Key Manufacturers of FC BGA, Date of Enter into This Industry
  • 4.5 Manufacturers Mergers & Acquisitions, Expansion Plans
  • 4.6 China FC BGA Market Size by Chinese Local Company
    • 4.6.1 China FC BGA Revenue by Chinese Local Players (2019-2024)
    • 4.6.2 China FC BGA Sales by Chinese Local Players (2019-2024)

5 Global FC BGA Market Size by Region

  • 5.1 Global FC BGA Market Size by Region: 2019 VS 2023 VS 2030
  • 5.2 Global FC BGA Market Size in Volume by Region (2019-2030)
    • 5.2.1 Global FC BGA Sales in Volume by Region: 2019-2024
    • 5.2.2 Global FC BGA Sales in Volume Forecast by Region (2025-2030)
  • 5.3 Global FC BGA Market Size in Value by Region (2019-2030)
    • 5.3.1 Global FC BGA Sales in Value by Region: 2019-2024
    • 5.3.2 Global FC BGA Sales in Value by Region: 2025-2030

6 North America

  • 6.1 North America FC BGA Market Size YoY Growth 2019-2030
  • 6.2 North America FC BGA Sales in Volume, by Product (2019, 2023 & 2030)
  • 6.3 North America FC BGA Sales in Volume, by Application (2019, 2023 & 2030)
  • 6.4 North America FC BGA Market Facts & Figures by Country (2019, 2023 & 2030)
    • 6.4.1 North America FC BGA Sales in Value by Country (2019, 2023 & 2030)
    • 6.4.2 North America FC BGA Sales in Volume by Country (2019, 2023 & 2030)
    • 6.4.3 United States
    • 6.4.4 Canada
    • 6.4.5 Mexico

7 Europe

  • 7.1 Europe FC BGA Market Size YoY Growth 2019-2030
  • 7.2 Europe FC BGA Sales in Volume, by Product (2019, 2023 & 2030)
  • 7.3 Europe FC BGA Sales in Volume, by Application (2019, 2023 & 2030)
  • 7.4 Europe FC BGA Market Facts & Figures by Country (2019, 2023 & 2030)
    • 7.4.1 Europe FC BGA Sales in Value by Country (2019, 2023 & 2030)
    • 7.4.2 Europe FC BGA Sales in Volume by Country (2019, 2023 & 2030)
    • 7.4.3 Germany
    • 7.4.4 UK
    • 7.4.5 France
    • 7.4.6 Nordic Countries
    • 7.4.7 Italy

8 Asia Pacific

  • 8.1 Asia Pacific FC BGA Market Size YoY Growth 2019-2030
  • 8.2 Asia Pacific FC BGA Sales in Volume, by Product (2019, 2023 & 2030)
  • 8.3 Asia Pacific FC BGA Sales in Volume, by Application (2019, 2023 & 2030)
  • 8.4 Asia Pacific FC BGA Market Facts & Figures by Country (2019, 2023 & 2030)
    • 8.4.1 Asia Pacific FC BGA Sales in Value by Country (2019, 2023 & 2030)
    • 8.4.2 Asia Pacific FC BGA Sales in Volume by Country (2019, 2023 & 2030)
    • 8.4.3 China
    • 8.4.4 Japan
    • 8.4.5 South Korea
    • 8.4.6 China Taiwan
    • 8.4.7 Southeast Asia
    • 8.4.8 India

9 Middle East & Africa

  • 9.1 Middle East & Africa FC BGA Market Size YoY Growth 2019-2030
  • 9.2 Middle East & Africa FC BGA Sales in Volume, by Product (2019, 2023 & 2030)
  • 9.3 Middle East & Africa FC BGA Sales in Volume, by Application (2019, 2023 & 2030)
  • 9.4 Middle East & Africa FC BGA Market Facts & Figures by Country (2019, 2023 & 2030)
    • 9.4.1 Middle East & Africa FC BGA Sales in Value by Country (2019, 2023 & 2030)
    • 9.4.2 Middle East & Africa FC BGA Sales in Volume by Country (2019, 2023 & 2030)

10 South America

  • 10.1 South America FC BGA Market Size YoY Growth 2019-2030
  • 10.2 South America FC BGA Sales in Volume, by Product (2019, 2023 & 2030)
  • 10.3 South America FC BGA Sales in Volume, by Application (2019, 2023 & 2030)
  • 10.4 South America FC BGA Market Facts & Figures by Country (2019, 2023 & 2030)
    • 10.4.1 South America FC BGA Sales in Value by Country (2019, 2023 & 2030)
    • 10.4.2 South America FC BGA Sales in Volume by Country (2019, 2023 & 2030)

11 Company Profiles

  • 11.1 Unimicron
    • 11.1.1 Unimicron Corporation Information
    • 11.1.2 Unimicron Overview
    • 11.1.3 Unimicron FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.1.4 Unimicron FC-BGA Products Offered
    • 11.1.5 Unimicron Recent Developments
  • 11.2 Ibiden
    • 11.2.1 Ibiden Corporation Information
    • 11.2.2 Ibiden Overview
    • 11.2.3 Ibiden FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.2.4 Ibiden FC-BGA Products Offered
    • 11.2.5 Ibiden Recent Developments
  • 11.3 Nan Ya PCB
    • 11.3.1 Nan Ya PCB Corporation Information
    • 11.3.2 Nan Ya PCB Overview
    • 11.3.3 Nan Ya PCB FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.3.4 Nan Ya PCB FC-BGA Products Offered
    • 11.3.5 Nan Ya PCB Recent Developments
  • 11.4 Shinko Electric Industries
    • 11.4.1 Shinko Electric Industries Corporation Information
    • 11.4.2 Shinko Electric Industries Overview
    • 11.4.3 Shinko Electric Industries FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.4.4 Shinko Electric Industries FC-BGA Products Offered
    • 11.4.5 Shinko Electric Industries Recent Developments
  • 11.5 Kinsus Interconnect Technology
    • 11.5.1 Kinsus Interconnect Technology Corporation Information
    • 11.5.2 Kinsus Interconnect Technology Overview
    • 11.5.3 Kinsus Interconnect Technology FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.5.4 Kinsus Interconnect Technology FC-BGA Products Offered
    • 11.5.5 Kinsus Interconnect Technology Recent Developments
  • 11.6 AT&S
    • 11.6.1 AT&S Corporation Information
    • 11.6.2 AT&S Overview
    • 11.6.3 AT&S FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.6.4 AT&S FC-BGA Products Offered
    • 11.6.5 AT&S Recent Developments
  • 11.7 Semco
    • 11.7.1 Semco Corporation Information
    • 11.7.2 Semco Overview
    • 11.7.3 Semco FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.7.4 Semco FC-BGA Products Offered
    • 11.7.5 Semco Recent Developments
  • 11.8 Kyocera
    • 11.8.1 Kyocera Corporation Information
    • 11.8.2 Kyocera Overview
    • 11.8.3 Kyocera FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.8.4 Kyocera FC-BGA Products Offered
    • 11.8.5 Kyocera Recent Developments
  • 11.9 TOPPAN
    • 11.9.1 TOPPAN Corporation Information
    • 11.9.2 TOPPAN Overview
    • 11.9.3 TOPPAN FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.9.4 TOPPAN FC-BGA Products Offered
    • 11.9.5 TOPPAN Recent Developments
  • 11.10 Zhen Ding Technology
    • 11.10.1 Zhen Ding Technology Corporation Information
    • 11.10.2 Zhen Ding Technology Overview
    • 11.10.3 Zhen Ding Technology FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.10.4 Zhen Ding Technology FC-BGA Products Offered
    • 11.10.5 Zhen Ding Technology Recent Developments
  • 11.11 Daeduck Electronics
    • 11.11.1 Daeduck Electronics Corporation Information
    • 11.11.2 Daeduck Electronics Overview
    • 11.11.3 Daeduck Electronics FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.11.4 Daeduck Electronics FC-BGA Products Offered
    • 11.11.5 Daeduck Electronics Recent Developments
  • 11.12 Zhuhai Access Semiconductor Co., Ltd.
    • 11.12.1 ACCESS Corporation Information
    • 11.12.2 ACCESS Overview
    • 11.12.3 ACCESS FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.12.4 ACCESS FC-BGA Products Offered
  • 11.13 LG InnoTek
    • 11.13.1 LG InnoTek Corporation Information
    • 11.13.2 LG InnoTek Overview
    • 11.13.3 LG InnoTek FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.13.4 LG InnoTek FC-BGA Products Offered
    • 11.13.5 LG InnoTek Recent Developments
  • 11.14 Shennan Circuit
    • 11.14.1 Shennan Circuit Corporation Information
    • 11.14.2 Shennan Circuit Overview
    • 11.14.3 Shennan Circuit FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.14.4 Shennan Circuit FC-BGA Products Offered
  • 11.15 Shenzhen Fastprint Circuit Tech
    • 11.15.1 Shenzhen Fastprint Circuit Tech Corporation Information
    • 11.15.2 Shenzhen Fastprint Circuit Tech Overview
    • 11.15.3 Shenzhen Fastprint Circuit Tech FC-BGA Sales, Revenue and Gross Margin (2019-2024) (2019-2024)
    • 11.15.4 Shenzhen Fastprint Circuit Tech FC-BGA Products Offered
    • 11.15.5 Shenzhen Fastprint Circuit Tech Recent Developments

12 Industry Chain and Sales Channels Analysis

  • 12.1 FC BGA Industry Chain Analysis
  • 12.2 FC BGA Key Raw Materials
    • 12.2.1 Key Raw Materials
    • 12.2.2 Raw Materials Key Suppliers
  • 12.3 FC BGA Production Mode & Process
  • 12.4 FC BGA Sales and Marketing
    • 12.4.1 FC BGA Sales Channels
  • 12.5 FC BGA Customers

13 Research Findings and Conclusion

14 Appendix

  • 14.1 Research Methodology
    • 14.1.1 Methodology/Research Approach
    • 14.1.2 Data Source
  • 14.2 Author Details
  • 14.3 Disclaimer
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