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시장보고서
상품코드
1531505
세계의 고정밀 다이본더 시장 : 분석 및 예측(2019-2030년)Global High Accuracy Die Bonder Market Report, History and Forecast 2019-2030 |
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QYResearch
세계의 고정밀 다이본더 시장 규모는 2023년에 2억 5,328만 달러에 달했습니다.
이 시장은 2024년부터 2030년까지 예측 기간에 5.28%의 연평균 복합 성장률(CAGR)로 확대될 전망이며, 2030년에는 3억 4,970만 달러에 달할 것으로 예측되고 있습니다.
북미의 고정밀 다이본더 시장 규모는 2023년 3,921만 달러에 달했습니다. 이 시장은 2024년부터 2030년까지 예측 기간에 3.63%의 연평균 복합 성장률(CAGR)로 확대될 전망이며, 2030년에는 4,933만 달러에 달할 것으로 예측되고 있습니다.
아시아태평양의 고정밀 다이본더 시장 규모는 2023년 1억 7,816만 달러에 달했습니다. 이 시장은 2024년부터 2030년까지 예측 기간에 5.62%의 연평균 복합 성장률(CAGR)로 확대될 전망이며, 2030년에는 2억 4,979만 달러에 달할 것으로 예측되고 있습니다.
유럽의 고정밀 다이본더 시장 규모는 2023년에 3,502만 달러에 달했습니다. 이 시장은 2024년부터 2030년까지 예측 기간 동안 3.54%의 연평균 복합 성장률(CAGR)로 확대될 전망이며, 2030년까지 4,401만 달러에 이를 것으로 예측됩니다.
본 보고서에서는 세계의 고정밀 다이본더 시장에 대해 조사했으며, 시장 개요와 함께 유형별, 용도별, 지역별 동향, 시장 진출기업 프로파일 등의 정보를 제공합니다.
목차
제1장 고정밀 다이본더 시장 개요
- 고정밀 다이본더 제품 개요
- 고정밀 다이본더 시장 : 유형별
- 세계의 고정밀 다이본더 시장 규모 : 유형별
제2장 고정밀 다이본더 시장에서의 경쟁
제3장 고정밀 다이본더의 현상 및 전망 : 지역별
- 세계의 고정밀 다이본더 시장 규모 및 CAGR : 지역별(2019년, 2023년, 2030년)
- 세계의 고정밀 다이본더 시장 규모 실적 : 지역별
- 세계의 고정밀 다이본더 시장 규모 예측 : 지역별
제4장 고정밀 다이본더 : 용도별
- 고정밀 다이본더 시장 : 용도별
- 세계의 고정밀 다이본더 시장 규모 : 용도별
제5장 북미의 고정밀 다이본더의 동향 : 국가별
제6장 유럽의 고정밀 다이본더의 동향 : 국가별
제7장 아시아태평양의 고정밀 다이본더의 동향 : 지역별
제8장 라틴아메리카의 고정밀 다이본더의 동향 : 국가별
제9장 중동 및 아프리카의 고정밀 다이본더의 동향 : 국가별
제10장 기업 프로파일
- ASMPT
- BE Semiconductor Industries
- Kulicke &Soffa
- SHIBAURA
- Hanmi Semiconductor
- MRSI
- HANWHA
- PALOMAR TECHNOLOGIES
- Finetech
- Pac Tech
제11장 업스트림, 기회, 과제, 위험 및 영향요인 분석
- 고정밀 다이본더의 주요 원재료
- 제조 비용 구조
- 고정밀 다이본더 산업 체인 분석
- 고정밀 다이본더 시장 역학
제12장 마케팅 전략 분석 및 유통업체
제13장 조사 결과 및 결론
제14장 부록
AJY 24.08.19The global market for High Accuracy Die Bonder was US$ 253.28 million in the year 2023, and is projected to reach a revised size of US$ 349.70 million by 2030, growing at a CAGR of 5.28 % during the forecast period 2024-2030.
North American market for High Accuracy Die Bonder was valued at $39.21 million in 2023 and will reach $49.33 million by 2030, at a CAGR of 3.63% during the forecast period of 2024 through 2030.
Asia-Pacific market for High Accuracy Die Bonder was valued at $ 178.16 million in 2023 and will reach $ 249.79 million by 2030, at a CAGR of 5.62% during the forecast period of 2024 through 2030.
Europe market for High Accuracy Die Bonder was valued at $ 35.02 million in 2023 and will reach $ 44.01 million by 2030, at a CAGR of 3.54% during the forecast period of 2024 through 2030.
Report Scope
This report aims to provide a comprehensive presentation of the global market for High Accuracy Die Bonder, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High Accuracy Die Bonder.
The High Accuracy Die Bonder market size, estimations, and forecasts are provided in terms of sales volume (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global High Accuracy Die Bonder market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global High Accuracy Die Bonder market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
Market Segmentation
This report covers the High Accuracy Die Bonder segments by manufacturers, by Type, by Application, by region and country, and provides market size (value, volume and average price) and CAGR for the history and forecast period (2019-2023, 2024-2030), considering 2023 as the base year. It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market.
By Company
- ASMPT(Amicra)
- BESI
- K&S
- Shibaura
- Hamni
- MRSI
- HANWHA
- PALOMAR TECHNOLOGIES
- Finetech
- Pac Tech
Segment by Type
- Die Bonder
- Flip Chip Bonder
Segment by Application
- Semiconductor Industry
- AOC Industry
By Region
- North America
- United States
- Mexico
- Canada
- Asia-Pacific
- China
- Japan
- South Korea
- China Taiwan
- Southeast Asia
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Latin America
- Brazil
- Argentina
- Middle East & Africa
- Middle East
- Africa
Chapter Outline
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, Latin America, Middle East & Africa.
Chapter Two: Detailed analysis of High Accuracy Die Bonder manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of High Accuracy Die Bonder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, Latin America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Table of Contents
1 High Accuracy Die Bonder Market Overview
- 1.1 High Accuracy Die Bonder Product Overview
- 1.2 High Accuracy Die Bonder Market by Type
- 1.2.1 Die Bonder
- 1.2.2 Flip Chip Bonder
- 1.3 Global High Accuracy Die Bonder Market Size by Type
- 1.3.1 Global High Accuracy Die Bonder Market Size Overview by Type (2019-2030)
- 1.3.2 Global High Accuracy Die Bonder Historic Market Size Review by Type (2019-2024)
- 1.3.3 Global High Accuracy Die Bonder Forecasted Market Size by Type (2025-2030)
2 High Accuracy Die Bonder Market Competition by Company
- 2.1 Global Top Players by High Accuracy Die Bonder Sales (2019-2024)
- 2.2 Global Top Players by High Accuracy Die Bonder Revenue (2019-2024)
- 2.3 Global Top Players by High Accuracy Die Bonder Price (2019-2024)
- 2.4 Global Top Manufacturers High Accuracy Die Bonder Manufacturing Base Distribution and Headquarters
- 2.5 High Accuracy Die Bonder Market Competitive Situation and Trends
- 2.5.1 High Accuracy Die Bonder Market Concentration Rate (2019-2024)
- 2.5.2 Global 5 and 10 Largest Manufacturers by High Accuracy Die Bonder Sales and Revenue in 2023
- 2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in High Accuracy Die Bonder as of 2023)
3 High Accuracy Die Bonder Status and Outlook by Region
- 3.1 Global High Accuracy Die Bonder Market Size and CAGR by Region: 2019 VS 2023 VS 2030
- 3.2 Global High Accuracy Die Bonder Historic Market Size by Region
- 3.2.1 Global High Accuracy Die Bonder Sales in Volume by Region (2019-2024)
- 3.2.2 Global High Accuracy Die Bonder Sales in Value by Region (2019-2024)
- 3.2.3 Global High Accuracy Die Bonder Sales (Volume & Value), Price and Gross Margin (2019-2024)
- 3.3 Global High Accuracy Die Bonder Forecasted Market Size by Region
- 3.3.1 Global High Accuracy Die Bonder Sales in Volume by Region (2025-2030)
- 3.3.2 Global High Accuracy Die Bonder Sales in Value by Region (2025-2030)
- 3.3.3 Global High Accuracy Die Bonder Sales (Volume & Value), Price and Gross Margin (2025-2030)
4 High Accuracy Die Bonder by Application
- 4.1 High Accuracy Die Bonder Market by Application
- 4.1.1 Semiconductor Industry
- 4.1.2 AOC Industry
- 4.2 Global High Accuracy Die Bonder Market Size by Application
- 4.2.1 Global High Accuracy Die Bonder Market Size Overview by Application (2019-2030)
- 4.2.2 Global High Accuracy Die Bonder Historic Market Size Review by Application (2019-2024)
- 4.2.3 Global High Accuracy Die Bonder Forecasted Market Size by Application (2025-2030)
5 North America High Accuracy Die Bonder by Country
- 5.1 North America High Accuracy Die Bonder Historic Market Size by Country
- 5.1.1 North America High Accuracy Die Bonder Market Size Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
- 5.1.2 North America High Accuracy Die Bonder Sales in Volume by Country (2019-2024)
- 5.1.3 North America High Accuracy Die Bonder Sales in Value by Country (2019-2024)
- 5.2 North America High Accuracy Die Bonder Forecasted Market Size by Country
- 5.2.1 North America High Accuracy Die Bonder Sales in Volume by Country (2025-2030)
- 5.2.2 North America High Accuracy Die Bonder Sales in Value by Country (2025-2030)
6 Europe High Accuracy Die Bonder by Country
- 6.1 Europe High Accuracy Die Bonder Historic Market Size by Country
- 6.1.1 Europe High Accuracy Die Bonder Market Size Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
- 6.1.2 Europe High Accuracy Die Bonder Sales in Volume by Country (2019-2024)
- 6.1.3 Europe High Accuracy Die Bonder Sales in Value by Country (2019-2024)
- 6.2 Europe High Accuracy Die Bonder Forecasted Market Size by Country
- 6.2.1 Europe High Accuracy Die Bonder Sales in Volume by Country (2025-2030)
- 6.2.2 Europe High Accuracy Die Bonder Sales in Value by Country (2025-2030)
7 Asia-Pacific High Accuracy Die Bonder by Region
- 7.1 Asia-Pacific High Accuracy Die Bonder Historic Market Size by Region
- 7.1.1 Asia-Pacific High Accuracy Die Bonder Market Size Growth Rate (CAGR) by Region: 2019 VS 2023 VS 2030
- 7.1.2 Asia-Pacific High Accuracy Die Bonder Sales in Volume by Region (2019-2024)
- 7.1.3 Asia-Pacific High Accuracy Die Bonder Sales in Value by Region (2019-2024)
- 7.2 Asia-Pacific High Accuracy Die Bonder Forecasted Market Size by Region
- 7.2.1 Asia-Pacific High Accuracy Die Bonder Sales in Volume by Region (2025-2030)
- 7.2.2 Asia-Pacific High Accuracy Die Bonder Sales in Value by Region (2025-2030)
8 Latin America High Accuracy Die Bonder by Country
- 8.1 Latin America High Accuracy Die Bonder Historic Market Size by Country
- 8.1.1 Latin America High Accuracy Die Bonder Market Size Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
- 8.1.2 Latin America High Accuracy Die Bonder Sales in Volume by Country (2019-2024)
- 8.1.3 Latin America High Accuracy Die Bonder Sales in Value by Country (2019-2024)
- 8.2 Latin America High Accuracy Die Bonder Forecasted Market Size by Country
- 8.2.1 Latin America High Accuracy Die Bonder Sales in Volume by Country (2025-2030)
- 8.2.2 Latin America High Accuracy Die Bonder Sales in Value by Country (2025-2030)
9 Middle East and Africa High Accuracy Die Bonder by Country
- 9.1 Middle East and Africa High Accuracy Die Bonder Historic Market Size by Country
- 9.1.1 Middle East and Africa High Accuracy Die Bonder Market Size Growth Rate (CAGR) by Country: 2019 VS 2023 VS 2030
- 9.1.2 Middle East and Africa High Accuracy Die Bonder Sales in Volume by Country (2019-2024)
- 9.1.3 Middle East and Africa High Accuracy Die Bonder Sales in Value by Country (2019-2024)
- 9.2 Middle East and Africa High Accuracy Die Bonder Forecasted Market Size by Country
- 9.2.1 Middle East and Africa High Accuracy Die Bonder Sales in Volume by Country (2025-2030)
- 9.2.2 Middle East and Africa High Accuracy Die Bonder Sales in Value by Country (2025-2030)
10 Company Profiles
- 10.1 ASMPT
- 10.1.1 ASMPT Company Information
- 10.1.2 ASMPT Introduction and Business Overview
- 10.1.3 ASMPT High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.1.4 ASMPT High Accuracy Die Bonder Products Offered
- 10.2 BE Semiconductor Industries
- 10.2.1 BE Semiconductor Industries Company Information
- 10.2.2 BE Semiconductor Industries Introduction and Business Overview
- 10.2.3 BE Semiconductor Industries High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.2.4 BE Semiconductor Industries High Accuracy Die Bonder Products Offered
- 10.3 Kulicke & Soffa
- 10.3.1 Kulicke & Soffa Company Information
- 10.3.2 Kulicke & Soffa Introduction and Business Overview
- 10.3.3 Kulicke & Soffa High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.3.4 Kulicke & Soffa High Accuracy Die Bonder Products Offered
- 10.4 SHIBAURA
- 10.4.1 SHIBAURA Company Information
- 10.4.2 SHIBAURA Introduction and Business Overview
- 10.4.3 SHIBAURA High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.4.4 SHIBAURA High Accuracy Die Bonder Products Offered
- 10.5 Hanmi Semiconductor
- 10.5.1 Hanmi Semiconductor Company Information
- 10.5.2 Hanmi Semiconductor Introduction and Business Overview
- 10.5.3 Hanmi Semiconductor High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.5.4 Hanmi Semiconductor High Accuracy Die Bonder Products Offered
- 10.6 MRSI
- 10.6.1 MRSI Company Information
- 10.6.2 MRSI Introduction and Business Overview
- 10.6.3 MRSI High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.6.4 MRSI High Accuracy Die Bonder Products Offered
- 10.7 HANWHA
- 10.7.1 HANWHA Company Information
- 10.7.2 HANWHA Introduction and Business Overview
- 10.7.3 HANWHA High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.7.4 HANWHA High Accuracy Die Bonder Products Offered
- 10.8 PALOMAR TECHNOLOGIES
- 10.8.1 PALOMAR TECHNOLOGIES Company Information
- 10.8.2 PALOMAR TECHNOLOGIES Introduction and Business Overview
- 10.8.3 PALOMAR TECHNOLOGIES High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.8.4 PALOMAR TECHNOLOGIES High Accuracy Die Bonder Products Offered
- 10.9 Finetech
- 10.9.1 Finetech Company Information
- 10.9.2 Finetech Introduction and Business Overview
- 10.9.3 Finetech High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.9.4 Finetech High Accuracy Die Bonder Products Offered
- 10.10 Pac Tech
- 10.10.1 Pac Tech Company Information
- 10.10.2 Pac Tech Introduction and Business Overview
- 10.10.3 Pac Tech High Accuracy Die Bonder Sales, Revenue and Gross Margin (2019-2024)
- 10.10.4 Pac Tech High Accuracy Die Bonder Products Offered
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
- 11.1 High Accuracy Die Bonder Key Raw Materials
- 11.1.1 Key Raw Materials
- 11.1.2 Raw Materials Key Suppliers
- 11.2 Manufacturing Cost Structure
- 11.2.1 Raw Materials
- 11.2.2 Labor Cost
- 11.2.3 Manufacturing Expenses
- 11.3 High Accuracy Die Bonder Industrial Chain Analysis
- 11.4 High Accuracy Die Bonder Market Dynamics
- 11.4.1 High Accuracy Die Bonder Industry Trends
- 11.4.2 High Accuracy Die Bonder Market Drivers
- 11.4.3 High Accuracy Die Bonder Market Challenges
12 Marketing Strategy Analysis, Distributors
- 12.1 Sales Channel
- 12.2 High Accuracy Die Bonder Distributors
- 12.3 High Accuracy Die Bonder Downstream Customers
13 Research Findings and Conclusion
14 Appendix
- 14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
- 14.1.2 Data Source
- 14.2 Author Details
- 14.3 Disclaimer
