시장보고서
상품코드
1857072

세계의 TCB 본더 : 시장 점유율 및 순위, 전체 판매량 및 수요 예측(2025-2031년)

TCB Bonder - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

발행일: | 리서치사: QYResearch | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

    
    
    




■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

세계의 TCB 본더 시장 규모는 2024년에 1억 1,900만 달러로 추정되며, 2031년에는 3억 1,700만 달러로 재조정되어 예측 기간인 2025-2031년 CAGR은 14.5%를 보일 것으로 예측됩니다.

열 압착, 이 기술에서는 다이와 패키지를 접착제로 접합하지 않습니다. 대신 '열 압착'이라는 공정으로 다이에 열과 힘을 가합니다. 범프는 반대편 패드에 강제로 압착되어 패키지의 금속화와 접촉하는 부분에 두 번째 금속 결합이 형성됩니다. 이 기술은 일반적으로 350°-400°C의 고열과 100g/범프에 달하는 힘을 필요로 합니다.

시장 규모는 지속적으로 확대되고 있으며, 아시아태평양이 성장을 주도하고 있습니다.

드라이버 5G 통신, 고성능 컴퓨팅(HPC), 자동차 전장 등의 분야에서 첨단 패키징(3D IC, 칩렛 등)에 대한 수요가 급증하면서 본딩 머신 수요 증가를 견인하고 있습니다.

기술 업그레이드: 자동화와 고정밀도가 주류가 되고 있습니다.

고정밀 정렬: 광학 정렬 시스템의 정확도가 +1μm까지 향상되어 첨단 패키징의 초소형 솔더 조인트에 대한 요구를 충족합니다.

저온 접합 기술: 열 응력에 의한 손상을 줄이고, 플렉서블 일렉트로닉스이나 MEMS와 같은 섬세한 디바이스에 적합합니다.

멀티 머티리얼 대응 금속, 세라믹, 폴리머 등 이종 재료의 접합에 대응하여 응용 분야를 확대.

시장 경쟁 구도: 고집적화, 국내 대체 가속화.

국산화율 상승: 정책적 지원과 국산 반도체 생산능력 확대(SMIC, Tongfu Microelectronics 수요 등)가 맞물려 국산 장비에서 수입 장비로의 대체가 진행되고 있습니다.

응용 분야 확대: 첨단 패키징과 새로운 수요.

반도체 패키징: 플립칩, 웨이퍼 레벨 패키징(WLP), 3D IC 집적화는 열 압착기에 대한 수요가 가장 높은 분야입니다.

MEMS와 센서: 밀폐형 패키징에 대한 요구가 자동차용 일렉트로닉스과 사물인터넷에 본딩 머신의 적용을 촉진하고 있습니다.

플렉서블 일렉트로닉스: 웨어러블 디바이스 및 플렉서블 스크린 제조에 있어 저온 본딩 기술에 대한 수요가 증가하고 있습니다.

파워 디바이스: 실리콘 카바이드(SiC) 및 질화갈륨(GaN) 디바이스의 패키징은 신뢰할 수 있는 본딩 공정에 의존하고 있습니다.

열압착기 산업은 "기술의 정교화, 시장의 지역화, 경쟁의 차별화"라는 특징을 보일 것입니다. 중국 반도체 산업 체인의 자율화가 가속화되는 가운데, 국산 장비는 틈새 분야(열압착, 플렉서블 전자 패키징 등)에서 추월을 달성할 것으로 기대되는 반면, 국제 무역 마찰과 공급망 변동에 따른 리스크에 대한 경계가 필요합니다.

세계 TCB 본더 시장에 대해 조사 분석했으며, 지역별-국가별, 유형별-용도별 분석과 함께 총 판매량, 매출, 가격, 주요 기업의 시장 점유율 및 순위를 중심으로 종합적인 시장 현황에 대해 조사 분석했습니다.

TCB 본더 시장 규모, 추정 및 예측은 2024년을 기준 연도로 하여 2020년부터 2031년까지의 과거 데이터와 예측 데이터를 판매량(단위) 및 매출액(백만 달러)으로 제공합니다. 정량적 및 정성적 분석을 통해 독자들이 비즈니스/성장 전략을 수립하고, 시장 경쟁 구도를 평가하고, 현재 시장에서의 위치를 분석하여 TCB 본더에 대한 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 돕습니다.

목차

제1장 시장 개요

  • TCB 본더 제품 서론
  • TCB 본더 세계 시장 규모 예측
  • TCB 본더 시장 동향과 촉진요인
  • 전제조건과 제약
  • 조사 목적
  • 인사이트 연수

제2장 기업별 경쟁 분석

  • 세계의 TCB 본더 기업 수익 순위(2024년)
  • 세계의 TCB 본더 기업별 매출(2020-2025년)
  • 세계의 TCB 본더 기업 판매 수량 순위(2024년)
  • 세계의 TCB 본더 기업별 판매 수량(2020-2025년)
  • 세계의 TCB 본더 기업별 평균 가격(2020-2025년)
  • 주요 제조업체의 TCB 본더 제조거점 및 본사
  • 주요 제조업체의 TCB 본더 제품 제공
  • 주요 제조업체의 TCB 본더 양산 개시시기
  • TCB 본더 시장 경쟁 분석
  • 인수합병(M&A) 및 확대

제3장 유형별 세분화

  • 유형별 서론
    • 자동 TCB 본더
    • 수동 TCB 본더
  • 세계의 TCB 본더 유형별 판매액
  • 세계의 TCB 본더 유형별 판매 수량
  • 세계의 TCB 본더 유형별 평균 가격(2020-2031년)

제4장 용도별 세분화

  • 용도별 서론
    • IDM
    • OSAT
  • 세계의 TCB 본더 용도별 판매액
  • 세계의 TCB 본더 용도별 판매 수량
  • 세계의 TCB 본더 용도별 평균 가격(2020-2031년)

제5장 지역별 세분화

  • 세계의 TCB 본더 지역별 판매액
  • 세계의 TCB 본더 지역별 판매 수량
  • 세계의 TCB 본더 지역별 평균 가격(2020-2031년)
  • 북미
  • 유럽
  • 아시아태평양
  • 남미
  • 중동 및 아프리카

제6장 주요 국가/지역별 세분화

  • 주요 국가/지역의 TCB 본더 판매액 성장 동향, 2020년 VS 2024년 VS 2031년
  • 주요 국가, 지역별 TCB 본더 판매액·판매 수량
  • 미국
  • 유럽
  • 중국
  • 일본
  • 한국
  • 동남아시아
  • 인도

제7장 기업 개요

  • ASMPT(Amicra)
  • K&S
  • BESI
  • Shibaura
  • Hamni
  • SET
  • HANWHA

제8장 산업 체인 분석

제9장 조사 결과와 결론

제10장 부록

LSH

The global market for TCB Bonder was estimated to be worth US$ 119 million in 2024 and is forecast to a readjusted size of US$ 317 million by 2031 with a CAGR of 14.5% during the forecast period 2025-2031.

Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.

The market size continues to expand, with the Asia-Pacific region leading the growth.

Drivers: The surge in demand for advanced packaging (such as 3D IC and Chiplet) in fields like 5G communication, high-performance computing (HPC), and automotive electronics is driving the growth in demand for bonding machines.

Technological Upgrades: Automation and high precision are becoming mainstream.

High-precision alignment: The accuracy of optical alignment systems has improved to +-1μm, meeting the requirements for tiny solder joints in advanced packaging.

Low-temperature bonding technology: Reduces thermal stress damage, suitable for sensitive devices like flexible electronics and MEMS.

Multi-material compatibility: Supports bonding of heterogeneous materials such as metals, ceramics, and polymers, expanding application scenarios.

Market Competition Landscape: High concentration, with accelerated domestic substitution.

Increased localization rate: Policy support combined with the expansion of local semiconductor production capacity (e.g., demand from SMIC and Tongfu Microelectronics) is driving the substitution of domestic equipment for imports.

Expansion of application areas: Advanced packaging and emerging demands.

Semiconductor packaging: Flip Chip, Wafer Level Packaging (WLP), and 3D IC integration have the highest demand for thermal compression bonding machines.

MEMS and sensors: The need for hermetic packaging is driving the application of bonding machines in automotive electronics and the Internet of Things.

Flexible electronics: The demand for low-temperature bonding technology is growing in the manufacturing of wearable devices and flexible screens.

Power devices: The packaging of silicon carbide (SiC) and gallium nitride (GaN) devices relies on high-reliability bonding processes.

The thermal compression bonding machine industry will exhibit characteristics of "technological refinement, market regionalization, and competitive differentiation." As the autonomy of China's semiconductor industry chain accelerates, domestic equipment is expected to achieve overtaking in niche areas (such as thermosonic bonding and flexible electronic packaging), while remaining vigilant about risks from international trade friction and supply chain fluctuations.

This report aims to provide a comprehensive presentation of the global market for TCB Bonder, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of TCB Bonder by region & country, by Type, and by Application.

The TCB Bonder market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding TCB Bonder.

Market Segmentation

By Company

  • ASMPT (Amicra)
  • K&S
  • BESI
  • Shibaura
  • Hamni
  • SET
  • HANWHA

Segment by Type

  • Automatic TCB Bonder
  • Manual TCB Bonder

Segment by Application

  • IDMs
  • OSAT

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of TCB Bonder manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of TCB Bonder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of TCB Bonder in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 TCB Bonder Product Introduction
  • 1.2 Global TCB Bonder Market Size Forecast
    • 1.2.1 Global TCB Bonder Sales Value (2020-2031)
    • 1.2.2 Global TCB Bonder Sales Volume (2020-2031)
    • 1.2.3 Global TCB Bonder Sales Price (2020-2031)
  • 1.3 TCB Bonder Market Trends & Drivers
    • 1.3.1 TCB Bonder Industry Trends
    • 1.3.2 TCB Bonder Market Drivers & Opportunity
    • 1.3.3 TCB Bonder Market Challenges
    • 1.3.4 TCB Bonder Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global TCB Bonder Players Revenue Ranking (2024)
  • 2.2 Global TCB Bonder Revenue by Company (2020-2025)
  • 2.3 Global TCB Bonder Players Sales Volume Ranking (2024)
  • 2.4 Global TCB Bonder Sales Volume by Company Players (2020-2025)
  • 2.5 Global TCB Bonder Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers TCB Bonder Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers TCB Bonder Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of TCB Bonder
  • 2.9 TCB Bonder Market Competitive Analysis
    • 2.9.1 TCB Bonder Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by TCB Bonder Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in TCB Bonder as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 Automatic TCB Bonder
    • 3.1.2 Manual TCB Bonder
  • 3.2 Global TCB Bonder Sales Value by Type
    • 3.2.1 Global TCB Bonder Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global TCB Bonder Sales Value, by Type (2020-2031)
    • 3.2.3 Global TCB Bonder Sales Value, by Type (%) (2020-2031)
  • 3.3 Global TCB Bonder Sales Volume by Type
    • 3.3.1 Global TCB Bonder Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global TCB Bonder Sales Volume, by Type (2020-2031)
    • 3.3.3 Global TCB Bonder Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global TCB Bonder Average Price by Type (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 IDMs
    • 4.1.2 OSAT
  • 4.2 Global TCB Bonder Sales Value by Application
    • 4.2.1 Global TCB Bonder Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global TCB Bonder Sales Value, by Application (2020-2031)
    • 4.2.3 Global TCB Bonder Sales Value, by Application (%) (2020-2031)
  • 4.3 Global TCB Bonder Sales Volume by Application
    • 4.3.1 Global TCB Bonder Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global TCB Bonder Sales Volume, by Application (2020-2031)
    • 4.3.3 Global TCB Bonder Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global TCB Bonder Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global TCB Bonder Sales Value by Region
    • 5.1.1 Global TCB Bonder Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global TCB Bonder Sales Value by Region (2020-2025)
    • 5.1.3 Global TCB Bonder Sales Value by Region (2026-2031)
    • 5.1.4 Global TCB Bonder Sales Value by Region (%), (2020-2031)
  • 5.2 Global TCB Bonder Sales Volume by Region
    • 5.2.1 Global TCB Bonder Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global TCB Bonder Sales Volume by Region (2020-2025)
    • 5.2.3 Global TCB Bonder Sales Volume by Region (2026-2031)
    • 5.2.4 Global TCB Bonder Sales Volume by Region (%), (2020-2031)
  • 5.3 Global TCB Bonder Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America TCB Bonder Sales Value, 2020-2031
    • 5.4.2 North America TCB Bonder Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe TCB Bonder Sales Value, 2020-2031
    • 5.5.2 Europe TCB Bonder Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific TCB Bonder Sales Value, 2020-2031
    • 5.6.2 Asia Pacific TCB Bonder Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America TCB Bonder Sales Value, 2020-2031
    • 5.7.2 South America TCB Bonder Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa TCB Bonder Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa TCB Bonder Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions TCB Bonder Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions TCB Bonder Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions TCB Bonder Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions TCB Bonder Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States TCB Bonder Sales Value, 2020-2031
    • 6.3.2 United States TCB Bonder Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States TCB Bonder Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe TCB Bonder Sales Value, 2020-2031
    • 6.4.2 Europe TCB Bonder Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe TCB Bonder Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China TCB Bonder Sales Value, 2020-2031
    • 6.5.2 China TCB Bonder Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China TCB Bonder Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan TCB Bonder Sales Value, 2020-2031
    • 6.6.2 Japan TCB Bonder Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan TCB Bonder Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea TCB Bonder Sales Value, 2020-2031
    • 6.7.2 South Korea TCB Bonder Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea TCB Bonder Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia TCB Bonder Sales Value, 2020-2031
    • 6.8.2 Southeast Asia TCB Bonder Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia TCB Bonder Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India TCB Bonder Sales Value, 2020-2031
    • 6.9.2 India TCB Bonder Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India TCB Bonder Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 ASMPT (Amicra)
    • 7.1.1 ASMPT (Amicra) Company Information
    • 7.1.2 ASMPT (Amicra) Introduction and Business Overview
    • 7.1.3 ASMPT (Amicra) TCB Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 ASMPT (Amicra) TCB Bonder Product Offerings
    • 7.1.5 ASMPT (Amicra) Recent Development
  • 7.2 K&S
    • 7.2.1 K&S Company Information
    • 7.2.2 K&S Introduction and Business Overview
    • 7.2.3 K&S TCB Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 K&S TCB Bonder Product Offerings
    • 7.2.5 K&S Recent Development
  • 7.3 BESI
    • 7.3.1 BESI Company Information
    • 7.3.2 BESI Introduction and Business Overview
    • 7.3.3 BESI TCB Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 BESI TCB Bonder Product Offerings
    • 7.3.5 BESI Recent Development
  • 7.4 Shibaura
    • 7.4.1 Shibaura Company Information
    • 7.4.2 Shibaura Introduction and Business Overview
    • 7.4.3 Shibaura TCB Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.4.4 Shibaura TCB Bonder Product Offerings
    • 7.4.5 Shibaura Recent Development
  • 7.5 Hamni
    • 7.5.1 Hamni Company Information
    • 7.5.2 Hamni Introduction and Business Overview
    • 7.5.3 Hamni TCB Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.5.4 Hamni TCB Bonder Product Offerings
    • 7.5.5 Hamni Recent Development
  • 7.6 SET
    • 7.6.1 SET Company Information
    • 7.6.2 SET Introduction and Business Overview
    • 7.6.3 SET TCB Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.6.4 SET TCB Bonder Product Offerings
    • 7.6.5 SET Recent Development
  • 7.7 HANWHA
    • 7.7.1 HANWHA Company Information
    • 7.7.2 HANWHA Introduction and Business Overview
    • 7.7.3 HANWHA TCB Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.7.4 HANWHA TCB Bonder Product Offerings
    • 7.7.5 HANWHA Recent Development

8 Industry Chain Analysis

  • 8.1 TCB Bonder Industrial Chain
  • 8.2 TCB Bonder Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 TCB Bonder Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 TCB Bonder Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer
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