세계의 하이브리드 본딩 기술 시장 : 2024년

The global Hybrid Bonding Technology market size in terms of revenue is projected to reach 618.42 million USD by 2030 from 123.49 million USD in 2023, with a CAGR 24.70% during 2024-2030.

North America market for Hybrid Bonding Technology is estimated to increase from 25.86 million USD in 2023 to reach 116.45 million USD by 2030, at a CAGR of 21.13% during the forecast period of 2024 through 2030.

Europe market for Hybrid Bonding Technology is estimated to increase from 13.20 million USD in 2023 to reach 62.23 million USD by 2030, at a CAGR of 23.43% during the forecast period of 2024 through 2030.

Asia-Pacific market for Hybrid Bonding Technology is estimated to increase from 81.40 million USD in 2023 to reach 424.72 million USD by 2030, at a CAGR of 26.05% during the forecast period of 2024 through 2030.

The major global manufacturers of Hybrid Bonding Technology include EV Group (EVG), Applied Materials, Adeia, SUSS MicroTec, Intel, Huawei, etc. In 2023, the world's top five vendors accounted for approximately 74.57% of the revenue.

This report aims to provide a comprehensive presentation of the global market for Hybrid Bonding Technology, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Hybrid Bonding Technology.

The Hybrid Bonding Technology market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Hybrid Bonding Technology market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Hybrid Bonding Technology companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

• EV Group (EVG)
• Applied Materials
• Adeia
• SUSS MicroTec
• Intel
• Huawei

Segment by Type

• Wafer-to-wafer Hybrid Bonding
• Die-to-wafer Hybrid Bonding

Segment by Application

• CMOS Image Sensor (CIS)
• NAND
• DRAM
• High Bandwidth Memory (HBM)
• Others

By Region

• North America
• United States
• Canada
• Asia-Pacific
• China
• Japan
• South Korea
• Taiwan
• Southeast Asia
• India
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Rest of Europe
• Latin America
• Mexico
• Brazil
• Rest of Latin America
• Middle East & Africa
• Israel

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.

Chapter 3: Detailed analysis of Hybrid Bonding Technology company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.

Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 12: The main points and conclusions of the report.

Table of Contents

1 Report Overview

• 1.1 Study Scope
• 1.2 Market Analysis by Type
  • 1.2.1 Global Hybrid Bonding Technology Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
  • 1.2.2 Wafer-to-wafer Hybrid Bonding
  • 1.2.3 Die-to-wafer Hybrid Bonding
• 1.3 Market by Application
  • 1.3.1 Global Hybrid Bonding Technology Market Growth by Application: 2019 VS 2023 VS 2030
  • 1.3.2 CMOS Image Sensor (CIS)
  • 1.3.3 NAND
  • 1.3.4 DRAM
  • 1.3.5 High Bandwidth Memory (HBM)
  • 1.3.6 Others
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Global Growth Trends

• 2.1 Global Hybrid Bonding Technology Market Perspective (2019-2030)
• 2.2 Global Hybrid Bonding Technology Growth Trends by Region
  • 2.2.1 Global Hybrid Bonding Technology Market Size by Region: 2019 VS 2023 VS 2030
  • 2.2.2 Hybrid Bonding Technology Historic Market Size by Region (2019-2024)
  • 2.2.3 Hybrid Bonding Technology Forecasted Market Size by Region (2025-2030)
• 2.3 Hybrid Bonding Technology Market Dynamics
  • 2.3.1 Hybrid Bonding Technology Industry Trends
  • 2.3.2 Hybrid Bonding Technology Market Drivers
  • 2.3.3 Hybrid Bonding Technology Market Challenges
  • 2.3.4 Hybrid Bonding Technology Market Restraints

3 Competition Landscape by Key Players

• 3.1 Global Top Hybrid Bonding Technology Players by Revenue
  • 3.1.1 Global Top Hybrid Bonding Technology Players by Revenue (2019-2024)
  • 3.1.2 Global Hybrid Bonding Technology Revenue Market Share by Players (2019-2024)
• 3.2 Global Hybrid Bonding Technology Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
• 3.3 Global Key Players Ranking by Hybrid Bonding Technology Revenue
• 3.4 Global Hybrid Bonding Technology Market Concentration Ratio
  • 3.4.1 Global Hybrid Bonding Technology Market Concentration Ratio (CR5 and HHI)
  • 3.4.2 Global Top 5 Companies by Hybrid Bonding Technology Revenue in 2023
• 3.5 Global Key Players of Hybrid Bonding Technology Head office and Area Served
• 3.6 Global Key Players of Hybrid Bonding Technology, Product and Application
• 3.7 Global Key Players of Hybrid Bonding Technology, Date of Enter into This Industry
• 3.8 Hybrid Bonding Market Mergers & Acquisitions, Expansion Plans

4 Hybrid Bonding Technology Breakdown Data by Type

• 4.1 Global Hybrid Bonding Technology Historic Market Size by Type (2019-2024)
• 4.2 Global Hybrid Bonding Technology Forecasted Market Size by Type (2025-2030)

5 Hybrid Bonding Technology Breakdown Data by Application

• 5.1 Global Hybrid Bonding Technology Historic Market Size by Application (2019-2024)
• 5.2 Global Hybrid Bonding Technology Forecasted Market Size by Application (2025-2030)

6 North America

• 6.1 North America Hybrid Bonding Technology Market Size (2019-2030)
• 6.2 North America Hybrid Bonding Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
• 6.3 North America Hybrid Bonding Technology Market Size by Country (2019-2024)
• 6.4 North America Hybrid Bonding Technology Market Size by Country (2025-2030)
• 6.5 United States
• 6.6 Canada

7 Europe

• 7.1 Europe Hybrid Bonding Technology Market Size (2019-2030)
• 7.2 Europe Hybrid Bonding Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
• 7.3 Europe Hybrid Bonding Technology Market Size by Country (2019-2024)
• 7.4 Europe Hybrid Bonding Technology Market Size by Country (2025-2030)
• 7.5 Germany
• 7.6 France
• 7.7 U.K.
• 7.8 Italy
• 7.9 Russia

8 Asia-Pacific

• 8.1 Asia-Pacific Hybrid Bonding Technology Market Size (2019-2030)
• 8.2 Asia-Pacific Hybrid Bonding Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
• 8.3 Asia-Pacific Hybrid Bonding Technology Market Size by Region (2019-2024)
• 8.4 Asia-Pacific Hybrid Bonding Technology Market Size by Region (2025-2030)
• 8.5 China
• 8.6 Japan
• 8.7 South Korea
• 8.8 Taiwan
• 8.9 Southeast Asia
• 8.10 India

9 Latin America

• 9.1 Latin America Hybrid Bonding Technology Market Size (2019-2030)
• 9.2 Latin America Hybrid Bonding Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
• 9.3 Latin America Hybrid Bonding Technology Market Size by Country (2019-2024)
• 9.4 Latin America Hybrid Bonding Technology Market Size by Country (2025-2030)
• 9.5 Mexico
• 9.6 Brazil

10 Middle East & Africa

• 10.1 Middle East & Africa Hybrid Bonding Technology Market Size (2019-2030)
• 10.2 Middle East & Africa Hybrid Bonding Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
• 10.3 Middle East & Africa Hybrid Bonding Technology Market Size by Country (2019-2024)
• 10.4 Middle East & Africa Hybrid Bonding Technology Market Size by Country (2025-2030)
• 10.5 Israel

11 Key Players Profiles

• 11.1 EV Group (EVG)
  • 11.1.1 EV Group (EVG) Company Details
  • 11.1.2 EV Group (EVG) Business Overview
  • 11.1.3 EV Group (EVG) Hybrid Bonding Technology Introduction
  • 11.1.4 EV Group (EVG) Revenue in Hybrid Bonding Technology Business (2019-2024)
  • 11.1.5 EV Group (EVG) Recent Development
• 11.2 Applied Materials
  • 11.2.1 Applied Materials Company Details
  • 11.2.2 Applied Materials Business Overview
  • 11.2.3 Applied Materials Hybrid Bonding Technology Introduction
  • 11.2.4 Applied Materials Revenue in Hybrid Bonding Technology Business (2019-2024)
  • 11.2.5 Applied Materials Recent Development
• 11.3 Adeia
  • 11.3.1 Adeia Company Details
  • 11.3.2 Adeia Business Overview
  • 11.3.3 Adeia Hybrid Bonding Technology Introduction
  • 11.3.4 Adeia Revenue in Hybrid Bonding Technology Business (2019-2024)
  • 11.3.5 Adeia Recent Development
• 11.4 SUSS MicroTec
  • 11.4.1 SUSS MicroTec Company Details
  • 11.4.2 SUSS MicroTec Business Overview
  • 11.4.3 SUSS MicroTec Hybrid Bonding Technology Introduction
  • 11.4.4 SUSS MicroTec Revenue in Hybrid Bonding Technology Business (2019-2024)
  • 11.4.5 SUSS MicroTec Recent Development
• 11.5 Intel
  • 11.5.1 Intel Company Details
  • 11.5.2 Intel Business Overview
  • 11.5.3 Intel Hybrid Bonding Technology Introduction
  • 11.5.4 Intel Revenue in Hybrid Bonding Technology Business (2019-2024)
  • 11.5.5 Intel Recent Development
• 11.6 Huawei
  • 11.6.1 Huawei Company Details
  • 11.6.2 Huawei Business Overview
  • 11.6.3 Huawei Hybrid Bonding Technology Introduction
  • 11.6.4 Huawei Revenue in Hybrid Bonding Technology Business (2019-2024)
  • 11.6.5 Huawei Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

• 13.1 Research Methodology
  • 13.1.1 Methodology/Research Approach
  • 13.1.2 Data Source
• 13.2 Author Details
• 13.3 Disclaimer