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시장보고서
상품코드
1862203
세계의 첨단 패키징 검사 시스템 시장 : 점유율, 랭킹, 총 매출액, 수요 예측(2025-2031년)Advanced Packaging Inspection Systems - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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QYResearch
첨단 패키징 검사 시스템 세계 시장 규모는 2024년에 5억 1,800만 달러로 평가되었고, 2025년부터 2031년 예측 기간 동안 CAGR 9.5%로 성장하고 2031년까지 9억 7,000만 달러로 확대될 것으로 예측되고 있습니다.
이 보고서는 첨단 패키징 검사 시스템에 대한 최근의 관세 조정과 국제 전략적 대책에 대한 국경을 넘나드는 산업 활동, 탄소 프린트, 자본 배분 패턴, 지역 경제 상호 의존성, 공급망 재구성 등의 관점에서 종합적인 평가를 제공합니다.
첨단 패키징 검사 시스템은 반도체 제조 공정에서 첨단 패키징 기술의 품질, 신뢰성 및 성능을 검사하고 보증하는 데 사용되는 전문 장치 솔루션입니다. 반도체 디바이스가 보다 소형화, 고성능화, 복잡화됨에 따라, 종래의 검사 방법으로는 불충분해지고 있습니다. 따라서 매우 미세한 규모의 결함, 정렬 및 재료 무결성을 검증하기 위해 첨단 패키징 검사 시스템은 매우 중요합니다.
2024년 세계 첨단 패키징 검사 시스템의 판매량은 약 505대에 이르렀으며, 평균 세계 시장 가격은 1대당 약 102만 6천 달러였습니다.
스마트폰, 웨어러블 기기, 데이터센터, IoT 디바이스의 소형화, 고속화, 에너지 절약화에 대한 지속적인 추구가 주요 촉진요인이 되고 있습니다. 기존의 2차원 스케일링은 물리적 한계에 가까워지고 있으며, 팬아웃 웨이퍼 레벨 패키징(FOWLP), 시스템 인 패키지(SiP), 2.5D/3D 통합 등 첨단 패키징 기법이 필수적입니다. 이러한 기술은 미세 스케일 결함을 검출하기 위해 정밀한 검사가 필요하며 고급 검사 시스템이 필수적입니다.
5G 연결, 인공지능(AI), 자율주행차 등 신규 기술은 초고속, 저지연, 절전 칩을 요구합니다. 이러한 용도는 마이크로 범프, TSV, RDL과 함께 첨단 패키징에 크게 의존하고 있으며 수율과 신뢰성을 유지하기 위해 첨단 검사가 필요합니다. 이러한 시장이 확대됨에 따라 미세화와 고집적화를 추종할 수 있는 검사장치에 대한 수요가 높아지고 있습니다.
반도체 제조는 자본 집약적이며, 웨이퍼 제조 및 패키징에는 매우 높은 비용이 듭니다. 약간의 결함으로도 큰 경제적 손실로 이어질 수 있습니다. 첨단 패키징 검사 시스템은 제조업체가 수율을 개선하고, 재작업을 줄이고, 제조 후 공정에서 고비용 고장을 방지하는 데 도움이 됩니다. 이 비용 관리 이점을 통해 검사 솔루션은 반도체 팹 및 외부 위탁 반도체 조립 및 테스트(OSAT) 제공업체에게 중요한 투자가 되었습니다.
본 보고서는 첨단 패키징 검사 시스템 세계 시장에 대한 총 판매 수량, 매출액, 가격, 주요 기업의 시장 점유율 및 순위에 초점을 맞추어 지역별, 국가별, 전력별, 용도별 분석을 종합적으로 제시하는 것을 목적으로 하고 있습니다.
본 보고서에서는 2024년을 기준연도로 하고, 2020년부터 2031년까지의 과거 데이터 및 예측 데이터에 근거해, 판매 수량(대수) 및 매출액(백만 달러)의 관점에서 첨단 패키징 검사 시스템 시장 규모, 추정 및 예측을 제공합니다. 정량적, 정성적 분석의 양면에서 독자 여러분이 비즈니스/성장 전략의 수립, 시장 경쟁 평가, 현재의 마켓플레이스에 있어서의 자사의 위치의 분석, 첨단 패키징 검사 시스템에 관한 정보에 근거한 비즈니스 판단을 실시하는 것을 지원합니다.
시장 세분화
기업별
- Camtek
- Onto Innovation
- KLA
- Intekplus
- Cohu
- Semiconductor Technologies & Instruments(STI)
전력별 부문
- 광학 패키지 검사 시스템
- 적외선 패키지 검사 시스템
용도별 부문
- IDM
- OSAT
지역별
- 북미
- 미국
- 캐나다
- 아시아태평양
- 중국
- 일본
- 한국
- 동남아시아
- 인도
- 호주
- 기타 아시아태평양
- 유럽
- 독일
- 프랑스
- 영국
- 이탈리아
- 네덜란드
- 북유럽 국가
- 기타 유럽
- 라틴아메리카
- 멕시코
- 브라질
- 기타 라틴아메리카
- 중동 및 아프리카
- 튀르키예
- 사우디아라비아
- 아랍에미리트(UAE)
- 기타 중동 및 아프리카
자주 묻는 질문
The global market for Advanced Packaging Inspection Systems was estimated to be worth US$ 518 million in 2024 and is forecast to a readjusted size of US$ 970 million by 2031 with a CAGR of 9.5% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Advanced Packaging Inspection Systems cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
An Advanced Packaging Inspection System is a specialized equipment solution used in the semiconductor manufacturing process to inspect and ensure the quality, reliability, and performance of advanced packaging technologies. As semiconductor devices have become smaller, more powerful, and more complex, traditional inspection methods are no longer sufficient. Advanced packaging inspection systems are therefore critical in verifying defects, alignment, and material integrity at very fine scales.
In 2024, global Advanced Packaging Inspection System sales volume reached approximately 505 units, with an average global market price of around 1,026 K US$ per unit.
The continuous push for smaller, faster, and more energy-efficient electronics in smartphones, wearables, data centers, and IoT devices is a major driver. Traditional 2D scaling is approaching physical limits, making advanced packaging methods such as Fan-Out Wafer-Level Packaging (FOWLP), System-in-Package (SiP), and 2.5D/3D integration essential. These techniques require precise inspection to detect micro-scale defects, making advanced inspection systems indispensable.
Emerging technologies such as 5G connectivity, artificial intelligence (AI), and autonomous vehicles demand ultra-high-speed, low-latency, and power-efficient chips. These applications rely heavily on advanced packaging with micro-bumps, TSVs, and RDLs, all of which need sophisticated inspection to maintain yield and reliability. As these markets expand, they fuel the demand for inspection equipment that can keep pace with shrinking feature sizes and higher integration density.
Semiconductor manufacturing is capital intensive, with extremely high costs for wafer fabrication and packaging. Even minor defects can lead to significant financial losses. Advanced Packaging Inspection Systems help manufacturers improve yield, reduce rework, and prevent costly failures in later stages of production. This cost-control advantage makes inspection solutions a critical investment for semiconductor fabs and outsourced semiconductor assembly and test (OSAT) providers.
This report aims to provide a comprehensive presentation of the global market for Advanced Packaging Inspection Systems, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Advanced Packaging Inspection Systems by region & country, by Power, and by Application.
The Advanced Packaging Inspection Systems market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Advanced Packaging Inspection Systems.
Market Segmentation
By Company
- Camtek
- Onto Innovation
- KLA
- Intekplus
- Cohu
- Semiconductor Technologies & Instruments (STI)
Segment by Power
- Optical Based Packaging Inspection Systems
- Infrared Packaging Inspection Systems
Segment by Application
- IDM
- OSAT
By Region
- North America
- United States
- Canada
- Asia-Pacific
- China
- Japan
- South Korea
- Southeast Asia
- India
- Australia
- Rest of Asia-Pacific
- Europe
- Germany
- France
- U.K.
- Italy
- Netherlands
- Nordic Countries
- Rest of Europe
- Latin America
- Mexico
- Brazil
- Rest of Latin America
- Middle East & Africa
- Turkey
- Saudi Arabia
- UAE
- Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Advanced Packaging Inspection Systems manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Power, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Advanced Packaging Inspection Systems in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Advanced Packaging Inspection Systems in country level. It provides sigmate data by Power, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Table of Contents
1 Market Overview
- 1.1 Advanced Packaging Inspection Systems Product Introduction
- 1.2 Global Advanced Packaging Inspection Systems Market Size Forecast
- 1.2.1 Global Advanced Packaging Inspection Systems Sales Value (2020-2031)
- 1.2.2 Global Advanced Packaging Inspection Systems Sales Volume (2020-2031)
- 1.2.3 Global Advanced Packaging Inspection Systems Sales Price (2020-2031)
- 1.3 Advanced Packaging Inspection Systems Market Trends & Drivers
- 1.3.1 Advanced Packaging Inspection Systems Industry Trends
- 1.3.2 Advanced Packaging Inspection Systems Market Drivers & Opportunity
- 1.3.3 Advanced Packaging Inspection Systems Market Challenges
- 1.3.4 Advanced Packaging Inspection Systems Market Restraints
- 1.4 Assumptions and Limitations
- 1.5 Study Objectives
- 1.6 Years Considered
2 Competitive Analysis by Company
- 2.1 Global Advanced Packaging Inspection Systems Players Revenue Ranking (2024)
- 2.2 Global Advanced Packaging Inspection Systems Revenue by Company (2020-2025)
- 2.3 Global Advanced Packaging Inspection Systems Players Sales Volume Ranking (2024)
- 2.4 Global Advanced Packaging Inspection Systems Sales Volume by Company Players (2020-2025)
- 2.5 Global Advanced Packaging Inspection Systems Average Price by Company (2020-2025)
- 2.6 Key Manufacturers Advanced Packaging Inspection Systems Manufacturing Base and Headquarters
- 2.7 Key Manufacturers Advanced Packaging Inspection Systems Product Offered
- 2.8 Key Manufacturers Time to Begin Mass Production of Advanced Packaging Inspection Systems
- 2.9 Advanced Packaging Inspection Systems Market Competitive Analysis
- 2.9.1 Advanced Packaging Inspection Systems Market Concentration Rate (2020-2025)
- 2.9.2 Global 5 and 10 Largest Manufacturers by Advanced Packaging Inspection Systems Revenue in 2024
- 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Advanced Packaging Inspection Systems as of 2024)
- 2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Power
- 3.1 Introduction by Power
- 3.1.1 Optical Based Packaging Inspection Systems
- 3.1.2 Infrared Packaging Inspection Systems
- 3.2 Global Advanced Packaging Inspection Systems Sales Value by Power
- 3.2.1 Global Advanced Packaging Inspection Systems Sales Value by Power (2020 VS 2024 VS 2031)
- 3.2.2 Global Advanced Packaging Inspection Systems Sales Value, by Power (2020-2031)
- 3.2.3 Global Advanced Packaging Inspection Systems Sales Value, by Power (%) (2020-2031)
- 3.3 Global Advanced Packaging Inspection Systems Sales Volume by Power
- 3.3.1 Global Advanced Packaging Inspection Systems Sales Volume by Power (2020 VS 2024 VS 2031)
- 3.3.2 Global Advanced Packaging Inspection Systems Sales Volume, by Power (2020-2031)
- 3.3.3 Global Advanced Packaging Inspection Systems Sales Volume, by Power (%) (2020-2031)
- 3.4 Global Advanced Packaging Inspection Systems Average Price by Power (2020-2031)
4 Segmentation by Application
- 4.1 Introduction by Application
- 4.1.1 IDM
- 4.1.2 OSAT
- 4.2 Global Advanced Packaging Inspection Systems Sales Value by Application
- 4.2.1 Global Advanced Packaging Inspection Systems Sales Value by Application (2020 VS 2024 VS 2031)
- 4.2.2 Global Advanced Packaging Inspection Systems Sales Value, by Application (2020-2031)
- 4.2.3 Global Advanced Packaging Inspection Systems Sales Value, by Application (%) (2020-2031)
- 4.3 Global Advanced Packaging Inspection Systems Sales Volume by Application
- 4.3.1 Global Advanced Packaging Inspection Systems Sales Volume by Application (2020 VS 2024 VS 2031)
- 4.3.2 Global Advanced Packaging Inspection Systems Sales Volume, by Application (2020-2031)
- 4.3.3 Global Advanced Packaging Inspection Systems Sales Volume, by Application (%) (2020-2031)
- 4.4 Global Advanced Packaging Inspection Systems Average Price by Application (2020-2031)
5 Segmentation by Region
- 5.1 Global Advanced Packaging Inspection Systems Sales Value by Region
- 5.1.1 Global Advanced Packaging Inspection Systems Sales Value by Region: 2020 VS 2024 VS 2031
- 5.1.2 Global Advanced Packaging Inspection Systems Sales Value by Region (2020-2025)
- 5.1.3 Global Advanced Packaging Inspection Systems Sales Value by Region (2026-2031)
- 5.1.4 Global Advanced Packaging Inspection Systems Sales Value by Region (%), (2020-2031)
- 5.2 Global Advanced Packaging Inspection Systems Sales Volume by Region
- 5.2.1 Global Advanced Packaging Inspection Systems Sales Volume by Region: 2020 VS 2024 VS 2031
- 5.2.2 Global Advanced Packaging Inspection Systems Sales Volume by Region (2020-2025)
- 5.2.3 Global Advanced Packaging Inspection Systems Sales Volume by Region (2026-2031)
- 5.2.4 Global Advanced Packaging Inspection Systems Sales Volume by Region (%), (2020-2031)
- 5.3 Global Advanced Packaging Inspection Systems Average Price by Region (2020-2031)
- 5.4 North America
- 5.4.1 North America Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 5.4.2 North America Advanced Packaging Inspection Systems Sales Value by Country (%), 2024 VS 2031
- 5.5 Europe
- 5.5.1 Europe Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 5.5.2 Europe Advanced Packaging Inspection Systems Sales Value by Country (%), 2024 VS 2031
- 5.6 Asia Pacific
- 5.6.1 Asia Pacific Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 5.6.2 Asia Pacific Advanced Packaging Inspection Systems Sales Value by Region (%), 2024 VS 2031
- 5.7 South America
- 5.7.1 South America Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 5.7.2 South America Advanced Packaging Inspection Systems Sales Value by Country (%), 2024 VS 2031
- 5.8 Middle East & Africa
- 5.8.1 Middle East & Africa Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 5.8.2 Middle East & Africa Advanced Packaging Inspection Systems Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
- 6.1 Key Countries/Regions Advanced Packaging Inspection Systems Sales Value Growth Trends, 2020 VS 2024 VS 2031
- 6.2 Key Countries/Regions Advanced Packaging Inspection Systems Sales Value and Sales Volume
- 6.2.1 Key Countries/Regions Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 6.2.2 Key Countries/Regions Advanced Packaging Inspection Systems Sales Volume, 2020-2031
- 6.3 United States
- 6.3.1 United States Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 6.3.2 United States Advanced Packaging Inspection Systems Sales Value by Power (%), 2024 VS 2031
- 6.3.3 United States Advanced Packaging Inspection Systems Sales Value by Application, 2024 VS 2031
- 6.4 Europe
- 6.4.1 Europe Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 6.4.2 Europe Advanced Packaging Inspection Systems Sales Value by Power (%), 2024 VS 2031
- 6.4.3 Europe Advanced Packaging Inspection Systems Sales Value by Application, 2024 VS 2031
- 6.5 China
- 6.5.1 China Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 6.5.2 China Advanced Packaging Inspection Systems Sales Value by Power (%), 2024 VS 2031
- 6.5.3 China Advanced Packaging Inspection Systems Sales Value by Application, 2024 VS 2031
- 6.6 Japan
- 6.6.1 Japan Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 6.6.2 Japan Advanced Packaging Inspection Systems Sales Value by Power (%), 2024 VS 2031
- 6.6.3 Japan Advanced Packaging Inspection Systems Sales Value by Application, 2024 VS 2031
- 6.7 South Korea
- 6.7.1 South Korea Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 6.7.2 South Korea Advanced Packaging Inspection Systems Sales Value by Power (%), 2024 VS 2031
- 6.7.3 South Korea Advanced Packaging Inspection Systems Sales Value by Application, 2024 VS 2031
- 6.8 Southeast Asia
- 6.8.1 Southeast Asia Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 6.8.2 Southeast Asia Advanced Packaging Inspection Systems Sales Value by Power (%), 2024 VS 2031
- 6.8.3 Southeast Asia Advanced Packaging Inspection Systems Sales Value by Application, 2024 VS 2031
- 6.9 India
- 6.9.1 India Advanced Packaging Inspection Systems Sales Value, 2020-2031
- 6.9.2 India Advanced Packaging Inspection Systems Sales Value by Power (%), 2024 VS 2031
- 6.9.3 India Advanced Packaging Inspection Systems Sales Value by Application, 2024 VS 2031
7 Company Profiles
- 7.1 Camtek
- 7.1.1 Camtek Company Information
- 7.1.2 Camtek Introduction and Business Overview
- 7.1.3 Camtek Advanced Packaging Inspection Systems Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.1.4 Camtek Advanced Packaging Inspection Systems Product Offerings
- 7.1.5 Camtek Recent Development
- 7.2 Onto Innovation
- 7.2.1 Onto Innovation Company Information
- 7.2.2 Onto Innovation Introduction and Business Overview
- 7.2.3 Onto Innovation Advanced Packaging Inspection Systems Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.2.4 Onto Innovation Advanced Packaging Inspection Systems Product Offerings
- 7.2.5 Onto Innovation Recent Development
- 7.3 KLA
- 7.3.1 KLA Company Information
- 7.3.2 KLA Introduction and Business Overview
- 7.3.3 KLA Advanced Packaging Inspection Systems Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.3.4 KLA Advanced Packaging Inspection Systems Product Offerings
- 7.3.5 KLA Recent Development
- 7.4 Intekplus
- 7.4.1 Intekplus Company Information
- 7.4.2 Intekplus Introduction and Business Overview
- 7.4.3 Intekplus Advanced Packaging Inspection Systems Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.4.4 Intekplus Advanced Packaging Inspection Systems Product Offerings
- 7.4.5 Intekplus Recent Development
- 7.5 Cohu
- 7.5.1 Cohu Company Information
- 7.5.2 Cohu Introduction and Business Overview
- 7.5.3 Cohu Advanced Packaging Inspection Systems Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.5.4 Cohu Advanced Packaging Inspection Systems Product Offerings
- 7.5.5 Cohu Recent Development
- 7.6 Semiconductor Technologies & Instruments (STI)
- 7.6.1 Semiconductor Technologies & Instruments (STI) Company Information
- 7.6.2 Semiconductor Technologies & Instruments (STI) Introduction and Business Overview
- 7.6.3 Semiconductor Technologies & Instruments (STI) Advanced Packaging Inspection Systems Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.6.4 Semiconductor Technologies & Instruments (STI) Advanced Packaging Inspection Systems Product Offerings
- 7.6.5 Semiconductor Technologies & Instruments (STI) Recent Development
8 Industry Chain Analysis
- 8.1 Advanced Packaging Inspection Systems Industrial Chain
- 8.2 Advanced Packaging Inspection Systems Upstream Analysis
- 8.2.1 Key Raw Materials
- 8.2.2 Raw Materials Key Suppliers
- 8.2.3 Manufacturing Cost Structure
- 8.3 Midstream Analysis
- 8.4 Downstream Analysis (Customers Analysis)
- 8.5 Sales Model and Sales Channels
- 8.5.1 Advanced Packaging Inspection Systems Sales Model
- 8.5.2 Sales Channel
- 8.5.3 Advanced Packaging Inspection Systems Distributors
9 Research Findings and Conclusion
10 Appendix
- 10.1 Research Methodology
- 10.1.1 Methodology/Research Approach
- 10.1.1.1 Research Programs/Design
- 10.1.1.2 Market Size Estimation
- 10.1.1.3 Market Breakdown and Data Triangulation
- 10.1.2 Data Source
- 10.1.2.1 Secondary Sources
- 10.1.2.2 Primary Sources
- 10.1.1 Methodology/Research Approach
- 10.2 Author Details
- 10.3 Disclaimer
