반도체 몰딩 시스템 시장 : 시장 점유율과 순위, 전체 판매 및 수요 예측(2025-2031년)

The global market for Semiconductor Molding Systems was estimated to be worth US$ 426 million in 2024 and is forecast to a readjusted size of US$ 653 million by 2031 with a CAGR of 6.6% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Semiconductor Molding Systems cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and testing. Packaging refers to cutting, wire bonding, molding, trim & forming the wafer after production and processing, so that the integrated circuit can achieve electrical and signal connections with external devices while providing physical and chemical protection for the integrated circuit. Molding refers to a plastic molding process in which packaging materials such as epoxy resin mixture are injected into the mold cavity at a certain temperature and pressure, and the devices that need to be protected, such as chips, are wrapped in the plastic, and then solidified into a whole body.

The roles of Molding products in semiconductor packaging are as follows:

1. Protective effect. Exposed semiconductor chips will not fail under strict environmental control, but the daily environment does not have the required environmental control conditions at all, so the chips need to be protected by packaging.

2. Supporting effect. The support has two functions. One is to support the chip, which is to fix the chip to facilitate circuit connection. The other is to form a certain shape to support the entire device after the packaging is completed, making the entire device less likely to be damaged.

3. Connection function. The function of the connection is to connect the electrodes of the chip to the external circuit, the pin is used to connect the external circuit, and the gold wire connects the pin to the circuit of the chip. The carrier stage is used to carry the chip, the epoxy resin adhesive is used to stick the chip on the carrier stage, the pins are used to support the entire device, and the plastic package plays a role in fixing and protecting it.

4. Ensure reliability. Any packaging needs to have a certain degree of reliability, which is the most important metric in the entire packaging process.

Semiconductor packaging equipment plays a vital role in the semiconductor manufacturing process, especially in the plastic encapsulation process, which ensures that the chip is protected, the electrical connection with the external circuit board is stable, and the mechanical stability is enhanced.

Plastic encapsulation refers to the process of injecting encapsulation materials (such as epoxy resin mixtures) into the mold cavity at a certain temperature and pressure, wrapping the chip and other devices that need to be protected in the plastic encapsulation material, and then curing them into a whole.

The degree of automation of semiconductor plastic encapsulation machines determines the cost of the entire encapsulation process, such as labor costs, packaging raw material costs, etc. The price difference between different products is very large, mainly depending on the number of presses. The more presses, the more expensive the price. In various regions of the world, the production areas of semiconductor plastic encapsulation systems are mainly distributed in Japan and China, with Japan occupying most of the market share. There is still a certain gap between Chinese plastic encapsulation machines and international leading companies (such as TOWA) in terms of product performance and packaging technology. However, as Chinese companies have made continuous breakthroughs in product development technology in recent years, some companies have also occupied a certain market share in the advanced packaging market, such as HIIG Trinity (Anhui) Technology.

This report aims to provide a comprehensive presentation of the global market for Semiconductor Molding Systems, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Molding Systems by region & country, by Type, and by Application.

The Semiconductor Molding Systems market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Molding Systems.

Market Segmentation

By Company

• Towa
• Besi
• ASMPT
• I-PEX Inc
• HIIG Trinity (Anhui) Technology
• Shanghai Xinsheng
• Mtex Matsumura
• Asahi Engineering
• Nextool Technology Co., Ltd.
• APIC YAMADA
• Suzhou Bopai Semiconductor (Boschman)
• Suzhou Saiken Intelligent Technology
• Jiangsu Guoxin Intelligent Equipment Co., Ltd
• Dongguan Huayue Semiconductor Technology

Segment by Type

• Fully Automatic Molding System
• Semi-automatic Molding System
• Manual Molding System

Segment by Application

• Advanced Packaging
• Traditional Packaging

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Semiconductor Molding Systems manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Semiconductor Molding Systems in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Semiconductor Molding Systems in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 Semiconductor Molding Systems Product Introduction
• 1.2 Global Semiconductor Molding Systems Market Size Forecast
  • 1.2.1 Global Semiconductor Molding Systems Sales Value (2020-2031)
  • 1.2.2 Global Semiconductor Molding Systems Sales Volume (2020-2031)
  • 1.2.3 Global Semiconductor Molding Systems Sales Price (2020-2031)
• 1.3 Semiconductor Molding Systems Market Trends & Drivers
  • 1.3.1 Semiconductor Molding Systems Industry Trends
  • 1.3.2 Semiconductor Molding Systems Market Drivers & Opportunity
  • 1.3.3 Semiconductor Molding Systems Market Challenges
  • 1.3.4 Semiconductor Molding Systems Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global Semiconductor Molding Systems Players Revenue Ranking (2024)
• 2.2 Global Semiconductor Molding Systems Revenue by Company (2020-2025)
• 2.3 Global Semiconductor Molding Systems Players Sales Volume Ranking (2024)
• 2.4 Global Semiconductor Molding Systems Sales Volume by Company Players (2020-2025)
• 2.5 Global Semiconductor Molding Systems Average Price by Company (2020-2025)
• 2.6 Key Manufacturers Semiconductor Molding Systems Manufacturing Base and Headquarters
• 2.7 Key Manufacturers Semiconductor Molding Systems Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of Semiconductor Molding Systems
• 2.9 Semiconductor Molding Systems Market Competitive Analysis
  • 2.9.1 Semiconductor Molding Systems Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor Molding Systems Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Molding Systems as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 Fully Automatic Molding System
  • 3.1.2 Semi-automatic Molding System
  • 3.1.3 Manual Molding System
• 3.2 Global Semiconductor Molding Systems Sales Value by Type
  • 3.2.1 Global Semiconductor Molding Systems Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global Semiconductor Molding Systems Sales Value, by Type (2020-2031)
  • 3.2.3 Global Semiconductor Molding Systems Sales Value, by Type (%) (2020-2031)
• 3.3 Global Semiconductor Molding Systems Sales Volume by Type
  • 3.3.1 Global Semiconductor Molding Systems Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global Semiconductor Molding Systems Sales Volume, by Type (2020-2031)
  • 3.3.3 Global Semiconductor Molding Systems Sales Volume, by Type (%) (2020-2031)
• 3.4 Global Semiconductor Molding Systems Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Advanced Packaging
  • 4.1.2 Traditional Packaging
• 4.2 Global Semiconductor Molding Systems Sales Value by Application
  • 4.2.1 Global Semiconductor Molding Systems Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global Semiconductor Molding Systems Sales Value, by Application (2020-2031)
  • 4.2.3 Global Semiconductor Molding Systems Sales Value, by Application (%) (2020-2031)
• 4.3 Global Semiconductor Molding Systems Sales Volume by Application
  • 4.3.1 Global Semiconductor Molding Systems Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global Semiconductor Molding Systems Sales Volume, by Application (2020-2031)
  • 4.3.3 Global Semiconductor Molding Systems Sales Volume, by Application (%) (2020-2031)
• 4.4 Global Semiconductor Molding Systems Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global Semiconductor Molding Systems Sales Value by Region
  • 5.1.1 Global Semiconductor Molding Systems Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global Semiconductor Molding Systems Sales Value by Region (2020-2025)
  • 5.1.3 Global Semiconductor Molding Systems Sales Value by Region (2026-2031)
  • 5.1.4 Global Semiconductor Molding Systems Sales Value by Region (%), (2020-2031)
• 5.2 Global Semiconductor Molding Systems Sales Volume by Region
  • 5.2.1 Global Semiconductor Molding Systems Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global Semiconductor Molding Systems Sales Volume by Region (2020-2025)
  • 5.2.3 Global Semiconductor Molding Systems Sales Volume by Region (2026-2031)
  • 5.2.4 Global Semiconductor Molding Systems Sales Volume by Region (%), (2020-2031)
• 5.3 Global Semiconductor Molding Systems Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America Semiconductor Molding Systems Sales Value, 2020-2031
  • 5.4.2 North America Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe Semiconductor Molding Systems Sales Value, 2020-2031
  • 5.5.2 Europe Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific Semiconductor Molding Systems Sales Value, 2020-2031
  • 5.6.2 Asia Pacific Semiconductor Molding Systems Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America Semiconductor Molding Systems Sales Value, 2020-2031
  • 5.7.2 South America Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa Semiconductor Molding Systems Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions Semiconductor Molding Systems Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions Semiconductor Molding Systems Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions Semiconductor Molding Systems Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions Semiconductor Molding Systems Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States Semiconductor Molding Systems Sales Value, 2020-2031
  • 6.3.2 United States Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe Semiconductor Molding Systems Sales Value, 2020-2031
  • 6.4.2 Europe Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China Semiconductor Molding Systems Sales Value, 2020-2031
  • 6.5.2 China Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan Semiconductor Molding Systems Sales Value, 2020-2031
  • 6.6.2 Japan Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea Semiconductor Molding Systems Sales Value, 2020-2031
  • 6.7.2 South Korea Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia Semiconductor Molding Systems Sales Value, 2020-2031
  • 6.8.2 Southeast Asia Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India Semiconductor Molding Systems Sales Value, 2020-2031
  • 6.9.2 India Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 Towa
  • 7.1.1 Towa Company Information
  • 7.1.2 Towa Introduction and Business Overview
  • 7.1.3 Towa Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 Towa Semiconductor Molding Systems Product Offerings
  • 7.1.5 Towa Recent Development
• 7.2 Besi
  • 7.2.1 Besi Company Information
  • 7.2.2 Besi Introduction and Business Overview
  • 7.2.3 Besi Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 Besi Semiconductor Molding Systems Product Offerings
  • 7.2.5 Besi Recent Development
• 7.3 ASMPT
  • 7.3.1 ASMPT Company Information
  • 7.3.2 ASMPT Introduction and Business Overview
  • 7.3.3 ASMPT Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 ASMPT Semiconductor Molding Systems Product Offerings
  • 7.3.5 ASMPT Recent Development
• 7.4 I-PEX Inc
  • 7.4.1 I-PEX Inc Company Information
  • 7.4.2 I-PEX Inc Introduction and Business Overview
  • 7.4.3 I-PEX Inc Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 I-PEX Inc Semiconductor Molding Systems Product Offerings
  • 7.4.5 I-PEX Inc Recent Development
• 7.5 HIIG Trinity (Anhui) Technology
  • 7.5.1 HIIG Trinity (Anhui) Technology Company Information
  • 7.5.2 HIIG Trinity (Anhui) Technology Introduction and Business Overview
  • 7.5.3 HIIG Trinity (Anhui) Technology Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 HIIG Trinity (Anhui) Technology Semiconductor Molding Systems Product Offerings
  • 7.5.5 HIIG Trinity (Anhui) Technology Recent Development
• 7.6 Shanghai Xinsheng
  • 7.6.1 Shanghai Xinsheng Company Information
  • 7.6.2 Shanghai Xinsheng Introduction and Business Overview
  • 7.6.3 Shanghai Xinsheng Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 Shanghai Xinsheng Semiconductor Molding Systems Product Offerings
  • 7.6.5 Shanghai Xinsheng Recent Development
• 7.7 Mtex Matsumura
  • 7.7.1 Mtex Matsumura Company Information
  • 7.7.2 Mtex Matsumura Introduction and Business Overview
  • 7.7.3 Mtex Matsumura Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 Mtex Matsumura Semiconductor Molding Systems Product Offerings
  • 7.7.5 Mtex Matsumura Recent Development
• 7.8 Asahi Engineering
  • 7.8.1 Asahi Engineering Company Information
  • 7.8.2 Asahi Engineering Introduction and Business Overview
  • 7.8.3 Asahi Engineering Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 Asahi Engineering Semiconductor Molding Systems Product Offerings
  • 7.8.5 Asahi Engineering Recent Development
• 7.9 Nextool Technology Co., Ltd.
  • 7.9.1 Nextool Technology Co., Ltd. Company Information
  • 7.9.2 Nextool Technology Co., Ltd. Introduction and Business Overview
  • 7.9.3 Nextool Technology Co., Ltd. Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 Nextool Technology Co., Ltd. Semiconductor Molding Systems Product Offerings
  • 7.9.5 Nextool Technology Co., Ltd. Recent Development
• 7.10 APIC YAMADA
  • 7.10.1 APIC YAMADA Company Information
  • 7.10.2 APIC YAMADA Introduction and Business Overview
  • 7.10.3 APIC YAMADA Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.10.4 APIC YAMADA Semiconductor Molding Systems Product Offerings
  • 7.10.5 APIC YAMADA Recent Development
• 7.11 Suzhou Bopai Semiconductor (Boschman)
  • 7.11.1 Suzhou Bopai Semiconductor (Boschman) Company Information
  • 7.11.2 Suzhou Bopai Semiconductor (Boschman) Introduction and Business Overview
  • 7.11.3 Suzhou Bopai Semiconductor (Boschman) Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.11.4 Suzhou Bopai Semiconductor (Boschman) Semiconductor Molding Systems Product Offerings
  • 7.11.5 Suzhou Bopai Semiconductor (Boschman) Recent Development
• 7.12 Suzhou Saiken Intelligent Technology
  • 7.12.1 Suzhou Saiken Intelligent Technology Company Information
  • 7.12.2 Suzhou Saiken Intelligent Technology Introduction and Business Overview
  • 7.12.3 Suzhou Saiken Intelligent Technology Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.12.4 Suzhou Saiken Intelligent Technology Semiconductor Molding Systems Product Offerings
  • 7.12.5 Suzhou Saiken Intelligent Technology Recent Development
• 7.13 Jiangsu Guoxin Intelligent Equipment Co., Ltd
  • 7.13.1 Jiangsu Guoxin Intelligent Equipment Co., Ltd Company Information
  • 7.13.2 Jiangsu Guoxin Intelligent Equipment Co., Ltd Introduction and Business Overview
  • 7.13.3 Jiangsu Guoxin Intelligent Equipment Co., Ltd Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.13.4 Jiangsu Guoxin Intelligent Equipment Co., Ltd Semiconductor Molding Systems Product Offerings
  • 7.13.5 Jiangsu Guoxin Intelligent Equipment Co., Ltd Recent Development
• 7.14 Dongguan Huayue Semiconductor Technology
  • 7.14.1 Dongguan Huayue Semiconductor Technology Company Information
  • 7.14.2 Dongguan Huayue Semiconductor Technology Introduction and Business Overview
  • 7.14.3 Dongguan Huayue Semiconductor Technology Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.14.4 Dongguan Huayue Semiconductor Technology Semiconductor Molding Systems Product Offerings
  • 7.14.5 Dongguan Huayue Semiconductor Technology Recent Development

8 Industry Chain Analysis

• 8.1 Semiconductor Molding Systems Industrial Chain
• 8.2 Semiconductor Molding Systems Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 Semiconductor Molding Systems Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 Semiconductor Molding Systems Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer