반도체 패키징 시장 예측 : 산업 규모, 점유율, 동향, 기회, 패키징 플랫폼별, 유형별, 기술별, 최종 사용자 산업별, 지역별, 경쟁 구도별(2021-2031년)

The Global Semiconductor Packaging Market will grow from USD 31.24 Billion in 2025 to USD 46.96 Billion by 2031 at a 7.03% CAGR. Semiconductor packaging entails the encasement of integrated circuits to provide physical protection, heat dissipation, and electrical connectivity to printed circuit boards. The market growth is fundamentally driven by the surging demand for high-performance computing and artificial intelligence, coupled with the increasing semiconductor content in electric vehicles.

Key Market Drivers

The surging adoption of artificial intelligence and high-performance computing is fundamentally reshaping the Global Semiconductor Packaging Market by necessitating architectures that maximize bandwidth and power efficiency. As AI algorithms require rapid data movement between logic and memory units, the industry is pivoting toward 2.5D and 3D packaging solutions to bridge the gap that traditional interconnects cannot sustain. This computational intensity drives foundries to aggressively scale their backend capabilities to accommodate complex integration schemes like Chip-on-Wafer-on-Substrate.

Key Market Challenges

The escalating cost and technical complexity associated with advanced packaging processes constitute a severe impediment to the expansion of the Global Semiconductor Packaging Market. As the industry moves toward heterogeneous integration to address physical scaling limits, the requirement for ultra-precise interconnects necessitates substantial capital expenditure on specialized infrastructure. This financial burden creates a high barrier to entry that disproportionately affects smaller market participants who lack the liquidity to upgrade their facilities.

Key Market Trends

The Commercialization of Glass Core Substrates for High-Performance Computing is emerging as a critical material evolution to address the stability limitations of traditional organic interposers. As manufacturers aggressively scale chiplet architectures, glass provides superior flatness and dimensional stability, which enables the ultra-fine interconnect pitches required for next-generation AI processors and mitigates warpage issues in large-form-factor packages. This transition is rapidly moving from research to active industrial deployment as companies build dedicated infrastructure to support this technology.

Key Market Players

• ASE Technology Holding Co., Ltd.
• Amkor Technology, Inc.
• Taiwan Semiconductor Manufacturing Company
• Intel Corporation
• Samsung Electronics Co., Ltd.
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• Powertech Technology Inc.
• ChipMOS Technologies Inc.
• Siliconware Precision Industries Co., Ltd.
• Texas Instruments Incorporated

Report Scope:

In this report, the Global Semiconductor Packaging Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Semiconductor Packaging Market, By Packaging Platform:

• Advanced Packaging
• Traditional Packaging

Semiconductor Packaging Market, By Type:

• Flip Chip
• Embedded DIE
• Fan-in WLP
• Fan-out WLP

Semiconductor Packaging Market, By Technology:

• Grid Array
• Small Outline Package
• Flat no-leads packages
• Dual-flat no-leads (DFN)
• Quad-flat no-leads (QFN)
• Dual In-Line Package
• Plastic Dual Inline Package (PDIP)
• Ceramic Dual Inline Package (CDIP)
• Others

Semiconductor Packaging Market, By End-user Industry:

• Consumer Electronics
• Aerospace & Defense
• Medical Devices
• Communications & Telecom
• Automotive
• and Energy & Lighting

Semiconductor Packaging Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Semiconductor Packaging Market.

Available Customizations:

Global Semiconductor Packaging Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Semiconductor Packaging Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Packaging Platform (Advanced Packaging, Traditional Packaging)
  • 5.2.2. By Type (Flip Chip, Embedded DIE, Fan-in WLP, Fan-out WLP)
  • 5.2.3. By Technology (Grid Array, Small Outline Package, Flat no-leads packages, Dual-flat no-leads (DFN), Quad-flat no-leads (QFN), Dual In-Line Package, Plastic Dual Inline Package (PDIP), Ceramic Dual Inline Package (CDIP), Others)
  • 5.2.4. By End-user Industry (Consumer Electronics, Aerospace & Defense, Medical Devices, Communications & Telecom, Automotive, and Energy & Lighting)
  • 5.2.5. By Region
  • 5.2.6. By Company (2025)
• 5.3. Market Map

6. North America Semiconductor Packaging Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Packaging Platform
  • 6.2.2. By Type
  • 6.2.3. By Technology
  • 6.2.4. By End-user Industry
  • 6.2.5. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Semiconductor Packaging Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Packaging Platform
      • 6.3.1.2.2. By Type
      • 6.3.1.2.3. By Technology
      • 6.3.1.2.4. By End-user Industry
  • 6.3.2. Canada Semiconductor Packaging Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Packaging Platform
      • 6.3.2.2.2. By Type
      • 6.3.2.2.3. By Technology
      • 6.3.2.2.4. By End-user Industry
  • 6.3.3. Mexico Semiconductor Packaging Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Packaging Platform
      • 6.3.3.2.2. By Type
      • 6.3.3.2.3. By Technology
      • 6.3.3.2.4. By End-user Industry

7. Europe Semiconductor Packaging Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Packaging Platform
  • 7.2.2. By Type
  • 7.2.3. By Technology
  • 7.2.4. By End-user Industry
  • 7.2.5. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Semiconductor Packaging Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Packaging Platform
      • 7.3.1.2.2. By Type
      • 7.3.1.2.3. By Technology
      • 7.3.1.2.4. By End-user Industry
  • 7.3.2. France Semiconductor Packaging Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Packaging Platform
      • 7.3.2.2.2. By Type
      • 7.3.2.2.3. By Technology
      • 7.3.2.2.4. By End-user Industry
  • 7.3.3. United Kingdom Semiconductor Packaging Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Packaging Platform
      • 7.3.3.2.2. By Type
      • 7.3.3.2.3. By Technology
      • 7.3.3.2.4. By End-user Industry
  • 7.3.4. Italy Semiconductor Packaging Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Packaging Platform
      • 7.3.4.2.2. By Type
      • 7.3.4.2.3. By Technology
      • 7.3.4.2.4. By End-user Industry
  • 7.3.5. Spain Semiconductor Packaging Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Packaging Platform
      • 7.3.5.2.2. By Type
      • 7.3.5.2.3. By Technology
      • 7.3.5.2.4. By End-user Industry

8. Asia Pacific Semiconductor Packaging Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Packaging Platform
  • 8.2.2. By Type
  • 8.2.3. By Technology
  • 8.2.4. By End-user Industry
  • 8.2.5. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Semiconductor Packaging Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Packaging Platform
      • 8.3.1.2.2. By Type
      • 8.3.1.2.3. By Technology
      • 8.3.1.2.4. By End-user Industry
  • 8.3.2. India Semiconductor Packaging Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Packaging Platform
      • 8.3.2.2.2. By Type
      • 8.3.2.2.3. By Technology
      • 8.3.2.2.4. By End-user Industry
  • 8.3.3. Japan Semiconductor Packaging Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Packaging Platform
      • 8.3.3.2.2. By Type
      • 8.3.3.2.3. By Technology
      • 8.3.3.2.4. By End-user Industry
  • 8.3.4. South Korea Semiconductor Packaging Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Packaging Platform
      • 8.3.4.2.2. By Type
      • 8.3.4.2.3. By Technology
      • 8.3.4.2.4. By End-user Industry
  • 8.3.5. Australia Semiconductor Packaging Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Packaging Platform
      • 8.3.5.2.2. By Type
      • 8.3.5.2.3. By Technology
      • 8.3.5.2.4. By End-user Industry

9. Middle East & Africa Semiconductor Packaging Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Packaging Platform
  • 9.2.2. By Type
  • 9.2.3. By Technology
  • 9.2.4. By End-user Industry
  • 9.2.5. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Semiconductor Packaging Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Packaging Platform
      • 9.3.1.2.2. By Type
      • 9.3.1.2.3. By Technology
      • 9.3.1.2.4. By End-user Industry
  • 9.3.2. UAE Semiconductor Packaging Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Packaging Platform
      • 9.3.2.2.2. By Type
      • 9.3.2.2.3. By Technology
      • 9.3.2.2.4. By End-user Industry
  • 9.3.3. South Africa Semiconductor Packaging Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Packaging Platform
      • 9.3.3.2.2. By Type
      • 9.3.3.2.3. By Technology
      • 9.3.3.2.4. By End-user Industry

10. South America Semiconductor Packaging Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Packaging Platform
  • 10.2.2. By Type
  • 10.2.3. By Technology
  • 10.2.4. By End-user Industry
  • 10.2.5. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Semiconductor Packaging Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Packaging Platform
      • 10.3.1.2.2. By Type
      • 10.3.1.2.3. By Technology
      • 10.3.1.2.4. By End-user Industry
  • 10.3.2. Colombia Semiconductor Packaging Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Packaging Platform
      • 10.3.2.2.2. By Type
      • 10.3.2.2.3. By Technology
      • 10.3.2.2.4. By End-user Industry
  • 10.3.3. Argentina Semiconductor Packaging Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Packaging Platform
      • 10.3.3.2.2. By Type
      • 10.3.3.2.3. By Technology
      • 10.3.3.2.4. By End-user Industry

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Semiconductor Packaging Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. ASE Technology Holding Co., Ltd.
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Amkor Technology, Inc.
• 15.3. Taiwan Semiconductor Manufacturing Company
• 15.4. Intel Corporation
• 15.5. Samsung Electronics Co., Ltd.
• 15.6. Jiangsu Changjiang Electronics Technology Co., Ltd.
• 15.7. Powertech Technology Inc.
• 15.8. ChipMOS Technologies Inc.
• 15.9. Siliconware Precision Industries Co., Ltd.
• 15.10. Texas Instruments Incorporated

16. Strategic Recommendations

17. About Us & Disclaimer