시장보고서
상품코드
1873678

세계의 SiN AMB 기판 : 시장 점유율과 순위, 전체 판매량 및 수요 예측(2025-2031년)

SiN AMB Substrate - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

발행일: | 리서치사: QYResearch | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

    
    
    




■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

세계의 SiN AMB 기판 시장 규모는 2024년에 5억 600만 달러로 추정되며, 2025-2031년의 예측 기간에 CAGR 17.8%로 확대되어 2031년까지 15억 1,300만 달러로 재조정될 전망입니다.

본 보고서는 SiN AMB 기판의 국경 간 산업 발자국, 자본 배분 패턴, 지역 경제의 상호 의존성, 공급망 재구축, 최근 관세 조정 및 국제적인 전략적 대응 조치에 대한 종합적인 평가를 제공합니다.

액티브 메탈 브레이징(AMB)은 세라믹 기판의 최신 기술로, 질화알루미늄(AlN) 또는 질화규소(SiN)를 사용하여 두꺼운 구리 층을 제조할 수 있습니다. AMB는 고온 진공 브레이징 공정을 통해 세라믹 기판 위에 순수 구리를 브레이징하기 때문에 일반적인 금속화 공정을 사용하지 않습니다. 높은 신뢰성과 독자적인 방열성을 갖춘 기판을 제공할 뿐만 아니라, 0.25mm의 얇은 세라믹 기판에 최대 800µm의 양면 구리 중량을 구현하는 기술입니다.

SiN AMB 기판의 세계 주요 제조업체로는 Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials 등이 있습니다. 2023년 기준, 세계 상위 8개사의 매출 점유율은 약 85%를 차지하고 있습니다.

현재 SiN AMB 기판은 주로 일본, 독일, 중국에서 생산되고 있으며, 2023년 시장 점유율은 각각 27.3%, 24.56%, 43.5%를 차지합니다. 중국의 생산 점유율은 2030년까지 57%를 보일 것으로 예측됩니다. NGK 일렉트로닉스 디바이스와 페로텍이 말레이시아에 AMB 생산 공장 건설을 시작하거나 완료함에 따라 향후 몇 년 동안 동남아시아가 생산 거점으로서 중요한 역할을 할 것으로 예측됩니다.

이 보고서는 SiN AMB 기판 세계 시장에 대해 총 판매량, 매출, 가격, 주요 기업의 시장 점유율 및 순위에 초점을 맞추고, 지역별, 국가별, 기판 두께별, 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.

SiN AMB 기판 시장 규모, 추정 및 예측은 판매량(평방미터)과 매출액(백만 달러)으로 제시되며, 2024년을 기준 연도로, 2020년에서 2031년까지의 과거 데이터와 예측 데이터를 포함합니다. 정량적, 정성적 분석을 통해 독자들이 SiN AMB 기판에 대한 사업 전략 및 성장 전략 수립, 시장 경쟁 평가, 현재 시장에서의 자사 포지셔닝 분석, 정보에 입각한 사업 판단을 할 수 있도록 지원합니다.

시장 세분화

기업별

  • Rogers Corporation
  • Heraeus Electronics
  • Kyocera
  • NGK Electronics Devices
  • Toshiba Materials
  • Denka
  • DOWA METALTECH
  • KCC
  • Proterial
  • Mitsubishi Materials
  • Jiangsu Fulehua Semiconductor Technology
  • BYD
  • Bomin Electronics
  • Zhejiang TC Ceramic Electronic
  • Shengda Tech
  • Beijing Moshi Technology
  • Nantong Winspower
  • Wuxi Tianyang Electronics
  • Fengpeng Electronics(Zhuhai)
  • Guangzhou Xianyi Electronic Technology
  • Fujian Huaqing Electronic Material Technology
  • Konfoong Materials International

기판 두께별 부문

  • 0.32mm SiN AMB 기판
  • 0.25mm SiN AMB 기판

용도별 부문

  • 자동차
  • 트랙션·철도
  • 신에너지 및 전력망
  • 군 및 항공우주
  • 기타

지역별

  • 북미
    • 미국
    • 캐나다
  • 아시아태평양
    • 중국
    • 일본
    • 한국
    • 동남아시아
    • 인도
    • 호주
    • 기타 아시아태평양
  • 유럽
    • 독일
    • 프랑스
    • 영국
    • 이탈리아
    • 네덜란드
    • 북유럽 국가
    • 기타 유럽
  • 라틴아메리카
    • 멕시코
    • 브라질
    • 기타 라틴아메리카
  • 중동 및 아프리카
    • 튀르키예
    • 사우디아라비아
    • 아랍에미리트(UAE)
    • 기타 중동 및 아프리카
LSH

자주 묻는 질문

  • SiN AMB 기판 시장 규모는 어떻게 예측되나요?
  • SiN AMB 기판의 주요 제조업체는 어디인가요?
  • SiN AMB 기판의 생산 지역은 어디인가요?
  • SiN AMB 기판의 두께별 세분화는 어떻게 되나요?
  • SiN AMB 기판의 용도는 무엇인가요?

The global market for SiN AMB Substrate was estimated to be worth US$ 506 million in 2024 and is forecast to a readjusted size of US$ 1513 million by 2031 with a CAGR of 17.8% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on SiN AMB Substrate cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.

The global key manufacturers of SiN AMB Substrates include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.

Currently the SiN AMB Substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.

This report aims to provide a comprehensive presentation of the global market for SiN AMB Substrate, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of SiN AMB Substrate by region & country, by Substrate Thicknesses, and by Application.

The SiN AMB Substrate market size, estimations, and forecasts are provided in terms of sales volume (Square Meters) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiN AMB Substrate.

Market Segmentation

By Company

  • Rogers Corporation
  • Heraeus Electronics
  • Kyocera
  • NGK Electronics Devices
  • Toshiba Materials
  • Denka
  • DOWA METALTECH
  • KCC
  • Proterial
  • Mitsubishi Materials
  • Jiangsu Fulehua Semiconductor Technology
  • BYD
  • Bomin Electronics
  • Zhejiang TC Ceramic Electronic
  • Shengda Tech
  • Beijing Moshi Technology
  • Nantong Winspower
  • Wuxi Tianyang Electronics
  • Fengpeng Electronics (Zhuhai)
  • Guangzhou Xianyi Electronic Technology
  • Fujian Huaqing Electronic Material Technology
  • Konfoong Materials International

Segment by Substrate Thicknesses

  • 0.32mm SiN AMB Substrates
  • 0.25mm SiN AMB Substrates

Segment by Application

  • Automobile
  • Traction & Railway
  • New Energy & Power Grid
  • Military & Aerospace
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of SiN AMB Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Substrate Thicknesses, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of SiN AMB Substrate in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of SiN AMB Substrate in country level. It provides sigmate data by Substrate Thicknesses, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 SiN AMB Substrate Product Introduction
  • 1.2 Global SiN AMB Substrate Market Size Forecast
    • 1.2.1 Global SiN AMB Substrate Sales Value (2020-2031)
    • 1.2.2 Global SiN AMB Substrate Sales Volume (2020-2031)
    • 1.2.3 Global SiN AMB Substrate Sales Price (2020-2031)
  • 1.3 SiN AMB Substrate Market Trends & Drivers
    • 1.3.1 SiN AMB Substrate Industry Trends
    • 1.3.2 SiN AMB Substrate Market Drivers & Opportunity
    • 1.3.3 SiN AMB Substrate Market Challenges
    • 1.3.4 SiN AMB Substrate Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global SiN AMB Substrate Players Revenue Ranking (2024)
  • 2.2 Global SiN AMB Substrate Revenue by Company (2020-2025)
  • 2.3 Global SiN AMB Substrate Players Sales Volume Ranking (2024)
  • 2.4 Global SiN AMB Substrate Sales Volume by Company Players (2020-2025)
  • 2.5 Global SiN AMB Substrate Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers SiN AMB Substrate Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers SiN AMB Substrate Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of SiN AMB Substrate
  • 2.9 SiN AMB Substrate Market Competitive Analysis
    • 2.9.1 SiN AMB Substrate Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by SiN AMB Substrate Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in SiN AMB Substrate as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Substrate Thicknesses

  • 3.1 Introduction by Substrate Thicknesses
    • 3.1.1 0.32mm SiN AMB Substrates
    • 3.1.2 0.25mm SiN AMB Substrates
  • 3.2 Global SiN AMB Substrate Sales Value by Substrate Thicknesses
    • 3.2.1 Global SiN AMB Substrate Sales Value by Substrate Thicknesses (2020 VS 2024 VS 2031)
    • 3.2.2 Global SiN AMB Substrate Sales Value, by Substrate Thicknesses (2020-2031)
    • 3.2.3 Global SiN AMB Substrate Sales Value, by Substrate Thicknesses (%) (2020-2031)
  • 3.3 Global SiN AMB Substrate Sales Volume by Substrate Thicknesses
    • 3.3.1 Global SiN AMB Substrate Sales Volume by Substrate Thicknesses (2020 VS 2024 VS 2031)
    • 3.3.2 Global SiN AMB Substrate Sales Volume, by Substrate Thicknesses (2020-2031)
    • 3.3.3 Global SiN AMB Substrate Sales Volume, by Substrate Thicknesses (%) (2020-2031)
  • 3.4 Global SiN AMB Substrate Average Price by Substrate Thicknesses (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 Automobile
    • 4.1.2 Traction & Railway
    • 4.1.3 New Energy & Power Grid
    • 4.1.4 Military & Aerospace
    • 4.1.5 Others
  • 4.2 Global SiN AMB Substrate Sales Value by Application
    • 4.2.1 Global SiN AMB Substrate Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global SiN AMB Substrate Sales Value, by Application (2020-2031)
    • 4.2.3 Global SiN AMB Substrate Sales Value, by Application (%) (2020-2031)
  • 4.3 Global SiN AMB Substrate Sales Volume by Application
    • 4.3.1 Global SiN AMB Substrate Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global SiN AMB Substrate Sales Volume, by Application (2020-2031)
    • 4.3.3 Global SiN AMB Substrate Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global SiN AMB Substrate Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global SiN AMB Substrate Sales Value by Region
    • 5.1.1 Global SiN AMB Substrate Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global SiN AMB Substrate Sales Value by Region (2020-2025)
    • 5.1.3 Global SiN AMB Substrate Sales Value by Region (2026-2031)
    • 5.1.4 Global SiN AMB Substrate Sales Value by Region (%), (2020-2031)
  • 5.2 Global SiN AMB Substrate Sales Volume by Region
    • 5.2.1 Global SiN AMB Substrate Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global SiN AMB Substrate Sales Volume by Region (2020-2025)
    • 5.2.3 Global SiN AMB Substrate Sales Volume by Region (2026-2031)
    • 5.2.4 Global SiN AMB Substrate Sales Volume by Region (%), (2020-2031)
  • 5.3 Global SiN AMB Substrate Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America SiN AMB Substrate Sales Value, 2020-2031
    • 5.4.2 North America SiN AMB Substrate Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe SiN AMB Substrate Sales Value, 2020-2031
    • 5.5.2 Europe SiN AMB Substrate Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific SiN AMB Substrate Sales Value, 2020-2031
    • 5.6.2 Asia Pacific SiN AMB Substrate Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America SiN AMB Substrate Sales Value, 2020-2031
    • 5.7.2 South America SiN AMB Substrate Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa SiN AMB Substrate Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa SiN AMB Substrate Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions SiN AMB Substrate Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions SiN AMB Substrate Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions SiN AMB Substrate Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions SiN AMB Substrate Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States SiN AMB Substrate Sales Value, 2020-2031
    • 6.3.2 United States SiN AMB Substrate Sales Value by Substrate Thicknesses (%), 2024 VS 2031
    • 6.3.3 United States SiN AMB Substrate Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe SiN AMB Substrate Sales Value, 2020-2031
    • 6.4.2 Europe SiN AMB Substrate Sales Value by Substrate Thicknesses (%), 2024 VS 2031
    • 6.4.3 Europe SiN AMB Substrate Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China SiN AMB Substrate Sales Value, 2020-2031
    • 6.5.2 China SiN AMB Substrate Sales Value by Substrate Thicknesses (%), 2024 VS 2031
    • 6.5.3 China SiN AMB Substrate Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan SiN AMB Substrate Sales Value, 2020-2031
    • 6.6.2 Japan SiN AMB Substrate Sales Value by Substrate Thicknesses (%), 2024 VS 2031
    • 6.6.3 Japan SiN AMB Substrate Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea SiN AMB Substrate Sales Value, 2020-2031
    • 6.7.2 South Korea SiN AMB Substrate Sales Value by Substrate Thicknesses (%), 2024 VS 2031
    • 6.7.3 South Korea SiN AMB Substrate Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia SiN AMB Substrate Sales Value, 2020-2031
    • 6.8.2 Southeast Asia SiN AMB Substrate Sales Value by Substrate Thicknesses (%), 2024 VS 2031
    • 6.8.3 Southeast Asia SiN AMB Substrate Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India SiN AMB Substrate Sales Value, 2020-2031
    • 6.9.2 India SiN AMB Substrate Sales Value by Substrate Thicknesses (%), 2024 VS 2031
    • 6.9.3 India SiN AMB Substrate Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 Rogers Corporation
    • 7.1.1 Rogers Corporation Company Information
    • 7.1.2 Rogers Corporation Introduction and Business Overview
    • 7.1.3 Rogers Corporation SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 Rogers Corporation SiN AMB Substrate Product Offerings
    • 7.1.5 Rogers Corporation Recent Development
  • 7.2 Heraeus Electronics
    • 7.2.1 Heraeus Electronics Company Information
    • 7.2.2 Heraeus Electronics Introduction and Business Overview
    • 7.2.3 Heraeus Electronics SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 Heraeus Electronics SiN AMB Substrate Product Offerings
    • 7.2.5 Heraeus Electronics Recent Development
  • 7.3 Kyocera
    • 7.3.1 Kyocera Company Information
    • 7.3.2 Kyocera Introduction and Business Overview
    • 7.3.3 Kyocera SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 Kyocera SiN AMB Substrate Product Offerings
    • 7.3.5 Kyocera Recent Development
  • 7.4 NGK Electronics Devices
    • 7.4.1 NGK Electronics Devices Company Information
    • 7.4.2 NGK Electronics Devices Introduction and Business Overview
    • 7.4.3 NGK Electronics Devices SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.4.4 NGK Electronics Devices SiN AMB Substrate Product Offerings
    • 7.4.5 NGK Electronics Devices Recent Development
  • 7.5 Toshiba Materials
    • 7.5.1 Toshiba Materials Company Information
    • 7.5.2 Toshiba Materials Introduction and Business Overview
    • 7.5.3 Toshiba Materials SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.5.4 Toshiba Materials SiN AMB Substrate Product Offerings
    • 7.5.5 Toshiba Materials Recent Development
  • 7.6 Denka
    • 7.6.1 Denka Company Information
    • 7.6.2 Denka Introduction and Business Overview
    • 7.6.3 Denka SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.6.4 Denka SiN AMB Substrate Product Offerings
    • 7.6.5 Denka Recent Development
  • 7.7 DOWA METALTECH
    • 7.7.1 DOWA METALTECH Company Information
    • 7.7.2 DOWA METALTECH Introduction and Business Overview
    • 7.7.3 DOWA METALTECH SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.7.4 DOWA METALTECH SiN AMB Substrate Product Offerings
    • 7.7.5 DOWA METALTECH Recent Development
  • 7.8 KCC
    • 7.8.1 KCC Company Information
    • 7.8.2 KCC Introduction and Business Overview
    • 7.8.3 KCC SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.8.4 KCC SiN AMB Substrate Product Offerings
    • 7.8.5 KCC Recent Development
  • 7.9 Proterial
    • 7.9.1 Proterial Company Information
    • 7.9.2 Proterial Introduction and Business Overview
    • 7.9.3 Proterial SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.9.4 Proterial SiN AMB Substrate Product Offerings
    • 7.9.5 Proterial Recent Development
  • 7.10 Mitsubishi Materials
    • 7.10.1 Mitsubishi Materials Company Information
    • 7.10.2 Mitsubishi Materials Introduction and Business Overview
    • 7.10.3 Mitsubishi Materials SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.10.4 Mitsubishi Materials SiN AMB Substrate Product Offerings
    • 7.10.5 Mitsubishi Materials Recent Development
  • 7.11 Jiangsu Fulehua Semiconductor Technology
    • 7.11.1 Jiangsu Fulehua Semiconductor Technology Company Information
    • 7.11.2 Jiangsu Fulehua Semiconductor Technology Introduction and Business Overview
    • 7.11.3 Jiangsu Fulehua Semiconductor Technology SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.11.4 Jiangsu Fulehua Semiconductor Technology SiN AMB Substrate Product Offerings
    • 7.11.5 Jiangsu Fulehua Semiconductor Technology Recent Development
  • 7.12 BYD
    • 7.12.1 BYD Company Information
    • 7.12.2 BYD Introduction and Business Overview
    • 7.12.3 BYD SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.12.4 BYD SiN AMB Substrate Product Offerings
    • 7.12.5 BYD Recent Development
  • 7.13 Bomin Electronics
    • 7.13.1 Bomin Electronics Company Information
    • 7.13.2 Bomin Electronics Introduction and Business Overview
    • 7.13.3 Bomin Electronics SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.13.4 Bomin Electronics SiN AMB Substrate Product Offerings
    • 7.13.5 Bomin Electronics Recent Development
  • 7.14 Zhejiang TC Ceramic Electronic
    • 7.14.1 Zhejiang TC Ceramic Electronic Company Information
    • 7.14.2 Zhejiang TC Ceramic Electronic Introduction and Business Overview
    • 7.14.3 Zhejiang TC Ceramic Electronic SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.14.4 Zhejiang TC Ceramic Electronic SiN AMB Substrate Product Offerings
    • 7.14.5 Zhejiang TC Ceramic Electronic Recent Development
  • 7.15 Shengda Tech
    • 7.15.1 Shengda Tech Company Information
    • 7.15.2 Shengda Tech Introduction and Business Overview
    • 7.15.3 Shengda Tech SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.15.4 Shengda Tech SiN AMB Substrate Product Offerings
    • 7.15.5 Shengda Tech Recent Development
  • 7.16 Beijing Moshi Technology
    • 7.16.1 Beijing Moshi Technology Company Information
    • 7.16.2 Beijing Moshi Technology Introduction and Business Overview
    • 7.16.3 Beijing Moshi Technology SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.16.4 Beijing Moshi Technology SiN AMB Substrate Product Offerings
    • 7.16.5 Beijing Moshi Technology Recent Development
  • 7.17 Nantong Winspower
    • 7.17.1 Nantong Winspower Company Information
    • 7.17.2 Nantong Winspower Introduction and Business Overview
    • 7.17.3 Nantong Winspower SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.17.4 Nantong Winspower SiN AMB Substrate Product Offerings
    • 7.17.5 Nantong Winspower Recent Development
  • 7.18 Wuxi Tianyang Electronics
    • 7.18.1 Wuxi Tianyang Electronics Company Information
    • 7.18.2 Wuxi Tianyang Electronics Introduction and Business Overview
    • 7.18.3 Wuxi Tianyang Electronics SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.18.4 Wuxi Tianyang Electronics SiN AMB Substrate Product Offerings
    • 7.18.5 Wuxi Tianyang Electronics Recent Development
  • 7.19 Fengpeng Electronics (Zhuhai)
    • 7.19.1 Fengpeng Electronics (Zhuhai) Company Information
    • 7.19.2 Fengpeng Electronics (Zhuhai) Introduction and Business Overview
    • 7.19.3 Fengpeng Electronics (Zhuhai) SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.19.4 Fengpeng Electronics (Zhuhai) SiN AMB Substrate Product Offerings
    • 7.19.5 Fengpeng Electronics (Zhuhai) Recent Development
  • 7.20 Guangzhou Xianyi Electronic Technology
    • 7.20.1 Guangzhou Xianyi Electronic Technology Company Information
    • 7.20.2 Guangzhou Xianyi Electronic Technology Introduction and Business Overview
    • 7.20.3 Guangzhou Xianyi Electronic Technology SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.20.4 Guangzhou Xianyi Electronic Technology SiN AMB Substrate Product Offerings
    • 7.20.5 Guangzhou Xianyi Electronic Technology Recent Development
  • 7.21 Fujian Huaqing Electronic Material Technology
    • 7.21.1 Fujian Huaqing Electronic Material Technology Company Information
    • 7.21.2 Fujian Huaqing Electronic Material Technology Introduction and Business Overview
    • 7.21.3 Fujian Huaqing Electronic Material Technology SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.21.4 Fujian Huaqing Electronic Material Technology SiN AMB Substrate Product Offerings
    • 7.21.5 Fujian Huaqing Electronic Material Technology Recent Development
  • 7.22 Konfoong Materials International
    • 7.22.1 Konfoong Materials International Company Information
    • 7.22.2 Konfoong Materials International Introduction and Business Overview
    • 7.22.3 Konfoong Materials International SiN AMB Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.22.4 Konfoong Materials International SiN AMB Substrate Product Offerings
    • 7.22.5 Konfoong Materials International Recent Development

8 Industry Chain Analysis

  • 8.1 SiN AMB Substrate Industrial Chain
  • 8.2 SiN AMB Substrate Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 SiN AMB Substrate Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 SiN AMB Substrate Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer
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