IC 전공정용 레이저 어닐링 장비 시장의 주요 기업은 어디인가요?

Veeco, Applied Materials, SCREEN Semiconductor Solutions 등이 있으며, 상위 3개사의 점유율은 78%가 넘습니다.

시장보고서

상품코드

1874435

세계의 IC 전공정용 레이저 어닐링 장비 : 시장 점유율과 순위, 전체 판매량 및 수요 예측(2025-2031년)

IC Front-end Laser Annealing Equipment - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

발행일: 2025년 10월 | 리서치사:

QYResearch | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

■ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송일정은 문의해 주시기 바랍니다.

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세계의 IC 전공정용 레이저 어닐링 장비 시장 규모는 2024년에 2억 3,300만 달러로 추정되며, 2025-2031년의 예측 기간에 CAGR 12.3%로 성장하여 2031년까지 5억 800만 달러로 확대될 것으로 예측됩니다.

본 보고서는 IC 프런트엔드 레이저 어닐링 장비에 대한 최근 관세 조정 및 국제 전략적 대응 조치, 국경 간 산업 발자국, 자본 배분 패턴, 지역 경제의 상호 의존성, 공급망 재구축에 대해 종합적으로 평가합니다.

IC 전공정용 레이저 어닐링 장비는 집적회로 제조에서 중요한 역할을 하는 장비입니다. 레이저 광을 이용하여 반도체 웨이퍼 표면을 국부적으로 가열 및 급냉시켜 재료의 결정 구조와 소자의 전기적 특성을 개선합니다. 주로 40nm 공정 이하의 칩 제조 공정에 사용됩니다.

IC 전공정용 레이저 어닐링 장비는 반도체 산업, 특히 집적회로(IC) 제조 전공정에서 중요한 역할을 담당하고 있으며, 재료의 격자 재조합, 응력 완화, 결함 복구 등의 분야에서 널리 활용되고 있습니다. 반도체 제조 공정이 고정밀화, 미세화, 저전력화로 발전함에 따라 레이저 어닐링 장비에 대한 시장 수요는 지속적인 성장 추세를 보이고 있습니다.

IC 전공정용 레이저 어닐링 장비의 응용은 주로 반도체 제조 전공정, 특히 웨이퍼 제조, 도핑 활성화, 전류 복구에 집중되어 있습니다. 첨단 물리적 처리 기술인 레이저 어닐링은 고에너지 레이저 펄스로 반도체 재료를 순간적으로 가열하여 재료 내부의 원자를 재배열하여 결정 구조 개선, 전도성 향상, 결함 밀도 감소를 실현합니다. 반도체 기술의 발전에 따라 레이저 어닐링 기술은 고정밀 공정에 단계적으로 도입되어 IC 제조에 필수적인 요소로 자리 잡고 있습니다.

최근 IC 전공정용 레이저 어닐링 장비 시장은 꾸준한 성장세를 보이고 있습니다. 주요 요인은 다음과 같습니다. 첫째, 반도체 산업의 기술 혁신, 특히 7nm, 5nm 이하의 미세공정 기술 추진에 따라 IC 제조에 있어 보다 정밀한 재료 가공 기술이 요구되고 있습니다. 둘째, 전자소자에 대한 성능 요구가 높아지는 가운데, 효율적이고 정밀한 가공 방법인 레이저 어닐링 기술은 IC 성능 향상에 큰 가능성을 보여주고 있습니다. 또한, 레이저 어닐링 장비는 생산 라인의 자동화를 촉진하고 생산 비용을 절감할 수 있어 시장 수요의 성장을 더욱 촉진하고 있습니다.

IC 전공정용 레이저 어닐링 장비의 세계 주요 업체로는 Veeco, Applied Materials, SCREEN Semiconductor Solutions 등이 있습니다. 상위 3개사의 점유율은 78%가 넘습니다. 아시아태평양이 가장 큰 시장으로 약 67%의 점유율을 차지하고 있습니다. 이어 북미가 18%, 유럽이 9% 시장 점유율을 차지하고 있습니다. 제품 유형별로는 14-28nm가 가장 큰 부문이며, 46%의 점유율을 차지하고 있습니다. 또한, 용도별로는 300mm 웨이퍼가 가장 큰 부문이며, 약 41%의 점유율을 가지고 있습니다.

이 보고서는 IC 프런트엔드 레이저 어닐링 장비 세계 시장에 대해 총 판매량, 매출, 가격, 주요 기업의 시장 점유율 및 순위에 초점을 맞추고 지역/국가, 유형 및 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.

IC 프런트엔드 레이저 어닐링 장비 시장 규모 추정 및 예측은 판매량(대수) 및 매출액(백만 달러)으로 제시되며, 2024년을 기준 연도로 하여 2020-2031년의 과거 데이터와 예측 데이터를 포함하는 2024년부터 2031년까지의 예측 데이터를 제공합니다. 정량적, 정성적 분석을 통해 독자들이 IC 전공정 레이저 어닐링 장비에 대한 사업 전략 및 성장 전략 수립, 시장 경쟁 평가, 현재 시장에서의 자사 포지셔닝 분석, 정보에 입각한 사업 판단을 할 수 있도록 지원합니다.

시장 세분화

기업별

Veeco
Applied Materials
SCREEN Semiconductor Solutions
Japan Steel Works
Hitachi
Beijing U-precision Tech

유형별 부문

14-28nm
28-40nm
기타

용도별 부문

200 mm 웨이퍼
300 mm 웨이퍼
기타

지역별

북미
- 미국
- 캐나다
아시아태평양
- 중국
- 일본
- 한국
- 동남아시아
- 인도
- 호주
- 기타 아시아태평양
유럽
- 독일
- 프랑스
- 영국
- 이탈리아
- 네덜란드
- 북유럽 국가
- 기타 유럽
라틴아메리카
- 멕시코
- 브라질
- 기타 라틴아메리카
중동 및 아프리카
- 튀르키예
- 사우디아라비아
- 아랍에미리트(UAE)
- 기타 중동 및 아프리카

LSH

자주 묻는 질문

IC 전공정용 레이저 어닐링 장비 시장 규모는 어떻게 예측되나요?
- 2024년에 2억 3,300만 달러로 추정되며, 2025-2031년의 예측 기간 동안 CAGR 12.3%로 성장하여 2031년까지 5억 800만 달러로 확대될 것으로 예측됩니다.
IC 전공정용 레이저 어닐링 장비의 주요 응용 분야는 무엇인가요?
- 주로 반도체 제조 전공정, 특히 웨이퍼 제조, 도핑 활성화, 전류 복구에 집중되어 있습니다.
IC 전공정용 레이저 어닐링 장비 시장의 주요 기업은 어디인가요?
- Veeco, Applied Materials, SCREEN Semiconductor Solutions 등이 있으며, 상위 3개사의 점유율은 78%가 넘습니다.
아시아태평양 지역의 IC 전공정용 레이저 어닐링 장비 시장 점유율은 얼마인가요?
- 아시아태평양이 가장 큰 시장으로 약 67%의 점유율을 차지하고 있습니다.
IC 전공정용 레이저 어닐링 장비의 기술 발전에 따른 시장 수요는 어떻게 변화하고 있나요?
- 반도체 제조 공정이 고정밀화, 미세화, 저전력화로 발전함에 따라 레이저 어닐링 장비에 대한 시장 수요는 지속적인 성장 추세를 보이고 있습니다.
IC 전공정용 레이저 어닐링 장비의 주요 기술적 특징은 무엇인가요?
- 고에너지 레이저 펄스로 반도체 재료를 순간적으로 가열하여 재료 내부의 원자를 재배열하여 결정 구조 개선, 전도성 향상, 결함 밀도 감소를 실현합니다.

The global market for IC Front-end Laser Annealing Equipment was estimated to be worth US$ 233 million in 2024 and is forecast to a readjusted size of US$ 508 million by 2031 with a CAGR of 12.3% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on IC Front-end Laser Annealing Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

IC front-end laser annealing equipment is a key equipment used in integrated circuit manufacturing. It uses laser beams to locally heat and quickly cool the surface of semiconductor wafers to improve the crystal structure of materials and the electrical properties of devices. IC front-end laser annealing equipment is mainly used in chip manufacturing with a process of 40nm and below.

IC front-end laser annealing equipment plays an important role in the semiconductor industry, especially in the front-end process of integrated circuit (IC) manufacturing, and is widely used in lattice reorganization, stress release, defect repair and other aspects of materials. As the semiconductor manufacturing process develops towards higher precision, smaller size and lower power consumption, the market demand for laser annealing equipment shows a continuous growth trend.

The application of IC front-end laser annealing equipment is mainly concentrated in the front-end process of semiconductor manufacturing, especially in wafer manufacturing, doping activation and current repair. As an advanced physical processing technology, laser annealing can quickly heat semiconductor materials through high-energy laser pulses, so that the atoms inside the material are rearranged, thereby improving the crystal structure, increasing conductivity and reducing defect density. With the development of semiconductor technology, laser annealing technology has gradually been introduced into higher-precision processes and has become an indispensable part of IC manufacturing.

The IC front-end laser annealing equipment market has shown a steady growth trend in recent years. The main reasons include the following aspects: First, the technological upgrading of the semiconductor industry, especially the promotion of 7nm, 5nm and smaller process technologies, requires more precise material processing technology in IC manufacturing. Secondly, as the performance requirements for electronic devices increase, laser annealing technology, as an efficient and precise processing method, has shown great potential in improving IC performance. In addition, laser annealing equipment can also improve the automation of production lines and reduce production costs, further promoting the growth of market demand.

Global key players of IC Front-end Laser Annealing Equipment include Veeco, Applied Materials, SCREEN Semiconductor Solutions, etc. The top three players hold a share over 78%. Asia-pacific is the largest market, which has a share about 67%, followed by North America and Europe with a market share of 18% and 9%, respectively. In terms of product type, 14-28nm is the largest segment, occupied for a share of 46%. And in terms of application, 300mm Wafer is the largest segment, which has a share about 41%.

This report aims to provide a comprehensive presentation of the global market for IC Front-end Laser Annealing Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of IC Front-end Laser Annealing Equipment by region & country, by Type, and by Application.

The IC Front-end Laser Annealing Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Front-end Laser Annealing Equipment.

Market Segmentation

By Company

Veeco
Applied Materials
SCREEN Semiconductor Solutions
Japan Steel Works
Hitachi
Beijing U-precision Tech

Segment by Type

14-28nm
28-40nm
Others

Segment by Application

200mm Wafer
300mm Wafer
Others

By Region

North America
- United States
- Canada
Asia-Pacific
- China
- Japan
- South Korea
- Southeast Asia
- India
- Australia
- Rest of Asia-Pacific
Europe
- Germany
- France
- U.K.
- Italy
- Netherlands
- Nordic Countries
- Rest of Europe
Latin America
- Mexico
- Brazil
- Rest of Latin America
Middle East & Africa
- Turkey
- Saudi Arabia
- UAE
- Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of IC Front-end Laser Annealing Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of IC Front-end Laser Annealing Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of IC Front-end Laser Annealing Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

1 Market Overview

1.1 IC Front-end Laser Annealing Equipment Product Introduction
1.2 Global IC Front-end Laser Annealing Equipment Market Size Forecast
- 1.2.1 Global IC Front-end Laser Annealing Equipment Sales Value (2020-2031)
- 1.2.2 Global IC Front-end Laser Annealing Equipment Sales Volume (2020-2031)
- 1.2.3 Global IC Front-end Laser Annealing Equipment Sales Price (2020-2031)
1.3 IC Front-end Laser Annealing Equipment Market Trends & Drivers
- 1.3.1 IC Front-end Laser Annealing Equipment Industry Trends
- 1.3.2 IC Front-end Laser Annealing Equipment Market Drivers & Opportunity
- 1.3.3 IC Front-end Laser Annealing Equipment Market Challenges
- 1.3.4 IC Front-end Laser Annealing Equipment Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered

2 Competitive Analysis by Company

2.1 Global IC Front-end Laser Annealing Equipment Players Revenue Ranking (2024)
2.2 Global IC Front-end Laser Annealing Equipment Revenue by Company (2020-2025)
2.3 Global IC Front-end Laser Annealing Equipment Players Sales Volume Ranking (2024)
2.4 Global IC Front-end Laser Annealing Equipment Sales Volume by Company Players (2020-2025)
2.5 Global IC Front-end Laser Annealing Equipment Average Price by Company (2020-2025)
2.6 Key Manufacturers IC Front-end Laser Annealing Equipment Manufacturing Base and Headquarters
2.7 Key Manufacturers IC Front-end Laser Annealing Equipment Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of IC Front-end Laser Annealing Equipment
2.9 IC Front-end Laser Annealing Equipment Market Competitive Analysis
- 2.9.1 IC Front-end Laser Annealing Equipment Market Concentration Rate (2020-2025)
- 2.9.2 Global 5 and 10 Largest Manufacturers by IC Front-end Laser Annealing Equipment Revenue in 2024
- 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Front-end Laser Annealing Equipment as of 2024)
2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

3.1 Introduction by Type
- 3.1.1 14-28nm
- 3.1.2 28-40nm
- 3.1.3 Others
3.2 Global IC Front-end Laser Annealing Equipment Sales Value by Type
- 3.2.1 Global IC Front-end Laser Annealing Equipment Sales Value by Type (2020 VS 2024 VS 2031)
- 3.2.2 Global IC Front-end Laser Annealing Equipment Sales Value, by Type (2020-2031)
- 3.2.3 Global IC Front-end Laser Annealing Equipment Sales Value, by Type (%) (2020-2031)
3.3 Global IC Front-end Laser Annealing Equipment Sales Volume by Type
- 3.3.1 Global IC Front-end Laser Annealing Equipment Sales Volume by Type (2020 VS 2024 VS 2031)
- 3.3.2 Global IC Front-end Laser Annealing Equipment Sales Volume, by Type (2020-2031)
- 3.3.3 Global IC Front-end Laser Annealing Equipment Sales Volume, by Type (%) (2020-2031)
3.4 Global IC Front-end Laser Annealing Equipment Average Price by Type (2020-2031)

4 Segmentation by Application

4.1 Introduction by Application
- 4.1.1 200mm Wafer
- 4.1.2 300mm Wafer
- 4.1.3 Others
4.2 Global IC Front-end Laser Annealing Equipment Sales Value by Application
- 4.2.1 Global IC Front-end Laser Annealing Equipment Sales Value by Application (2020 VS 2024 VS 2031)
- 4.2.2 Global IC Front-end Laser Annealing Equipment Sales Value, by Application (2020-2031)
- 4.2.3 Global IC Front-end Laser Annealing Equipment Sales Value, by Application (%) (2020-2031)
4.3 Global IC Front-end Laser Annealing Equipment Sales Volume by Application
- 4.3.1 Global IC Front-end Laser Annealing Equipment Sales Volume by Application (2020 VS 2024 VS 2031)
- 4.3.2 Global IC Front-end Laser Annealing Equipment Sales Volume, by Application (2020-2031)
- 4.3.3 Global IC Front-end Laser Annealing Equipment Sales Volume, by Application (%) (2020-2031)
4.4 Global IC Front-end Laser Annealing Equipment Average Price by Application (2020-2031)

5 Segmentation by Region

5.1 Global IC Front-end Laser Annealing Equipment Sales Value by Region
- 5.1.1 Global IC Front-end Laser Annealing Equipment Sales Value by Region: 2020 VS 2024 VS 2031
- 5.1.2 Global IC Front-end Laser Annealing Equipment Sales Value by Region (2020-2025)
- 5.1.3 Global IC Front-end Laser Annealing Equipment Sales Value by Region (2026-2031)
- 5.1.4 Global IC Front-end Laser Annealing Equipment Sales Value by Region (%), (2020-2031)
5.2 Global IC Front-end Laser Annealing Equipment Sales Volume by Region
- 5.2.1 Global IC Front-end Laser Annealing Equipment Sales Volume by Region: 2020 VS 2024 VS 2031
- 5.2.2 Global IC Front-end Laser Annealing Equipment Sales Volume by Region (2020-2025)
- 5.2.3 Global IC Front-end Laser Annealing Equipment Sales Volume by Region (2026-2031)
- 5.2.4 Global IC Front-end Laser Annealing Equipment Sales Volume by Region (%), (2020-2031)
5.3 Global IC Front-end Laser Annealing Equipment Average Price by Region (2020-2031)
5.4 North America
- 5.4.1 North America IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 5.4.2 North America IC Front-end Laser Annealing Equipment Sales Value by Country (%), 2024 VS 2031
5.5 Europe
- 5.5.1 Europe IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 5.5.2 Europe IC Front-end Laser Annealing Equipment Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
- 5.6.1 Asia Pacific IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 5.6.2 Asia Pacific IC Front-end Laser Annealing Equipment Sales Value by Region (%), 2024 VS 2031
5.7 South America
- 5.7.1 South America IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 5.7.2 South America IC Front-end Laser Annealing Equipment Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
- 5.8.1 Middle East & Africa IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 5.8.2 Middle East & Africa IC Front-end Laser Annealing Equipment Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

6.1 Key Countries/Regions IC Front-end Laser Annealing Equipment Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions IC Front-end Laser Annealing Equipment Sales Value and Sales Volume
- 6.2.1 Key Countries/Regions IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 6.2.2 Key Countries/Regions IC Front-end Laser Annealing Equipment Sales Volume, 2020-2031
6.3 United States
- 6.3.1 United States IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 6.3.2 United States IC Front-end Laser Annealing Equipment Sales Value by Type (%), 2024 VS 2031
- 6.3.3 United States IC Front-end Laser Annealing Equipment Sales Value by Application, 2024 VS 2031
6.4 Europe
- 6.4.1 Europe IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 6.4.2 Europe IC Front-end Laser Annealing Equipment Sales Value by Type (%), 2024 VS 2031
- 6.4.3 Europe IC Front-end Laser Annealing Equipment Sales Value by Application, 2024 VS 2031
6.5 China
- 6.5.1 China IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 6.5.2 China IC Front-end Laser Annealing Equipment Sales Value by Type (%), 2024 VS 2031
- 6.5.3 China IC Front-end Laser Annealing Equipment Sales Value by Application, 2024 VS 2031
6.6 Japan
- 6.6.1 Japan IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 6.6.2 Japan IC Front-end Laser Annealing Equipment Sales Value by Type (%), 2024 VS 2031
- 6.6.3 Japan IC Front-end Laser Annealing Equipment Sales Value by Application, 2024 VS 2031
6.7 South Korea
- 6.7.1 South Korea IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 6.7.2 South Korea IC Front-end Laser Annealing Equipment Sales Value by Type (%), 2024 VS 2031
- 6.7.3 South Korea IC Front-end Laser Annealing Equipment Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
- 6.8.1 Southeast Asia IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 6.8.2 Southeast Asia IC Front-end Laser Annealing Equipment Sales Value by Type (%), 2024 VS 2031
- 6.8.3 Southeast Asia IC Front-end Laser Annealing Equipment Sales Value by Application, 2024 VS 2031
6.9 India
- 6.9.1 India IC Front-end Laser Annealing Equipment Sales Value, 2020-2031
- 6.9.2 India IC Front-end Laser Annealing Equipment Sales Value by Type (%), 2024 VS 2031
- 6.9.3 India IC Front-end Laser Annealing Equipment Sales Value by Application, 2024 VS 2031

7 Company Profiles

7.1 Veeco
- 7.1.1 Veeco Company Information
- 7.1.2 Veeco Introduction and Business Overview
- 7.1.3 Veeco IC Front-end Laser Annealing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.1.4 Veeco IC Front-end Laser Annealing Equipment Product Offerings
- 7.1.5 Veeco Recent Development
7.2 Applied Materials
- 7.2.1 Applied Materials Company Information
- 7.2.2 Applied Materials Introduction and Business Overview
- 7.2.3 Applied Materials IC Front-end Laser Annealing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.2.4 Applied Materials IC Front-end Laser Annealing Equipment Product Offerings
- 7.2.5 Applied Materials Recent Development
7.3 SCREEN Semiconductor Solutions
- 7.3.1 SCREEN Semiconductor Solutions Company Information
- 7.3.2 SCREEN Semiconductor Solutions Introduction and Business Overview
- 7.3.3 SCREEN Semiconductor Solutions IC Front-end Laser Annealing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.3.4 SCREEN Semiconductor Solutions IC Front-end Laser Annealing Equipment Product Offerings
- 7.3.5 SCREEN Semiconductor Solutions Recent Development
7.4 Japan Steel Works
- 7.4.1 Japan Steel Works Company Information
- 7.4.2 Japan Steel Works Introduction and Business Overview
- 7.4.3 Japan Steel Works IC Front-end Laser Annealing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.4.4 Japan Steel Works IC Front-end Laser Annealing Equipment Product Offerings
- 7.4.5 Japan Steel Works Recent Development
7.5 Hitachi
- 7.5.1 Hitachi Company Information
- 7.5.2 Hitachi Introduction and Business Overview
- 7.5.3 Hitachi IC Front-end Laser Annealing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.5.4 Hitachi IC Front-end Laser Annealing Equipment Product Offerings
- 7.5.5 Hitachi Recent Development
7.6 Beijing U-precision Tech
- 7.6.1 Beijing U-precision Tech Company Information
- 7.6.2 Beijing U-precision Tech Introduction and Business Overview
- 7.6.3 Beijing U-precision Tech IC Front-end Laser Annealing Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
- 7.6.4 Beijing U-precision Tech IC Front-end Laser Annealing Equipment Product Offerings
- 7.6.5 Beijing U-precision Tech Recent Development

8 Industry Chain Analysis

8.1 IC Front-end Laser Annealing Equipment Industrial Chain
8.2 IC Front-end Laser Annealing Equipment Upstream Analysis
- 8.2.1 Key Raw Materials
- 8.2.2 Raw Materials Key Suppliers
- 8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
- 8.5.1 IC Front-end Laser Annealing Equipment Sales Model
- 8.5.2 Sales Channel
- 8.5.3 IC Front-end Laser Annealing Equipment Distributors

9 Research Findings and Conclusion

10 Appendix

10.1 Research Methodology
- 10.1.1 Methodology/Research Approach
  - 10.1.1.1 Research Programs/Design
  - 10.1.1.2 Market Size Estimation
  - 10.1.1.3 Market Breakdown and Data Triangulation
- 10.1.2 Data Source
  - 10.1.2.1 Secondary Sources
  - 10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer