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자율주행용 도메인 컨트롤러 및 센트럴 컴퓨팅 유닛(CCU) 시장 보고서(2026년)

Autonomous Driving Domain Controller and Central Computing Unit (CCU) Industry Report, 2026

발행일: | 리서치사: 구분자 ResearchInChina | 페이지 정보: 영문 650 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



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자율주행 도메인 컨트롤러(ADCU)에 관한 조사 : 원칩 CCU 솔루션이 자동차에 빠르게 도입되고 있습니다

중국 승용차 시장에서 양산되고 있는 자율주행 시스템은 L2에서 L2.5/L2.9로 점차 전환되고 있습니다. 2026년 이후, 일부 L3 자율주행 시스템에서는 임베디드 하드웨어를 통해 양산 및 상용화가 서서히 진행되고 있습니다. 또한, 각 OEM 업체들은 L4 수준의 로보택시 도입을 적극적으로 추진하고 있습니다. XPeng과 Geely는 잇달아 로보택시를 출시하고 있으며, 2027년부터 2028년까지 제3자와의 제휴를 통해 로보택시 운행을 계획하고 있습니다.

강제적인 국가 표준인 ‘지능형 및 연결형 차량 - 자율주행 시스템의 안전 요건’(GB 44721-2026)이 2026년 7월 30일에 공포되었으며, 2027년 7월 1일부터 정식으로 시행될 예정입니다. 2026년은 레벨 3 자율주행 시스템의 대규모 상용화가 시작되는 첫 해가 될 것이며, 고성능 ADCU의 출하대수는 계속해서 증가할 전망입니다.

‘Starry’는 스마트 콕핏과 자율주행이라는 두 가지 주요 연산 작업을 단일 칩으로 통합하고 있습니다. 경쟁사의 ‘자율주행 칩 + 콕핏 칩’ 솔루션과 비교하여 공간을 50% 절약하고, 부품 수를 30% 줄일 수 있으며,소프트웨어와 하드웨어 통합 시간을 56% 단축하고, 연구개발 리드타임을 18개월에서 8개월로 단축하며, 차량당 비용을 1,500-4,000위안 절감할 수 있습니다. Horizon Robotics는 2026년 10월에 ‘Starry’의 생산을 시작하고, 내년부터는 양산을 시작할 예정입니다.

이 칩을 채택하는 첫 번째 프로젝트에서는 PATEO CONNECT+ 및 BICV 등과의 제휴가 확정되어, 중국의 주요 신에너지차 OEM 제조사에 서비스를 제공하게 됩니다.

‘센트럴+존(Central+Zone)’ 아키텍처의 보급에 따라, 단일 칩 CCU 솔루션의 보급률은 급속히 높아지고 있습니다.

2025년은 단일 칩 솔루션의 양산이 시작된 첫 해로, Arcfox aT5와 동풍 닛산 N6가 양산 및 상용화를 선도했습니다. 2026년에는 Qualcomm SA8775/SA8797 및 Black Sesame Wudang C1296 등의 원칩 솔루션이 양산에 들어갔으며, Horizon Robotics의 ‘Starry’도 생태계의 강점을 살려 시장에 진출했습니다. 2027년부터 2028년까지 ‘센트럴+존’ 아키텍처의 보급률이 높아짐에 따라, 원칩 솔루션은 급속히 주류가 될 것입니다. 2030년까지 단일 칩 솔루션의 시장 점유율은 15.3%에 달하며, 359만 9,000대의 차량에 탑재될 것으로 예상됩니다.

현재 보쉬, ThunderX, AutoLink World, DeepRoute.ai는 퀄컴의 스냅드래곤 8797을 기반으로 한 CCU를 출시하고 있으며, 이들 제품은 2026년부터 2028년까지 양산되어 차량에 탑재될 전망입니다. ThunderX와 BICV는 호라이즌 로보틱스의 ‘Starry’를 기반으로 한 칩의 호환성 테스트를 진행하고 있습니다. Black Sesame의 ‘Wudang C1296’은 동풍자동차의 ‘Tianyuan Intelligent Cockpit Plus Platform’에 채택되어, 동풍 eπ007에 최초로 탑재될 예정입니다. 향후 동풍자동차의 모든 차종에 탑재될 전망이며, 2026년부터 2027년까지 여러 차종에서 양산이 계획되어 있습니다.

퀄컴 SA8797을 탑재한 세계 최초의 차종으로서, Leapmotor D19가 2026년 4월에 정식 출시되었습니다. 이 차량의 CCU에는 2개의 퀄컴 스냅드래곤 8797 칩이 탑재되어 있으며, 종합 연산 성능은 1280TOPS(4비트 스파스 연산 기준), 메모리 대역폭은 최대 540GB/s에 달합니다. 이는 현재 양산 중인 차량 중 가장 높은 연산 능력을 자랑하는 콕핏·주행 통합 솔루션 중 하나입니다. 듀얼 칩의 연동이 실현되면:

CPU : 2x18 Oryon, 160 SpecInt2k17rate. 시스템의 원활한 작동과 멀티태스킹 처리를 담당합니다.

GPU : 2x770 FPS Man 3.0. 화면 그래픽 렌더링, AR 표시 및 3A 화질 처리를 담당합니다;

NPU : 640TOPS(싱글), 1280TOPS(듀얼)로, AI 기반 모델과 자율주행의 의사결정을 강화합니다;

메모리 : 콕핏 내부에 48GB, 자율주행을 위해 64GB를 탑재했습니다. LPDDR5x가 540GB/s의 초고속 대역폭을 제공하여, 기능의 지연 없는 동시 실행을 보장합니다;

안전성 : ASIL-D를 준수하는 하드웨어 보안 아일랜드를 내장하여 자동차 업계 최고 수준의 기능 안전성을 확보함과 동시에, 폭주나 고장에 대한 근본적인 보호 기능을 실현합니다.

듀얼 8797 칩과 초대용량 메모리를 기반으로 하는 Leapmotor D19는 LEAP 4.0을 탑재하여, 콕핏과 주행의 통합을 통해 획기적인 시너지 효과를 실현하고 있습니다. 기존 차량 모델에서 콕핏과 자율주행 간의 긴밀한 연동을 가로막던 장벽을 허물고, ‘하나의 뇌로 차량의 지능을 제어’하는 것을 가능하게 합니다.

연산 능력의 동적 할당 : 시스템은 주행 상황에 따라 듀얼 8797 칩의 연산 능력을 자동으로 할당합니다. 엔터테인먼트 상황에서는 콕핏의 GPU/CPU 성능을 중시하고, 자율주행 시에는 NPU의 연산 능력을 강화함으로써 칩의 성능을 효율적으로 활용합니다.

양방향 데이터 상호 운용성 : 콕핏과 자율주행 시스템이 깊이 통합되어 있어, 내비게이션 정보, 자율주행 영상, 엔터테인먼트 콘텐츠가 매끄럽게 렌더링 및 전환되며, 자율주행 상태는 클러스터 및 CID에 실시간으로 동기화됩니다;

모든 영역에서 밀리초 수준의 응답성 : 차량 내 전송을 통해 지각, 의사결정부터 실행에 이르는 전 과정에서 지연이 발생하지 않습니다.

단일 Snapdragon 8797 칩의 AI 연산 능력은 최대 640TOPS(4비트 스파스 연산 기준)에 달합니다. 듀얼 칩 아키텍처에서는 한 칩이 음성 상호작용,앰비언트 조명, HUD 투사 등의 콕핏 작업에 전념하고, 다른 칩은 지각 융합, 경로 결정, 차량 모니터링 등의 자율주행 작업을 처리합니다. 통합된 미들웨어를 통해 고속 통신이 실현되며, 각 칩은 하이퍼바이저가 지원하는 안정적인 환경에서 작동합니다.

콕핏용으로는 QAM8797P에 48GB의 LPDDR5X와 128GB의 UFS를 조합하고, 자율주행용으로는 64GB의 LPDDR5X와 256GB의 UFS를 구성하고 있습니다. QAM8797P에는 뒷면에 8개의 XPMAU0102, 1개의 XPMAU0101, 그리고 1개의 XTI TPS659472E를 포함하여 총 10개의 PMIC가 탑재되어 있습니다. 디시리얼라이제이션용 칩은 4개입니다. 이 모든 칩이 ADI의 MAX96724일 것으로 추정되지만, 그중 1개는 MAX96714일 가능성이 있습니다. 사이드 뷰, 프론트 스테레오, 리어 뷰 각 카메라에는 2개의 MAX96724 디시리얼라이저가 할당되어 있으며, 서라운드 뷰 카메라에는 1개의 MAX96724 디시리얼라이저가 대응하고 있습니다. 또한, DMS는 1개의 MAX96714 또는 MAX96724 디시리얼라이저에 의해 지원됩니다. D19에는 CID, 클러스터 스크린, AR HUD, 천장 스크린, DLP 프로젝터 등 총 5개의 스크린이 탑재되어 있습니다. 직렬 칩은 4개이며, 클러스터 스크린과 AR HUD는 하나의 직렬 칩을 공유할 가능성이 있습니다. Wi-Fi 및 블루투스 모듈은 Quectel AF67E이며, 이더넷 스위치는 Realtek RTL9071CP를 채택하고 있습니다. MCU, 즉 르네사스 U2A16은 별도의 PCB에 탑재되어 있습니다.

2026년 9월에 개최된 Leapmotor Tech Day에서 Leapmotor는 새로운 차량 아키텍처 ‘LEAP 5.0’을 공식 발표했습니다. 중앙 도메인 제어형 전자 아키텍처인 LEAP 5.0은 진정한 중앙 집중형 통합 제어 모드를 채택하고 있습니다. 중앙 도메인 컨트롤러가 일원적으로 결정을 내리고, 다른 도메인 컨트롤러는 단순히 작업을 실행할 뿐입니다. 차량의 와이어링 하네스는 500미터 이내로 제한되어 있습니다. 이 아키텍처는 LEAP 3.0 및 LEAP 4.0을 바탕으로 지속적으로 개선된 것입니다. 또한 업계 최초로 48V 전원 공급 장치와 10기가비트 이더넷을 동시에 구현한 집중 통합형 EEA이기도 합니다. 이 아키텍처에는 3가지 핵심 하드웨어 및 소프트웨어 기능이 있습니다:

차량은 48V로 구동됩니다. 기존의 12V 전원 공급 장치와 비교하여 와이어링 하네스의 무게가 50% 경감되었으며, 섀시 바이 와이어 및 고출력 차량 내 생활 기능을 지원할 수 있습니다.

본 차량은 10G 다운링크, 100M 업링크를 갖춘 비대칭 이더넷과 통일된 차량용 통신 프로토콜을 채택하여, 게이트웨이에서의 프로토콜 변환에 따른 손실을 줄이고 있습니다;

‘차량-클라우드 에이전트 OS’를 탑재한 자동차용 에이전트는 저지연 작동과 데이터 프라이버시를 보장합니다. 클라우드 에이전트는 복잡한 추론과 장기 기억을 처리하며, 경량화된 반복 처리를 통해 차량이 사용자의 습관을 지속적으로 학습하고 적응할 수 있도록 합니다.

ADCU는 업그레이드와 반복적인 개선이 진행 중이며, 일부 OEM은 높은 연산 능력을 갖춘 자율주행용 칩의 자체 개발을 시작하고 있습니다.

Li Auto는 현재 ADCU로 ‘AD Pro’와 ‘AD MAX’ 두 가지 버전을 출시하고 있습니다:

AD Pro는 당초 Horizon Robotics의 J5를 핵심으로 했으나, 현재는 Horizon Robotics의 J6M을 채택하고 있습니다.

AD MAX는 당초 NVIDIA Orin-X를 핵심으로 삼았으나, 대신 NVIDIA Thor-U를 채택했습니다.

동시에 Li Auto는 NVIDIA Thor-U를 자체 개발한 Mach M100으로 대체했습니다. Mach M100에는 자체 개발한 NPU, 애플리케이션 CPU, 멀티미디어 IP, 보안 모듈 및 표준 I/O 인터페이스가 탑재되어 있어, 고수준의 NOA 및 향후 L3/L4 기능을 지원합니다. Mach M100 칩 1개의 실효 연산 성능은 1280TOPS에 달하며, 이는 NVIDIA Thor-U의 약 3배에 해당합니다. 또한, 2칩 구성의 실효 연산 성능은 NVIDIA Thor-U의 5-6배에 달할 가능성이 있습니다.

MACH M100은 생산을 급속히 확대하고 있습니다. Li Auto는 2026년 8월 기준으로 5만 개 이상의 MACH M100 칩을 출하했다고 밝혔습니다. 현재 두 번째 자체 개발 칩인 ‘Mach 200’은 테이프아웃 단계에 접어들었으며, 2027년에 양산이 시작될 전망입니다. 칩당 연산 능력은 2,000TOPS를 초과하며, 제조 공정은 3nm로 업그레이드되었습니다. Li Auto의 칩 로드맵은 매우 명확하여, 콕핏에서 시작하여 자율주행으로 확대되고, 나아가 콕핏과 주행의 통합으로 발전해 나가는 것입니다.

2024년 초 Turing 칩의 양산 개시 이후, XPeng은 중앙 연산 도메인 컨트롤러(XCCP)를 대폭 개편할 계획이며, 이를 통해 XPeng의 모든 차종에 Turing 칩이 탑재될 예정입니다. 구성은 4가지(하이, 미디엄, 로우)입니다:

Turing 칩 1개와 MediaTek MT8676(Fibocom AN762S)을 조합한 구성입니다. 이 구성을 채택한 대표적인 차종은 MONA 03 MAX입니다.

Turing 칩 2개와 MediaTek MT8676을 조합한 구성입니다. MONA 03 Ultra SE가 이 구성을 채택하고 있습니다.

튜링 칩 3개를 탑재한 구성에서는 그중 2개가 XCCP에, 1개가 VLMU에 각각 단독으로 배치됩니다. G7 등 중급 차종에는 미디어텍 MT8676이 탑재되어 있으며, X9나 GX 등 고급 차종에는 퀄컴 SA8295가 탑재되어 있습니다.

XPeng의 로봇 택시에는 4개의 Turing 칩이 사용되며, 여기에 자율주행용 이중화 시스템으로 1개가 추가로 탑재됩니다. 이러한 노력을 통해 Turing 칩의 출하량을 극대화하고, 칩 연구개발비 및 NRE 비용을 분산시킬 수 있을 뿐만 아니라, 하드웨어 시스템 설계를 간소화하고 연구 성과를 다목적으로 활용하여 연구개발 비용을 절감하는 것도 가능합니다.

최초로 적용되는 차종인 Xpeng G7 Ultra에는 3개의 Turing AI 칩이 탑재되어 있으며, 실효 연산 성능은 2200+TOPS, 메모리 용량은 216GB로 업계 최초의 L3 컴퓨팅 플랫폼을 자랑합니다. 로컬 VLA+VLM의 등장 : VLA-OL은 자율주행에 최초로 ‘모션 셀레브럼’을 추가했으며, 그 자율주행 능력의 상한선은 업계 최고 사양의 차량과 비교해 10배 이상 높습니다. VLM은 차량이 외부 환경을 이해하기 위한 AI 뇌이자, 사람과 차량 간의 대화 및 제어를 위한 차세대 OS의 진입점이며, 차세대 AIDV(자율주행차)의 표준 기능이 될 것입니다.

VLA-OL은 완전히 로컬에서 작동하며, 더 강력한 기능을 갖추고 있어 네트워크 연결이 필요하지 않고 전 세계 어디에서나 신속하게 배포할 수 있습니다. 또한 높은 프레임 레이트, 낮은 지연 시간, 긴 시퀀스 처리와 같은 특징도 갖추고 있습니다. 4D 비디오 스트림을 통한 지각 융합과 360° 전방위 지각을 통해, 어두운 곳, 역광, 비나 눈 등 복잡한 상황에서의 환경 인식 능력을 향상시켜, 자율주행이 도로 상황에 더 정확하게 대응할 수 있도록 지원합니다. 향후 이 모델은 구급차 인식 및 양보, 정체 구간에서의 적절한 차선 변경, 노면 붕괴 회피라는 3가지 주요 시나리오를 지원하게 될 것입니다.

2026년 3월 20일에 개최된 XPeng의 실적 설명회 정보에 따르면, XPeng의 Turing 칩 누적 출하대수는 20만 대를 돌파했습니다. 2026년 2분기부터는 모든 차종(Max 포함)에 Turing이 탑재될 전망이며, 연간 출하대수는 100만 대에 육박할 것으로 예상됩니다. 자동차 사업에서의 대규모 생산에 힘입어 Turing 칩 1개당 제조 비용은 2,500-3,000위안까지 낮아졌습니다.

XPeng G7에서 XCCP는 상자처럼 보이지만, 실제로는 상하 두 개의 상자가 고정되어 구성되어 있습니다. 기판 위에는 Turing 칩이 탑재되어 있으며, 64GB의 저장 용량을 갖추고 있습니다. LPDDR5는 Micron D8CWL, UFS는 Micron SH021로 추정되며, 용량은 256GB입니다. XPeng G7의 XCCP는 2개의 MCU(인피니온 TC397)를 채택하고 있으며, 콕핏에는 르네사스의 U2A16이 사용되고 있습니다. 이는 아마도 게이트웨이 처리도 담당하고 있는 것으로 보입니다. U2A16에 탑재된 QSPI NorFlash는 매크로닉스 제품입니다. U2A16 전용 ASIL-D 대응 PMIC로 르네사스의 RAA271084가 채택되어 있으며, 이를 통해 시스템이 ASIL-D 기준을 충족함을 보장합니다.

MTK MT8676을 기반으로 한 Fibocom AN762S-CN은 안드로이드를 내장한 차세대 멀티 모드 지원 지능형 5G Sub-6 통신 모듈입니다. AN762S-CN은 60×60×5.0mm(미정)의 SiP 패키지를 채택하여, 고객이 단말기를 유연하게 개발할 수 있도록 지원합니다. 5G Sub-6, LTE, WCDMA, GSM 등의 네트워크 규격을 지원하며, Wi-Fi 6E, BT5.3 및 멀티 콘스텔레이션 GNSS를 지원합니다. AN762S-CN은 AEC-Q104 인증을 획득했습니다. CPU 연산 성능은 170K DMIPS, GPU 연산 성능은 1.8TFLOPS, NPU 연산 성능은 20TOPS입니다.

상호연결에 대해서는 최첨단 10G 이더넷을 활용하여 여러 개의 Turing 칩을 연결하는 설계로 되어 있습니다. Broadcom BCM89890(10G 이더넷 PHY 칩)이 채택되었습니다. 이더넷 스위치로는 인피니언(Infineon)사의 88Q6113이 채택되어 있으며, 2개의 10G 포트를 지원합니다. 3-Turing 및 4-Turing 구성에서는 8개의 10G 포트를 갖추고 90G의 논블로킹 스위칭 용량을 실현하는 인피니온사의 MVQ6223이 채택될 가능성이 있습니다. 이는 현재 자동차 업계에서 최고 수준의 성능입니다.

2026년 5월, BYD는 중국 최초의 4nm 자율주행용 칩 ‘Xuanji A3’를 발표했습니다. 이 칩은 이미 양산 중이며, L3 및 L4 자율주행을 지원합니다. 3개의 칩이 효율적으로 연동되어 전력 소비 제어와 연산 능력 활용도를 고려하면서도, 총 2,100TOPS를 넘는 연산 능력을 실현하고 있습니다.

BYD는 플랫폼 아키텍처에 10단계의 중복성을 갖춘 ‘DiPilot(L3/L4)’의 출시를 계획하고 있습니다. 또한, 지각 계층의 센서 중복성부터 연산 계층의 SoC 및 MCU 중복성, 제어 계층의 알고리즘과 전원 중복성, 나아가 실행 계층의 조향,브레이크, 잠금 해제, 통신, 주차에 이르는 중복성까지, 자율주행 시스템의 모든 측면에서 다중 백업을 실현하고 있습니다. 또한, 1,000채널을 넘는 LiDAR, 1,000fps의 세계 셔터 카메라, 듀얼 장파장 IR 카메라를 탑재한 세계 최초의 시스템입니다. 1,000채널을 넘는 LiDAR는 4K 화질 수준의 감지 능력과 600미터라는 초장거리 감지 범위를 갖추고 있습니다. 세계 셔터 카메라는 1,000fps라는 초고프레임 레이트와 1ms 미만의 초저지연을 실현하여 L3 기능의 이중화를 확보하고 있습니다.

목차

제1장 ADCU 및 CCU 시장

제2장 고·중·저 레벨 자율주행 칩 플랫폼 및 ADCU 솔루션

제3장 국내외 OEM 각사의 ADCU 솔루션

제4장 국내의 ADCU 벤더

제5장 해외의 ADCU 벤더

KSM

Autonomous Driving Domain Controller (ADCU) Research: One-Chip CCU solutions are quickly available in vehicles

In China's passenger car market, autonomous driving systems involved in mass production have gradually shifted from L2 to L2.5/L2.9. Some L3 autonomous driving systems have gradually seen mass production and application through embedded hardware since 2026. In addition, OEMs are actively deploying L4 robotaxis. XPeng and Geely have successively launched robotaxis, and plan to cooperate with third parties in robotaxi operation in 2027-2028.

The mandatory national standard "Intelligent and Connected Vehicle - Safety Requirements for Automated Driving System" (GB 44721-2026) was released on July 30, 2026, and is scheduled to be officially implemented on July 1, 2027. 2026 marks the first year for large-scale commercial deployment of L3 autonomous driving systems, and high-level ADCUs will continue to see increase in volume.

"Starry" integrates the two major computing tasks of smart cockpit and autonomous driving through a single chip. Compared with the competitive "autonomous driving chip + cockpit chip" solution, the space can be saved by 50%, the components can be reduced by 30%, the software and hardware integration time is shortened by 56%, the R&D delivery cycle is compressed from 18 months to 8 months, and the cost per vehicle is reduced by RMB1,500 to 4,000. Horizon Robotics plans to start the production of "Starry" in October 2026, with mass production scheduled next year.

The first project adopting this chip has confirmed partnerships with PATEO CONNECT+, BICV, etc. to serve a leading new energy vehicle OEM in China.

With the popularization of the "central + zone" architecture, the penetration rate of One-Chip CCU solutions is rapidly increasing

2025 marked the first year of mass production for One-Chip solutions, with Arcfox aT5 and Dongfeng Nissan N6 taking the lead in mass production and application. In 2026, One-Chip solutions such as Qualcomm SA8775/SA8797 and Black Sesame Wudang C1296 entered mass production, and Horizon Robotics Starry made its foray into the market with its ecosystem advantages. From 2027 to 2028, with the increasing penetration rate of the "central + zone" architecture, One-Chip solutions will prevail quickly. It is expected that by 2030, One-Chip solutions will account for 15.3%, and be installed in 3.599 million vehicles.

Currently, Bosch, ThunderX, AutoLink World, and DeepRoute.ai have launched CCUs based on Qualcomm Snapdragon 8797, which are expected to be mass-produced and applied to vehicles from 2026 to 2028. ThunderX and BICV are conducting chip adaptation tests based on Horizon Robotics Starry. Black Sesame Wudang C1296 has been designated for Dongfeng's Tianyuan Intelligent Cockpit Plus Platform and will be the first mounted on Dongfeng eπ007. It is expected to be installed on all of Dongfeng's vehicle models in the future, and mass production is planned for multiple vehicle models from 2026 to 2027.

As the world's first vehicle model equipped with Qualcomm SA8797, Leapmotor D19 was officially launched in April 2026. Its CCU is equipped with two Qualcomm Snapdragon 8797 chips, with a comprehensive computing power of 1280TOPS (based on 4-bit sparse computing) and a memory bandwidth of up to 540GB/s. It is one of the cockpit-driving integration solutions with the strongest computing power in current production vehicles. After dual-chip collaboration is attained:

CPU: 2x18Oryon, 160SpecInt2k17rate, responsible for smooth system and multi-task operation;

GPU: 2x770FPSMan3.0, responsible for screen graphics rendering, AR display, and 3A image quality;

NPU: 640TOPS (single), 1280TOPS (dual), empowering AI foundation models and autonomous driving decision-making;

Memory: 48GB memory in the cockpit, 64GB memory in autonomous driving; LPDDR5x provides 540GB/s ultra-high bandwidth, ensuring that functions can run simultaneously without lag;

Safety: Built-in ASIL-D compliant hardware security island, highest automotive-grade functional safety level, underlying protection against runaway and faults.

Relying on dual 8797 chips + ultra-large memory, Leapmotor D19 is equipped with LEAP 4.0, pioneering cockpit-driving integration super synergy, breaking the barriers of traditional vehicle model cockpit and autonomous driving in-depth synergy, and enabling "a cerebrum to control the vehicle intelligence."

Dynamic allocation of computing power: The system will automatically allocate the computing power of the dual 8797 chips according to the car scenario. The entertainment scenario focuses on the cockpit GPU/CPU performance, and the NPU computing power is enhanced in autonomous driving to efficiently utilize the chip performance;

Two-way data interoperability: The cockpit and the autonomous driving system are deeply integrated, navigation information, autonomous driving pictures, and entertainment content are seamlessly rendered and switched without any sense, and the autonomous driving status is synchronized to the cluster and CID in real time;

Full-domain millisecond-level response: In-board transmission and no delay in the entire process from perception, decision-making to execution.

The AI computing power of a single Snapdragon 8797 chip is up to 640TOPS (based on 4-bit sparse computing). In the dual-chip architecture, one chip focuses on cockpit tasks such as voice interaction, ambient lighting, and HUD projection; the other handles autonomous driving tasks, including perception fusion, path decision-making, and vehicle monitoring. High-speed communication is realized via unified middleware, and each chip operates in a stable environment supported by Hypervisor.

For the cockpit, QAM8797P is paired with 48GB LPDDR5X and 128GB UFS; for autonomous driving, it is configured with 64GB LPDDR5X and 256GB UFS. QAM8797P has 10 PMICs, including 8XPMAU0102, 1XPMAU0101, and 1XTI TPS659472E on the back. There are four chips for deserialization. It is estimated that all of them are ADI MAX96724, but one of them may be MAX96714. The side view, front stereo and rear view cameras are involved with two MAX96724 deserializers, the surround view camera corresponds to one MAX96724 deserializer, and the DMS is supported by one MAX96714 or MAX96724 deserializer. D19 has 5 screens, namely CID, cluster screen, AR HUD, ceiling screen, and DLP projector. There are 4 serial chips, and the cluster screen and AR HUD may share one serial chip. The WiFI and Bluetooth modules are Quectel AF67E, and the Ethernet switch comes from from Realtek RTL9071CP. The MCU, namely Renesas U2A16, is on another PCB.

At the Leapmotor Tech Day in September 2026, Leapmotor officially released a new vehicle architecture - LEAP 5.0 . As a central domain control electronic architecture, LEAP 5.0 adopts a truly central integrated control mode. The central domain controller makes unified decisions, and the other domain controllers only execute tasks. The vehicle wiring harness is controlled within 500 meters. This architecture is iterated from LEAP 3.0 and LEAP 4.0. It is also the first centrally integrated EEA in the industry that simultaneously implements 48V power supply and 10 Gigabit Ethernet for the vehicle. The architecture has three core hardware and software capabilities:

The vehicle is powered by 48V. Compared with traditional 12V power supply, the wiring harness is 50% lighter and can support chassis-by-wire and high-power in-vehicle living functions;

The vehicle boasts asymmetric Ethernet, with 10G downlink, 100M uplink, a unified vehicle communication protocol, reducing gateway protocol conversion loss;

Powered by vehicle-cloud agent OS, the automotive agent ensures low-latency operation and data privacy. The cloud agent handles complex reasoning and long-term memory, and enables the vehicle to continuously learn and adapt to user habits through lightweight iteration.

ADCUs are upgraded and iterated, and some OEMs begin to develop high-computing-power autonomous driving chips by themselves

Li Auto currently has two versions of ADCUs: AD Pro and AD MAX:

AD Pro originally used Horizon Robotics J5 as its core, but has resorted to Horizon Robotics J6M.

AD MAX originally took NVIDIA Orin-X as the core, but has adopted NVIDIA Thor-U instead.

At the same time, Li Auto has replaced Nvidia Thor-U wit its self-developed Mach M100. Mach 100 includes the self-developed NPU, application CPU, multimedia IP, security modules and standard I/O interfaces, oriented towards high-level NOA and future L3/L4 capabilities. The effective computing power of a single Mach 100 chip reaches 1280TOPS, which is about 3 times that of Nvidia Thor-U, while the effective computing power of a dual-chip combination can be 5 to 6 times that of Nvidia Thor-U.

MACH M100 is ramping up rapidly. Li Auto disclosed that over 50,000 MACH M100 chips had been delivered as of August 2026. Currently, the second self-developed chip Mach 200 has entered the tape-out stage and is expected to be mass-produced in 2027. The computing power of a single chip exceeds 2000TOPS and the manufacturing process has upgraded to 3nm. Li Auto's chip roadmap is very clear: starting from the cockpit, extending to autonomous driving, and then to cockpit-driving integration.

Since the mass production of Turing chips in early 2024, XPeng has been planning to make a major revision to its central computing domain controller, or XCCP, so that all vehicle models of XPeng will be equipped with Turing chips, with four configurations (high, medium and low):

One Turing chip is paired with MediaTek MT8676 (Fibocom AN762S). The typical vehicle model with the configuration is MONA 03 MAX.

Two Turing chips are paired with MediaTek MT8676. MONA 03 Ultra SE has such a configuration.

There are three Turing chips, two of which are placed in the XCCP, and one is placed alone in the VLMU. Mid-range vehicle models such as G7 are also equipped with MediaTek MT8676, and high-end vehicle models like X9 and GX carry Qualcomm SA8295.

Four Turing chips are used for XPeng's robotaxi, and a separate one is added to serve as an autonomous driving redundant system. This move can increase the shipments of Turing chips as much as possible, dilute the chip R&D and NRE costs, and also simplify the hardware system design, multiplex the R&D results, and reduce R&D costs.

As the first supported vehicle model, Xpeng G7 Ultra is equipped with 3 Turing AI chips, with an effective computing power of 2200+TOPS and 216GB memory, boasting the industry's first L3 computing platform. Debut of local VLA+VLM: VLA-OL adds a "motion cerebrum" to autonomous driving for the first time, and the upper limit of autonomous driving capabilities is 10+ times higher than that of MAX vehicle models in the industry. VLM is an AI cerebrum for vehicles to understand the world, and the next-generation OS entry point for human-vehicle dialogue and control, which will become a standard feature of the next generation of AIDVs;

VLA-OL runs entirely locally, has stronger capabilities, does not require networking, and can be quickly deployed globally; it also has high frame rate, low latency, and long-sequence characteristics. Through 4D video stream perception fusion and 360° all-round perception, it improves environmental recognition capabilities in complex scenarios such as dark light, backlighting, rain and snow, etc., and helps autonomous driving respond to road conditions more accurately. In the future, this model will empower three major scenarios: ambulance recognition and giving way, reasonable lane changes in congested road sections, and pavement collapse avoidance.

According to information from XPeng's financial report conference call on March 20, 2026, the cumulative shipments of XPeng Turing chips had exceeded 200,000 units. It is expected to all vehicle models (including Max) will adopt Turing from the second quarter of 2026, and the annual shipments will be close to 1 million units. The large-scale production of the automotive business has reduced the manufacturing cost of a single Turing chip to RMB2,500-3,000.

In XPeng G7, XCCP looks like a box, but actually consists of two boxes (upper and lower) fixed together. There is a Turing chip on the board, equipped with 64GB storage. The LPDDR5 is speculated to be Micron D8CWL, and the UFS is Micron SH021, with a capacity of 256GB. XPeng G7's XCCP uses two MCUs (Infineon TC397); the cockpit uses Renesas U2A16, which is probably also responsible for gateways. The QSPI NorFlash equipped with U2A16 comes from Macronix. As a U2A16-specific ASIL-D PMIC, Renesas RAA271084 ensures that the system reaches ASIL-D.

Based on the MTK MT8676, Fibocom AN762S-CN is the next-generation multi-mode intelligent 5G Sub-6 communication module with built-in Android. AN762S-CN adopts a 60*60*5.0mm (TBD) SiP package to facilitate customers to flexibly develop terminals. It is compatible with 5G Sub-6, LTE, WCDMA, GSM and other network standards, and supports WiFi 6E, BT5.3 and multi-constellation GNSS. AN762S-CN has been certified by AEC-Q104. The CPU computing power is 170K DMIPS, the GPU computing power is 1.8TFLOPS, and the NPU computing power is 20TOPS.

For interconnection, the design leverages state-of-the-art 10G Ethernet to link multiple Turing chips. Broadcom BCM89890 (10G Ethernet PHY chip) is deployed. The Ethernet switch is Infineon 88Q6113, supporting two 10G ports. The 3-Turing and 4-Turing configurations may adopt Infineon MVQ6223, which features eight 10G ports and delivers a non-blocking switching capacity of 90G - the highest level in the automotive industry today.

In May 2026, BYD launched China's first 4nm autonomous driving chip - Xuanji A3. It has been mass-produced and supports L3 and L4 autonomous driving. The efficient collaboration of three chips can achieve a total computing power of over 2100TOPS, while taking into account power consumption control and computing power utilization.

BYD plans to launch DiPilot (L3/L4), which has ten layers of redundancy in the platform architecture. Besides, from sensor redundancy at the perception layer, to SoC and MCU redundancy at the computing layer, to algorithm and power supply redundancy at the control layer, as well as steering, braking, unlocking, communication, and parking redundancy at the execution layer, it realizes multiple backups for all aspects of the autonomous driving system. In addition, it is the first in the world to feature over-thousand-channel LiDAR, 1000fps global shutter cameras, dual long-wave IR cameras. The over-thousand-channel LiDAR has 4K image-level detection capabilities and an ultra-long detection range of 600 meters. The global shutter cameras have an ultra-high frame rate of 1000fps and an ultra-low latency of less than 1ms, ensuring the redundancy of L3 functions.

Table of Contents

Summary 1: High-level ADCU & CCU and Chip Selection

Summary 2: Mid-level ADCU & CCU and Chip Selection (1)

Summary 2: Mid-level ADCU & CCU and Chip Selection (2)

Summary 3: Low-level ADCU & CCU and Chip Selection

1 ADCU and CCU Market

  • 1.1 China's Passenger Car EEA and Computing Platform Deployment Method
  • China's Local Passenger Car EEA Penetration Rate, 2023-2030E
  • Attached Table: China's Local Passenger Car EEA Penetration Rate, 2023-2030E
  • 1.2 China's Passenger Car Autonomous Driving System Installations and Penetration Rate
  • China's Local Passenger Car Autonomous Driving System Installations (L0~L4), 2023-2030E
  • Attached Table: China's Local Passenger Car Autonomous Driving System Installation Rate, 2023-2030E
  • 1.3 China's Passenger Car ADCU Market Size and Penetration Rate
  • China's Local Passenger Car ADCU Shipments (10,000 Units), 2023-2030E
  • China's Local Passenger Car ADCU Market Size (RMB100 Million), 2023-2030E
  • Attached Table: China's Local Passenger Car ADCU Shipments and Market Size, 2023-2030E
  • China's Local Passenger Car ADCU Development Trend: Central Computing Platform Integration
  • Attached Table: Penetration Rate of Computing Platforms in Local Passenger Cars in China by Integration Form, 2023-2030E
  • China's Local Passenger Car Central Computing Platform (One Box One Chip) Penetration Rate, 2025-2030E
  • China's Local Passenger Car ADCU - Typical One-Chip Solution (1)
  • China's Local Passenger Car ADCU - Typical One-Chip Solution (2)
  • China's Local Passenger Car ADCU - Typical One-Chip Solution (3)
  • 1.4 China's Passenger Car ADCU Suppliers and Their SoC Market Share
  • Shipments of China's Local Passenger Car ADCU Suppliers (10,000 Units), 2023-H1 2026 (1)
  • Shipments of China's Local Passenger Car ADCU Suppliers (10,000 Units), 2023-H1 2026 (2)
  • China's Local Passenger Car ADCU SoC Installations (Vehicles), 2023-H1 2026 (1)
  • China's Local Passenger Car ADCU SoC Installations (Vehicles), 2023-H1 2026 (2)
  • Breakdown of China's Local Passenger Car ADCU SoC Installations (Vehicles), H1 2026
  • Breakdown of China's Local Passenger Car ADCU SoC Installations (Vehicles), 2025
  • Breakdown of China's Local Passenger Car ADCU SoC Installations (Vehicles), 2024
  • China's Local Passenger Car ADCU SoC Shipments (Units), 2023-H1 2026 (1)
  • China's Local Passenger Car ADCU SoC Shipments (Units), 2023-H1 2026 (2)
  • 1.5 Market Share of China's Passenger Car ADCU and SoC Vendors by Price Range
  • China's Local Passenger Car Sales Volume (by Price Range/Autonomous Driving Level), 2023-H1 2026 (1)
  • China's Local Passenger Car Sales Volume (by Price Range/Autonomous Driving Level), 2023-H1 2026 (2)
  • Installation Structure of Autonomous Driving Hardware in China's Local Passenger Cars (>RMB500,000), 2023-H1 2026
  • Market Share of Autonomous Driving Domain Controller Hardware and Master SoCs in China's Local Passenger Cars (>RMB500,000), 2023-H1 2026
  • Installation Structure of Autonomous Driving Hardware in China's Local Passenger Cars (RMB400,000-500,000), 2023-H1 2026
  • Market Share of Autonomous Driving Domain Controller Hardware and Master SoCs in China's Local Passenger Cars (RMB400,000-500,000), 2023-H1 2026
  • Installation Structure of Autonomous Driving Hardware in China's Local Passenger Cars (RMB350,000-400,000), 2023-H1 2026
  • Market Share of Autonomous Driving Domain Controller Hardware and Master SoCs in China's Local Passenger Cars (RMB350,000-400,000), 2023-H1 2026
  • Installation Structure of Autonomous Driving Hardware in China's Local Passenger Cars (RMB300,000-350,000), 2023-H1 2026
  • Market Share of Autonomous Driving Domain Controller Hardware and Master SoCs in China's Local Passenger Cars (RMB300,000-350,000), 2023-H1 2026
  • Installation Structure of Autonomous Driving Hardware in China's Local Passenger Cars (RMB250,000-300,000), 2023-H1 2026
  • Market Share of Autonomous Driving Domain Controller Hardware and Master SoCs in China's Local Passenger Cars (RMB250,000-300,000), 2023-H1 2026
  • Installation Structure of Autonomous Driving Hardware in China's Local Passenger Cars (RMB200,000-250,000), 2023-H1 2026
  • Market Share of Autonomous Driving Domain Controller Hardware and Master SoCs in China's Local Passenger Cars (RMB200,000-250,000), 2023-H1 2026
  • Installation Structure of Autonomous Driving Hardware in China's Local Passenger Cars (RMB150,000-200,000), 2023-H1 2026
  • Market Share of Autonomous Driving Domain Controller Hardware and Master SoCs in China's Local Passenger Cars (RMB150,000-200,000), 2023-H1 2026
  • Installation Structure of Autonomous Driving Hardware in China's Local Passenger Cars (RMB100,000-150,000), 2023-H1 2026
  • Market Share of Autonomous Driving Domain Controller Hardware and Master SoCs in China's Local Passenger Cars (RMB100,000-150,000), 2023-H1 2026
  • Installation Structure of Autonomous Driving Hardware in China's Local Passenger Cars (RMB0-100,000), 2023-H1 2026
  • Market Share of Autonomous Driving Domain Controller Hardware and Master SoCs in China's Local Passenger Cars (RMB0-100,000), 2023-H1 2026
  • 1.6 Cost of Main ADCUs and SoCs
  • Cost of Main ADCUs and SoCs (1)
  • Cost of Main ADCUs and SoCs (2)
  • Cost of Main ADCUs and SoCs (5)
  • Hardware BOM Cost Estimation 1: Qualcomm SA8775P-Based Cockpit-Driving Integration Domain Controller
  • Hardware BOM Cost Estimation 2: NVIDIA Orin-N-Based Domain Controller
  • Hardware BOM Cost Estimation 3: NVIDIA DRIVE Thor-Based ADCU

2 High, Mid and Low-Level Autonomous Driving Chip Platforms and ADCU Solutions

  • 2.1 High-Level (L2.9/L3) Autonomous Driving Chip Platforms and ADCU Solutions
  • 2.1.1 NVIDIA Thor-U/X
  • NVIDIA Thor Installations and Major Customers, 2025-Jun 2026
  • NVIDIA Thor-Based ADCU Solution (1)
  • NVIDIA Thor-Based ADCU Solution (2)
  • NVIDIA Thor-Based ADCU Solution (3)
  • NVIDIA's Autonomous Driving Solution (1)
  • NVIDIA's Autonomous Driving Solution (2)
  • NVIDIA's Autonomous Driving Solution (3)
  • NVIDIA's Autonomous Driving Solution (4)
  • NVIDIA DRIVE Thor-Based DCU Solution 1 (1)
  • NVIDIA DRIVE Thor-Based DCU Solution 1 (2)
  • NVIDIA DRIVE Thor-Based DCU Solution 1 (3)
  • NVIDIA DRIVE Thor-Based DCU Solution 2 (1)
  • NVIDIA DRIVE Thor-Based DCU Solution 2 (5)
  • 2.1.2 Qualcomm Snapdragon 8797
  • Qualcomm Snapdragon 8797 Installations and Major Customers, 2025-Jun 2026
  • Qualcomm Snapdragon 8797-Based ADCU Solution
  • Qualcomm Snapdragon 8797-Based DCU Solution 1 (1)
  • Qualcomm Snapdragon 8797-Based DCU Solution 1 (2)
  • Qualcomm Snapdragon 8797-Based DCU Solution 1 (3)
  • Qualcomm Snapdragon 8797-Based DCU Solution 2 (1)
  • Qualcomm Snapdragon 8797-Based DCU Solution 2 (2)
  • Qualcomm Snapdragon 8797-Based DCU Solution 2 (3)
  • Qualcomm Snapdragon 8797-Based DCU Solution 2 (4)
  • 2.1.3 Horizon Robotics Starry
  • Horizon Robotics Starry-Based ADCU Solution
  • Horizon Robotics Cockpit-Driving Integration SoC (1)
  • Horizon Robotics Cockpit-Driving Integration SoC (2)
  • Horizon Robotics Cockpit-Driving Integration SoC (3)
  • Horizon Robotics Cockpit-Driving Integration SoC (4)
  • Horizon Robotics Cockpit-Driving Integration SoC-Based Computing Platform Solution
  • 2.1.4 Horizon Robotics Journey 6P (J6P)
  • Horizon Robotics Journey 6P (J6P) Installations and Major Customers, 2025-Jun 2026
  • Horizon Robotics J6P-Based ADCU Solution
  • Horizon Robotics Journey 6P (1)
  • Horizon Robotics Journey 6P (2)
  • Horizon Robotics Autonomous Driving System Solution
  • Horizon Robotics Computing Platform Solution
  • 2.1.5 Huawei MDC
  • Huawei MDC Installations and Major Customers, 2025-Jun 2026
  • Huawei Ascend-Based ADCU Solution
  • Huawei Ascend-Based DCU Solution 1 (1)
  • Huawei Ascend-Based DCU Solution 1 (2)
  • Huawei Ascend-Based DCU Solution 1 (3)
  • Huawei Ascend-Based DCU Solution 1 (4)
  • Huawei Ascend-Based DCU Solution 2 (1)
  • Huawei Ascend-Based DCU Solution 2 (5)
  • Huawei Ascend-Based DCU Solution 3 (1)
  • Huawei Ascend-Based DCU Solution 3 (5)
  • 2.2 Mid-Level (L2/L2.5) Autonomous Driving Chip Platforms and ADCU Solutions
  • 2.2.1 NVIDIA Orin-X/Y/N
  • NVIDIA Orin-X/Y/N Installations and Major Customers, 2025-Jun 2026
  • NVIDIA Orin-X-Based ADCU Solution (1)
  • NVIDIA Orin-X-Based ADCU Solution (2)
  • NVIDIA Orin-X-Based ADCU Solution (3)
  • NVIDIA Orin-Y/N-Based ADCU Solution
  • NVIDIA Orin-X-Based DCU Solution 1
  • NVIDIA Orin-X-Based DCU Solution 2
  • NVIDIA Orin-X-Based DCU Solution 3
  • NVIDIA Orin-X-Based DCU Solution 4 (1)
  • NVIDIA Orin-X-Based DCU Solution 4 (2)
  • NVIDIA Orin-X-Based DCU Solution 4 (3)
  • NVIDIA Orin-X-Based DCU Solution 4 (4)
  • NVIDIA Orin-N-Based DCU Solution 1 (1)
  • NVIDIA Orin-N-Based DCU Solution 5 (1)
  • 2.2.2 Qualcomm Snapdragon 8775/8650
  • Qualcomm Snapdragon 8775/8650 Installations and Major Customers, 2025-Jun 2026
  • Qualcomm Snapdragon 8775-Based ADCU Solution
  • Qualcomm Snapdragon 8650-Based ADCU Solution
  • 2.2.3 Mobileye EyeQ6/EyeQ5
  • Mobileye EyeQ6/EyeQ5 Installations and Major Customers, 2025-Jun 2026
  • Mobileye EyeQ6-Based ADCU Solution
  • Mobileye EyeQ5-Based ADCU Solution (1)
  • Mobileye EyeQ5-Based ADCU Solution (2)
  • Mobileye's Autonomous Driving Planning
  • Mobileye's Autonomous Driving Solution (1)
  • Mobileye's Autonomous Driving Solution (2)
  • Mobileye's Autonomous Driving Solution (3)
  • Mobileye's Autonomous Driving Solution (4)
  • Mobileye EyeQ6-Based DCU Solution
  • Mobileye's Autonomous Driving SoC Solution 1
  • Mobileye's Autonomous Driving SoC Solution 2
  • 2.2.4 Horizon Robotics Journey 6E/6M (J6E/J6M)
  • Horizon Robotics Journey 6E/6M (J6E/J6M) Installations and Major Customers, 2025-Jun 2026
  • Horizon Robotics J6E-Based ADCU Solution (1)
  • Horizon Robotics J6E-Based ADCU Solution (2)
  • Horizon Robotics J6M-Based ADCU Solution (1)
  • Horizon Robotics J6M-Based ADCU Solution (2)
  • 2.2.5 Horizon Robotics Journey 5 (J5)
  • Horizon Robotics Journey 5 (J5) Installations and Major Customers, 2025-Jun 2026
  • Horizon Robotics J5-Based ADCU Solution (1)
  • Horizon Robotics J5-Based ADCU Solution (2)
  • 2.2.6 Xinxin Hangtu BMC X7
  • Xinxin Hangtu BMC X7 Installations and Major Customers, 2025-Jun 2026
  • Xinxin Hangtu BMC X7-Based ADCU Solution
  • Xinxin Hangtu Autonomous Driving SoC (1)
  • Xinxin Hangtu Autonomous Driving SoC (2)
  • Xinxin Hangtu Autonomous Driving SoC (3)
  • Xinxin Hangtu Autonomous Driving SoC Solution
  • 2.2.7 Black Sesame Huashan A1000/A2000
  • Black Sesame Huashan A1000 Installations and Major Customers, 2025-Jun 2026
  • Black Sesame Huashan A1000-Based ADCU Solution
  • Black Sesame Huashan A2000-Based ADCU Solution
  • Black Sesame Autonomous Driving SoC (1)
  • Black Sesame Autonomous Driving SoC (2)
  • Black Sesame Autonomous Driving SoC (3)
  • Black Sesame Autonomous Driving SoC (4)
  • Black Sesame Huashan A2000 Solution
  • 2.2.8 Black Sesame Wu-Tang C1000
  • Black Sesame Wudang C1000-Based ADCU Solution
  • Black Sesame Cockpit-Driving Integration SoC-Based Autonomous Driving Solution (1)
  • Black Sesame Cockpit-Driving Integration SoC-Based Autonomous Driving Solution (2)
  • Cockpit-Driving Integration SoC-Based Autonomous Driving Computing Platform: Secure & Intelligent Foundation (1)
  • Cockpit-Driving Integration SoC-Based Autonomous Driving Computing Platform: Secure & Intelligent Foundation (2)
  • 2.2.9 SiEngine SE1000/AD1000
  • SiEngine SE1000/AD1000-Based ADCU Solution
  • SiEngine Cockpit-Driving Integration SoC
  • SiEngine Autonomous Driving SoC (1)
  • SiEngine Autonomous Driving SoC (2)
  • SiEngine Autonomous Driving Ecosystem Platform
  • 2.2.10 Renesas R-Car X5
  • Renesas R-Car X5-Based ADCU Solution
  • Renesas Multi-Domain Fusion SoC (1)
  • Renesas Multi-Domain Fusion SoC (2)
  • 2.3 Low-Level (below L2) Autonomous Driving Chip Platforms and ADCU Solutions
  • 2.3.1 Horizon Robotics Journey 6B (J6B)
  • Horizon Robotics journey 6B (J6B) Installations and Major Customers, 2025-Jun 2026
  • Horizon Robotics J6B-Based ADCU Solution
  • 2.3.2 TI TDA4
  • TI TDA4 Installations and Major Customers, 2025-Jun 2026
  • TI TDA4-Based ADCU Solution (1)
  • TI TDA4-Based ADCU Solution (5)
  • 2.3.3 Renesas R-Car V3H/V4H
  • Renesas R-Car V3H/V4H Installations and Major Customers, 2025-Jun 2026
  • Renesas R-Car V3H/V4H-Based ADCU Solution
  • 2.3.4 AXERA M
  • AXERA M Installations and Major Customers, 2025-Jun 2026
  • AXERA "Axera Auto"-Based ADCU Solution
  • AXERA High-Level Autonomous Driving Chip (1)
  • AXERA High-Level Autonomous Driving Chip (2)
  • AXERA "Axera Auto" (1)
  • AXERA "Axera Auto" (2)
  • 2.3.5 ORITEK Longquan 560
  • ORITEK Longquan 560-Based ADCU Solution
  • ORITEK Autonomous Driving SoC (1)
  • ORITEK Autonomous Driving SoC (2)
  • 2.4 Summary of ADCUs and System Solutions of Tier1 Suppliers
  • Summary of ADCU Product Lines of Tier1 Suppliers (1)
  • Summary of ADCU Product Lines of Tier1 Suppliers (4)
  • Summary of ADCU Product Lines of Tier1 Suppliers (5)
  • 2.5 ADCUs and System Solutions of OEMs
  • Autonomous Driving Solutions and SoC Selection Strategy of BYD System (BYD) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of BYD System (Yangwang, Fangchengbao, Denza) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Leapmotor, AITO, and MAEXTRO (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Li Auto (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of NIO (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Xpeng (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Xiaomi and Zeekr (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Geely System (Geely) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Geely System (Geely) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Chery System (EXEED, JETOUR, iCAR) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Chery System (Fulwin, Chery, LUXEED) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of GAC Group (Aion, Trumpchi, Hyptec, AISTALAND) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of GAC Group (Aion, Trumpchi, Hyptec) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of SAIC Group (Roewe, MG, Rising Auto, SAIC (Shangjie)) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of SAIC Group (IM Motors) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of BAIC Group (ARCFOX, BAIC) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Changan Automobile (Avatr, Nevo, Deepal) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Great Wall Motor (Haval, WEY, Tank) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Dongfeng Motor (Dongfeng, EPICLAND) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Voyah and FAW Hongqi (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of BMW (China), Tesla and Mercedes-Benz (China) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Volkswagen (China) (Including Ongoing Projects)
  • Autonomous Driving Solutions and SoC Selection Strategy of Audi (China), Toyota (China) and Honda (China) (Including Ongoing Projects)

3 ADCU Solutions of Domestic and Foreign OEMs

  • 3.1 NIO
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous Driving Computing Platform Solution
  • 3.2 XPeng
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous Driving SoC (1)
  • Autonomous Driving SoC (2)
  • L3/L4 Autonomous Driving Layout
  • Autonomous Driving Computing Platform Solution (1)
  • Autonomous Driving Computing Platform Solution (2)
  • Autonomous Driving Computing Platform Solution (3)
  • Autonomous Driving Computing Platform Solution (4)
  • 3.3 Li Auto
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous Driving SoC (1)
  • Autonomous Driving SoC (2)
  • Autonomous Driving SoC (3)
  • Autonomous Driving SoC (4)
  • Autonomous Driving Computing Platform Solution 1
  • Autonomous Driving Computing Platform Solution 2 (1)
  • Autonomous Driving Computing Platform Solution 2 (2)
  • Autonomous Driving Computing Platform Solution 2 (3)
  • 3.4 Xiaomi Auto
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous driving SoC
  • 3.5 Leapmotor
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • EEA Development and Iteration
  • Autonomous Driving Computing Platform Solution (1)
  • Autonomous Driving Computing Platform Solution (2)
  • 3.6 BYD
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • ADCU Installation by Vehicle Model Platform (3)
  • ADCU Installation by Vehicle Model Platform (4)
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous driving SoC
  • Autonomous Driving SoC Solution
  • Autonomous Driving Computing Platform Solution (1)
  • Autonomous Driving Computing Platform Solution (5)
  • 3.7 Geely
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • ADCU Installation by Vehicle Model Platform (3)
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous Driving Computing Platform Solution 1
  • Autonomous Driving Computing Platform Solution 2
  • L3/L4 Autonomous Driving Layout (1)
  • L3/L4 Autonomous Driving Layout (2)
  • 3.8 Chery
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • ADCU Installation by Vehicle Model Platform (3)
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous Driving System Solution
  • Autonomous Driving Computing Platform Solution 1
  • Autonomous Driving Computing Platform Solution 2
  • 3.9 FAW Hongqi
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous driving SoC
  • 3.10 GAC Group
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • L3/L4 Autonomous Driving Layout 1
  • L3/L4 Autonomous Driving Layout 2 (1)
  • L3/L4 Autonomous Driving Layout 2 (2)
  • 3.11 SAIC Motor
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • ADCU Installation by Vehicle Model Platform (3)
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Integrated Technical Route (1)
  • Integrated Technical Route (2)
  • Integrated Technical Route (3)
  • 3.12 BAIC Group
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • ADCU Solution
  • 3.13 Changan
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • ADCU Installation by Vehicle Model Platform (3)
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous Driving System (1)
  • Autonomous Driving System (2)
  • L3/L4 Autonomous Driving Layout
  • 3.14 Great Wall Motor
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous Driving System
  • 3.15 Dongfeng Motor
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous Driving System (1)
  • Autonomous Driving System (2)
  • L3/L4 Autonomous Driving Layout 1
  • L3/L4 Autonomous Driving Layout 2
  • 3.16 SAIC-GM
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • ADCU Penetration Rate, 2024-H1 2026
  • 3.17 Harmony Intelligent Mobility Alliance (HIMA)
  • ADCU Installation by Vehicle Model Platform (1)
  • ADCU Installation by Vehicle Model Platform (2)
  • 3.18 BMW
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • Autonomous Driving System 1 (1)
  • Autonomous Driving System 1 (2)
  • Autonomous Driving System 2 (1)
  • Autonomous Driving System 2 (2)
  • 3.19 Volkswagen
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous driving SoC
  • Autonomous Driving System (1)
  • Autonomous Driving System (5)
  • ADCU 1
  • ADCU 2 (1)
  • ADCU 2 (2)
  • L3/L4 Autonomous Driving Layout (1)
  • L3/L4 Autonomous Driving Layout (2)
  • 3.20 Audi
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • ADCU Solution
  • Autonomous Driving System
  • 3.21 Mercedes-Benz
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • Autonomous Driving System
  • 3.22 Toyota
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • 3.23 Honda
  • ADCU Installation by Vehicle Model Platform
  • ADCU Penetration Rate, 2024-H1 2026
  • 3.24 Tesla
  • ADCU Installation by Vehicle Model Platform
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • ADCU Solution
  • 3rd Generation FSD SoC (1)
  • 3rd Generation FSD SoC (2)

4 Domestic ADCU Vendors

  • 4.1 Desay SV
  • ADCU and CCU Development Roadmap
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • NOA Domain Controller
  • Cockpit-Driving Integration Platform (1)
  • Cockpit-Driving Integration Platform (2)
  • Central Computing Platform
  • 4.2 Zhuoyu Technology
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • L2 Assisted Driving Controller
  • Cockpit-driving integrated controller
  • Autonomous Driving Controller
  • 4.3 Jingwei Hirain
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Domestic High-Computing-Power High-Level Autonomous Driving Computing Platform
  • 2nd Generation ADCU (1)
  • 2nd Generation ADCU (2)
  • 2nd Generation ADCU (3)
  • 4.4 iMotion
  • ADCU Development Roadmap
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Driving-Parking Integration Domain Controller (1)
  • Driving-Parking Integration Domain Controller (2)
  • Driving-Parking Integration Domain Controller (3)
  • Driving-Parking Integration Domain Controller (4)
  • Front view all-in-one
  • ADCU Algorithm
  • 4.5 Freetech
  • ODIN Digital Intelligence Base
  • Intelligent Driving Solution
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • "Fuxin No.1" Mass-Market 5G Cockpit-Driving-Parking Solution (1)
  • "Fuxin No.1" Mass-Market 5G Cockpit-Driving-Parking Solution (2)
  • L2 Driving-Parking Integration Domain Controller
  • L3 High-Level Autonomous Driving Solution (1)
  • L3 High-Level Autonomous Driving Solution (2)
  • L3 High-Level Autonomous Driving Solution (3)
  • Driving-Parking Integration Domain Controller
  • 4.6 Hangsheng Electronics
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Cockpit-Driving Integration Platform
  • Driving-Parking Integration Domain Controller
  • Cockpit-Driving Integration Platform (1)
  • Cockpit-Driving Integration Platform (2)
  • One-Chip Cockpit-Driving-Parking Integration Platform
  • 4.7 ECARX
  • ADCU and CCU Development Roadmap
  • Chip and Domain Controller Evolution
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Central Computing Platform
  • Driving-Parking Integration Domain Controller (1)
  • Driving-Parking Integration Domain Controller (2)
  • 4.8 Huawei
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • HiSilicon Autonomous Driving System Solution
  • 4.9 Neusoft Reach
  • ADCU and CCU Development Roadmap
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Front view all-in-one
  • L2+ Urban NOA Domain Controller (1)
  • L2+ Urban NOA Domain Controller (5)
  • 4.10 Lenovo Vehicle Computing
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • L4 Assisted Driving Domain Controller (1)
  • L4 Assisted Driving Domain Controller (2)
  • L2++ Assisted Driving Domain Controller
  • Central Computing Platform
  • 4.11 Luxshare Precision
  • Luxshare Precision and Related Subsidiaries
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • ADCU (1)
  • ADCU (2)
  • 4.12 Huaruijie Technology
  • ADCU Strategic Layout
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Front View All-In-One
  • 4.13 Huaqin Technology
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Driving-Parking Integration Domain Controller (1)
  • Driving-Parking Integration Domain Controller (2)
  • 4.14 Autolink
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Cockpit-Driving Integration Platform 1 (1)
  • Cockpit-Driving Integration Platform 1 (2)
  • Cockpit-Driving Integration Platform 1 (3)
  • Cockpit-Driving Integration Platform 1 (4)
  • Cockpit-Driving Integration Platform 2
  • AI Supercomputing Architecture (1)
  • AI Supercomputing Architecture (2)
  • AI Supercomputing Architecture (3)
  • AI Supercomputing Architecture (4)
  • 4.15 Technomous
  • ADCU Matrix
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Driving-Parking Integration Domain Controller (1)
  • Driving-Parking Integration Domain Controller (2)
  • 4.16 Baidu Apollo
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Autonomous Driving Solution 1
  • Autonomous Driving Solution 2 (1)
  • Autonomous Driving Solution 2 (2)
  • Autonomous Driving Solution 3 (1)
  • Autonomous Driving Solution 3 (2)
  • Cockpit-Driving Integration Intelligent Computing Platform (1)
  • Cockpit-Driving Integration Intelligent Computing Platform (2)
  • 4.17 Yihang.AI
  • Urban NOA R&D Solution
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Duxing Urban Autonomous Driving Platform (1)
  • Duxing Urban Autonomous Driving Platform (2)
  • BEV "Lingmo"
  • 4.18 NavInfo
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Driving-Parking Integration Domain Controller Layout
  • Driving-Parking Integration Domain Controller (1)
  • Driving-Parking Integration Domain Controller (2)
  • Driving-Parking Integration Domain Controller (3)
  • 4.19 Hyperview
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Cockpit-parking integrated domain controller
  • 4.20 Motovis
  • ADCU Product Line
  • Driving-Parking Integration Domain Controller (1)
  • Driving-Parking Integration Domain Controller (2)
  • 4.21 MINIEYE
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • Driving-Parking Integration Domain Controller
  • Assisted Driving Domain Controller (1)
  • Assisted Driving Domain Controller (2)
  • Assisted Driving Domain Controller (3)
  • Assisted Driving Domain Controller (4)
  • Assisted Driving Domain Controller Installation Case
  • 4.22 Joynext
  • ADCU Product Line
  • L3/L4 ADCU
  • CCU (1)
  • CCU (2)
  • 4.23 ThunderX
  • ADCU Development Roadmap
  • ADCU Functions and Configuration Planning
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • AI Fusion Domain Controller
  • Cockpit-Driving Integration Domain Controller (1)
  • Cockpit-Driving Integration Domain Controller (2)
  • 4.24 MAXIEYE
  • Autonomous Driving Products (1)
  • Autonomous Driving Products (2)
  • ADCU Product Line
  • Driving-Parking Integration Domain Controller Installation Case
  • Driving-Parking Integration Domain Controller (1)
  • Driving-Parking Integration Domain Controller (2)
  • Driving-Parking Integration Domain Controller (3)
  • 4.25 Pony.ai
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • L4 Intelligent Cockpit Domain Controller
  • L4 ADCU Installation Case
  • L4 ADCU (1)
  • L4 ADCU (2)
  • 4.26 Z-ONE
  • ADCU Product Line
  • Cockpit-Driving Integration Computing Platform (1)
  • Cockpit-Driving Integration Computing Platform (2)
  • 4.27 neueHCT
  • Business
  • ADCU Product Line
  • All-Scenario Assisted Driving Domain Controller (1)
  • High-Performance Assisted Driving Domain Controller (2)
  • 4.28 FINEST Automotive Technology
  • ADCU Product Line
  • Driving-Parking Integration Domain Controller (1)
  • Driving-Parking Integration Domain Controller (2)
  • Driving-Parking Integration Domain Controller (3)
  • 4.29 Nullmax
  • ADCU Product Line
  • ADCU
  • Cockpit-Driving Integration Domain Controller (1)
  • Cockpit-Driving Integration Domain Controller (2)
  • Driving-Parking Integration Domain Controller (1)
  • Driving-Parking Integration Domain Controller (2)
  • 4.30 DeepRoute.ai
  • ADCU Product Line
  • Cockpit-driving integration domain controller
  • High-Level ADCU Installation Case
  • Assisted Driving Platform (1)
  • Assisted Driving Platform (2)
  • 4.31 BICV
  • Cockpit-Driving Integration Platform Planning
  • ADCU Product Line
  • Cockpit-Driving Integration Platform

5 Foreign ADCU Vendors

  • 5.1 Bosch
  • Cockpit-Driving Integration Domain Controller Development Roadmap
  • ADCU Product Line (1)
  • ADCU Product Line (2)
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • Zongheng Assisted Driving - Basic Edition
  • Zongheng Assisted Driving - Upgraded Edition
  • Zongheng Assisted Driving - Supreme Edition (1)
  • Zongheng Assisted Driving - Supreme Edition (2)
  • 5.2 Aptiv
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • End-to-end AI ADAS Platform
  • Sixth-generation ADAS Platform (1)
  • Sixth-generation ADAS Platform (2)
  • Sixth-generation ADAS Platform (3)
  • 5.3 ZF
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • ADCU (1)
  • ADCU (2)
  • 5.4 Valeo
  • ADCU Product Line
  • ADCU Installations and Major Customers, 2025-Jun 2026
  • 5.5 Magna
  • ADCU Product Line
  • ADCU Solution (1)
  • ADCU Solution (2)
  • 5.6 AUMOVIO
  • ADCU Product Line
  • Cockpit-Driving-Parking Integration Domain Controller
  • 5.7 Visteon
  • ADCU Product Line
  • Cockpit-Driving Integration Module
  • 5.8 Astemo
  • ADCU Product Line
  • ADCU Layout
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