세계의 기판 대 기판(BTB) 커넥터 시장 예측(-2030년) : 제품, 부품, 구현 방법, 응용 분야, 최종사용자 및 지역별 분석

According to Stratistics MRC, the Global Board-to-Board Connectors Market is accounted for $11.6 billion in 2023 and is expected to reach $21.2 billion by 2030 growing at a CAGR of 9% during the forecast period. Board-to-board connectors are electrical connectors that are used to connect printed circuit boards (PCBs) together. They come in a variety of shapes and sizes, but they all have two basic parts: male and female connectors that fit together to form a connection. There are many different types of board-to-board connectors, each with its own set of features and benefits. The most popular type is the pinhead.

Market Dynamics:

Driver:

Rapid technological advancements

The market for board-to-board connectors has been significantly stimulated by rapid technological improvements in a number of industries, including electronics and telecommunications. To address the ever-increasing connectivity demands caused by the constant evolution of electronic devices and developments in numerous industries, sophisticated connectors must be used. Smartphones, tablets, and smartwatches are continuously gaining new features and capabilities. These developments necessitate smaller, more effective board-to-board connectors that can support complex circuitry and still retain strong connections. Since board-to-board connectors satisfy the requirements for miniaturization, high-speed data transfer, signal integrity, and reliable interconnections to enable seamless integration and support the advancement of technology in the modern world, the need for them is driven by the rapid technological advancements across various industries.

Restraint:

Technological complexities

Board-to-board connectors have to satisfy specific requirements for each application, including those related to signal integrity, power transmission, size restraints, environmental factors, and mechanical considerations. It might be difficult and time-consuming to design and create connectors that meet these special specifications. The necessity for customization for various applications and industries, together with the rapid pace of technological improvements, all add to the constraints.

Opportunity:

Rising trend of Edge computing and IOT

The demand for board-to-board connectors for enabling connectivity between devices, sensors, and edge computing modules is driven by the growing uptake of IoT devices and edge computing solutions. For IoT and edge computing applications, this opens up opportunities for connectors with particular properties like low power consumption, secure connections, and strong designs. For instance, edge computing is used in the industrial sector to monitor and manage manufacturing processes in real time. IoT products used in the inventive home market, including smart thermostats, lighting controls, and security cameras, rely on board-to-board connectors to connect the control unit to numerous sensors and actuators placed throughout the home.

Threat:

Technical challenges

A dependable signal transmission with less loss, distortion, and interference is essential as data transfer speeds rise. These difficulties are made worse by elements including insertion loss, reflection, crosstalk, impedance management, noise, EMI, skew, timing problems, material choice, and connector crosstalk. To meet these obstacles, manufacturers must use cutting-edge design approaches, exacting testing procedures, and premium materials. Delivering board-to-board connectors that satisfy the rigorous requirements of high-speed data transmission systems requires significant customer collaboration and consideration of particular application requirements.

COVID-19 Impact:

Due to the disruptions in their respective production and supply-chain operations brought on by numerous precautionary lockdowns and other limitations that were imposed by regulatory agencies around the world, the COVID-19 epidemic has had a substantial impact on several businesses. Additionally, consumer demand has decreased as people have become more driven to cut non-essential spending from their own budgets, as the general economic situation of the majority of people has been severely impacted by this outbreak.

The socket segment is expected to be the largest during the forecast period

The socket segment is anticipated to hold the largest market share during the projected period, because sockets provide a high level of flexibility and interchangeability, enabling simple component replacement and reconfiguration. This characteristic is extremely valuable in sectors like consumer electronics or telecoms, where regular updates or changes to electrical devices are widespread. Moreover, the board-to-board connections can be used with a variety of other board-to-board connectors, making them appropriate for use in a variety of applications and industries.

The 1 mm to 2 mm segment is expected to have the highest CAGR during the forecast period

Due to the widespread use of compact size, which enables the shrinking of electronic devices, the 1 mm to 2 mm segment is predicted to have profitable growth during the extrapolated period. Connectors with decreasing pitches are essential for enabling the integration of components in constrained locations as devices get smaller and lighter. Additionally, this is crucial in applications where it's necessary to efficiently route many signals, power lines, or data channels across boards or modules.

Region with largest share:

Owing to the region's aggressive pursuit of smart manufacturing efforts and adoption of Industry 4.0 technology, Asia Pacific is predicted to hold the largest share of the market during the dominance period. This includes incorporating robotics, automation, IoT, and data analytics into the production processes. Board-to-board connections are essential for enabling smooth connectivity and communication between various components in smart manufacturing systems, which is fueling market expansion.

Region with highest CAGR:

Several board-to-board (BTB) connector manufacturers operate in the region, and they are continually investing in the development of cutting-edge products used in a variety of applications. As a result, Asia Pacific is predicted to have highest CAGR of the global board-to-board (BTB) connectors market throughout the forecast period. Additionally, growing presence of manufacturers in the consumer electronics industry and the continuously expanding automotive industry in the area, particularly in China.

Key players in the market:

Some of the key players in Board-to-Board Connectors market include: Advanced Interconnect, Amphenol, Delphi, ERNI Electronics, Foxconn, Harting, Harwin, Hirose, JAE, JST, Kyocera Corporation, Molex, OMRON Corporation, Panasonic Electric Works Europe AG, Samtec, TE Connectivity and YAMAICHI.

Key Developments:

In March 2023, Hirose Electric Co. Ltd. has introduced the IT14 Series, a hermaphroditic board-to-board connector that enables high-speed data transmission at up to 112Gbps using PAM4 technology. The release of the IT14 Series primarily aims to ensure a consistent and reliable supply of components for the telecommunications equipment market. This series is specifically designed to meet the demands and requirements of the telecommunications industry.

In June 2022, Molex has officially launched the Molex Quad-Row Board-to-Board Connectors. This connector series introduces an innovative staggered-circuit layout, resulting in a remarkable 30% reduction in space compared to conventional connector designs. With these patent-pending connectors, product developers and device manufacturers gain enhanced freedom and flexibility to accommodate compact form factors across a wide range of applications, including smartphones, smartwatches, wearables, game consoles, and Augmented Reality/Virtual Reality (AR/VR) devices.

In April 2022, TE Connectivity has launched new 369 series connector which is ideal for hard and confined environments. While retaining full compatibility with existing 369 connectors, the sealed panel mount connector from the 369 series introduces numerous enhanced features.

Products Covered:

• Socket
• Pin Headers

Components Covered:

• Greater Than 2mm
• 1mm to 2mm
• Less Than 1mm

Mounting Methods Covered:

• Surface Mount Technology (SMT)
• Through Hole

Applications Covered:

• Open-Close Detection
• Position Detection
• Rotation Detection

End Users Covered:

• Energy & Power
• Transportation
• Aerospace & Defense
• Healthcare
• Automotive
• Telecommunication
• Industrial Automation
• Consumer Electronics

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 Application Analysis
• 3.8 End User Analysis
• 3.9 Emerging Markets
• 3.10 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Board-to-Board Connectors Market, By Product

• 5.1 Introduction
• 5.2 Socket
• 5.3 Pin Headers
  • 5.3.1 Shrouded Header
  • 5.3.2 Stacked Header

6 Global Board-to-Board Connectors Market, By Component

• 6.1 Introduction
• 6.2 Greater Than 2mm
• 6.3 1mm to 2mm
• 6.4 Less Than 1mm

7 Global Board-to-Board Connectors Market, By Mounting Method

• 7.1 Introduction
• 7.2 Surface Mount Technology (SMT)
• 7.3 Through Hole

8 Global Board-to-Board Connectors Market, By Application

• 8.1 Introduction
• 8.2 Open-Close Detection
• 8.3 Position Detection
• 8.4 Rotation Detection

9 Global Board-to-Board Connectors Market, By End User

• 9.1 Introduction
• 9.2 Energy & Power
• 9.3 Transportation
• 9.4 Aerospace & Defense
• 9.5 Healthcare
• 9.6 Automotive
• 9.7 Telecommunication
• 9.8 Industrial Automation
• 9.9 Consumer Electronics

10 Global Board-to-Board Connectors Market, By Geography

• 10.1 Introduction
• 10.2 North America
  • 10.2.1 US
  • 10.2.2 Canada
  • 10.2.3 Mexico
• 10.3 Europe
  • 10.3.1 Germany
  • 10.3.2 UK
  • 10.3.3 Italy
  • 10.3.4 France
  • 10.3.5 Spain
  • 10.3.6 Rest of Europe
• 10.4 Asia Pacific
  • 10.4.1 Japan
  • 10.4.2 China
  • 10.4.3 India
  • 10.4.4 Australia
  • 10.4.5 New Zealand
  • 10.4.6 South Korea
  • 10.4.7 Rest of Asia Pacific
• 10.5 South America
  • 10.5.1 Argentina
  • 10.5.2 Brazil
  • 10.5.3 Chile
  • 10.5.4 Rest of South America
• 10.6 Middle East & Africa
  • 10.6.1 Saudi Arabia
  • 10.6.2 UAE
  • 10.6.3 Qatar
  • 10.6.4 South Africa
  • 10.6.5 Rest of Middle East & Africa

11 Key Developments

• 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 11.2 Acquisitions & Mergers
• 11.3 New Product Launch
• 11.4 Expansions
• 11.5 Other Key Strategies

12 Company Profiling

• 12.1 Advanced Interconnect
• 12.2 Amphenol
• 12.3 Delphi
• 12.4 ERNI Electronics
• 12.5 Foxconn
• 12.6 Harting
• 12.7 Harwin
• 12.8 Hirose
• 12.9 JAE
• 12.10 JST
• 12.11 Kyocera Corporation
• 12.12 Molex
• 12.13 OMRON Corporation
• 12.14 Panasonic Electric Works Europe AG
• 12.15 Samtec
• 12.16 TE Connectivity
• 12.17 YAMAICHI