코폴리아미드 열활성 필름 접착제 시장 전망(-2030년) : 유형별, 최종 사용자별, 지역별 분석

According to Stratistics MRC, the Global Co-Polyamide Thermal Activated Film Adhesives Market is accounted for $513.5 million in 2023 and is expected to reach $1588.1 million by 2030 growing at a CAGR of 17.5% during the forecast period. Co-Polyamide thermal activated film adhesives are specialized adhesives designed for high-performance bonding applications. These adhesives consist of co-polyamide resins that are activated by heat to create strong bonds between substrates. They offer excellent adhesion properties, durability, and resistance to heat, chemicals, and environmental factors. Co-Polyamide thermal activated film adhesives are commonly used in industries such as aerospace, automotive, electronics, and construction.

According to CEPI, the total production of paper and board in the CEPI member countries of the European Union was 90,583 kilotons, registering a growth rate of 6.1% as compared to 85,349 kilotons of production in the year 2020.

Market Dynamics:

Driver:

Increasing demand in automotive industry

Automotive manufacturers require high-performance adhesives to meet stringent requirements for light weighting, fuel efficiency, and vehicle durability. Co-Polyamide thermal activated film adhesives offer excellent bonding strength, heat resistance, and durability, making them ideal for use in automotive assembly processes, such as bonding panels, trims, and structural components. This rising demand from the automotive sector fuels the growth of the market for these advanced adhesives.

Restraint:

Limited compatibility

Limited compatibility with certain substrates can pose a significant restraint in the Co-polyamide thermal activated film adhesives market. While these adhesives offer excellent bonding strength and durability, they may not be compatible with all materials, limiting their applicability in certain industries or applications. This constraint can hinder widespread adoption, particularly in cases where diverse substrates are involved, such as in multi-material assemblies.

Opportunity:

Growing demand in electronics sector

Due to the increasing complexity and miniaturization of electronic devices, there is a heightened need for high-performance adhesives that can provide strong, reliable bonds in challenging environments. Co-Polyamide Thermal Activated Film Adhesives offer excellent adhesion properties, thermal stability, and resistance to moisture and chemicals, making them ideal for bonding electronic components and substrates, thus driving their adoption in the electronics industry.

Threat:

Availability of substitute adhesive technologies

Alternative adhesive options, such as pressure-sensitive adhesives (PSAs) and epoxy adhesives, offer similar or even superior performance characteristics for certain applications. Additionally, advancements in research and development may lead to the introduction of novel adhesive technologies with enhanced properties and lower costs, further challenging the market position of Co-Polyamide thermal activated film adhesives.

Covid-19 Impact:

The COVID-19 pandemic has impacted the Co-Polyamide thermal activated film adhesives market by causing disruptions in supply chains, manufacturing operations, and demand from key industries such as automotive and aerospace. Lockdown measures, travel restrictions, and economic uncertainty have led to delays in project timelines and reduced investments in infrastructure and construction. However, as the economy gradually recovers and industries resume operations, the market is expected to rebound with renewed growth prospects.

The solvent-based segment is expected to be the largest during the forecast period

The solvent-based segment is anticipated to dominate the Co-Polyamide thermal activated film adhesives market during the forecast period owing to their superior bonding strength, versatility, and compatibility with a wide range of substrates. Additionally, they provide fast curing times and high resistance to heat and chemicals, making them suitable for various demanding applications across industries. These qualities drive their widespread adoption, contributing to the segment's projected leadership in the market.

The automotive segment is expected to have the highest CAGR during the forecast period

The automotive segment is anticipated to exhibit the highest growth during the forecast period. The growing automotive industry is experiencing rapid technological advancements, leading to the adoption of advanced materials like Co-Polyamide thermal activated film adhesives for light weighting, structural integrity, and improved performance. Additionally, increasing demand for fuel-efficient vehicles, stringent regulations regarding emissions and safety standards, and growing consumer preference for electric and hybrid vehicles are driving the demand for high-performance adhesives in automotive applications.

Region with largest share:

The North American region is poised to dominate the Co-Polyamide thermal activated film adhesives market due to regions home to key industries such as aerospace, automotive and electronics, which have high demand for advanced adhesive technologies. Additionally, the region boasts a strong focus on innovation, research, and development, driving the adoption of cutting-edge materials like Co-Polyamide thermal activated film adhesives. Moreover, well-established infrastructure, access to skilled labor, and favorable regulatory frameworks further enhance the market's growth potential in North America.

Region with highest CAGR:

The Asia Pacific region is poised for rapid growth in the Co-Polyamide thermal activated film adhesives market owing to the region's booming manufacturing sector, particularly in countries like China, Japan, and South Korea, which drives the demand for advanced adhesive solutions in industries such as automotive, electronics, and construction. Additionally, increasing investments in infrastructure development and technological advancements further fuel the adoption of Co-Polyamide thermal activated film adhesives. This robust industrial landscape positions Asia-Pacific as a key growth market for these advanced materials.

Key players in the market

Some of the key players in Co-Polyamide Thermal Activated Film Adhesives Market include 3M Company, Arkema Group, Ashland Global Holdings Inc., Avery Dennison Corporation, Bohle AG, Bostik SA, DELO Industrial Adhesives LLC, Dow Inc., Dymax Corporation, H.B. Fuller Company, Henkel AG & Co. KGaA, Huntsman Corporation, Jowat SE, LORD Corporation, Panacol-Elosol GmbH, Permabond Engineering Adhesives Ltd., Sika AG, Toppan Printing , Toyochem Co., Ltd. and Wisdom Adhesives Worldwide.

Key Developments:

In February 2021, Toppan Printing (Toppan), a global leader in communication, security, packaging, decor materials, and electronics solutions, has developed a high-strength adhesive for digital printing. TOPMER(TM) is suitable for retort sterilization, boiling sterilization, and heating in microwave ovens, thus expanding applications for packages employing digital printing and enabling high-value-added products that meet the diversifying needs of today's consumers. TOPMER(TM) will go on sale in Japan on February 24 targeting the food, toiletries, and cosmetics sectors.

Types Covered:

• Solvent-based
• Hot Melt
• Water-based
• Other Types

End Users Covered:

• Consumer Electronics
• Automotive
• Furniture
• Building & Construction
• Aerospace
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 End User Analysis
• 3.7 Emerging Markets
• 3.8 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Co-Polyamide Thermal Activated Film Adhesives Market, By Type

• 5.1 Introduction
• 5.2 Solvent-based
• 5.3 Hot Melt
• 5.4 Water-based
• 5.5 Other Types

6 Global Co-Polyamide Thermal Activated Film Adhesives Market, By End User

• 6.1 Introduction
• 6.2 Consumer Electronics
  • 6.2.1 Tablets
  • 6.2.2 Laptops
  • 6.2.3 Wearables
  • 6.2.4 Other Consumer Electronics
• 6.3 Automotive
  • 6.3.1 Interior Components
  • 6.3.2 Exterior Components
  • 6.3.3 Under-the-hood Components
• 6.4 Furniture
  • 6.4.1 Lamination
  • 6.4.2 Edge Banding
  • 6.4.3 Assembly
• 6.5 Building & Construction
  • 6.5.1 Insulation
  • 6.5.2 Sealing
  • 6.5.3 Labeling
• 6.6 Aerospace
• 6.7 Other End Users

7 Global Co-Polyamide Thermal Activated Film Adhesives Market, By Geography

• 7.1 Introduction
• 7.2 North America
  • 7.2.1 US
  • 7.2.2 Canada
  • 7.2.3 Mexico
• 7.3 Europe
  • 7.3.1 Germany
  • 7.3.2 UK
  • 7.3.3 Italy
  • 7.3.4 France
  • 7.3.5 Spain
  • 7.3.6 Rest of Europe
• 7.4 Asia Pacific
  • 7.4.1 Japan
  • 7.4.2 China
  • 7.4.3 India
  • 7.4.4 Australia
  • 7.4.5 New Zealand
  • 7.4.6 South Korea
  • 7.4.7 Rest of Asia Pacific
• 7.5 South America
  • 7.5.1 Argentina
  • 7.5.2 Brazil
  • 7.5.3 Chile
  • 7.5.4 Rest of South America
• 7.6 Middle East & Africa
  • 7.6.1 Saudi Arabia
  • 7.6.2 UAE
  • 7.6.3 Qatar
  • 7.6.4 South Africa
  • 7.6.5 Rest of Middle East & Africa

8 Key Developments

• 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 8.2 Acquisitions & Mergers
• 8.3 New Product Launch
• 8.4 Expansions
• 8.5 Other Key Strategies

9 Company Profiling

• 9.1 3M Company
• 9.2 Arkema Group
• 9.3 Ashland Global Holdings Inc.
• 9.4 Avery Dennison Corporation
• 9.5 Bohle AG
• 9.6 Bostik SA
• 9.7 DELO Industrial Adhesives LLC
• 9.8 Dow Inc.
• 9.9 Dymax Corporation
• 9.10 H.B. Fuller Company
• 9.11 Henkel AG & Co. KGaA
• 9.12 Huntsman Corporation
• 9.13 Jowat SE
• 9.14 LORD Corporation
• 9.15 Panacol-Elosol GmbH
• 9.16 Permabond Engineering Adhesives Ltd.
• 9.17 Sika AG
• 9.18 Toppan Printing
• 9.19 Toyochem Co., Ltd.
• 9.20 Wisdom Adhesives Worldwide